USD418485S - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD418485S
USD418485S US29/100,730 US10073099F USD418485S US D418485 S USD418485 S US D418485S US 10073099 F US10073099 F US 10073099F US D418485 S USD418485 S US D418485S
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US
United States
Prior art keywords
semiconductor device
view
elevational view
sectional
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/100,730
Inventor
Hisashi Kawafuji
Mitsutaka Iwasaki
Gourab Majumdar
Toshiaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASAKI, MITSUTAKA, MAJUMDAR, GOURAB, KAWAFUJI, HISASHI, SHINOHARA, TOSHIAKI
Application granted granted Critical
Publication of USD418485S publication Critical patent/USD418485S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of a semiconductor device, showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is an enlarged cross-sectional view thereof, taken along line 7--7 in FIG 1;
FIG. 8 is an enlarged cross-sectional view thereof, taken along line 8--8 in FIG. 1; and,
FIG. 9 is a front, right side and bottom perspective view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/100,730 1998-09-29 1999-02-17 Semiconductor device Expired - Lifetime USD418485S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2773898 1998-09-29
JP10-27738 1998-09-29

Publications (1)

Publication Number Publication Date
USD418485S true USD418485S (en) 2000-01-04

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ID=71730237

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/100,730 Expired - Lifetime USD418485S (en) 1998-09-29 1999-02-17 Semiconductor device

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US (1) USD418485S (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD448738S1 (en) 2000-10-04 2001-10-02 Sony Corporation Semiconductor element
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD448738S1 (en) 2000-10-04 2001-10-02 Sony Corporation Semiconductor element
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

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