USD1019581S1 - Inner tube of reaction tube for semiconductor manufacturing equipment - Google Patents

Inner tube of reaction tube for semiconductor manufacturing equipment Download PDF

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Publication number
USD1019581S1
USD1019581S1 US29/861,167 US202229861167F USD1019581S US D1019581 S1 USD1019581 S1 US D1019581S1 US 202229861167 F US202229861167 F US 202229861167F US D1019581 S USD1019581 S US D1019581S
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United States
Prior art keywords
semiconductor manufacturing
manufacturing equipment
tube
inner tube
reaction tube
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US29/861,167
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English (en)
Inventor
Atsushi Hirano
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIRANO, ATSUSHI
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US29/861,167 2022-05-30 2022-11-28 Inner tube of reaction tube for semiconductor manufacturing equipment Active USD1019581S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-011409D 2022-05-30
JP2022011409F JP1731673S (enrdf_load_stackoverflow) 2022-05-30 2022-05-30

Publications (1)

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USD1019581S1 true USD1019581S1 (en) 2024-03-26

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US (1) USD1019581S1 (enrdf_load_stackoverflow)
JP (1) JP1731673S (enrdf_load_stackoverflow)
TW (1) TWD232581S (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1051061S1 (en) 2023-05-05 2024-11-12 Molex, Llc Connector
USD1054992S1 (en) * 2023-05-05 2024-12-24 Molex, Llc Connector
USD1065091S1 (en) 2023-05-05 2025-03-04 Molex, Llc Connector
USD1069716S1 (en) * 2023-05-05 2025-04-08 Molex, Llc Connector

Citations (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637153A (en) * 1993-04-30 1997-06-10 Tokyo Electron Limited Method of cleaning reaction tube and exhaustion piping system in heat processing apparatus
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers
USD552047S1 (en) * 2005-02-28 2007-10-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20080205864A1 (en) * 2007-02-28 2008-08-28 Tokyo Electron Limited Heat processing furnace and vertical-type heat processing apparatus
US20080232787A1 (en) * 2007-03-20 2008-09-25 Takashi Ichikawa Heat processing furnace and vertical-type heat processing apparatus
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD619630S1 (en) * 2007-05-08 2010-07-13 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20120186573A1 (en) * 2011-01-21 2012-07-26 Jdira Lucian C Thermal processing furnace and liner for the same
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
JP1563524S (enrdf_load_stackoverflow) 2016-03-30 2016-11-21
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD843958S1 (en) * 2017-08-10 2019-03-26 Kokusai Electric Corporation Reaction tube
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
JP1644260S (enrdf_load_stackoverflow) 2019-03-20 2019-10-28
US11015248B2 (en) * 2018-05-25 2021-05-25 Kokusai Electric Corporation Substrate processing apparatus and method of manufacturing semiconductor device
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD958093S1 (en) * 2019-11-28 2022-07-19 Kokusai Electric Corporation Boat of substrate processing apparatus
USD965542S1 (en) * 2020-03-19 2022-10-04 Kokusai Electric Corporation Boat of substrate processing apparatus
USD981971S1 (en) * 2021-03-15 2023-03-28 Kokusai Electric Corporation Boat of substrate processing apparatus
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
US20230221700A1 (en) * 2020-09-28 2023-07-13 Kokusai Electric Corporation Temperature control method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1682719S (enrdf_load_stackoverflow) 2020-06-15 2021-04-05

