USD405062S - Processing tube for use in a semiconductor wafer heat processing apparatus - Google Patents

Processing tube for use in a semiconductor wafer heat processing apparatus Download PDF

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Publication number
USD405062S
USD405062S US29/083,422 US8342298F USD405062S US D405062 S USD405062 S US D405062S US 8342298 F US8342298 F US 8342298F US D405062 S USD405062 S US D405062S
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US
United States
Prior art keywords
semiconductor wafer
wafer heat
processing apparatus
tube
heat processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/083,422
Inventor
Tomohisa Shimazu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
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Filing date
Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMAZU, TOMOHISA
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Publication of USD405062S publication Critical patent/USD405062S/en
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Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 a perspective view of a processing tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a bottom plan view thereof;
FIG. 5 a rear elevational view thereof;
FIG. 6 a left side view thereof;
FIG. 7 a right side view thereof;
FIG. 8 a cross-sectional view taken along line VIII-VIII in FIG. 3;
FIG. 9 a cross-sectional view taken along line IX-IX in FIG. 2; and,
FIG. 10 a cross-sectional view taken along line X-X in FIG. 3.

Claims (1)

  1. I claim the ornamental design for processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
US29/083,422 1997-08-20 1998-02-05 Processing tube for use in a semiconductor wafer heat processing apparatus Expired - Lifetime USD405062S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6509297 1997-08-20
JP9-65092 1997-08-20

Publications (1)

Publication Number Publication Date
USD405062S true USD405062S (en) 1999-02-02

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US29/083,422 Expired - Lifetime USD405062S (en) 1997-08-20 1998-02-05 Processing tube for use in a semiconductor wafer heat processing apparatus

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD778458S1 (en) * 2015-02-23 2017-02-07 Hitachi Kokusai Electric Inc. Reaction tube
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD919583S1 (en) 2020-08-26 2021-05-18 Mahdi Al-Husseini Mortarboard with electronic tube display
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587689A (en) * 1983-01-12 1986-05-13 Minoru Nakamura Meat packing apparatus
US5046909A (en) * 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5314574A (en) * 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5320218A (en) * 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5407449A (en) * 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5518360A (en) * 1990-11-16 1996-05-21 Kabushiki-Kaisha Watanabe Shoko Wafer carrying device and wafer carrying method
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587689A (en) * 1983-01-12 1986-05-13 Minoru Nakamura Meat packing apparatus
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5046909A (en) * 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US5518360A (en) * 1990-11-16 1996-05-21 Kabushiki-Kaisha Watanabe Shoko Wafer carrying device and wafer carrying method
US5658115A (en) * 1991-09-05 1997-08-19 Hitachi, Ltd. Transfer apparatus
US5407449A (en) * 1992-03-10 1995-04-18 Asm International N.V. Device for treating micro-circuit wafers
US5320218A (en) * 1992-04-07 1994-06-14 Shinko Electric Co., Ltd. Closed container to be used in a clean room
US5314574A (en) * 1992-06-26 1994-05-24 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US5752796A (en) * 1996-01-24 1998-05-19 Muka; Richard S. Vacuum integrated SMIF system

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
USD778458S1 (en) * 2015-02-23 2017-02-07 Hitachi Kokusai Electric Inc. Reaction tube
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD790490S1 (en) * 2015-09-04 2017-06-27 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD901406S1 (en) * 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
USD919583S1 (en) 2020-08-26 2021-05-18 Mahdi Al-Husseini Mortarboard with electronic tube display

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