US7732228B2 - Method for manufacturing printing head - Google Patents

Method for manufacturing printing head Download PDF

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Publication number
US7732228B2
US7732228B2 US11/477,352 US47735206A US7732228B2 US 7732228 B2 US7732228 B2 US 7732228B2 US 47735206 A US47735206 A US 47735206A US 7732228 B2 US7732228 B2 US 7732228B2
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United States
Prior art keywords
base material
substrate
wiring base
electric wiring
printing head
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US11/477,352
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US20070006459A1 (en
Inventor
Takayuki Ono
Yohei Sato
Satoshi Shimazu
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Canon Inc
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Canon Inc
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Assigned to CANON KABUSHIKI KAISHA reassignment CANON KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMAZU, SATOSHI, SATO, YOHEI, ONO, TAKAYUKI
Publication of US20070006459A1 publication Critical patent/US20070006459A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17559—Cartridge manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17513—Inner structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17526—Electrical contacts to the cartridge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Definitions

  • the present invention relates to a method for manufacturing a printing head in which a resin or metal material is used to form ink ejecting nozzles. Specifically, the present invention relates to a method for manufacturing an printing head in which when a flying lead portion of a substrate having ejection energy generating elements is electrically connected to a flexible wiring base material having a flying lead terminal portion, the substrate having the energy generating elements is connected to the electric wiring base material having the flying leads with the flying lead terminal portion slacked.
  • a printing head used in an ink jet printing apparatus is provided with a printing element substrate from which ink droplets are ejected.
  • the printing element substrate has a plurality of energy generating means (for example, heaters) that generate energy required to eject ink through ink ejection orifices, electric wiring such as Al which supplies power to each energy generating element; the energy generating elements and electric wiring are formed by a film forming technique.
  • a plurality of ink channels and ejection orifices corresponding to printing elements are also formed by a photolithography technique.
  • the printing element substrate connects to an electric wiring base material that applies an electric signal for allowing ink to be ejected to the printing element substrate.
  • the electric wiring base material and printing element substrate are connected together using flying leads connected to the electric wiring base material. In this case, to maintain the connection between the printing element substrate and the electric wiring base material, the flying leads need to be slacked.
  • the substrate having the energy generating elements and the electric wiring base material are laminated to an ink supply member or an ink supply supplementing member.
  • the electric connection portion and flying lead portion are then fixed using a sealing material or the like. Consequently, heat resulting from these steps thermally expands the ink supply member and ink supply supplementing member to pull the laminated electric wiring base material away from the electric connection portion. At this time, if the flying leads are insufficiently slacked, the electric connection portion or flying lead portion may be loaded and disadvantageously cracked or destroyed.
  • Japanese Patent Application Laid-open No. 5-218141 (1993) Such a technique as shown in Japanese Patent Application Laid-open No. 5-218141 (1993) is known as a method for forming a slack shape in the flying lead portion.
  • Japanese Patent Application Laid-open No. 5-218141 (1993) presses an elastomer such as silicone rubber against flying leads (inner leads) of an electric wiring base material (TAB tape) electrically connected to a substrate (semiconductor pellet). The flying lead portion is thus bent and slacked.
  • TAB tape electric wiring base material
  • Another known method for forming a slack shape in the flying lead uses a male mold and a female mold to pre-form a slack shape in the flying lead portion.
  • the conventional technique presses the elastomer or the like against the flying leads electrically connected to the substrate to mechanically bend the flying leads in crank form. This may heavily load the electric connection portion and locally concentrate stress in the flying leads. In particular, if the pitch and width of the flying leads decrease with increasing density of connection terminals of the substrate, the load on the flying leads and electric connection portion further increases. This may make the flying leads or their connection portions more likely to be destroyed, for example, cracked or cut. Furthermore, if an elastomer or the like is pressed against the flying leads, it must be durable.
  • An object of the present invention is to provide a method for manufacturing a printing head that can maintain the appropriate connection between a substrate having ejection energy generating elements and flying leads provided on an electric wiring base material even if heat generated during a manufacture process or the like thermally expands the components, the printing head being able to be inexpensively manufactured using a reduced number of manufacture steps.
  • the present invention is configured as described below.
  • a first aspect of the present invention provides a method for manufacturing a printing head, the method comprising: a connecting step of connecting deformable flying leads provided on an electric wiring base material to electric connection terminals provided on a substrate having ejection energy generating elements that receive electric energy to generate ejection energy required to eject ink; and a mounting step of mounting a unit comprising the electric wiring base material and the substrate connected together during the connecting step, on the printing head main body, wherein the connecting step electrically connects the substrate and the flying leads together with a predetermined distance between the substrate and the flying leads, and the mounting step fixes the unit comprising the substrate and electric wiring base material to the printing head main body so that a distance between the electric connection terminals of the substrate and the electric wiring base material is shorter than the predetermined distance, to form a slack shape bent along a continuous curved surface of each of the flying leads.
  • a second aspect of the present invention provides a method for manufacturing a printing head, the method comprising: a connecting step of connecting deformable flying leads provided on an electric wiring base material to electric connection terminals provided on a substrate having ejection energy generating elements that receive electric energy to generate ejection energy required to eject ink; and a mounting step of mounting a unit comprising the electric wiring base material and substrate connected together during the connecting step, on first and second surfaces formed on the printing head main body at different heights; wherein the connecting step positions the electric connection terminals of the substrate and the wiring substrate via a step amount larger than that which is equal to a difference in height between the first and second surfaces, and connects the flying leads to the electric connection terminals, to form a slack shape bent along a continuous curved surface of each of the flying leads coupling the electric wiring base material mounted on the first surface during the mounting step to the electric connection terminals of the substrate mounted on the second surface during the mounting step.
  • the slack shape of the flying leads can absorb the increased distance. This enables the appropriate connection to be maintained between the flying leads and the substrate. A reliable printing head can thus be manufactured. Further, a slack shape can be formed on each of the flying leads by setting the step amount between the substrate and the flying lead during the step of electrically connecting the substrate and the flying lead provided on the electric wiring base material together. This eliminates the need to provide, for example, a step of newly forming a slack shape. The manufacture costs can thus be reduced.
  • the slack shape is formed on each flying lead. Accordingly, even if the printing head is placed in a heated environment and its parts are thermally expanded to increase the spacing between the substrate and the electric wiring base material, the slack shape formed on the flying lead can absorb the increased spacing. This enables the appropriate connection to be maintained between the flying lead and the substrate.
  • FIG. 1 is a plan view schematically showing an example of an ink jet printing apparatus to which a printing head according to an embodiment of the present invention is applied;
  • FIG. 2 is a perspective view showing an example of configuration of the printing head according to the embodiment of the present invention as viewed from a bottom surface of the printing head;
  • FIG. 3 is an exploded perspective view of the printing head shown in FIG. 2 and from which a printing element substrate and an electric wiring base material have been removed through the bottom of the printing head main body;
  • FIG. 4 is an partly cutaway perspective view showing an example of configuration of a printing element substrate provided in the printing head shown in FIG. 2 ;
  • FIG. 5 is an enlarged sectional view of the printing head shown in FIG. 4 , the view being taken along line V-V of FIG. 2 ;
  • FIG. 6A is sectional view schematically showing that a unit including a printing element substrate and a printing element base material connected together is mounted in the printing head main body according to the embodiment of the present invention
  • FIG. 6B is a sectional view schematically showing receiving jigs used to connect the printing element substrate and an electric wiring base material together;
  • FIGS. 7A to 7E are enlarged sectional views schematically showing a process of fixing the printing element substrate and electric wiring base material to the printing head main body;
  • FIG. 8A is an enlarged sectional view schematically showing that after the process shown in FIGS. 7A to 7E , a sealing compound is applied to the connection portion between the printing element substrate and electric wiring base material;
  • FIG. 8B is an enlarged sectional view showing that heat curing is executed on the printing head shown in FIG. 8A ;
  • FIG. 9A is an enlarged sectional view schematically showing that the unit including the printing element substrate and electric wiring base material connected together is mounted on the printing head main body according to a comparative example of the embodiment of the present invention, which has not been subjected to heat curing yet;
  • FIG. 9B is an enlarged sectional view schematically showing that the unit including the printing element substrate and electric wiring base material connected together is mounted on the printing head main body according to the comparative example of the embodiment of the present invention, which has already been subjected to heat curing.
