US6980432B2 - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

Info

Publication number
US6980432B2
US6980432B2 US10/676,325 US67632503A US6980432B2 US 6980432 B2 US6980432 B2 US 6980432B2 US 67632503 A US67632503 A US 67632503A US 6980432 B2 US6980432 B2 US 6980432B2
Authority
US
United States
Prior art keywords
circuit board
electronic apparatus
casing
top panel
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime, expires
Application number
US10/676,325
Other languages
English (en)
Other versions
US20040066631A1 (en
Inventor
Yoshihiro Natsume
Yutaka Toyama
Takashi Kato
Naohide Kohyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Assigned to YAMAHA CORPORATION reassignment YAMAHA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KATO, TAKASHI, KOHYAMA, NAOHIDE, NATSUME, YOSHIHIRO, TOYAMA, YUTAKA
Publication of US20040066631A1 publication Critical patent/US20040066631A1/en
Application granted granted Critical
Publication of US6980432B2 publication Critical patent/US6980432B2/en
Adjusted expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04H—BROADCAST COMMUNICATION
    • H04H60/00—Arrangements for broadcast applications with a direct linking to broadcast information or broadcast space-time; Broadcast-related systems
    • H04H60/02—Arrangements for generating broadcast information; Arrangements for generating broadcast-related information with a direct linking to broadcast information or to broadcast space-time; Arrangements for simultaneous generation of broadcast information and broadcast-related information
    • H04H60/04—Studio equipment; Interconnection of studios
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans

Definitions

  • the present invention relates to an electronic apparatus, and more specifically, to an electronic apparatus having circuit boards and high load parts that generate heat, arranged in a casing.
  • Japanese Laid-Open Patent Publication (Kokai) No. 2000-049482 discloses a cooling structure for electronic apparatuses which is comprised of a plurality of fans that blow uniform air flows between a plurality of circuit boards mounted in stages in the casing, and guide vanes that guide the uniform air flows.
  • an electronic apparatus comprising a plurality of circuit boards having electronic parts mounted thereon, at least one high load part that generates heat, and a casing that houses the plurality of circuit boards and the at least one high load part and has exhaust ports formed therein for heat radiation, wherein the electronic apparatus is disposed to extend substantially horizontally, and the plurality of circuit boards comprise a first circuit board disposed to extend substantially horizontally and a second circuit board disposed to extend substantially vertically with a horizontal gap provided between the first circuit board and the second circuit board, the at least one high load part is arranged below the horizontal gap, and the exhaust ports are arranged above the horizontal gap.
  • heat generated by high load parts acts to heat the air surrounding these high load parts. Consequently, upward air flows are generated, which pass through the horizontal gap. The upward air flows are discharged through the exhaust ports disposed above the gap.
  • the heat in the casing is discharged to the outside of the casing together with the upward air flows, and therefore the circuit boards and the high load parts can be effectively cooled, to thereby improve the cooling efficiency in the casing without sacrificing cost reduction and designing compact in size.
  • no fan may be provided in the casing if the heat in the casing can be efficiently discharged to the outside of the casing. Even if any fans are used, fans can be used, which consume less power than conventional fans used for ventilating the interior of the casing.
  • the casing comprises a slanted top panel, a front plate, a rear plate, a pair of side plates, and a bottom plate and has a generally wedge-like shape as viewed from a side thereof.
  • Such a shape of the casing can be adopted as the side shape of a mixing apparatus, the side shape of the upper part of a cathode-ray tube television set, or the like.
  • At least one of the first circuit board and second circuit board has mounted thereon electronic parts constituting an audio signal modulating circuit, and the at least one high load part is a power source or an expansion card.
  • the electronic apparatus is a mixing apparatus in which heat tends to accumulate in the casing
  • the heat generated by the high load parts causes the upward air flows, and therefore the circuit boards and the high load parts can be effectively cooled.
  • the exhaust ports are formed at higher locations of the slanted top panel.
  • the plurality of circuit boards include a third circuit board
  • the casing comprises a panel shaft pivoted to an end of the slanted top panel corresponding to the front plate, the slanted top panel being capable of being pivotally moved about the panel shaft, a frame for having mounted thereon the third circuit board between the pair of side plates such that the third circuit board extends substantially horizontally, and a frame shaft pivoted to one end of the frame in a vicinity of a center of each of the pair of side plates, the frame being capable of being pivotally moved about the frame shaft in a direction in which the top panel is pivotally moved.
  • the slanted top panel can be pivotally moved about the panel shaft and the frame can be pivotally moved about the frame shaft so that maintenance can be easily carried out.
  • the panel shaft is pivoted to an end of the slanted top panel corresponding to the front plate, and the frame shaft is pivoted to one end of the frame in the vicinity of the center of each of the pair of side plates, to thereby provide space in the vicinity of the pivoted part of the frame shaft.
  • the electronic apparatus further comprises a fourth circuit board having operating elements mounted thereon, and the slanted top panel has formed therein a plurality of holes and slots through which the operating elements penetrate to project outward of the slanted top panel.
  • the plurality of circuit boards include a fifth circuit board
  • the frame has mounted thereon the third circuit board on which electronic parts are mounted and the fifth circuit board on which other electronic parts are mounted, and the third circuit board and the fifth circuit board are disposed such that surfaces of the third circuit board and the fifth circuit board on which no electronic parts are mounted are opposed to each other.
  • the electronic parts mounted on the third circuit board and other electronic parts mounted on the fifth circuit board can be easily exposed to air flows passing over the respective circuit boards, whereby improved cooling effects can be obtained to enable the electronic parts to stably exhibit their functions.
  • the electronic apparatus is a mixing apparatus for audio signals.
  • FIG. 1 is a perspective view showing the appearance of an electronic apparatus 100 according to a first embodiment of the present invention
  • FIG. 2 is a side view of the electronic apparatus 100 , showing air flows generated inside the electronic apparatus 100 shown in FIG. 1 ;
  • FIG. 3 is a side view of the electronic apparatus 100 , shown in FIG. 1 , schematically showing a top panel 11 and a frame 40 which have been pivotally moved to a position for maintenance;
  • FIG. 4 is a plan view showing the arrangement of component parts inside the electronic apparatus, in which a second circuit board 22 and a third circuit board 23 are mounted on the frame 40 ;
  • FIG. 5 is a plan view showing the arrangement of a power source 31 and expansion slots 32 a on a bottom plate 15 ;
  • FIG. 6 is a side view of an electronic apparatus 100 a according to a second embodiment of the present invention, showing air flows generated inside the electronic apparatus 100 a ;
  • FIG. 7 is a side view of an electronic apparatus 100 b according to a third embodiment of the present invention, showing air flows generated inside the electronic apparatus 100 b.
  • FIG. 1 is a perspective view showing the appearance of an electronic apparatus 100 according to a first embodiment of the present invention.
  • FIG. 2 is a side view of the electronic apparatus 100 , schematically showing air flows generated inside the electronic apparatus 100 shown in FIG. 1 .
  • a casing 10 of the electronic apparatus 100 is comprised of a top panel 11 , a front plate 12 , a rear plate 13 , a pair of side plates 14 , and a bottom plate 15 .
  • the casing 10 has a generally wedge-like shape as viewed from a side thereof.
  • the top panel 11 is formed therein with a plurality of holes and slots through which operating elements such as faders, knobs, push buttons, and a display panel penetrate and project outward of the top panel 11 .
  • the top panel 11 is slanted such that the rear plate 13 is higher in level than the front panel 12 .
  • Exhaust ports 17 are formed in a rear end of the top panel 11 .
  • intake ports 16 are formed in the front panel 12
  • intake ports 16 a are formed in a lower part of the rear plate 13 .
  • the electronic apparatus 100 is implemented as a mixing apparatus for audio signals.
  • the casing 10 of the electronic apparatus 100 houses a first circuit board 21 , a second circuit board 22 , a third circuit board 23 , and a fourth circuit board 24 , on which electronic parts constituting audio signal modulating circuits or the like are mounted, as well as a power source 31 and an expansion card 32 as high load parts that generate heat.
  • the expansion card 32 is inserted into an expansion slot 32 a .
  • a program stored in a ROM in the expansion card 32 is transmitted to a predetermined circuit board via the expansion slot 32 a.
  • the first circuit board 21 and the third circuit board 23 are disposed to extend substantially horizontally.
  • the second circuit 22 is disposed to extend substantially vertically at a location between the first circuit board 21 and the third circuit board 23 with a horizontal gap 80 provided from the third circuit board 23 and the first circuit board 21 , respectively.
  • the fourth circuit board 24 is mounted on a back surface (inner surface) of the top panel 11 such that operating elements mounted on the fourth circuit board 24 penetrate through the holes and slots formed in the top panel 11 and project outward of the top panel 11 .
  • a fifth circuit board 25 is mounted on a back surface of the third circuit board 23 such that their back surfaces (i.e. the surfaces on which no electronic parts are mounted) are opposed to each other.
  • the electronic parts mounted on the fifth circuit board 25 and third circuit board 23 can be easily exposed to air flows passing over the respective circuit boards, whereby improved cooling effects can be obtained to enable the electronic parts to stably exhibit their functions.
  • the power source 31 and the expansion card 32 are arranged on the bottom plate 15 at a location below the horizontal gap 80 .
  • the first circuit board 21 is fixed to the side plates 14 and bottom plate 15 , the third circuit board 23 and the fifth circuit board 25 to the side plates 14 via a frame 40 , and the fourth circuit board 24 to the top panel 11 , by respective fixing means, not shown.
  • FIG. 3 is a side view of the electronic apparatus 100 , shown in FIG. 1 , schematically showing the top panel 11 and the frame 40 which have been pivotally moved to a position for maintenance.
  • a panel shaft 42 is pivoted to an end of the top panel 11 on the front panel 12 side, about which the top panel 11 is pivotally moved to be opened and closed.
  • a frame shaft 41 is pivoted to a front end of the frame 40 corresponding to a front end of the third circuit board 23 at a longitudinally intermediate location in the casing 10 (in the vicinity of a longitudinal center of each of the side plates 14 ).
  • the top panel 11 can be pivotally moved about the panel shaft 42 and the frame 40 can be pivotally moved about the frame shaft 41 so that maintenance can be easily carried out.
  • the frame 40 constitutes a rear panel 130 as a part of the rear plate 13 .
  • the second circuit board 22 is mounted on an inner surface of the rear panel 130 .
  • FIG. 4 is a plan view showing the arrangement of component parts inside the electronic apparatus, in which the second circuit board 22 and the third circuit board 23 are mounted on the frame 40 .
  • FIG. 5 is a plan view showing the arrangement of the power source 31 and the expansion slots 32 a on the bottom plate 15 .
  • the second circuit board 22 is provided with a plurality of input and output terminals 220 to which external audio apparatuses and electronic musical instruments are connected.
  • the input and output terminals 220 are arranged at intervals in the horizontal direction and are connected to the second circuit board 22 .
  • the third circuit board 22 may be provided with a plurality of switches or the like.
  • the opposite sides of the third circuit board 23 which are opposed to the pair of side plates 14 are fixed to the frame 40 . Further, input and output elements 230 such as switches are provided on the third circuit board 23 , which penetrate through openings formed in the top panel 11 and project outward of the top panel 11 .
  • air flows are generated, which pass between the plurality of input and output terminals 220 arranged at intervals, through a space 82 ( FIG. 2 ) located between the front plate 12 and the frame shaft 41 of the third circuit board 23 , and through gaps between the inner peripheries of the plurality of holes and slots in the top panel 11 and the outer peripheries of the input and output members 230 , to further enhance the effects of cooling of the interior of the casing.
  • vertical air flows which are substantially straight in the vertical direction, extending from the power source 31 and expansion card 32 , which act as heat sources, through the horizontal gap 80 to the exhaust ports 17 are formed. Further, electronic parts such as ICs, which generate much heat, are arranged on the second circuit board 22 so that heat generated by these parts can be discharged directly through the vertical air flows. Furthermore, air heated while flowing along the first circuit board 21 and the third circuit board 23 is joined to the vertical air flows.
  • the interior of the casing 10 can be cooled even without using any fans as provided in the conventional electronic apparatus. This makes it possible to reduce the cost and space in the casing required to install fans and eliminate electric noise caused by fans or other noise.
  • the intake ports 16 and 16 a and the exhaust ports 17 may be formed at locations different from those described above; they may be formed in the side plates 14 . However, the intake ports 16 and 16 a should desirably be formed in a lower part of the casing 10 , as shown in FIG. 2 . This enables the creation of air flows upwardly extending from the lower part of the casing 10 to an upper part thereof, which are induced by the above described upward air flows. Particularly, according to the arrangement shown in FIG. 2 , the intake ports 16 and 16 a are arranged such that air introduced through the intake ports 16 and 16 a causes air flows that come into contact with the high load parts. Consequently, the high load parts do not only discharge their own heat through the upward air flows but are also brought into contact with the air flows flowing in through the intake ports 16 and 16 a , so that the high load parts are cooled by outside air.
  • the intake ports 16 and 16 a can be omitted.
  • air can be exhausted not only through the exhaust ports 17 but also through the plurality of holes in the top panel 11 , through which the operating portions are projected.
  • the exhaust ports 17 are formed at the rear panel 13 side end of the top panel 11 , i.e. at higher positions in the casing 10 , the heat in the casing can be efficiently discharged to the outside of the casing 10 together with the upward air flows.
  • FIG. 6 is a side view of an electronic apparatus 100 a according to a second embodiment of the present invention, showing air flows generated inside the electronic apparatus 100 a.
  • the electronic apparatus 100 a according to the second embodiment is distinguished from the electronic apparatus 100 of the first embodiment mainly in that a fan 50 is used and a second circuit board 22 a is separated from the frame 40 .
  • a casing 10 a has exhaust ports 17 a in its rear plate 13 a , and the fan 50 is provided in the casing 10 a . Further, in the present embodiment, the second circuit board 22 a is separated from the frame 40 and fixed to the side plates 14 of the casing 10 a . Except for these, the arrangement of the present embodiment is almost the same as that of the above described first embodiment.
  • heat generated by the power source 31 and expansion card 32 acts to heat the air surrounding the power source 31 and expansion card 32 to generate upward air flows passing through the horizontal gap 80 .
  • the upward air flows are discharged through the exhaust ports 17 a arranged above the gap 80 .
  • the fan 50 creates negative pressure in a region of the interior of the casing 10 a which corresponds to an upper part of the upper panel 11 . This stabilizes the upward air flows.
  • air flows are generated, which enter the intake ports 16 and 16 a , then pass between the circuit boards 21 and 22 a and 24 and a circuit board 23 a , between each of the circuit boards 21 , 22 a , 23 a , and 24 and the casing 10 , and through the horizontal gap 80 , and finally are discharged through the exhaust ports 17 a . Consequently, the interior of the casing 10 a can be efficiently ventilated to effectively cool the circuit boards 21 , 22 a , 23 a , and 24 , the power source 31 , and the expansion card 32 .
  • the fan 50 As the fan 50 , a fan providing output power that can just supplement a spontaneously generated upward air flows may be used. Therefore, the fan 50 may consume less power than conventional fans. Thus, noise can be suppressed to a lower value than the conventional arrangement using fans.
  • FIG. 7 is a side view of an electronic apparatus 100 b according to the third embodiment showing air flows generated inside the electronic apparatus 100 b.
  • the electronic apparatus 100 b according to the third embodiment is distinguished from the electronic apparatus 100 a according to the second embodiment in that a second circuit board 22 b is disposed to extend substantially parallel with the side plates 14 .
  • the present embodiment is intended to solve the problem that heat is generated by ICs and the like mounted on the circuit boards instead of the power source 31 and expansion card 32 , described above. Except for this, the electronic apparatus 100 b is identical in construction with the electronic apparatus 100 a shown in FIG. 5 .
  • ICs 33 as high load parts are mounted on the second circuit board 22 b .
  • the first circuit board 21 and the third circuit board 23 a are disposed to extend substantially horizontally.
  • the second circuit 22 is disposed to extend substantially vertically between the first circuit board 21 and the third circuit board 23 a with the horizontal gap 80 provided between the second circuit 22 and the third circuit board 23 a .
  • the second circuit board 22 b is disposed to extend substantially parallel with the side plates 14 .
  • the second circuit board 22 b is disposed to extend substantially parallel with the side plates 14 , the second circuit board 22 b or one or more other circuit boards, not shown, which are parallel with the second circuit board 22 b , can be cooled without blocking air flows flowing in through the intake ports 16 and passing under the first circuit board 21 .
  • a mixing apparatus for audio signals is illustrated as the electronic apparatus.
  • similar effects can be produced by applying the present invention to other electronic apparatuses such as a personal computer and audio visual equipment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US10/676,325 2002-10-04 2003-09-30 Electronic apparatus Expired - Lifetime US6980432B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-292069 2002-10-04
JP2002292069A JP3815559B2 (ja) 2002-10-04 2002-10-04 電子装置

Publications (2)

Publication Number Publication Date
US20040066631A1 US20040066631A1 (en) 2004-04-08
US6980432B2 true US6980432B2 (en) 2005-12-27

Family

ID=31987204

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/676,325 Expired - Lifetime US6980432B2 (en) 2002-10-04 2003-09-30 Electronic apparatus

Country Status (4)

Country Link
US (1) US6980432B2 (ja)
EP (1) EP1406478B1 (ja)
JP (1) JP3815559B2 (ja)
CN (2) CN1231107C (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080117591A1 (en) * 2006-11-16 2008-05-22 Autonetworks Technologies, Ltd. Electric connection box
US20120069520A1 (en) * 2010-09-22 2012-03-22 Panasonic Corporation Electronic device with cooling capability
US20120174376A1 (en) * 2007-11-12 2012-07-12 Hortig Michael Base element, base system and method for manufacturing another base system

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6922336B2 (en) * 2003-04-11 2005-07-26 Hewlett-Packard Development Company, L.P. Pivoted field replaceable unit apparatus and method
US7345873B2 (en) * 2004-09-29 2008-03-18 General Electric Company System and method for cooling electronic systems
JP5082485B2 (ja) 2007-02-16 2012-11-28 ヤマハ株式会社 音響調節器の筐体構造
US7885066B2 (en) * 2008-07-17 2011-02-08 Juniper Networks, Inc. Airflow/cooling solution for chassis with orthogonal boards
JP5544347B2 (ja) * 2011-10-27 2014-07-09 京セラドキュメントソリューションズ株式会社 操作部ユニットの取付構造及び画像形成装置
JP2014093224A (ja) * 2012-11-05 2014-05-19 Toyota Industries Corp 電池パック
CN107543285B (zh) * 2015-03-05 2020-12-22 广东美的暖通设备有限公司 一种控制器及设有该控制器的中央空调
CN109002137A (zh) * 2018-07-27 2018-12-14 合肥金新允电子技术有限公司 一种分体式散热工控主板

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353173A (en) * 1964-09-09 1967-11-14 Call Boy Systems Inc Multiple signal module hotel call system
US4380947A (en) * 1980-06-20 1983-04-26 Nippon Gakki Seizo Kabushiki Kaisha Portable electronic musical instrument having separable controlling panel and keyboard
US5243493A (en) 1992-04-29 1993-09-07 Industrial Technology Research Institute Fanless convection cooling design for personal computers
US5396398A (en) * 1993-12-21 1995-03-07 Fender Musical Instruments Corporation Portable control console
JP2000049482A (ja) 1998-07-28 2000-02-18 Nec Corp 電子機器の冷却構造
US20010005309A1 (en) * 1999-12-24 2001-06-28 Shizuo Iwasaki Forced ventilation system for electric instruments
US6336691B1 (en) 1999-05-05 2002-01-08 Plug-In Storage Systems, Inc. Storage cabinet for electronic devices
EP1170891A1 (de) 2000-07-04 2002-01-09 Hans-Peter Wilfer Portables Behältnis zur Aufnahme eines ton- oder lichttechnischen Mischpultes
US6349029B1 (en) * 1999-10-20 2002-02-19 Micronpc, Llc Computer component security apparatus and method
US6501650B2 (en) * 2001-03-30 2002-12-31 General Electric Company Series-parallel fans system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851339U (ja) * 1981-09-30 1983-04-07 富士通株式会社 キ−ボ−ド装置
JPS61260698A (ja) * 1985-05-15 1986-11-18 株式会社日立製作所 電子機器の通気構造
JPH0631863B2 (ja) * 1985-08-12 1994-04-27 大成建設株式会社 原子炉の廃止処理工法
JPS6276592A (ja) * 1985-09-27 1987-04-08 日本電気株式会社 多層セラミツク配線基板
JPH118485A (ja) * 1997-06-16 1999-01-12 Nec Corp 電子機器の冷却構造
JPH11330748A (ja) * 1998-05-14 1999-11-30 Seiko Epson Corp 電子機器の放熱構造
JP2001177267A (ja) * 1999-12-15 2001-06-29 Hitachi Telecom Technol Ltd 電子機器
JP2001217578A (ja) * 2000-02-02 2001-08-10 Sony Corp 電気機器

