US6794727B2 - Single receiving side contactless electronic module continuous manufacturing process - Google Patents

Single receiving side contactless electronic module continuous manufacturing process Download PDF

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Publication number
US6794727B2
US6794727B2 US10/254,736 US25473602A US6794727B2 US 6794727 B2 US6794727 B2 US 6794727B2 US 25473602 A US25473602 A US 25473602A US 6794727 B2 US6794727 B2 US 6794727B2
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United States
Prior art keywords
antenna
microcircuit
module
electronic
cards
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US10/254,736
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US20030025186A1 (en
Inventor
Michel Leduc
Philippe Martin
Richard Kalinowski
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Thales DIS France SA
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Gemplus SA
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    • GPHYSICS
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    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
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Definitions

  • the present invention relates to the field of portable objects such as, in particular, contactless electronic labels and chip cards provided with an electronic module comprising an integrated microcircuit.
  • the invention also relates to a process for manufacturing such modules and such portable objects.
  • Portable objects are already known in the form of contactless cards, of ISO format, which are intended to perform various operations such as, for example, payment operations for transport, telephone or other services. These operations are conducted by means of remote coupling between the card's electronic module and a receiver or reader unit. Coupling may be made in reading mode only or in reading/writing mode.
  • the invention does not only concern cards which operate exclusively without contact. It also relates to mixed or hybrid cards which are able to operate in both modes: without and with contact.
  • These mixed cards are intended, for example, for operations of electronic cash dispensing type for which, after being charged with units of value (monetary units, payment units for various services) they are remote debited by a certain number of these units of value when they are passed in the proximity of a reading terminal: this type of debiting assumes contactless operation. If required, these cards can be re-charged in a purpose-designed dispenser.
  • contactless cards shall be construed as meaning both mixed cards and contactless cards.
  • portable items are known in the form of electronic labels, generally used for various identification or follow-up operations. They are made up firstly of an electronic module with a microcircuit, and secondly of a carrier for this module associated with a coiled antenna operating at relatively low frequency (150 Khz) and of relatively large size in relation to the size of the module.
  • contactless cards also have disadvantages. Such as they are currently produced, contactless cards are portable objects of normalized size.
  • a usual, but in no way restrictive, standard for the present invention is the so-called ISO 7810 standard which corresponds to a card of standard format 85 mm long, 54 mm wide and 0.76 mm thick.
  • each card comprises a card body made up of an assembly of plastic sheets and of an electronic module, embedded in this assembly, comprising an integrated circuit or microcircuit also called a ⁇ chip>> connected via two connection terminals to a coiled antenna of self-inductance type.
  • the chip has a memory and may, in some cases, comprise a microprocessor.
  • the size of the electronic module is substantially smaller than the size of the card, the module generally being positioned in one of the corners of the card, since the mechanical stresses exerted on the module through bending of the card are not as high in the corners as in the centre of the card.
  • a module 21 comprises a module carrier 28 on which is fixed an integrated circuit chip 29 .
  • a coil 30 surmounts chip 29 in such manner as to confer contactless identification capacity upon the module.
  • the antenna is in the form of a coiled air antenna inserted over the chip which gives rise to difficulties relating to production, cost, yield and lack of homogeneous performance.
  • the effective surface area of the antenna is small, which is detrimental to its range.
  • the card in accordance with this document cannot be produced in economic manner. It is known that the size of an elementary semiconductor pad is one of the main cost factors for mass produced integrated circuits. In this document, however, the minimum size of the integrated circuit incorporating the antenna is of about at least 24 mm 2 , whereas cheap contactless cards generally use microcircuits of very small size, of about 1 mm 2 .
  • a plurality of other processes for making contactless cards are also known, such as those described in French patent applications made by the same applicant and filed under numbers 95 400305.9, 95 400365.3 and 95 400790.2. These patent applications all describe a contactless card provided with an antenna whose size is substantially the same as that of the card and is connected to a micromodule carrying the chip.
  • Such antenna has the advantage of having a relatively high range for a given reading or writing magnetic field.
  • the equation which determines the electromotive force E appearing at the terminals of the receiver antenna when it breaks an electromagnetic field is of the following type:
  • K is a constant
  • S is the surface area of an average turn of antenna
  • N is the number of turns coiled to form the antenna
  • indices e and r represent the emitting and receiver sides respectively
  • D is the reading distance, i.e. the distance between the card antenna and the antenna of the outside reader.
  • voltage E To cause the circuits of the card chip to operate in order to initialize and conduct a reading operation, voltage E must be exceed a certain threshold, which is generally in the region of 3 Volts.
  • the efficiency of the antenna at the chosen frequency for reading or writing, will be determined by the overvoltage coefficient of the antenna coil which is given by the equation:
  • L is the coil inductance which increases with coil diameter and the number of turns
  • 2 ⁇ f in which f is the reading frequency which is fixed for a given application
  • R is the electric resistance of the antenna coil, which is proportional to the length of wire of which it is formed.
  • the number N of turns is limited by the width of a turn and the space between two turns which depend upon the technology used for fabrication.
  • the natural tendency to obtain a good antenna for a contactless card is to use on the contactless card an antenna in which the size of each turn is as close as possible to the surface of the card.
  • the contactless cards on the market comprise an antenna integrated into the body of the card close to its periphery.
  • card and antenna assembly often remain complex and costly since the electronic module and antenna coil must be connected by means that are difficult to automate. Further, the assembly undergoes lamination which is a costly process requiring the addition of resin to sink the coil and module in the card in such manner that they do not appear on the surface of the card and do not deform the upper and lower sheets used for colamination.
  • the complexity of the process does not give yields comparable with those achieved for the manufacture of contact cards. This is especially so when integrating the restraints required for certain types of card printing and the possible existence of a magnetic stripe or embossing.
  • the latter must have virtually perfect planarity with defects of less than 6 ⁇ m.
  • embossing materials need to be chosen which are compatible with the card manufacturing process and the antenna must, in particular, leave free the area provided for embossing otherwise it would be damaged during embossing.
  • the purpose of the present invention is to make available non-expensive means which may be used for the manufacture of portable objects of chip card and/or electronic label type.
  • Another objective of the invention is to provide low-cost manufacturing processes for contactless cards and labels allowing reliable, quality manufacture using automated machines.
  • a further objective of the invention is to describe a manufacturing process which can be used to obtain perfectly planar contactless cards.
  • An additional objective of the invention is to make available a process for manufacturing contactless cards which is compatible with all subsequent stages of card body and antenna assembly, in particular with offset card printing, card embossing or the depositing of a magnetic stripe.
  • the invention sets forth an electronic module of a type that is suitable for producing contactless cards and/or contactless electronic labels, and comprising a carrier substrate to carry an electronic microcircuit, said electronic microcircuit being connectable to an antenna in such manner as to enable contactless operation of the module, characterized in that the antenna is wholly arranged on the module and in that it comprises turns made on the plane of the carrier substrate.
  • the invention therefore provides a basic part of small size which may be used virtually indifferently for the production of contactless cards of usual format or small-sized electronic labels, regardless of their shape.
  • the antenna is made up of a spiral whose outer size is in the region of 5 to 15 mm, preferably of about 12 mm, whose ends are connected to contacts of the electronic microcircuit,
  • the antenna is made up of a conductor spiral having between 6 and 50 turns, each turn having a width of approximately 50 to 300 ⁇ m, the space between two contiguous turns being of about 50 to 200 ⁇ m.
  • the spiral forming the antenna is, for example, of substantially circular outer shape, with an outer diameter of about 5 to 15 mm, preferably of about 12 mm.
  • said spiral is of substantially square outer shape, with an outer side measurement of approximately 5 to 15 mm, preferably approximately 12 mm, or of substantially oval outer shape having a larger measurement of approximately 15 mm and a smaller measurement of approximately 5 mm.
  • the microcircuit is placed in the centre of the antenna and on the same side of the module as the antenna, the connection terminals of the antenna being connected to respective corresponding contact pads of the module or microcircuit via conductor leads.
  • the microcircuit is placed on the same side as the antenna astride the latter's turns, the connection terminals of the antenna being connected to respective corresponding contact pads of the module and electronic microcircuit via conductor leads, and an insulator being placed between the microcircuit and at least the underlying area of the antenna.
  • the electronic microcircuit is placed on the side of the module which does not carry the antenna, the connection terminals of the antenna being connected to respective corresponding contact pads of the module or microcircuit via conductor leads crossing over pits made in the module carrier at said connection terminals of the antenna.
  • the electronic module comprises an antenna connected to the microcircuit, and on the other face of the carrier substrate it comprises visible contact pads that are also connected to the microcircuit in such manner as to obtain a hybrid card able to be read and written on via the contacts and/or the antenna.
  • a tuning capacitor is connected in parallel to the terminals of the antenna and of the electronic microcircuit, and its value is chosen so as to obtain a module operating frequency situated in a range of approximately 1 Mhz to 450 Mhz.
  • the value of the tuning capacitor is in the region of 12 to 180 picoFarad, and the operating frequency of the module is approximately 13.56 Mhz.
  • the value of the tuning capacitor is in the region of 30 to 500 picoFarad, and the operating frequency of the module is approximately 8.2 Mhz.
  • This tuning capacitor is obtaining by depositing oxidized silicon on the surface of the microcircuit previously coated with an insulator.
  • the invention also relates to a contactless card and an electronic label comprising a small-sized electronic module with an integrated antenna, in particular of the type described above, and to respective processes for the manufacture of a contactless card and an electronic label of this type.
  • the invention considers using the production lines of contactless cards for the manufacture of electronic labels.
  • an electronic module needs only to be cut out from a contactless card such as described above, in such manner as to leave around the electronic module some card body substance for the purposes of protecting the module.
  • This technique may be completed by cutting out another part of the same shape, for example from the same card, then fixing this part against the first in such manner as to surround and protect the module.
  • FIG. 1 shows a contactless card of the state of the art
  • FIG. 2 shows a contactless card of the invention
  • FIG. 3 shows a strip used for the continuous manufacture of electronic modules of the invention, intended for use in contactless cards or electronic labels of the invention, and a card intended to house the module;
  • FIGS. 4A to 4 G show several variants of embodiment of an electronic module of the invention, able or intended to be incorporated into the body of a contactless card or into an electronic label;
  • FIGS. 5 a to 5 D show a section view of several variants of embodiment of an electronic module provided with an antenna, according to the invention.
  • FIG. 6 shows a section view of a module for a contact and contactless hybrid card.
  • FIG. 7 shows the stages of a manufacturing process for a variant of electronic label using the electronic module of the inventions.
  • FIG. 1 showing a diagram and plan of a contactless card 1 having the type of those actually marketed.
  • antenna 2 in the form of a large-sized coil, slightly smaller than the size of the card, is integrated into the card body 3 , and two end of the coil of antenna 2 are connected to supply contacts 4 , 5 of an electronic module 6 carrying an integrated microcircuit 7 also called a chip.
  • the coil is shown to scale, except in respect of the number of turns, only four turns being shown.
  • To assemble such coil 2 with card body 3 it is required to conduct complex, costly lamination or injection operations with the above-mentioned disadvantages.
  • With this kind of antenna it is possible to read card information from a distance of 70 mm onwards at a frequency of a few Mhz.
  • the general underlying principle of the invention consists of no longer using the large-sized antennas currently used for contactless cards, in order to overcome the above-mentioned disadvantages.
  • the invention also sets out, in order to reach the desired objectives of reliability and low manufacturing cost, to use certain principles and the production lines used for the manufacture of contact cards, such manufacture being currently well circumscribed and allowing low manufacturing costs to be obtained.
  • a diagram of the solution put forward is shown by the card 1 in FIG. 2 . It consists of using a particular module 6 of chip card combining on one same small-sized carrier the electronic functions of conventional chip modules, and the function of transmitting/receiving antenna for contactless transmission of information between the card and an outside reading/writing device (not shown).
  • module 6 is compatible with known manufacturing processes used to manufacture contact cards, in its thickness and plane, length and width.
  • the size of the antenna obtained must, contrary to the teaching of the state of the art, be compatible with the size of the module, while maintaining a number of turns able to assure electromagnetic transmission at sufficient distance, in the region of a few centimeters.
  • the antenna is made in the form of a spiral made up of a group of turns lying directly on the carrier substrate and substantially in the same plane, which excludes air coils as taught by some documents of the prior art mentioned above.
  • the antenna may have an outer turn of substantially square, rectangular, circular or oval shape or any other suitable shape.
  • the two ends of the antenna are connected to the supply terminals of an integrated circuit, in particular a memory and/or microprocessor, also positioned on the module as shown under reference 7 in the diagram in FIG. 2 but shown in more detail in FIGS. 4 to 6 .
  • FIG. 3 illustrating the separation of an electronic module of the invention from a strip 8 comprising a plurality of modules 6 placed for example in two rows.
  • the fabrication of conventional electronic modules on such strips is well known as such in the sphere of contact card production and will not therefore be further described.
  • a module 6 of the invention for example of the type comprising an integrated circuit 7 ⁇ astride>> the turns of an antenna 2 in square spiral shape, is detached from strip 8 by a cutting process, for example mechanical cutting.
  • the cut-out module is taken by automated means that are not shown but are known, and is brought preferably with the reverse side facing upwards (integrated circuit and antenna facing the bottom of the opening of the card body) opposite a blind opening 9 made in the card body 3 of a contactless chip card 1 . Attachment of module 6 in opening 9 provided is made by gluing, welding or any other appropriate means.
  • FIGS. 4A to 4 G show in more detail several module variants intended to be integrated into cards for the production of contactless cards, or to be integrated into a support of a different form to the card, for example to manufacture electronic labels.
  • a module 6 is made up of a conventional carrier substrate 10 (in relatively flexible film, mylar, epoxy or capton) on which is added not a coil but an antenna pattern 2 which may be made in several manners as will be explained below.
  • Antenna 2 is, for example, made by stamping from a copper sheet followed by assembly of the stamped sheet with the carrier substrate.
  • Carrier substrate 10 and antenna 2 are possibly assembled in precise manner, using known substrate guiding and positioning means.
  • Antenna 2 may also be obtained by photochemical etching of the antenna pattern, or by depositing metallic matter on a flexible film forming substrate 10 .
  • a suitable carrier substrate 10 has consequences on the thickness of the module and is chiefly dependent upon the intended use of the module. This choice is fully within the scope of men of the art.
  • antenna 2 is made up of a copper stripe approximately 15 ⁇ m to 70 ⁇ m thick, made in spiral form, with spaces between the turns of the same size. Ends 11 , 12 of this spiral are preferably widened so as to form contact pads for connection with microcircuit 7 .
  • FIG. 4A shows connecting conductor leads 13 , 14 to connect a respective terminal of chip 7 to a corresponding respective end 11 , 12 of the antenna.
  • a lead 15 needs to be passed above the antenna lines.
  • an insulator 16 is previously deposited, in particular by screen processing between the corresponding stripe zone and connector lead 15 .
  • antenna 2 takes up the whole side of the module and has no free space in its centre.
  • the invention provides for gluing microcircuit 7 either onto the module face with no antenna or onto the same face as the antenna (FIG. 4 D), after placing an insulator (dark part 16 ) between antenna 2 and microcircuit 7 .
  • FIG. 4E shows a variant of electronic module 6 , in which antenna 2 has a round spiral shape, microcircuit 7 being positioned over the plane of the turns with interpositioning of an insulator 16 . With this configuration it is possible to minimize the length of connection leads between the antenna and the microcircuit.
  • FIG. 4F illustrates an additional variant of module 6 of the invention, particularly adapted to cases in which an elongated or rectangular module is required.
