US8039760B2 - Mounting board and method of producing the same - Google Patents

Mounting board and method of producing the same Download PDF

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Publication number
US8039760B2
US8039760B2 US12/822,611 US82261110A US8039760B2 US 8039760 B2 US8039760 B2 US 8039760B2 US 82261110 A US82261110 A US 82261110A US 8039760 B2 US8039760 B2 US 8039760B2
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United States
Prior art keywords
conductive elements
mounting board
electronic component
lands
solder pieces
Prior art date
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Expired - Fee Related
Application number
US12/822,611
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English (en)
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US20100258341A1 (en
Inventor
Tomoharu Sagawa
Atsushi Kume
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Fujikura Ltd
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Fujikura Ltd
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Assigned to FUJIKURA LTD. reassignment FUJIKURA LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUME, ATSUSHI, SAGAWA, TOMOHARU
Publication of US20100258341A1 publication Critical patent/US20100258341A1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the present invention relates to a mounting board and a method of producing the same. More particularly, the invention relates to a mounting hoard which ensures excellent connection reliability and on which small electronic components can be mounted.
  • Electronic components have been mounted on a circuit board or other substrate using solder or a conductive adhesive.
  • connection terminal structure includes a wiring board 101 having a wiring pattern formed thereon.
  • the wiring pattern includes first lands 102 .
  • Second lands 103 made from a metallic material with poor solderability are provided on the first lands 102 .
  • Third lands 104 made from precious metal material with good solderability are provided on the second lands 103 for soldering.
  • the second lands 103 define a surface to exclude solder pieces 106 at an outer periphery of the third lands 104 .
  • Electrode sections 141 of an electronic component 140 and the wiring board 101 are electrically connected together via the solder pieces 106 .
  • the wiring board 101 is made from epoxy resin, ceramic or alumina, and the wiring pattern therefore is a copper circuit. Accordingly, the structure disclosed in Patent Document 1 addresses typical problems relating to soldering on copper wiring, including a problem of separation of lands for soldering (namely, the third land 104 ) and the solder pieces 106 .
  • the membrane circuit board includes a polyethylene terephthalate (hereinafter referred to as PET) substrate on which a printed silver paste circuit is formed.
  • PET polyethylene terephthalate
  • low-temperature solder with a soldering temperature of about not more than 165° C.
  • FIG. 13A is a cross-sectional view schematically showing an exemplary mounting board in which an electronic component is mounted on a membrane circuit board using a conductive adhesive.
  • a conductive paste circuit 220 provided on a substrate 210 is electrically connected to electrode sections 241 of an electronic component 240 via conductive adhesive pieces 260 ( 260 a ). Outer peripheral areas of the conductive adhesives 260 a are sealed with sealing resin 261 adhering thereto.
  • adhesive strength between the electronic component 240 and the substrate 210 is determined by epoxy resin contained in the conductive adhesive pieces 260 or by the sealing resin 261 . Unlike connection by soldering, no metal connection is established in the mounting board of FIG. 13A , a connection state is therefore unstable that can cause poor conductivity.
  • the conductive adhesive pieces 260 typically include silver powder and epoxy resin as principal components.
  • the silver component in the conductive adhesive pieces 260 is incompatible with the tin component and they may cause galvanic corrosion.
  • moisture ingression into an epoxy resin component at an interface of the conductive adhesive pieces 260 and the connecting sections of the electrode sections 241 may cause local cell corrosion (i.e., galvanic corrosion).
  • tin may be dissolved or oxidized to cause poor connectivity.
  • a binder with reduced hygroscopicity should be employed to inhibit moisture ingression.
  • the conductive adhesive pieces 260 a may be deformed and extended during mounting of the electronic component 240 . In a subsequent heating process, the conductive adhesive pieces 260 a may lose viscosity and then flow out of the applied place. As a result, two conductive adhesive pieces 260 a are flown into space 250 to unite together as shown in FIG. 13B . To prevent occurrence of such a phenomenon, the distance between the two conductive adhesive pieces 260 a should be increased to some extent. It is therefore difficult to mount small electronic components on the conventional mounting board.
  • the invention has been made in view of the aforementioned circumstances, and an object thereof is to provide a mounting board which ensures excellent connection reliability and on which small electronic components can be mounted.
  • Another object of the invention is to provide a method of producing a mounting board on which tin-plated small electronic components can be mounted with improved yields of products.
  • a mounting board includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin.
  • the second element further contains silver.
  • the insulative base is made from polyethylene terephthalate.
  • the lands are larger than the second conductive elements.
  • resin is disposed at least between the electronic component and the insulative base.
  • a method of producing a mounting board is a method of producing a mounting board which includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin, the method including: forming the first conductive elements and the second conductive elements on the insulative base; forming the solder pieces on the second conductive elements; and mounting the electronic component with each of the electrode sections contacting with each of the solder pieces.
  • resin is provided between the electronic component and the insulative base and at least between the electronic component and the insulative base is filled with the resin.
  • the electrode sections of the electronic component and the second conductive elements are electrically connected together using not a silver-containing conductive adhesive but tin-containing solder.
  • the second conductive elements and the electrode sections are electrically connected together by metal connection, stable conduction can be established and the connection reliability can be improved.
  • the solder pieces are not likely to lose viscosity and flow out to be electrically connected together. Thus, the distance between the solder pieces can be reduced. Accordingly, a mounting board on which small electronic components can be mounted is provided.