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353173A (en) * 1964-09-09 1967-11-14 Call Boy Systems Inc Multiple signal module hotel call system
US4380947A (en) * 1980-06-20 1983-04-26 Nippon Gakki Seizo Kabushiki Kaisha Portable electronic musical instrument having separable controlling panel and keyboard
US5243493A (en) 1992-04-29 1993-09-07 Industrial Technology Research Institute Fanless convection cooling design for personal computers
US5396398A (en) * 1993-12-21 1995-03-07 Fender Musical Instruments Corporation Portable control console
JP2000049482A (ja) 1998-07-28 2000-02-18 Nec Corp 電子機器の冷却構造
US6222729B1 (en) 1998-07-28 2001-04-24 Nec Corporation Electronic device cooling system having guides for guiding a flow of the air evenly
US6336691B1 (en) 1999-05-05 2002-01-08 Plug-In Storage Systems, Inc. Storage cabinet for electronic devices
US6349029B1 (en) * 1999-10-20 2002-02-19 Micronpc, Llc Computer component security apparatus and method
US20010005309A1 (en) * 1999-12-24 2001-06-28 Shizuo Iwasaki Forced ventilation system for electric instruments
EP1170891A1 (de) 2000-07-04 2002-01-09 Hans-Peter Wilfer Portables Behältnis zur Aufnahme eines ton- oder lichttechnischen Mischpultes
US6501650B2 (en) * 2001-03-30 2002-12-31 General Electric Company Series-parallel fans system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080117591A1 (en) * 2006-11-16 2008-05-22 Autonetworks Technologies, Ltd. Electric connection box
US8654528B2 (en) * 2006-11-16 2014-02-18 Autonetworks Technologies, Ltd. Electric connection box
US20120174376A1 (en) * 2007-11-12 2012-07-12 Hortig Michael Base element, base system and method for manufacturing another base system
US20120069520A1 (en) * 2010-09-22 2012-03-22 Panasonic Corporation Electronic device with cooling capability
US8934241B2 (en) * 2010-09-22 2015-01-13 Panasonic Corporation Electronic device with cooling capability

Also Published As

Publication number Publication date
EP1406478A2 (en) 2004-04-07
JP2004128305A (ja) 2004-04-22
CN2655593Y (zh) 2004-11-10
US20040066631A1 (en) 2004-04-08
EP1406478A3 (en) 2005-07-13
CN1498070A (zh) 2004-05-19
CN1231107C (zh) 2005-12-07
EP1406478B1 (en) 2011-08-24
JP3815559B2 (ja) 2006-08-30

Similar Documents

Publication Publication Date Title
US7447021B2 (en) Air guiding cover
US6980432B2 (en) Electronic apparatus
US5287244A (en) Computer housing with low noise cooling system
US20140078669A1 (en) Display Apparatus and Electronic Apparatus
US7522413B2 (en) Heat dissipating system
US8292705B2 (en) Electronic apparatus, fan unit, and subrack
US9648779B2 (en) Electronic apparatus, such as a modem or the like, comprising a plurality of air-cooled processors
US6781831B1 (en) Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US5751550A (en) Ultra-quiet, thermally efficient cooling system for forced air cooled electronics
US6396684B2 (en) Structure of tower-type personal computer
JPH0385797A (ja) 電気機器の冷却装置
US10820431B2 (en) Electronic apparatus
US20080013276A1 (en) Systems and methods for improved cooling of electrical components
US10278303B2 (en) Electronic apparatus
JP2000232287A (ja) 自然空冷電子機器筐体
JP3570995B2 (ja) 電子回路パッケージの冷却構造
US6759588B1 (en) Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
JP2002185169A (ja) 屋外設置型通信装置
JP2001177267A (ja) 電子機器
JPH07131953A (ja) 電力装置の空冷構造
JP3564453B2 (ja) 電子機器筐体の空冷構造
US6075697A (en) Use of pressurized enclosure for impingement cooling of electronic component
JPH06204675A (ja) 電子装置の冷却構造
JP2828058B2 (ja) 電子機器の冷却構造
JP2005309738A (ja) 電子機器

Legal Events

Date Code Title Description
AS Assignment

Owner name: YAMAHA CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NATSUME, YOSHIHIRO;TOYAMA, YUTAKA;KATO, TAKASHI;AND OTHERS;REEL/FRAME:014577/0674

Effective date: 20030918

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12