USD1022907S1 - Tubular reactor - Google Patents
Tubular reactor Download PDFInfo
- Publication number
- USD1022907S1 USD1022907S1 US29/843,558 US202229843558F USD1022907S US D1022907 S1 USD1022907 S1 US D1022907S1 US 202229843558 F US202229843558 F US 202229843558F US D1022907 S USD1022907 S US D1022907S
- Authority
- US
- United States
- Prior art keywords
- tubular reactor
- view
- elevational view
- reactor
- tubular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Description
Claims (1)
- I claim the ornamental design for a tubular reactor, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022-004138D | 2022-03-01 | ||
JP2022004138F JP1731789S (en) | 2022-03-01 | 2022-03-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1022907S1 true USD1022907S1 (en) | 2024-04-16 |
Family
ID=84322450
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/843,558 Active USD1022907S1 (en) | 2022-03-01 | 2022-06-22 | Tubular reactor |
Country Status (3)
Country | Link |
---|---|
US (1) | USD1022907S1 (en) |
JP (1) | JP1731789S (en) |
TW (1) | TWD230584S (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1713189S (en) * | 2021-09-15 | 2022-04-21 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD405431S (en) * | 1997-08-20 | 1999-02-09 | Tokyo Electron Ltd. | Tube for use in a semiconductor wafer heat processing apparatus |
USD405429S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD424024S (en) * | 1997-01-31 | 2000-05-02 | Tokyo Electron Limited | Quartz process tube |
US20030221779A1 (en) * | 2002-03-28 | 2003-12-04 | Kazuyuki Okuda | Substrate processing apparatus |
USD590359S1 (en) * | 2006-02-20 | 2009-04-14 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers or the like |
USD594488S1 (en) * | 2007-04-20 | 2009-06-16 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD618638S1 (en) | 2008-05-09 | 2010-06-29 | Hitachi Kokusai Electric, Inc. | Reaction tube |
USD619630S1 (en) * | 2007-05-08 | 2010-07-13 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD742339S1 (en) | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD770993S1 (en) * | 2015-09-04 | 2016-11-08 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD772824S1 (en) * | 2015-02-25 | 2016-11-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD778457S1 (en) * | 2015-02-23 | 2017-02-07 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD791090S1 (en) * | 2015-09-04 | 2017-07-04 | Hitachi Kokusai Electric Inc. | Reaction tube |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD166710S (en) | 2013-07-08 | 2015-03-21 | 日立國際電氣股份有限公司 | reaction tube |
-
2022
- 2022-03-01 JP JP2022004138F patent/JP1731789S/ja active Active
- 2022-06-15 TW TW111302867F patent/TWD230584S/en unknown
- 2022-06-22 US US29/843,558 patent/USD1022907S1/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD405429S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Processing tube for use in a semiconductor wafer heat processing apparatus |
USD424024S (en) * | 1997-01-31 | 2000-05-02 | Tokyo Electron Limited | Quartz process tube |
USD405431S (en) * | 1997-08-20 | 1999-02-09 | Tokyo Electron Ltd. | Tube for use in a semiconductor wafer heat processing apparatus |
US20030221779A1 (en) * | 2002-03-28 | 2003-12-04 | Kazuyuki Okuda | Substrate processing apparatus |
USD590359S1 (en) * | 2006-02-20 | 2009-04-14 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers or the like |
USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD594488S1 (en) * | 2007-04-20 | 2009-06-16 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD619630S1 (en) * | 2007-05-08 | 2010-07-13 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
USD618638S1 (en) | 2008-05-09 | 2010-06-29 | Hitachi Kokusai Electric, Inc. | Reaction tube |
USD742339S1 (en) | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD778457S1 (en) * | 2015-02-23 | 2017-02-07 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD772824S1 (en) * | 2015-02-25 | 2016-11-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD770993S1 (en) * | 2015-09-04 | 2016-11-08 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD791090S1 (en) * | 2015-09-04 | 2017-07-04 | Hitachi Kokusai Electric Inc. | Reaction tube |
Also Published As
Publication number | Publication date |
---|---|
TWD230584S (en) | 2024-04-01 |
JP1731789S (en) | 2022-12-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |