USD1112118S1 - Semiconductor device - Google Patents

Semiconductor device

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Publication number
USD1112118S1
USD1112118S1 US29/928,782 US202429928782F USD1112118S US D1112118 S1 USD1112118 S1 US D1112118S1 US 202429928782 F US202429928782 F US 202429928782F US D1112118 S USD1112118 S US D1112118S
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US
United States
Prior art keywords
semiconductor device
view
elevation view
ornamental design
side elevation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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US29/928,782
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English (en)
Inventor
Masamichi Ikuta
Nao Ueda
Shingo Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
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Publication of USD1112118S1 publication Critical patent/USD1112118S1/en
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US29/928,782 2023-09-11 2024-02-15 Semiconductor device Active USD1112118S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-018530D 2023-09-11
JP2023018530F JP1769931S (https=) 2023-09-11 2023-09-11

Publications (1)

Publication Number Publication Date
USD1112118S1 true USD1112118S1 (en) 2026-02-10

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ID=90926323

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Application Number Title Priority Date Filing Date
US29/928,782 Active USD1112118S1 (en) 2023-09-11 2024-02-15 Semiconductor device

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US (1) USD1112118S1 (https=)
JP (1) JP1769931S (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1769849S (https=) * 2023-09-11 2024-05-08
JP1769931S (https=) * 2023-09-11 2024-05-08
JP1769848S (https=) * 2023-09-11 2024-05-08

Citations (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US4979016A (en) * 1988-05-16 1990-12-18 Dallas Semiconductor Corporation Split lead package
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421421S (en) * 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD475981S1 (en) * 2002-03-29 2003-06-17 Mitsubishi Denki Kabushiki Kaisha Integrated circuits substrate
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6716670B1 (en) * 2002-01-09 2004-04-06 Bridge Semiconductor Corporation Method of forming a three-dimensional stacked semiconductor package device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD558694S1 (en) * 2005-10-11 2008-01-01 Gem Services, Inc. Quad-28JW surface mount package
USD560623S1 (en) * 2005-10-11 2008-01-29 Gem Services, Inc. Quad-24JW surface mount package
US7361983B2 (en) * 2002-07-26 2008-04-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
JP1603358S (https=) 2017-10-19 2018-05-07
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD877708S1 (en) * 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
US10790245B2 (en) * 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
JP1711418S (ja) 2021-10-13 2022-03-31 半導体素子
JP1711446S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1711417S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1724641S (ja) 2022-03-07 2022-09-13 半導体モジュール
JP1727399S (ja) 2022-01-28 2022-10-14 半導体素子
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
JP1769931S (https=) * 2023-09-11 2024-05-08
JP1769849S (https=) * 2023-09-11 2024-05-08
JP1769848S (https=) * 2023-09-11 2024-05-08
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
US12224218B2 (en) * 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling

Patent Citations (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US4979016A (en) * 1988-05-16 1990-12-18 Dallas Semiconductor Corporation Split lead package
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5646443A (en) * 1993-10-15 1997-07-08 Nec Corporation Semiconductor package
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD421421S (en) * 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6716670B1 (en) * 2002-01-09 2004-04-06 Bridge Semiconductor Corporation Method of forming a three-dimensional stacked semiconductor package device
USD475981S1 (en) * 2002-03-29 2003-06-17 Mitsubishi Denki Kabushiki Kaisha Integrated circuits substrate
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US7361983B2 (en) * 2002-07-26 2008-04-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD558694S1 (en) * 2005-10-11 2008-01-01 Gem Services, Inc. Quad-28JW surface mount package
USD560623S1 (en) * 2005-10-11 2008-01-29 Gem Services, Inc. Quad-24JW surface mount package
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD877708S1 (en) * 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
US10790245B2 (en) * 2016-06-27 2020-09-29 NGK Electronics Devices, Inc. High-frequency ceramic board and high-frequency semiconductor element package
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
JP1603358S (https=) 2017-10-19 2018-05-07
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD913978S1 (en) * 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
JP1711417S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1711446S (ja) * 2021-10-13 2022-03-31 半導体素子
JP1711418S (ja) 2021-10-13 2022-03-31 半導体素子
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
JP1727399S (ja) 2022-01-28 2022-10-14 半導体素子
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
US12224218B2 (en) * 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
JP1724641S (ja) 2022-03-07 2022-09-13 半導体モジュール
JP1769848S (https=) * 2023-09-11 2024-05-08
JP1769849S (https=) * 2023-09-11 2024-05-08
JP1769931S (https=) * 2023-09-11 2024-05-08

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
TSH82IDT,https://estore.st.com/en/tsh82idt-cpn.html?srsltid=AfmBOoqVijtkP66WG0ZzM3Ss6YksaF0UYA_HfCt04GuMQJxva1cdN5SN,2025. (Year: 2025). *
TSV711ICT,https://estore.st.com/en/tsv711ict-cpn.html?srsltid=AfmBOoo3ZG0QKTgeEEPntFpYH3xRXCqS3tNiJa3xjrLHUFCWj_HbBBC-,2025. (Year: 2025). *
TSH82IDT,https://estore.st.com/en/tsh82idt-cpn.html?srsltid=AfmBOoqVijtkP66WG0ZzM3Ss6YksaF0UYA_HfCt04GuMQJxva1cdN5SN,2025. (Year: 2025). *
TSV711ICT,https://estore.st.com/en/tsv711ict-cpn.html?srsltid=AfmBOoo3ZG0QKTgeEEPntFpYH3xRXCqS3tNiJa3xjrLHUFCWj_HbBBC-,2025. (Year: 2025). *

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