  • the pattern of antenna 2 has a substantially oblong spiral shape
  • microcircuit is preferably located in the centre of the antenna and the connections between the terminals of the microcircuit and the coil pads are made as described for FIG. 4 B.
  • connection between the chip pads and the contact terminals of the antenna may be made using a conventional connection technique for conductor leads, such as for example so-called ⁇ bonding >> consisting of conductor leads welded between a pad of the microcircuit and a respective terminal of the antenna, or using the so-called ⁇ flip-chip >> technique consisting of adding the microcircuit onto the module substrate 10 with the face carrying the antenna and microcircuit glued onto the substrate. Resin protection of the contacts is then achieved using conventional processes for producing contact chip cards.
  • ⁇ bonding consisting of conductor leads welded between a pad of the microcircuit and a respective terminal of the antenna
  • ⁇ flip-chip >> technique consisting of adding the microcircuit onto the module substrate 10 with the face carrying the antenna and microcircuit glued onto the substrate. Resin protection of the contacts is then achieved using conventional processes for producing contact chip cards.
  • FIG. 4G gives a more detailed view of an electronic module 6 of the invention, on which a tuning capacitor 17 has been fabricated astride the antenna turns, by depositing on top of insulating layer 16 (shaded part).
  • a terminal 18 of capacitor 17 is connected to terminal 12 and pad 14
  • the other terminal 19 of capacitor 17 is connected to terminal 11 and pad 13 via intermediate pads 20 , 21 connected by an intermediate connection 22 located between intermediate pads 20 , 21 and made over insulating layer 16 in such manner as not to short-circuit the antenna turns.
  • tuning capacitor 17 can be integrated onto microcircuit 17 itself, at the design stage of the latter, which will reduce the number of manufacturing stages of module 6 .
  • the antenna pattern is determined so that it will allow operation at high frequency, in the Mhz region, the value of tuning capacitor 17 being chosen to obtain a determined operating frequency of antenna 2 within a high frequency range of approximately 1 Mhz to 450 Mhz.
  • the value of tuning capacitor 17 is in the region of 12 to 180 picoFarad.
  • the value of the tuning capacitor is in the region of 30 to 500 picoFarad.
  • FIGS. 5 and 6 show various embodiments of module 6 , shown in section view.
  • a metal grid has been used as an antenna that is cut out and then glued onto carrier substrate 10 .
  • Mechanical cutting of a spiral antenna is suitable for stripe widths that are not too fine, currently in the region of at least 300 ⁇ m.
  • microcircuit 7 and antenna 2 are situated on the two opposite faces of carrier substrate 10 , contact terminals 11 , 12 of antenna 2 being connected to pads of the microcircuit (not shown) via connection leads 15 brought through pits 23 made in carrier 10 .
  • microcircuit 7 is on the same side as antenna 2 and is deposited over its turns with interpositioning of an insulator 16 .
  • microcircuit 7 is placed in a cavity 25 made for this purpose in carrier 10 of the module, which allows the thickness of the module unit 6 to be reduced.
  • microcircuit 7 is simply glued in the centre of antenna 2 , as is also shown in FIGS. 4A, 4 B. In all cases, the whole of the antenna is positioned on carrier substrate 10 forming part of the module, and the microcircuit is added onto this substrate and antenna structure.
  • antenna 2 instead of a cut-out metal grid, a grid that is etched in or deposited by metallisation or otherwise on a suitable carrier substrate 10 .
  • FIG. 6 which is a top section view of another embodiment of electronic module 6 , in order to obtain a hybrid contact and contactless module, particularly adapted to the manufacture of hybrid cards.
  • microcircuit 7 and the antenna are placed on a first face of carrier substrate 10 of the module, as already described in respect of FIG. 5 .
  • contacts 26 identical to contacts for contact cards, are connected to corresponding pads of the microcircuit by conductor leads 27 .
  • the microcircuit can communicate with the outside using contacts 26 or antenna 2 depending upon the outside signal applied. All the effective components for the operation of the hybrid card, including antenna 2 , are therefore arranged on a hybrid module 6 of small size, able to be inserted, i.e. to be incorporated into a card body.
  • two modules 6 of the one of the above-described types may be made side by side in the width of a standard film 10 (i.e. 35 mm), but other arrangements of module 6 on a carrier strip 8 come within the limits of the invention.
  • Each module 6 may then be transferred onto a card body 3 of standard ISO format using conventional processes for transferring modules to card bodies, such as used for the production of contact cards.
  • modules 6 may be used for the production of electronic labels, of the type used for object identification. If necessary, after being cut from carrier strip 8 , modules 6 are protected by a protective resin coating or any other suitable material, allowing small-sized labels to be obtained at low cost. Obviously, the modules may also be integrated or fixed onto different or more voluminous supports (keys, packaging, etc.) in relation to the intended application.
  • FIG. 7 ( d ) using any appropriate technique, in particular by gluing or ultrasound welding.
  • a part 29 is cut out from the same card having the same size and at the same level as part 28 .
  • FIG. 7 ( f ) an enlarged diagram is given in FIG. 7 ( f ).
  • parts 28 and 29 could be cut out separately and subsequently assembled.
  • Such label 30 incorporates a module 6 protected on both sides, and may be graphically personalized on both sides to produce labels that can be used in games or any other applications.
  • a chip 7 mounted using this process and associated with antenna 2 can currently achieve an operating distance of approximately 50 mm whereas the same chip mounted with a conventional coil of card size can reach approximately 70 to 75 mm. This difference is not critical for most currently considered contactless applications. Also, this performance may be substantially improved by working on transmission circuits and the recovery of electromagnetic energy of the module and outside readers.
  • the module size is in the region of 12 mm ⁇ 12 mm, but it is possible to consider slightly larger, elongated formats to increase performance, or even optimising the reader antenna or even the chip antenna itself in respect of its consumption to improve performance and attain that of a larger antenna.
  • module 6 is used to manufacture cards, card integrity is maintained throughout the entire production process. Consequently, the card body may easily be used in conventional manner to house a magnetic stripe. Also, it may be printed using any existing processes with no particular restraints other than those that are known for the manufacture of a conventional card.
  • the choice of material for the card body is in no way restricted: it can be adapted to the needs of various applications given consideration.
  • the invention simultaneously solves all the above-described disadvantages connected with the production of contactless modules for contactless cards, in particular in respect of cost, space requirement, printing, compatibility with embossing or the insertion of a magnetic stripe.
  • the small size of the antenna brings comparable advantages for the production of electronic labels, that are not dependent upon the shape of a card body.
  • the economic advantage of the invention is undeniable; it enables the same production lines to be used for the production of electronic modules with integrated antennae, and of operational, contactless electronic labels and cards at a fraction of the current cost of processes used to produce contactless cards or labels, at every stage of their manufacture.

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  • Credit Cards Or The Like (AREA)
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US10/254,736 1996-01-17 1997-01-27 Single receiving side contactless electronic module continuous manufacturing process Expired - Lifetime US6794727B2 (en)

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FR9600889A FR2743649B1 (fr) 1996-01-17 1996-01-17 Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
FR9600889 1996-01-17
FR96/00889 1996-01-17
PCT/FR1997/000098 WO1997026621A1 (fr) 1996-01-17 1997-01-17 Module electronique sans contact pour carte ou etiquette
US09/101,049 US20020089049A1 (en) 1996-01-17 1997-01-27 Contactless electronic module for a card or label
US10/254,736 US6794727B2 (en) 1996-01-17 1997-01-27 Single receiving side contactless electronic module continuous manufacturing process

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020099473A1 (en) * 2000-11-08 2002-07-25 Paul Amadeo Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards
US20040129786A1 (en) * 2001-02-02 2004-07-08 Yves Reignoux Portable object with chip and antenna
US20040219714A1 (en) * 2001-12-28 2004-11-04 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US20040245348A1 (en) * 1998-08-31 2004-12-09 Jiro Nagaoka Contactless IC media and system applying the same
US20050141150A1 (en) * 2003-10-29 2005-06-30 Bentley Philip G. Electrical connection of components
US20050230777A1 (en) * 2004-03-04 2005-10-20 Davide Chiola Termination design with multiple spiral trench rings
US20060232415A1 (en) * 2002-08-28 2006-10-19 Renesas Technology Corp. Inlet for an electronic tag
US20070159353A1 (en) * 2004-01-23 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Film-like article and method for manufacturing the same
US20070194130A1 (en) * 2004-03-25 2007-08-23 Pierre-Alain Bauer Method for making an electronic label and electronic label obtained by said method
US20070271467A1 (en) * 1997-08-10 2007-11-22 Gemplus Method for making smart cards capable of operating with and without contact
US20100109970A1 (en) * 2008-10-31 2010-05-06 Nisha Ganwani Folded antenna structures for portable devices
USRE41361E1 (en) * 2001-04-25 2010-06-01 Muhlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
US9272370B2 (en) 2010-08-12 2016-03-01 Féinics Amatech Teoranta Laser ablating structures for antenna modules for dual interface smartcards
US20220147785A1 (en) * 2020-11-12 2022-05-12 Advanide Holdings Pte. Ltd. Card inlay for direct connection or inductive coupling technology
US12050952B2 (en) 2020-11-12 2024-07-30 Advanide Holdings Pte. Ltd. Card inlay for direct connection or inductive coupling technology

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10203066A (ja) * 1997-01-28 1998-08-04 Hitachi Ltd 非接触icカード
FR2765010B1 (fr) * 1997-06-20 1999-07-16 Inside Technologies Micromodule electronique, notamment pour carte a puce
DE19732644C1 (de) * 1997-07-29 1998-11-12 Siemens Ag Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung sowie Chipkarte
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
EP1031939B1 (en) * 1997-11-14 2005-09-14 Toppan Printing Co., Ltd. Composite ic card
IL122250A (en) * 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
KR20000075883A (ko) * 1998-01-09 2000-12-26 씨. 필립 채프맨 집적 회로 칩과 코일을 동시 실장시킨 집적 회로 패키지 및 그 제조 방법
EP0977145A3 (en) * 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC card
US6630370B2 (en) * 1998-10-02 2003-10-07 Shinko Electric Industries Co., Ltd. Process for manufacturing IC card
TW484101B (en) * 1998-12-17 2002-04-21 Hitachi Ltd Semiconductor device and its manufacturing method
JP2002533914A (ja) * 1998-12-18 2002-10-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 集積回路と伝送コイルを備えるデータキャリアモジュール
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
ATE202428T1 (de) 1999-01-23 2001-07-15 Ident Gmbh X Rfid-transponder mit bedruckbarer oberfläche
EP1031940A1 (de) * 1999-02-24 2000-08-30 Sihl GmbH Anordnung enthaltend eine Vielzahl elektronischer Schaltungen
FR2794264B1 (fr) * 1999-05-27 2001-11-02 Gemplus Card Int Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte
JP3928682B2 (ja) * 1999-06-22 2007-06-13 オムロン株式会社 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
FR2796208B1 (fr) * 1999-07-08 2002-10-25 Gemplus Card Int Antenne pour carte a puce sans contact, cartes hybrides et etiquettes electroniques
FR2796760B1 (fr) * 1999-07-23 2002-02-01 Gemplus Card Int Etiquette electronique et procede pour sa fabrication
JP2001256456A (ja) * 2000-03-10 2001-09-21 Shinko Electric Ind Co Ltd Icタグ及びその製造方法
KR100746742B1 (ko) * 2001-02-03 2007-08-06 삼성전자주식회사 리더 코일 안테나 및 이를 이용한 비접촉 카드 인증 시스템
JP4684433B2 (ja) * 2001-02-07 2011-05-18 大日本印刷株式会社 接触・非接触兼用型icモジュールとその製造方法
KR20010099429A (ko) * 2001-09-27 2001-11-09 김경현 신분증위조방지시스템
JP4141857B2 (ja) * 2003-02-18 2008-08-27 日立マクセル株式会社 半導体装置
US20060285301A1 (en) * 2003-05-05 2006-12-21 Axalto Sa Method for making a pre-laminated inlet
US7612677B2 (en) 2005-01-28 2009-11-03 Smartrac Ip B.V. Method for producing a security layered construction and security layered construction and identification documents containing such a construction
DE102004011702B4 (de) * 2004-03-10 2006-02-16 Circle Smart Card Ag Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte
WO2005106961A1 (en) * 2004-04-28 2005-11-10 Semiconductor Energy Laboratory Co., Ltd. Mos capacitor and semiconductor device
US7604176B2 (en) * 2004-05-20 2009-10-20 American Express Travel Related Services Company, Inc. Radio frequency fobs and methods of using the same
US7798415B1 (en) 2004-05-20 2010-09-21 American Express Travel Realted Services Company, Inc. Wireless transaction fobs and methods of using the same
FR2882174B1 (fr) * 2005-02-11 2007-09-07 Smart Packaging Solutions Sps Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
JP2006271596A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
CN100361150C (zh) * 2005-06-24 2008-01-09 清华大学 带有硅基集成天线的射频识别标卡
DE102005038132B4 (de) 2005-08-11 2008-04-03 Infineon Technologies Ag Chipmodul und Chipkarte
FR2890212B1 (fr) 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
JP4997779B2 (ja) * 2006-02-13 2012-08-08 大日本印刷株式会社 非接触データキャリア
EP1863090A1 (en) * 2006-06-01 2007-12-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
KR100809028B1 (ko) * 2006-06-07 2008-03-03 (주)아이디밸리 교통카드용 알에프 모듈
FR2904723B1 (fr) * 2006-08-01 2008-12-19 Arjowiggins Security Soc Par A Structure de securite, notamment pour un document de securite et/ou de valeur
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Rfidを内蔵したゲームカードおよびその製造方法
FR2937448B1 (fr) 2008-10-17 2012-11-16 Oberthur Technologies Module, carte a microcircuit et procede de fabrication correspondant.
US8186603B2 (en) * 2009-09-22 2012-05-29 On Track Innovation Ltd. Contactless smart sticker
SE534533C2 (sv) 2009-10-07 2011-09-27 Pampett Ab Metod och system för detektering av fukt vid en absorberande artikel
FR2963142B1 (fr) * 2010-07-20 2012-09-14 Oberthur Technologies Carte a microcircuit de type sans contact
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
DE102010036057A1 (de) * 2010-09-01 2012-03-01 Giesecke & Devrient Gmbh Chipmodul mit Kennzeichnung
EP2463809A1 (fr) * 2010-12-07 2012-06-13 NagraID S.A. Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne
JP5344000B2 (ja) * 2011-05-09 2013-11-13 大日本印刷株式会社 接触非接触両用icモジュール及びicカード
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
DE102011056329A1 (de) * 2011-12-13 2013-06-13 Infineon Technologies Ag Chipkartenmodul
EP2669852A1 (fr) 2012-05-31 2013-12-04 Gemalto SA Module à puce de circuit intégré avec antenne
FR2992761B1 (fr) * 2012-07-02 2015-05-29 Inside Secure Procede de fabrication d'un microcircuit sans contact
FR2994005B1 (fr) * 2012-07-25 2017-05-26 Microconnections Sas Module electronique pour carte a puce et circuit imprime pour la realisation d'un tel module
US9286564B2 (en) * 2012-11-20 2016-03-15 Xerox Corporation Apparatuses and methods for printed radio frequency identification (RFID) tags
EP2736001A1 (fr) 2012-11-27 2014-05-28 Gemalto SA Module électronique à interface de communication tridimensionnelle
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
JP6124119B2 (ja) * 2013-03-29 2017-05-10 パナソニックIpマネジメント株式会社 給電装置及び受電装置
DE102013104567A1 (de) * 2013-05-03 2014-11-06 Infineon Technologies Ag Chipanordnung, Chipkartenanordnung und Verfahren zum Herstellen einer Chipanordnung
EP2892012A1 (fr) * 2014-01-06 2015-07-08 Gemalto SA Module électronique, son procédé de fabrication, et dispositif électronique comprenant un tel module
WO2015113184A1 (zh) * 2014-01-29 2015-08-06 北京嘉岳同乐极电子有限公司 高灵敏磁传感器及其制作方法
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
CN103984977A (zh) * 2014-05-27 2014-08-13 江苏远洋数据股份有限公司 一种双界面卡
US10438110B2 (en) 2015-07-08 2019-10-08 Assa Abloy Ab Multiple frequency transponder with a single antenna
EP3182336A1 (fr) 2015-12-14 2017-06-21 Gemalto Sa Dispositif radiofrequence a circuit lc ajustable comprenant un module electrique et/ou electronique
EP3182507A1 (fr) 2015-12-15 2017-06-21 Gemalto Sa Module antenne simple face avec composant cms
DE102016114199B4 (de) * 2016-08-01 2021-07-22 Infineon Technologies Ag Chipkartenmodul, chipkarte, chipkartenanordnung, verfahren zum ausbilden eines chipkartenmoduls und verfahren zum ausbilden einer chipkarte
FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
US10826158B2 (en) * 2018-02-27 2020-11-03 Thin Film Electronics Asa Printed and/or thin film integrated circuit with integrated antenna, and methods of making and using the same
EP3663984A1 (fr) 2018-12-06 2020-06-10 Thales Dis France SA Procede de fabrication d'une carte a puce avec interconnexion de modules
EP3663983A1 (fr) 2018-12-06 2020-06-10 Thales Dis France SA Procédé de fabrication d'une carte à puce métallique ou non avec antenne relais
EP3671563A1 (fr) 2018-12-21 2020-06-24 Thales Dis France SA Procédé de fabrication d'une carte à puce métallique, de préférence avec antenne relais
EP3671561A1 (fr) 2018-12-21 2020-06-24 Thales Dis France SA Procede de fabrication d'une carte a puce radiofrequence metallique a permittivite electromagnetique amelioree
EP3671564A1 (fr) 2018-12-21 2020-06-24 Thales Dis France SA Procede de fabrication d'un insert de carte a puce radiofrequence comportant une plaque metallique
EP3671562A1 (fr) 2018-12-21 2020-06-24 Thales Dis France SA Procédé de fabrication d'une carte à puce radiofréquence metallique à permittivite améliorée avec perforations étendues
CN110309897B (zh) * 2019-08-14 2024-07-30 莆田澳普睿智能科技有限公司 一种耐冲击电子标签及其制作方法
JP1662551S (ja) * 2019-09-06 2020-06-29
EP3789919A1 (fr) 2019-09-09 2021-03-10 Thales Dis France SA Procédé de fabrication d'une carte à puce métallique avec mini antenne relais
CN110632668B (zh) * 2019-10-14 2024-05-17 厦门顶尖电子有限公司 一种电子价签的定位方法、电子价签组件及系统
EP3832546A1 (fr) 2019-12-02 2021-06-09 Thales Dis France Sa Procédé de fabrication d'une carte à puce radiofréquence comprenant une plaque en metal avec une fente ou un jeu dans la plaque
EP3832547A1 (fr) 2019-12-02 2021-06-09 Thales Dis France Sa L'invention concerne un procede de fabrication d'une carte a puce radiofrequence comprenant une plaque en metal avec une fente dans la plaque
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
EP4012612A1 (fr) 2020-12-11 2022-06-15 Thales DIS France SA Procédé de fabrication d'une carte à puce avec positionnement d'insert métallique
CN112990416B (zh) * 2021-04-22 2021-11-19 四川谦泰仁投资管理有限公司 一种带有天线检测端口的高频rfid芯片及标签

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030064544A1 (en) * 2000-04-04 2003-04-03 Erik Heinemann Method for producing laminated smart cards
US6617676B1 (en) * 1998-12-21 2003-09-09 Gemplus Method for making a contactless chip card

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
AU1712188A (en) * 1987-04-27 1988-12-02 Soundcraft, Inc. Method for manufacture of and structure of a laminated proximity card
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
ATE124829T1 (de) * 1987-11-18 1995-07-15 Univ Western Australia Transponder.
FR2641102B1 (ja) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
DE8909783U1 (de) * 1989-08-16 1990-09-13 Pepperl & Fuchs GmbH, 68307 Mannheim Codeträger für ein induktives Identifikationssystem zum berührungslosen Erkennen und/oder Markieren von Objekten
JPH04152191A (ja) * 1990-10-17 1992-05-26 Mitsubishi Electric Corp Tab基板及びそれを用いた非接触icカード
FR2678753B1 (fr) * 1991-07-02 1996-12-20 Gemplus Card Int Fabrication de cartes a puce a module autodetachable.
DE4311493C2 (de) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
DE69323293T2 (de) * 1993-04-14 1999-09-09 Gustafson Elektronische Vorrichtung zur Kennzeichnung
JP3305843B2 (ja) * 1993-12-20 2002-07-24 株式会社東芝 半導体装置
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6617676B1 (en) * 1998-12-21 2003-09-09 Gemplus Method for making a contactless chip card
US20030064544A1 (en) * 2000-04-04 2003-04-03 Erik Heinemann Method for producing laminated smart cards

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070271467A1 (en) * 1997-08-10 2007-11-22 Gemplus Method for making smart cards capable of operating with and without contact
US7740180B2 (en) 1997-10-08 2010-06-22 Gemalto, S.A. Method for making smart cards capable of operating with and without contact
US7663564B2 (en) 1997-10-08 2010-02-16 Gemalto, S.A. Method for making smart cards capable of operating with and without contact
US20100011223A9 (en) * 1997-10-08 2010-01-14 Gemplus Method for making smart cards capable of operating with and without contact
US20100133347A9 (en) * 1997-10-08 2010-06-03 Gemplus Method for making smart cards capable of operating with and without contact
US7958622B1 (en) * 1997-10-08 2011-06-14 Gemalto S.A. Method for making smart cards
US20070272761A1 (en) * 1997-10-08 2007-11-29 Gemplus Method for making smart cards capable of operating with and without contact
US20040245348A1 (en) * 1998-08-31 2004-12-09 Jiro Nagaoka Contactless IC media and system applying the same
US20020099473A1 (en) * 2000-11-08 2002-07-25 Paul Amadeo Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards
US7028910B2 (en) * 2001-02-02 2006-04-18 Schlumberger, Systemes Portable object with chip and antenna
US20040129786A1 (en) * 2001-02-02 2004-07-08 Yves Reignoux Portable object with chip and antenna
USRE41361E1 (en) * 2001-04-25 2010-06-01 Muhlbauer Ag Method for connecting microchips to an antenna arranged on a support strip for producing a transponder
US7018844B2 (en) * 2001-12-28 2006-03-28 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US20040219714A1 (en) * 2001-12-28 2004-11-04 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
US20060232415A1 (en) * 2002-08-28 2006-10-19 Renesas Technology Corp. Inlet for an electronic tag
US7663209B2 (en) 2002-08-28 2010-02-16 Renesas Technology Corp. Inlet for an electronic tag
US7243421B2 (en) 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
US20050141150A1 (en) * 2003-10-29 2005-06-30 Bentley Philip G. Electrical connection of components
US20070159353A1 (en) * 2004-01-23 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Film-like article and method for manufacturing the same
US8305213B2 (en) 2004-01-23 2012-11-06 Semiconductor Energy Laboratory Co., Ltd. Film-like article and method for manufacturing the same
US7196397B2 (en) * 2004-03-04 2007-03-27 International Rectifier Corporation Termination design with multiple spiral trench rings
US20050230777A1 (en) * 2004-03-04 2005-10-20 Davide Chiola Termination design with multiple spiral trench rings
US7815122B2 (en) * 2004-03-25 2010-10-19 Eric Bauer Method for making an electronic label and electronic label obtained by said method
US20070194130A1 (en) * 2004-03-25 2007-08-23 Pierre-Alain Bauer Method for making an electronic label and electronic label obtained by said method
US20100109970A1 (en) * 2008-10-31 2010-05-06 Nisha Ganwani Folded antenna structures for portable devices
US8188926B2 (en) * 2008-10-31 2012-05-29 Silicon Laboratories, Inc. Folded antenna structures for portable devices
US9272370B2 (en) 2010-08-12 2016-03-01 Féinics Amatech Teoranta Laser ablating structures for antenna modules for dual interface smartcards
US20220147785A1 (en) * 2020-11-12 2022-05-12 Advanide Holdings Pte. Ltd. Card inlay for direct connection or inductive coupling technology
US11551050B2 (en) * 2020-11-12 2023-01-10 Advanide Holdings Pte. Ltd. Card inlay for direct connection or inductive coupling technology
US12050952B2 (en) 2020-11-12 2024-07-30 Advanide Holdings Pte. Ltd. Card inlay for direct connection or inductive coupling technology

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ES2226994T3 (es) 2005-04-01
EP0875039B1 (fr) 2001-08-22
BR9709153A (pt) 1999-08-03
FR2743649A1 (fr) 1997-07-18
EP1492048A2 (fr) 2004-12-29
ATE204662T1 (de) 2001-09-15
FR2743649B1 (fr) 1998-04-03
EP0875039A1 (fr) 1998-11-04
CN1165873C (zh) 2004-09-08
RU2194306C2 (ru) 2002-12-10
JPH11509024A (ja) 1999-08-03
CA2243326A1 (fr) 1997-07-24
DE69730362T2 (de) 2005-09-08
ATE274214T1 (de) 2004-09-15
WO1997026621A1 (fr) 1997-07-24
KR19990077335A (ko) 1999-10-25
AU713433B2 (en) 1999-12-02
DE69706280T2 (de) 2002-05-08
ES2163114T3 (es) 2002-01-16
JP2002207987A (ja) 2002-07-26
US20030025186A1 (en) 2003-02-06
EP1492048A3 (fr) 2005-12-14
EP1118960A3 (fr) 2002-11-06
DE69706280D1 (de) 2001-09-27
CA2243326C (fr) 2003-05-13
EP1118960A2 (fr) 2001-07-25
DE69730362D1 (de) 2004-09-23
EP1118960B1 (fr) 2004-08-18
AU1447797A (en) 1997-08-11
CN1213449A (zh) 1999-04-07
US20020089049A1 (en) 2002-07-11
JP3779328B2 (ja) 2006-05-24

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