Patent Citations (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637153A (en) * 1993-04-30 1997-06-10 Tokyo Electron Limited Method of cleaning reaction tube and exhaustion piping system in heat processing apparatus
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
USD423463S (en) * 1997-01-31 2000-04-25 Tokyo Electron Limited Quartz process tube
USD424024S (en) * 1997-01-31 2000-05-02 Tokyo Electron Limited Quartz process tube
USD551634S1 (en) * 2005-02-28 2007-09-25 Tokyo Electron Limited Wafer-boat for heat-processing of semiconductor wafers
USD552047S1 (en) * 2005-02-28 2007-10-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD600659S1 (en) * 2006-09-12 2009-09-22 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
US20080205864A1 (en) * 2007-02-28 2008-08-28 Tokyo Electron Limited Heat processing furnace and vertical-type heat processing apparatus
US20080232787A1 (en) * 2007-03-20 2008-09-25 Takashi Ichikawa Heat processing furnace and vertical-type heat processing apparatus
USD594488S1 (en) * 2007-04-20 2009-06-16 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD619630S1 (en) * 2007-05-08 2010-07-13 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD611013S1 (en) * 2008-03-28 2010-03-02 Tokyo Electron Limited Process tube for manufacturing semiconductor wafers
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
US20120186573A1 (en) * 2011-01-21 2012-07-26 Jdira Lucian C Thermal processing furnace and liner for the same
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD720308S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD724551S1 (en) * 2011-11-18 2015-03-17 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD711843S1 (en) * 2013-06-28 2014-08-26 Hitachi Kokusai Electric Inc. Reaction tube
USD719114S1 (en) * 2013-06-28 2014-12-09 Hitachi Kokusai Electric Inc. Reaction tube
USD720707S1 (en) * 2013-06-28 2015-01-06 Hitachi Kokusai Electric Inc. Reaction tube
USD725055S1 (en) * 2013-06-28 2015-03-24 Hitachi Kokusai Electric Inc. Reaction tube
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD772824S1 (en) * 2015-02-25 2016-11-29 Hitachi Kokusai Electric Inc. Reaction tube
USD770993S1 (en) * 2015-09-04 2016-11-08 Hitachi Kokusai Electric Inc. Reaction tube
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
JP1563524S (enrdf_load_stackoverflow) 2016-03-30 2016-11-21
USD800080S1 (en) * 2016-03-30 2017-10-17 Tokyo Electron Limited Reactor tube for semiconductor production devices
USD842824S1 (en) * 2017-08-09 2019-03-12 Kokusai Electric Corporation Reaction tube
USD842823S1 (en) * 2017-08-10 2019-03-12 Kokusai Electric Corporation Reaction tube
USD843958S1 (en) * 2017-08-10 2019-03-26 Kokusai Electric Corporation Reaction tube
JP1605462S (enrdf_load_stackoverflow) * 2017-08-10 2021-05-31
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
US11015248B2 (en) * 2018-05-25 2021-05-25 Kokusai Electric Corporation Substrate processing apparatus and method of manufacturing semiconductor device
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
JP1644260S (enrdf_load_stackoverflow) 2019-03-20 2019-10-28
USD901406S1 (en) 2019-03-20 2020-11-10 Kokusai Electric Corporation Inner tube of reactor for semiconductor fabrication
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD958093S1 (en) * 2019-11-28 2022-07-19 Kokusai Electric Corporation Boat of substrate processing apparatus
USD931823S1 (en) * 2020-01-29 2021-09-28 Kokusai Electric Corporation Reaction tube
USD986826S1 (en) * 2020-03-10 2023-05-23 Kokusai Electric Corporation Reaction tube
USD965542S1 (en) * 2020-03-19 2022-10-04 Kokusai Electric Corporation Boat of substrate processing apparatus
US20230221700A1 (en) * 2020-09-28 2023-07-13 Kokusai Electric Corporation Temperature control method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus
USD981971S1 (en) * 2021-03-15 2023-03-28 Kokusai Electric Corporation Boat of substrate processing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1051061S1 (en) 2023-05-05 2024-11-12 Molex, Llc Connector
USD1054992S1 (en) * 2023-05-05 2024-12-24 Molex, Llc Connector
USD1065091S1 (en) 2023-05-05 2025-03-04 Molex, Llc Connector
USD1069716S1 (en) * 2023-05-05 2025-04-08 Molex, Llc Connector

Also Published As

Publication number Publication date
TWD232581S (zh) 2024-08-01
JP1731673S (enrdf_load_stackoverflow) 2022-12-08

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