  • FIG. 1 is a schematic plan view showing an example of an ink jet printing apparatus to which the present invention is applicable.
  • the printing apparatus has a carriage 102 on which printing heads H 1000 and H 1001 are positioned and replaceably mounted.
  • the carriage 102 is provided with an electric connection portion through which a driving signal and the like are transmitted to ejecting portions via external signal connection terminals of the printing heads H 1000 and H 1001
  • the carriage 102 is supported so as to be able to reciprocate along a guide shaft 103 extending in a main scanning direction and installed in the apparatus main body.
  • a print medium 108 such as paper or a plastic thin sheet is fed by an auto sheet feeder (ASF) 132 .
  • the print medium 108 is further conveyed (sub-scanning) through a position (print area) opposite surfaces (ejection orifice surfaces) of the printing heads H 1000 and H 1001 on which ejection orifices are formed.
  • the printing heads H 1000 and H 1001 are mounted on the carriage 102 so that the ejection orifices in each ejecting portion are arranged in a direction (for example, a sub-scanning direction) crossing the main scanning direction of the carriage 102 .
  • ink is ejected from the ejection orifice arrays to execute printing over a width corresponding to the range within which the ejection orifices are arranged.
  • the printing head of the present embodiment is inseparably integrated with ink tanks.
  • the printing head is composed of the first printing head H 1000 and the second printing head H 1001 .
  • the first printing head H 1000 has an ink housing portion in which black ink is filled and an ejecting portion that ejects the black ink supplied from the ink housing portion.
  • the second printing head H 1001 has ink housing potions in which plural color inks (for example, a cyan, magenta, and yellow inks) is filled and ejecting portions that eject the color inks supplied from the respective ink housing portions.
  • the printing heads H 1000 and H 1001 are in cartridge form which is fixedly supported by positioning means and electric contacts and which is removable from the carriage 102 . If any filled ink is consumed and exhausted, the corresponding printing head can be replaced with a new one.
  • the printing head H 1001 is configured similarly to the printing head H 1000 except that it ejects the plural color inks, with its description omitted.
  • FIG. 2 is perspective views showing an example of configuration of the printing head H 1000 , which can be mounted in the printing apparatus in FIG. 1 .
  • FIG. 3 is an exploded perspective view of the printing head H 1000 .
  • the printing head H 1000 comprises an installation guide H 1560 that guides the printing head H 1000 to the installation position of the carriage 102 in the ink jet printing apparatus, and an engaging portion H 1930 that fixedly installs the printing head on the carriage via a fixation lever (not shown) provided on the carriage.
  • the printing head H 1000 further comprises an X direction (main scanning direction) abutting portion H 1570 , a Y direction (sub-scanning direction) abutting portion H 1580 , and a Z direction (vertical direction) abutting portion H 1590 that allow the printing head to be located at a predetermined installation position on the carriage.
  • the printing head is thus positioned on the carriage 102 by these abutting portions to enable external signal connection terminals H 1302 on an electric wiring base material H 1300 to electrically contact pins in an electric connection portion provided in the carriage.
  • FIG. 4 is a perspective view partly exploded in order to illustrate the configuration of the printing element substrate H 1100 .
  • the printing element substrate of the present embodiment uses electrothermal conversion elements that generate, in accordance with an electric signal, thermal energy required to cause film boiling in ink.
  • the electrothermal conversion elements are arranged opposite the ink ejection orifices to eject ink perpendicularly to the main plane of the substrate (this form is referred to as a side shooter).
  • the printing element substrate H 1100 is, for example, an Si (silicon) substrate H 1110 of thickness 0.5 to 1 mm in which a slot-shaped ink supply port H 1102 serving as an ink channel is formed by anisotropic etching utilizing the crystal orientation of Si or sand blasting.