  • the second conductive elements and the electrode sections of the electronic component are electrically connected together by soldering.
  • the solder pieces are thus not likely to lose viscosity and be electrically connected together during production of the mounting board unlike those using a conductive adhesive. Therefore, yields of products can be improved.
  • the distance between the solder pieces can be reduced and thus small electronic components can be mounted on the mounting board.
  • FIG. 1 is a cross-sectional view schematically showing a mounting board according to a first embodiment of the invention.
  • FIG. 2A is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the first embodiment.
  • FIG. 2B is a cross-sectional process diagram schematically showing the method of producing the mounting board according to the first embodiment.
  • FIG. 2C is a cross-sectional process diagram schematically showing the method of producing the mounting board according to the first embodiment.
  • FIG. 2D is a cross-sectional process diagram schematically showing the method of producing the mounting board according to the first embodiment.
  • FIG. 3A is a cross-sectional view schematically showing a mounting board according to a modified embodiment of the invention.
  • FIG. 3B is a plan view schematically showing the mounting board according to the modified embodiment.
  • FIG. 3C is a plan view schematically showing a vicinity of a land of the mounting board according to the modified embodiment.
  • FIG. 4A is a cross-sectional view schematically showing a mounting board according to a second embodiment of the invention.
  • FIG. 4B is a cross-sectional view schematically showing a modified embodiment of the mounting board according to the second embodiment.
  • FIG. 5A is a cross-sectional view schematically showing a mounting board according to a third embodiment of the invention.
  • FIG. 5B is a plan view schematically showing the mounting board according to the third embodiment.
  • FIG. 5C is a plan view schematically showing a vicinity of a land of the mounting board according to the third embodiment.
  • FIG. 6A is a cross-sectional view schematically showing a mounting board according to a fourth embodiment of the invention.
  • FIG. 6B is a plan view schematically showing the mounting board according to the fourth embodiment.
  • FIG. 7A is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fourth embodiment.
  • FIG. 7B is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fourth embodiment.
  • FIG. 7C is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fourth embodiment.
  • FIG. 7D is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fourth embodiment.
  • FIG. 7E is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fourth embodiment.
  • FIG. 8A is a cross-sectional view schematically showing a mounting board according to a fifth embodiment of the invention.
  • FIG. 8B is a plan view schematically showing the mounting board according to the fifth embodiment.
  • FIG. 9A is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fifth embodiment.
  • FIG. 9B is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fifth embodiment.
  • FIG. 9C is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fifth embodiment.
  • FIG. 9D is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fifth embodiment.
  • FIG. 9E is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fifth embodiment.
  • FIG. 9F is a cross-sectional process diagram schematically showing a method of producing the mounting board according to the fifth embodiment.
  • FIG. 10A is an image of a cross section of the mounting board according to the first embodiment of the invention photographed by using an electron microscope.
  • FIG. 10B shows distribution of copper in the image of FIG. 10A .
  • FIG. 10C shows distribution of silver in the image of FIG. 10A .
  • FIG. 11A shows a result of elemental analysis of an inside of a second conductive elements.
  • FIG. 11B shows a result of elemental analysis of a vicinity of an interface of the second conductive elements and solder.
  • FIG. 12 is a cross-sectional view schematically showing an exemplary conventional mounting board.
  • FIG. 13A is a cross-sectional view schematically showing another exemplary conventional mounting board.
  • FIG. 13B is a cross-sectional view schematically showing another exemplary conventional mounting board.
  • FIG. 14 is a cross-sectional view schematically showing a further exemplary conventional mounting board.
  • mounting board 10 insulative base 21: first conductive elements 21b: land 22: second conductive elements 30 (30A and 30B): solder 40: electronic component 41 (41A and 41B): electrode section 42: main body 50: space 60: resin 70: resist
  • FIG. 1 is a cross-sectional view schematically showing an exemplary mounting board according to the invention.
  • a mounting board 1 of the invention schematically includes: an insulative base 10 ; a plurality of first conductive elements 21 provided on the insulative base 10 and having lands 21 b ; a plurality of second conductive elements 22 disposed on the lands 21 b ; a plurality of solder pieces 30 each disposed on each of the second conductive elements 22 ; and an electronic component 40 which includes electrode sections 41 each contacting each of the solder pieces 30 .
  • the first conductive elements 21 are made from a first element that contains at least silver.
  • the second conductive elements 22 are made from a second element that contains at least copper.
  • the solder pieces 30 are made from a third element that contains at least tin.
  • the insulative base 10 is made from resin, glass or other materials, among which resin is preferred for its flexibility.
  • a film-shaped resin sheet made from PET is preferably used.
  • the first conductive elements 21 and the second conductive elements 22 are disposed on a surface 10 a of the insulative base 10 and are conducted with the electrode sections 41 of the electronic component 40 .
  • the first conductive elements 21 are covered with unillustrated resist such that areas other than the lands 21 b of the first conductive elements 21 and vicinities thereof are not exposed.
  • the resist may be a conventionally well-known material.
  • a plurality of the first conductive elements 21 , a plurality of the second conductive elements 22 , a plurality of the solder pieces 30 , and a plurality of the electrode sections 41 of the electronic component 40 may be provided in space section 50 defined by the insulative base 10 and the main body 42 of the electronic component 40 . These components may be electrically connected to one another.
  • the first conductive elements 21 and the second conductive elements 22 are preferably made from materials having similar resistance values and mutually causing minimum chemical reaction at an interface therebetween.
  • the first conductive elements 21 may be made from a first element which contains at least silver.
  • the first element may be, in addition to silver, an alloy of platinum, gold, nickel, palladium and other substances.
  • the second conductive elements 22 may preferably be made from a second element which contains copper having similar resistance value to that of silver, and being not likely to cause chemical reaction at interfaces with the first conductive elements 21 .
  • the second element may be, in addition to copper, an alloy of silver, gold, platinum, nickel, palladium and other substances.
  • the first conductive elements 21 and the second conductive elements 22 may have thickness of, for example, 1 to 100 ⁇ m.
  • the solder pieces 30 ( 30 A, 30 B) electrically connects the second conductive elements 22 and the electrode sections 41 of the electronic component 40 .
  • the solder pieces 30 are made from a third element which contains at least tin.
  • the third element may preferably be made from a material further containing bismuth, which is compatible with the electrode sections 41 that may contain tin.
  • the solder pieces 30 may be, for example, Sn—Bi solder.
  • the content of Bi can be suitably adjusted depending on the electrode sections 41 of the electronic component 40 , the insulative base 10 , the second conductive elements 22 and other components to which the solder pieces 30 may be applied.
  • the solder pieces 30 may be Sn 42 Bi 58 solder.
  • soldering to the insulative base 10 which is a membrane circuit board made from a film such as PET
  • typical lead-free solder that requires soldering temperature of not less than 180° C. may cause damage to the insulative base 10 . Therefore, Sn—Bi low-temperature solder with soldering temperature of not more than 165° C. is preferably used.
  • the electronic component 40 is electrically connected to the first conductive elements 21 and the second conductive elements 22 on the insulative base 10 .
  • the electronic component 40 includes a main body 42 and electrode sections 41 electrically connected to the second conductive elements 22 .
  • the main body 42 is not particularly limited, and may be a well-known material.
  • Each of the electrode sections 41 is provided to extend from a first surface 40 a to a second surface 40 c via a side surface 40 b of the electronic component 40 as shown in FIG. 1 .
  • the electrode sections 41 may be made from any well-known material, such as tin, gold and copper.
  • Each of the electrode sections 41 may be provided to extend from the first surface 40 a to the side surface 40 b of the electronic component 40 .
  • the electrode sections 41 may be disposed only on the first surface 40 a of the electronic component 40 of the main body 42 which faces the insulative base 10 . Areas of the electrode sections 41 may be extended to reach the side surface 40 b of the electronic component 40 to establish conduction with the solder pieces 30 . Thus, contact areas of the solder pieces 30 and the electrode sections 41 increase to improve connection reliability.
  • the electrode sections 41 may be disposed at corners of the electronic component 40 to provide electrical connection with the solder pieces 30 on three surfaces, thereby providing further increased contact areas and thus improving connection reliability. As shown in FIG. 1 , with the electrode sections 41 provided to extend from the first surface 40 a to the second surface 40 c of the electronic component 40 , the electronic component 40 can be conducted with other substrates or other electronic components at the second surface 40 c side.
  • the second conductive elements 22 and the electrode sections 41 of the electronic component 40 are electrically connected together by metal connection using the solder pieces 30 .
  • the connection is stable and poor conduction is reduced.
  • the solder pieces 30 are not likely to lose viscosity and flow out to be electrically connected together. The distance between the solder pieces 30 can therefore be reduced. In this manner, the mounting board 1 on which small electronic components 40 can be mounted is provided.
  • the first conductive elements 21 are made from the silver-containing first element and the second conductive elements 22 are made from the copper-containing second element.
  • the tin-containing solder pieces 30 such as low-temperature solder having poor solderability with the first conductive elements 21 but having high solderability with the second conductive elements 22 may be employed to improve connection reliability between the solder pieces 30 and the second conductive elements 22 .
  • galvanic corrosion is not likely to occur in the connection of the tin-containing solder pieces 30 and the copper-containing second conductive elements 22 .
  • the tin-containing solder pieces 30 ensures stable connection with the electrode sections 41 made of any one of tin, copper, gold, and other substances. Accordingly, connection reliability between the solder pieces 30 and the second conductive elements 22 and between the solder pieces 30 and the electrode sections 41 can be improved. Since copper contained in the second conductive elements 22 has similar resistance value to that of silver contained in the first conductive elements 21 , chemical reaction is not likely to occur in the interfaces between the first conductive elements 21 and the second conductive elements 22 . In this manner, the mounting board 1 A with improved connection reliability is provided.
  • the first element made from, for example, silver paste is applied to the surface 10 a of the insulative base 10 by, for example, screen printing.
  • the first element is then dried by heat to provide the first conductive elements 21 with lands 21 b formed thereon.
  • the second element made from, for example, copper paste is applied to the lands 21 b of the first conductive elements 21 by, for example, screen printing.
  • the second element is then dried by heat to provide the second conductive elements 22 .
  • solder pieces 30 e.g., Sn/Bi low-temperature solder pieces 30 made from the tin-contained third element, are applied to the second conductive elements 22 by, for example, screen printing or dispensing. Distance between adjacent solder pieces 30 and distance between the insulative base 10 and the electronic component 40 can be suitably adjusted depending on the electronic component 40 to be mounted.
  • the electrode sections 41 of the electronic component 40 are aligned with the positions to which the solder pieces 30 are applied. Each of the electrode sections 41 is made into contact with each of the solder pieces 30 , and then heated to mount the electronic component 40 .
  • the mounting board 1 A of the present embodiment is provided.
  • the second conductive elements 22 and the electrode sections 41 of the electronic component 40 are electrically connected together via the solder pieces 30 .
  • the solder pieces 30 are not likely to lose viscosity and the solder pieces 30 A and 30 B are not likely to flow out to be electrically connected together.
  • the distance between the solder pieces 30 A and 30 B can be reduced, thereby allowing the small electronic component 40 to be mounted. Due to a self-alignment property of the solder pieces 30 , the electronic component 40 can be mounted more precisely as compared to those using conductive paste.
  • FIGS. 3A , 3 B and 3 C schematically show an exemplary mounting board 1 B according to a modified embodiment of the present embodiment.
  • FIG. 3A is a cross-sectional view and
  • FIG. 3B is a plan view of the mounting board 1 B.
  • FIG. 3C is a plan view of vicinities of lands 21 b.
  • second conductive elements 22 are larger than the lands 21 b of first conductive elements 21 .
  • the radius R 2 of the second conductive elements 22 is larger than the radius R 1 of the lands 21 b of the first conductive elements 21 by a as shown in FIG. 3C .
  • a is larger than a degree of printing alignment accuracy during production of the second conductive elements 22 , and is not less than 0.2 mm, for example.
  • the second conductive elements 22 are not necessarily formed concentric with the lands 21 b , as shown in FIGS. 3A to 3C .
  • Thickness of the second conductive elements 22 is suitably adjusted depending on the electronic equipment in which the mounting board of the present embodiment is used. If the mounting board is to be bent a plurality of times, thin second conductive elements are preferred. Similarly, as to the size of the second conductive elements 22 , if the mounting board is to be bent a plurality of times, smaller radius R 2 of the second conductive elements 22 is preferred. The radius R 2 of the second conductive elements 22 may be sufficiently large if prevention of migration, galvanic corrosion and short circuit of the solder pieces 30 is more important than the bending property.
  • the solder pieces 30 are not likely to flow into the lands 21 b during melting and curing. Accordingly, the solder pieces 30 and the lands 21 b never come into direct contact with each other. As a result, occurrence of short circuit of the solder pieces 30 and occurrence of galvanic corrosion or migration between the solder pieces 30 and the lands 21 b can be prevented. If the Sn/Bi low-temperature solder having high solderability with copper (i.e., the second conductive elements 22 ) is employed, larger-sized second conductive elements 22 may provide improved connection reliability with the solder pieces 30 .
  • FIG. 4A is a cross-sectional view schematically showing a mounting board 1 C according to a second embodiment of the invention.
  • the mounting board 1 C of the present embodiment differs from the mounting board 1 A of the first embodiment in that resin 60 is provided in space 50 at least between an electronic component 40 and an insulative base 10 .
  • first conductive elements 21 are covered with resist 70 such that areas other than lands 21 b of the first conductive elements 21 and vicinities thereof are not exposed.
  • the resin 60 is not particularly limited so long as it is thermosetting and is used as a non-conductive adhesive agent.
  • Examples of the resin 60 may include epoxy resin and acrylic resin.
  • the resin 60 is disposed in the space 50 between the electronic component 40 and the insulative base 10 so as to adhere to the electronic component 40 and the insulative base 10 , thereby improving fixing strength of the electronic component 40 to the insulating substrate 10 .
  • the resin 60 is provided not only in the space 50 between the electronic component 40 and the insulative base 10 but also over the exposed first conductive elements 21 , the lands 21 b and the second conductive elements 22 to seal the same.
  • the electronic component 240 is also sealed by the resin 262 .
  • the resin 60 is provided to seal the conductive sections and the space 50 without sealing the electronic component 40 . Accordingly, the mounting board 1 C of the present embodiment has achieved an effect, in addition to the effects described above, that electronic components can be mounted with higher density as compared to conventional mounting boards.
  • the resist 70 which is provided to prevent the first conductive elements 21 from exposing may be used to cover areas other than the electronic component 40 and the low-temperature solder pieces 30 instead of the resin 60 which seals the first conductive elements 21 and the second conductive elements 22 so that they are not exposed.
  • Thickness of the resist 70 can be suitably adjusted depending on the electronic equipment or other components in which the mounting board is used, and may be 20 to 40 ⁇ m, for example. Excessively thick resist 70 may impair mounting property (i.e., connectivity and machine strength) in mounting the electronic component 40 . On the contrary, excessively thin resist 70 may hardly demonstrate resist property.
  • the resin 60 may also be applied to the mounting board 1 B according to the modified embodiment as well as to the mounting board of present embodiment to provide the same effects as those of the mounting board 1 C of the second embodiment.
  • FIGS. 5A , 5 B and 5 C schematically show a mounting board 1 E according to a third embodiment of the invention.
  • FIG. 5A is a cross-sectional view and
  • FIG. 5B is a plan view of the mounting board 1 E.
  • FIG. 5C is a plan view of vicinities of lands 21 b .
  • second conductive elements 22 are smaller than the lands 21 b of first conductive elements 21 .
  • the radius R 1 of the lands 21 b of the first conductive elements 21 is larger than the radius R 2 of the second conductive elements 22 by ⁇ as shown in FIG. 5C .
  • ⁇ is larger than a degree of printing alignment accuracy during production of the second conductive elements 22 , and is not less than 0.2 mm, for example.
  • the second conductive elements 22 are not necessarily formed concentric with the lands 21 b.
  • the mounting board 1 E of the present embodiment has achieved an effect, in addition to the effects obtained by the mounting board 1 A of the first embodiment described above, that the mounting board 1 E has greater flexibility as compared to the mounting board 1 B of the modified embodiment since the copper-made second conductive elements 22 are smaller than the lands 21 b of the first conductive elements 21 .
  • the mounting board 1 E of the present embodiment is suitable for an electric apparatus which repeatedly being bent.
  • FIGS. 6A and 6B schematically show a mounting board 1 F according to a fourth embodiment of the invention.
  • FIG. 6A is a cross-sectional view
  • FIG. 6B is a plan view of the mounting board 1 F.
  • the mounting board 1 F of the present embodiment differs from the mounting board 1 E of the third embodiment in that resin 60 is provided at least in space 50 between an electronic component 40 and an insulative base 10 .
  • the resin 60 is the same as that in the second embodiment.
  • the effects of the mounting board 1 B of the second embodiment and the effects of the mounting board 1 E of the third embodiment are obtained in the mounting board 1 F of the present embodiment.
  • areas other than the electronic component 40 and low-temperature solder pieces 30 may be covered with resist 70 instead of the resin 60 so that first conductive elements 21 and second conductive elements 22 are not exposed.
  • resist 70 instead of the resin 60 .
  • moisture ingression due to, for example, dew condensation into the conductive sections (i.e., the first conductive elements 21 , the second conductive elements 22 , the solder pieces 30 and the connection sites thereof) hardly occurs. Accordingly, the mounting board in which migration is not likely to occur can be provided.
  • the first conductive elements 21 and the second conductive elements 22 are formed on a surface 10 a of the insulative base 10 in the same manner as in the first embodiment.
  • Lands 21 b of the first conductive elements 21 are formed larger than the second conductive elements 22 by an amount over a degree of printing alignment accuracy. With this configuration, the second conductive elements 22 are always inside the lands 21 b.
  • the resist 70 is printed by screen printing in areas including the vicinities of the lands 21 b so as to cover the exposed first conductive elements 21 .
  • the resist 70 is then dried.
  • the resin 60 is printed by screen printing on the second conductive elements 22 in areas other than portions where the low-temperature solder pieces 30 are to be applied, on the exposed lands 21 b and on the first conductive elements 21 .
  • the resin 60 is provided in those areas, the first conductive elements 21 and the second conductive elements 22 are not exposed in the subsequent step and the conductive sections (i.e., the first conductive elements 21 , the second conductive elements 22 , the solder pieces 30 and the connection sites thereof) may be sealed with the resin 60 .
  • the low-temperature solder pieces 30 are applied on the second conductive elements 22 in the same manner as in the first embodiment.
  • the electrode sections 41 of the electronic component 40 are aligned with the positions where the solder pieces 30 are applied and the electronic component 40 is mounted.
  • the mounting board is then heated.
  • the mounting board 1 F of the present embodiment is provided.
  • the low-temperature solder pieces 30 are applied to the lands 21 b which were already covered with the resin 60 . There is thus no possibility that the low-temperature solder pieces 30 flow into the lands 21 b during melting and curing of the low-temperature solder pieces 30 . Accordingly, the low-temperature solder pieces 30 and the lands 21 b never come into direct contact with each other. As a result, occurrence of galvanic corrosion or migration between the low-temperature solder pieces 30 and the lands 21 b can be prevented.
  • FIGS. 8A and 8B schematically show a mounting board 10 according to a fifth embodiment of the invention.
  • FIG. 8A is a cross-sectional view
  • FIG. 8B is a plan view of the mounting board 1 G.
  • the mounting board 1 G of the present embodiment differs from the mounting board 1 E of the third embodiment in that resist 70 is provided to cover the second conductive elements 22 , first conductive elements 21 and lands 21 b except for areas where low-temperature solder pieces 30 are disposed on the second conductive elements 22 , and that resin 60 is provided in space 50 so as to adhere to an electronic component 40 and an insulative base 10 .
  • Thickness of the resist 70 can be suitably adjusted depending on the electronic equipment or other components in which the mounting board is used, and may be 20 to 40 ⁇ m, for example. Excessively thick resist 70 may impair mounting property (i.e., connectivity and machine strength) in mounting the electronic component 40 . On the contrary, excessively thin resist 70 may hardly demonstrate resist property.
  • the first conductive elements 21 , the lands 21 b and the second conductive elements 22 are covered with the resist 70 and thus are not exposed.
  • moisture ingression due to, for example, dew condensation into the conductive sections i.e., the first conductive elements 21 , the second conductive elements 22 , the solder pieces 30 and the connection sites thereof
  • migration resistance characteristics of an entire mounting section can be improved.
  • the resin 60 adheres to both the electronic component 40 and the insulative base 10 , thereby improving fixing strength of the entire mounting section.
  • the first conductive elements 21 and the second conductive elements 22 are formed on a surface 10 a of the insulative base 10 in the same manner as in the fourth embodiment.
  • the resist 70 is printed by screen printing so as to cover the first conductive elements 21 , the lands 21 b and the second conductive elements 22 except for portions where the low-temperature solder pieces 30 are applied on the second conductive elements 22 . Then, the resist 70 is heated and dried.
  • the resin 60 is applied on the insulative base 10 by screen printing or dispensing to areas below the electronic component 40 is to be mounted.
  • the low-temperature solder pieces 30 are applied in the same manner as in the first embodiment.
  • the electrode sections 41 of the electronic component 40 are aligned with the areas where the solder pieces 30 are applied and then the electronic component 40 is mounted. Then, the mounting board is heated.
  • the mounting board 1 G of the present embodiment is provided.
  • the resin 60 is applied or printed onto the insulative base 10 after the lands 21 b and the second conductive elements 22 are covered with the resist 70 . Accordingly, the resist 70 disposed at ends of the second conductive elements 22 can prevent ingression of the resin 60 into areas of the second conductive elements 22 to which the solder pieces 30 are applied. Therefore, yields of products can be improved.
  • the second element for forming the second conductive elements 22 further includes silver.
  • the silver-containing second element may include silver-plated copper powder.
  • the copper powder may be silver-plated to prevent oxidization of the copper powder, thereby improving conductivity.
  • FIG. 10A is an image of a cross section of the mounting board according to the first embodiment of the invention photographed by using an electron microscope.
  • the second conductive elements 22 of the mounting board are made from silver-plated copper powder.
  • the mounting board is photographed at 2000-fold magnification.
  • FIG. 10B is an image in which distribution of copper in FIG. 10A is detected.
  • FIG. 10C is an image in which distribution of silver in FIG. 10A is detected.
  • FIG. 11A shows a result of elemental analysis of the inside of second conductive elements 22 made from silver-plated copper powder.
  • FIG. 11B shows a result of elemental analysis by using SEM-EDS of interfaces of the second conductive elements 22 made from silver-plated copper powder and the solder pieces 30 .
  • the second conductive elements 22 are made from silver-plated copper powder
  • a piece of 100- ⁇ m-thick PET film was used as an insulative base.
  • conductive paste consisting mainly of silver filler was applied by screen printing to form a circuit pattern.
  • the film thickness of the circuit pattern was 10 ⁇ m.
  • the conductive paste was then dried by heat and first conductive elements having lands were formed as a circuit on the insulative base.
  • conductive paste consisting mainly of copper filler was applied by screen printing on the lands of the first conductive elements.
  • the conductive paste was then dried by heat to form second conductive elements.
  • solder was applied to the second conductive elements using a dispenser.
  • the solder was applied under following conditions: nozzle diameter was 0.2 mm, air pressure was 60 kPa, discharging duration was 500 msec and distance between the nozzle and the second conductive elements was 0.1 mm.
  • the electronic component was mounted such that the applied Sn/Bi low-temperature solder pieces and electrode sections of the electronic component were electrically connected together.
  • the electronic component herein was a jumper chip resistor of 1.6 ⁇ 0.8 ⁇ 0.45 mm (length ⁇ width ⁇ height) having tin-plated electrode sections.
  • the mounting board was then heated to melt the Sn/Bi low-temperature solder pieces. In this manner, the mounting board of Example 1 was produced.
  • First conductive elements and second conductive elements were formed on the PET film in the same manner as in Example 1.
  • a conductive adhesive was applied to the second conductive elements using a dispenser.
  • the conductive adhesive was applied under following conditions: nozzle diameter was 0.2 mm, air pressure was 50 kPa, discharging duration was 200 msec and distance between the nozzle and the second conductive elements was 0.1 mm.
  • Example 1 An electronic component was mounted using a mounting machine such that its tin-plated electrode sections were aligned with areas to which the conductive adhesive was applied. Then, the conductive adhesive was dried and cured.
  • the electronic component was the same as that of Example 1.
  • thermosetting resin was applied as sealing resin using a dispenser so as to cover four sides of the mounted electronic component.
  • the sealing resin was applied so as not to adhere to an upper surface of the electronic component.
  • Example 1 and Comparative Example Electrical current at 1 mA was applied to the mounting boards of Example 1 and Comparative Example using a constant voltage current generator (R6142 manufacture by Advantest Corporation).
  • the voltage applied between the electronic component and the first conductive elements i.e., the board circuit
  • the resistance (i.e., connection resistance) between the electronic component and the first conductive elements was computed based on the measured voltage.
  • the number of samples measured was 20 for each Example 1 and Comparative Example. Average values of the resistance values ( ⁇ ) obtained from Example 1 and Comparative Example are shown in Table 1.
  • connection resistance of the mounting boards was measured again.
  • connection resistance after the wet heat test increased considerably in Comparative Example. This is because the electrode sections of the electronic component were tin-plated, which was incompatible with the conductive adhesive and thus corrosion occurred in their connection interface. In Example 1, the connection resistance after wet heat was substantially not changed.
  • a mounting board shown in FIGS. 3A to 3C was produced for Example 2.
  • a circuit i.e., first conductive elements
  • Film thickness of the circuit was 10 ⁇ m and a land diameter was 1.2 mm.
  • Conductive paste consisting mainly of copper filler was applied by screen printing to lands to produce copper lands (i.e., second conductive elements).
  • the copper lands were 30 ⁇ m in film thickness and 1.6 mm in diameter.
  • Low-temperature solder pieces were then formed in the same manner as in Example 1, and an electronic component was mounted. In this manner, the mounting board of Example 2 was produced.
  • a mounting board on which resist is provided as shown in FIG. 4B was produced for Example 3.
  • a circuit i.e., first conductive elements
  • copper lands i.e., second conductive elements
  • resist was applied by screen printing to the copper lands so as to cover the circuit and the copper lands except for areas where the low-temperature solder pieces were applied.
  • the resist was then heated and dried.
  • Film thickness of the resist was 20 ⁇ m and a diameter of the areas to which the low-temperature solder pieces were applied (i.e., areas on the copper lands to which no resist was applied) was 1.2 mm.
  • the low-temperature solder pieces were then formed in the same manner as in Example 1, and an electronic component was mounted. In this manner, the mounting board of Example 3 was produced.
  • a mounting board shown in FIGS. 6A and 6B was produced for Example 4.
  • a circuit i.e., first conductive elements
  • copper lands i.e., second conductive elements
  • a diameter of the lands of the circuit was 1.6 mm and a diameter of the copper lands was 1.2 mm.
  • resist was printed by screen printing to vicinities of the lands of the circuit so as to cover the exposed circuit.
  • a thermosetting non-conductive adhesive was applied to the copper lands except for areas to which low-temperature solder was to be applied, to the lands of the exposed circuit and to the circuit by screen printing.
  • thermosetting non-conductive adhesive was 30 ⁇ m and a diameter of the areas to which the low-temperature solder was to be applied (i.e., the areas on the copper lands to which no thermosetting non-conductive adhesive was applied) was 1.2 mm. Low-temperature solder pieces were formed in the same manner as in Example 1 and an electronic component was mounted. In this manner, the mounting board of Example 4 was produced.
  • a mounting board shown in FIGS. 8A and 8B was produced for Example 5.
  • a circuit and copper lands were formed in the same manner as in Example 4. Resist was printed by screen printing so as to cover the circuit, the lands of the circuit and the copper lands except for areas of the copper lands where the low-temperature solder was to be applied. The resist was then heated and dried. A thermosetting non-conductive adhesive was printed by screen printing onto an area below the mounting component. The low-temperature solder pieces were formed in the same manner as in Example 1, and an electronic component was mounted. In this manner, the mounting board of Example 5 was produced.
  • connection resistance As to connection resistance, visual inspection and occurrence of migration was carried out for the obtained mounting boards of Examples 1 to 5 and Comparative Example. The results are shown in Table 2. Evaluation was carried out in the following manner.
  • connection resistance The evaluation method of the connection resistance is described above. The number of samples measured was 20 for each example. Average values of the resistance value ( ⁇ ) obtained in Examples 1 to 5 and Comparative Example are shown in Table 2.
  • Example 1 Example 2
  • Example 3 Example 4
  • Example 5 Connection Resistance ( ⁇ ) 0.309 0.114 0.110 0.110 0.110 0.110 0.110 Visual Inspection (Number BAD (9) GOOD GOOD GOOD GOOD of defective items) Migration (Number of BAD (8) NOT GOOD GOOD GOOD defective items) GOOD (2)
  • connection resistance in Examples 1 to 5 was lower than that of Comparative Example. This means that connection of the electronic component and the board circuit was stable. The connection reliability was improved.
  • defects due to unification of the conductive adhesive pieces were observed in Comparative Example while no defect was observed in Examples 1 to 5. This is because a solder material was used in Examples 1 to 5 and thus self alignment characteristic of the solder prevents occurrence of unification. With this configuration, even small components can be mounted without causing defects.
  • migration occurred in many mounting boards in Comparative Example while migration was effectively suppressed in Example 1. Especially in the mounting boards of Examples 2 to 5 in which resist or an adhesive agent was provided between the electronic component and the PET film, migration was not observed at all and it was confirmed that migration could be prevented more effectively.
  • the electronic components can be stably mounted in Examples 1 to 5 regardless of content of tin in the electrode of the electronic component or size of the electronic component.
  • the resin provided between the electronic component and the insulative base prevented migration and improved fixing strength of the electronic component.
  • the invention can be applied to membrane circuit boards in various electric appliances and electronic equipment.
US12/822,611 2007-12-26 2010-06-24 Mounting board and method of producing the same Expired - Fee Related US8039760B2 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130194710A1 (en) * 2010-08-06 2013-08-01 Phoenix Contact Gmbh & Co. Kg. Thermal overload protection apparatus
US20190075660A1 (en) * 2016-02-18 2019-03-07 Mitsubishi Electric Corporation Electronic device and method of manufacturing the same
US10388464B2 (en) * 2016-09-19 2019-08-20 Biotronik Se & Co. Kg Method for manufacturing a leadless solid electrolyte capacitor and corresponding capacitor
US11212915B2 (en) 2019-03-29 2021-12-28 Murata Manufacturing Co., Ltd. Stretchable mounting board

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Publication number Priority date Publication date Assignee Title
KR20140030918A (ko) * 2012-09-04 2014-03-12 삼성전기주식회사 인쇄회로기판
JP6386854B2 (ja) * 2014-09-29 2018-09-05 日本特殊陶業株式会社 セラミック基板
ITUB20169865A1 (it) * 2016-01-07 2017-07-07 Osram Gmbh Procedimento per montare componenti su un substrato, substrato e dispositivo corrispondenti
JP2018014381A (ja) * 2016-07-20 2018-01-25 富士通株式会社 基板及び電子機器
CN110199579B (zh) * 2017-09-14 2022-07-01 新电元工业株式会社 电子模块以及电子模块的制造方法
TWI736695B (zh) * 2017-10-24 2021-08-21 啟耀光電股份有限公司 電子裝置與其製造方法
JP7167721B2 (ja) * 2019-01-10 2022-11-09 株式会社デンソー 半導体装置およびその製造方法
CN114846911A (zh) * 2020-09-29 2022-08-02 株式会社村田制作所 伸缩性安装基板以及伸缩性安装基板的制造方法
WO2023053412A1 (ja) * 2021-09-30 2023-04-06 株式会社メイコー はんだ実装用ランドを有する基板
WO2023106055A1 (ja) * 2021-12-08 2023-06-15 株式会社村田製作所 伸縮性デバイス

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH043490A (ja) 1990-04-19 1992-01-08 Nippon Chemicon Corp 厚膜集積回路の配線導体の形成方法
JPH04348587A (ja) 1991-05-27 1992-12-03 Matsushita Electric Ind Co Ltd 回路基板およびその製造方法
JPH0669639A (ja) 1992-08-21 1994-03-11 Tdk Corp チップ部品の装着方法
JPH09260822A (ja) 1996-03-18 1997-10-03 Teikoku Tsushin Kogyo Co Ltd 基板への半田による電子部品接続固定構造
JPH11251177A (ja) 1998-10-16 1999-09-17 Murata Mfg Co Ltd チップ部品
US6011313A (en) * 1997-06-23 2000-01-04 Ford Motor Company Flip chip interconnections on electronic modules
US20050029666A1 (en) * 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device
JP2006120677A (ja) 2004-10-19 2006-05-11 Alps Electric Co Ltd 配線基板の接続端子構造
US20090211796A1 (en) * 2005-03-17 2009-08-27 Hitachi Cable, Ltd Electronic device substrate and its fabrication method, and electronic device and its fabrication method
US7768140B2 (en) * 2006-10-03 2010-08-03 Shinko Electric Industries Co., Ltd. Semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461202A (en) * 1992-10-05 1995-10-24 Matsushita Electric Industrial Co., Ltd. Flexible wiring board and its fabrication method
JPH11103142A (ja) * 1997-09-29 1999-04-13 Kyocera Corp 配線基板およびその製造方法
JP2003007937A (ja) * 2001-06-26 2003-01-10 Fujikura Ltd 電子部品実装モジュール及びその製造方法
JP4893104B2 (ja) * 2005-06-08 2012-03-07 日立化成工業株式会社 導電ペーストおよびそれを用いた電子部品搭載基板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH043490A (ja) 1990-04-19 1992-01-08 Nippon Chemicon Corp 厚膜集積回路の配線導体の形成方法
JPH04348587A (ja) 1991-05-27 1992-12-03 Matsushita Electric Ind Co Ltd 回路基板およびその製造方法
JPH0669639A (ja) 1992-08-21 1994-03-11 Tdk Corp チップ部品の装着方法
JPH09260822A (ja) 1996-03-18 1997-10-03 Teikoku Tsushin Kogyo Co Ltd 基板への半田による電子部品接続固定構造
US6011313A (en) * 1997-06-23 2000-01-04 Ford Motor Company Flip chip interconnections on electronic modules
JPH11251177A (ja) 1998-10-16 1999-09-17 Murata Mfg Co Ltd チップ部品
US20050029666A1 (en) * 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device
JP2006120677A (ja) 2004-10-19 2006-05-11 Alps Electric Co Ltd 配線基板の接続端子構造
US20090211796A1 (en) * 2005-03-17 2009-08-27 Hitachi Cable, Ltd Electronic device substrate and its fabrication method, and electronic device and its fabrication method
US7768140B2 (en) * 2006-10-03 2010-08-03 Shinko Electric Industries Co., Ltd. Semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130194710A1 (en) * 2010-08-06 2013-08-01 Phoenix Contact Gmbh & Co. Kg. Thermal overload protection apparatus
US9083174B2 (en) * 2010-08-06 2015-07-14 Phoenix Contact Gmbh & Co. Kg Thermal overload protection apparatus
US20190075660A1 (en) * 2016-02-18 2019-03-07 Mitsubishi Electric Corporation Electronic device and method of manufacturing the same
US10512168B2 (en) * 2016-02-18 2019-12-17 Mitsubishi Electric Corporation Electronic device and method of manufacturing the same
US10388464B2 (en) * 2016-09-19 2019-08-20 Biotronik Se & Co. Kg Method for manufacturing a leadless solid electrolyte capacitor and corresponding capacitor
US11212915B2 (en) 2019-03-29 2021-12-28 Murata Manufacturing Co., Ltd. Stretchable mounting board

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EP2234466A4 (en) 2013-07-10
CN101911845B (zh) 2013-05-22
JPWO2009081929A1 (ja) 2011-05-06
EP2234466B1 (en) 2019-04-10
WO2009081929A1 (ja) 2009-07-02
JP5220766B2 (ja) 2013-06-26
CN101911845A (zh) 2010-12-08

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