  • Two arrays of the electrothermal conversion elements H 1103 are arranged across the ink supply port H 1102 in the Si substrate H 1110 ; the electrothermal conversion elements H 1103 generate, in accordance with an electric signal, thermal energy required to cause film boiling in ink.
  • the electrothermal conversion elements in one of the arrays are arranged offset from the corresponding electrothermal conversion elements in the other away by half an arrangement pitch in the arrangement direction, that is, in the sub-scanning direction.
  • An ejection orifice forming member is adhered to the printing element substrate H 1100 with the electrothermal conversion elements aligned with the corresponding ejection orifices; the ejection orifice forming member consists of a resin material and has an ink channel wall H 1106 and ejection orifices H 1107 formed by a photolithography technique. This constitutes an ejecting portion H 1108 .
  • Electric wiring, a fuse, a logic circuit, and an electrode portion H 1104 are formed on the Si substrate H 1110 ; the electric wiring consists of Al to supply power to the electrothermal conversion elements H 1103 , the logic circuit that drives the electrothermal conversion elements in accordance with print data, and the electrode portion H 1104 electrically connects these components to external devices.
  • Bumps H 1105 made of Au or the like are formed on the electrode portion H 1104 .
  • the electrothermal conversion elements H 1103 and the like can be formed utilizing an existing film forming technique.
  • ink supplied through the ink channel H 1102 is ejected from the ejection orifices 1107 corresponding to the electrothermal conversion elements H 1103 under the pressure of bubbles generated by heat from the electrothermal conversion elements H 1103 .
  • the elements that generate energy utilized to eject ink are not limited to the electrothermal conversion elements that generate, in response to energization, thermal energy required to heat and bubble ink.
  • Ink may be ejected parallel to the main plane of the substrate on which the electrothermal conversion elements are arranged (this form is referred to as an edge shooter).
  • the electric wiring base material H 1300 forms an electric signal path through which an electric signal that causes ink to be ejected is applied to the printing element substrate H 1100 .
  • the electric wiring base material H 1300 is constructed by forming a wiring pattern of a copper foil on a polyimide base material. An opening is formed in the electric wiring base material H 1300 so that the printing element substrate H 1100 can be incorporated into the opening. Flying leads H 1304 are formed near an edge of the opening and connected to the electrode portion H 1104 of the printing element substrate H 1100 .
  • External signal connection terminals H 1302 are formed on the electric wiring base material H 1300 to receive an electric signal from the main body apparatus. The external signal connection terminals H 1302 are connected, via the flying leads H 1304 , to the conductive wiring pattern of a copper foil or the like formed on the electric wiring base material H 1300 .
  • the electric connection between the electric wiring base material H 1300 and the printing element substrate H 1100 is made by, for example, connecting the bumps H 1105 , formed on the electrode portion H 1104 of the printing element substrate H 1100 , to the flying leads H 1304 of the electric wiring base material H 1300 , corresponding to the electrode portion H 1104 of the printing element substrate H 1100 according to a connection method according to the present invention, described later.
  • Resin is molded to form the printing element substrate H 1100 , which constitutes the ejecting portion, and the printing head main body H 1500 , serving as a supporting member that supports the electric wiring base material H 1300 .
  • 5 to 40% of glass filler is mixed into the resin material in order to improve form rigidity.
  • the glass filler is characterized to change, when contained in the resin, the coefficient of linear expansion of the resin depending on the orientation of the filler.
  • An ink supply port H 1200 is formed downstream of the ink channel in order to supply black ink to the printing element substrate H 1100 .
  • the printing element substrate H 1100 is positionally accurately bonded and fixed to an ink supply holding member H 1500 so that the ink supply port 1102 is in communication with each ink supply port H 1200 in the ink supply holding member H 1500 .
  • FIG. 5 is an enlarged sectional view showing the printing head H 1000 , shown in FIG. 4 , the view being taken along line V-V of FIG. 2 ,
  • the printing element substrate H 1100 and electric wiring base material H 1300 are mounted on the printing head main body H 1500 .
  • a part of the electric wiring base material H 1300 is fixedly bonded, with a second adhesive H 1308 , to a plane formed around the periphery of the ink supply port H 1200 .
  • the electric connection portion between the printing element substrate H 1100 and the electric wiring base material H 1300 is sealed with a first sealing compound 1307 and the second sealing compound 1308 . This protects the electric connection portion from corrosion by ink and external impacts.
  • the first sealing compound H 1308 seals the back surface of the connection portion between the flying leads H 1304 of the electric wiring base material H 1300 and the bumps H 1105 of the printing element substrate H 1100 as well as the outer periphery of the printing element substrate.
  • the second sealing compound H 1308 seals the front of the connection portion.
  • the non-adhered area of the electric wiring base material H 1300 is folded along a side of the main body which is almost orthogonal to a surface of the printing head main body H 1500 which includes the ink supply port H 1200 .
  • Pins H 1317 projecting from sides of the main body are then inserted through holes H 1315 formed in several positions around the area, for example, the four corners of the area. Heat caulking or bonding is then carried out to fix the pins H 1317 .
  • FIG. 6A is an enlarged sectional view schematically showing that the printing element substrate H 1100 and electric wiring base material H 1300 are mounted on the printing head main body H 1500 .
  • the printing head H 1000 is provided with the printing head main body H 1500 , the printing element substrate H 1100 , having the energy generating elements, and the electric wiring base material H 1300 , comprising the flying leads H 1304 connected to the electric connection terminal portions H 1105 provided on the opposite sides of the printing element substrate H 1100 .
  • FIG. 6A shows how one lead of the electric wiring base material H 1300 is connected to a corresponding one of the electric connection terminals H 1105 formed at the respective end of the printing element substrate H 1100 . That is to say, FIG.6A is an enlarged view of the region left of a broken line in FIG. 5 .
  • reference numeral H 1309 denotes an adhesive that fixes the electric wiring base material H 1304 to the main body H 1500 .
  • Reference numeral H 1310 denotes an adhesive that fixes the printing element substrate to the printing head main body H 1500 .
  • FIG. 6B is a diagram showing a jig used to connect the printing element substrate H 1100 and the electric wiring base material H 1300 together.
  • reference numeral 101 denotes a receiving jig that holds the electric wiring base material H 1300 .
  • Reference numeral 102 denotes a receiving jig that holds the printing element substrate H 1100 .
  • At least one of the receiving jigs 101 and 102 can be moved in vertical and horizontal directions by an elevating and lowering mechanism (not shown). This enables adjustment of a step Hg between the bottom surface of the element wiring base material H 1300 held by the receiving jig 101 and the bottom surface of the printing element substrate H 1100 held by the receiving jig 102 . It is possible to adjust the relative positions of the held electric wiring base material H 1300 and printing element substrate H 1100 in the horizontal direction.
  • the electric wiring base material H 1300 having the flying leads H 1304 is fixed to the receiving jig 101 .
  • the printing element substrate H 1100 having the electric connection terminal H 1105 is fixed to the receiving jig 102 .
  • a top surface of the receiving jig 101 is set above a top surface of the receiving jig 102 .
  • the resulting step amount Hg (see FIG. 6B ) has a value (0.85 mm) set on the basis of a value meeting a relation described later.
  • each flying lead H 1304 projects to the space above the corresponding connection terminal H 1105 .
  • the electric connection terminal H 1105 is aligned with the flying lead H 1304 . Consequently, in this aligning step, the flying lead H 1304 and the electric connection terminal H 1105 do not contact each other. This makes it possible to prevent the flying lead H 1304 from being loaded, thus enabling proper alignment.
  • the flying lead H 1304 of the electric wiring base material H 1300 is electrically connected to the electric connection terminal H 1105 .
  • the present embodiment uses a gang bonding manner to make this electric connection.
  • the bonding manner is not limited to the gang bonding manner but may be a single point bonding manner.
  • the flying lead H 1304 connected during this step is substantially straight from its base end to its part contacting the electric connection terminal H 1105
  • the printing element substrate H 1100 and the electric wiring base material H 1300 are removed from the jigs 101 and 102 , respectively; the electric wiring base material H 1300 has the flying leads H 1304 electrically connected to the printing element substrate H 1100 .
  • the printing element substrate H 1100 and electric wiring base material H 1300 are then arranged on the printing head main body H 1500 .
  • the step amount between a top surface H 1504 of step portion H 1502 of the printing head main body H 1500 and a top surface H 1506 of a lower portion H 1505 is set smaller than that between a top surface of the jig 101 and a top surface of the jig 102 .
  • the printing element substrate H 1100 is fixedly bonded, via an adhesive H 1310 , to the top surface H 1506 of the lower portion H 1505 , formed in the printing head main body H 1500 .
  • An adhesive H 1309 is applied to the top surface of the step portion 1502 of the printing head main body H 1500 .
  • the electric wiring base material H 1300 is lowered and fixedly bonded to the top surface of the printing head main body H 1500 via the adhesive H 1309 .
  • the step amount between the top surface H 1504 of step portion H 1502 of the printing head main body H 1500 and the top surface H 1506 of the lower portion H 1505 is set smaller than that between the top surface of the jig 101 and the top surface of the jig 102 .
  • the unit including the printing element substrate H 1100 and electric wiring base material H 1300 connected together is fixed to the printing head main body H 1500 . Then, as shown in FIG. 8A , a heat-hardening sealing compound 1311 is applied to the periphery of the electric connection portion between each flying lead H 1304 and the corresponding electric connection terminal H 1105 .
  • heat curing is executed to harden the applied heat-hardening protect sealing compound H 1311 as shown in FIG. 8B . This reinforces the electric connection portion to protect it from short-circuiting or corrosion resulting from attachment of a liquid such as ink.
  • the heat curing thermally expands the printing head main body H 1500 . Since the electric wiring base material H 1300 and the printing element substrate H 1100 are fixedly bonded to the printing head main body H 1500 , the electric wiring base material H 1300 is pulled away from the electric connection terminals H 1105 of the printing element substrate H 1100 . This increases the distance from the base end of each flying lead H 1304 to the corresponding electric connection terminal H 1105 . However, a slack amount appropriate to deal with the heat curing is preset for the flying leads H 1304 . Thus, even if an increase in distance is caused by the heat curing, the increase in distance is absorbed by a part of the slack amount of the flying leads H 1304 .
  • the flying leads do not go completely slack.
  • a gently bent slack shape is maintained.
  • the continuously gently bent shape of the flying leads H 1304 prevents a possible local marked stress.
  • the present embodiment thus prevents cracks or ruptures caused by thermal expansion of the flying leads H 1304 , resulting in improved reliability.
  • the flying lead H 1304 is not slack or is insufficiently slack after the heat-hardening sealing compound H 1311 has been applied as shown in FIG. 9A , thermal expansion resulting from heat curing applies an excessive tension to the flying lead H 1304 . This may rupture or crack the flying lead H 1304 as shown in FIG. 9B , thus significantly degrading reliability.
  • the sealing compound H 1311 is hardened with the flying lead H 1304 inappropriately electrically connected as described above. This requires an inspection step of checking the connection state, thus complicating the manufacture process to increase manufacture costs.
  • the present embodiment can avoid this situation. Specifically, the present embodiment can greatly improve the reliability of the printing head while simplifying the manufacture process to reduce the manufacture costs.
  • Reference character Lc denotes the distance (see FIG. 5 ) between the ends of connection portions of the right and left flying leads H 1304 connected to the respective electric connection terminals H 1105 ( FIG. 5 shows only one of them), provided at the respective ends of the printing element substrate H 1100 .
  • Reference character Lm denotes the distance (see FIG. 5 ) between one side end surface 1503 and the other side end surface 1503 of the step portion H 1502 of the printing head main body H 1500 .
  • Reference character Hc denotes a thickness (bonding height) from the back surface of the printing element substrate H 1100 to the electric connection terminal H 1105 .
  • Reference character Hs denotes the thickness of the adhesive H 1310 , used to laminate the printing element substrate H 1100 to the printing head main body H 1500 .
  • Reference character Hm denotes the step amount between the top surface H 1504 of step portion H 1502 of the printing head main body H 1500 and the top surface H 1506 of the lower portion H 1505 .
  • Reference character Hk denotes the thickness of the adhesive H 1310 , used to laminate the electric wiring base material H 1300 .
  • Reference character Ht denotes the thickness of wiring protect film of the electric wiring base material H 1300 .
  • Reference character Hg denotes the step amount between the top surface of the receiving jig 101 and the top surface of the receiving jig 102 .
  • the present embodiment uses the above set values to set the step amount Hg between the jigs 101 and 102 on the basis of the following relation:
  • the following table shows an example of parameter values set according to the present embodiment.
  • the step amount Hg between the jigs 101 and 102 was at least 0.79 mm.
  • the step amount Hg was set at 0.85 mm on the basis of the above calculation, the thickness of the printing element substrate H 1100 , the tolerance of the electric wiring base material H 1300 , and the like.
  • the heat-hardening sealing compound is applied to the periphery of electric connection portion between each flying lead and the corresponding electric connection terminal.
  • the present invention is not limited to this sealing compound.
  • a sealing compound that can be hardened at room temperature is also available. This eliminates the heat curing step of hardening the sealing compound. Accordingly, ⁇ T in the above relation may be set depending on the other heating environments.
  • the present invention is applied to the configuration of the printing head H 1101 that ejects black ink.
  • the present invention can provide a similar configuration for a cyan, magenta, and yellow printing heads H 1001 .
  • the types and number of tones (colors and concentrations) of ink used in the printing head may of course be set appropriately.
  • the present invention is applied to the printing head inseparably integrated with the ink housing portion.
  • the present invention does not exclude the form of a printing head separably integrated with ink tanks.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
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JP2005200149A JP4743851B2 (ja) 2005-07-08 2005-07-08 記録ヘッドの製造方法

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US20120300426A1 (en) * 2009-12-02 2012-11-29 Masamichi Yamamoto Connection structure of printed circuit board, method for producing same, and anisotropic conductive adhesive
US8919927B2 (en) 2012-07-24 2014-12-30 Canon Kabushiki Kaisha Liquid ejection head and method of manufacturing the same
US9662885B2 (en) 2013-03-29 2017-05-30 Canon Kabushiki Kaisha Process for producing liquid ejection head

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US7971966B2 (en) * 2006-12-15 2011-07-05 Canon Kabushiki Kaisha Ink jet recording head
JP4994968B2 (ja) * 2007-06-21 2012-08-08 キヤノン株式会社 インクジェットプリントヘッドの製造方法
JP5541656B2 (ja) * 2008-06-17 2014-07-09 キヤノン株式会社 記録ヘッド
JP5340038B2 (ja) * 2008-06-17 2013-11-13 キヤノン株式会社 インクジェット記録ヘッドおよび液体噴射記録ヘッド
JP5541655B2 (ja) * 2008-06-17 2014-07-09 キヤノン株式会社 記録ヘッド
JP5366659B2 (ja) * 2009-05-28 2013-12-11 キヤノン株式会社 液体吐出記録ヘッド
JP6659089B2 (ja) * 2014-05-13 2020-03-04 キヤノン株式会社 液体吐出ヘッド
JP6537242B2 (ja) * 2014-10-14 2019-07-03 キヤノン株式会社 液体吐出ヘッドの製造方法
JP7229753B2 (ja) * 2018-12-18 2023-02-28 キヤノン株式会社 液体吐出ヘッドの製造方法
JP7317627B2 (ja) * 2019-08-09 2023-07-31 キヤノン株式会社 液体吐出用ヘッド及び液体吐出装置

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US8919927B2 (en) 2012-07-24 2014-12-30 Canon Kabushiki Kaisha Liquid ejection head and method of manufacturing the same
US9662885B2 (en) 2013-03-29 2017-05-30 Canon Kabushiki Kaisha Process for producing liquid ejection head

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JP4743851B2 (ja) 2011-08-10
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