US6462994B2 - Semiconductor memory device with redundancy logic cell and repair method - Google Patents

Semiconductor memory device with redundancy logic cell and repair method Download PDF

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US6462994B2
US6462994B2 US09/929,930 US92993001A US6462994B2 US 6462994 B2 US6462994 B2 US 6462994B2 US 92993001 A US92993001 A US 92993001A US 6462994 B2 US6462994 B2 US 6462994B2
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address
defect
cell
redundancy
node
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US20020044489A1 (en
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Jae Hoon Kim
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Mosaid Technologies Inc
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • G11C29/804—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout to prevent clustered faults

Definitions

  • the present invention relates generally to semiconductor memory devices and, in particular, to a semiconductor memory device and a repair method that employ programmable self-contained repairable cells to repair defect cells of a semiconductor memory device in a package state.
  • a memory cell plays an important role. Therefore, when a single cell in a group of cells has a defect, which-results in a malfunction of the-entire group of cells, the corresponding memory device is considered to be “condemned goods”.
  • the disposal of such devices as defective goods is an inefficient way to reduce mass product yields.
  • pre-constructing redundancy cells in DRAMs is a common way to obtain an acceptable device when that device is defective.
  • defect cells are replaced with redundancy cells when the defect cells are detected.
  • Redundancy cell repair technology fabricates sufficient fuses in a semiconductor memory device, and replaces any defect column lines and row lines with spare lines by applying a laser beam method.
  • the laser beam method is mainly employed in a wafer state that precedes the packaging of a semiconductor device. Therefore, the repair process cannot be performed when defect cells are found after the device has been packaged.
  • U.S. Pat. Nos. 6,011,734 and 5,764,577 disclose repair technology that is implemented in the packaging step of a semiconductor device.
  • U.S. Pat. Nos. 6,011,734 and 5,764,577 disclose repair methods that pre-construct spare cells in a DRAM device, store a defect cell address to a latch, inactivate a corresponding defect cell by comparing the latched address with the address accessed from the outside, and then activate redundancy circuits.
  • the problems stated above, as well, as other related problems of the prior art, are solved by the present invention, a semiconductor memory device and a repair method that employ programmable self-contained repairable cells to repair defect cells of a semiconductor memory device in a package state.
  • the semiconductor memory device and the repair method of the invention pre-construct redundancy logic cells in the peripheries of a memory cell array to replace defect cells of the memory cell array with the redundancy logic cells.
  • a semiconductor memory device includes an address buffer for receiving an external address.
  • a row decoder decodes a row address provided by the address buffer, and generates a word line selecting signal.
  • a column decoder decodes a column address provided by the address buffer, and generates a bit line selecting signal.
  • a memory cell array has a plurality of memory cells. Each of the plurality of memory cells is activated by a selection of a word line and a bit line by the word line selecting signal and the bit line selecting signal, respectively.
  • a redundancy logic cell replaces defect cells in the memory cell array.
  • a plurality of defect cell address latches store defect cell addresses corresponding to the defect cells in the memory cell array. The defect cells are detected in a memory test.
  • a plurality of comparators output repair signals when an address stored in the plurality of defect cell address latches corresponds to the external address received by the address buffer.
  • a redundancy controller generates a control signal to intercept the word line selecting signal and the bit line selecting signal corresponding to the defect cells in response to a repair signal outputted in a normal mode, and generates another control signal to enable a read/write operation of the redundancy logic cell in place of the defect cells.
  • a semiconductor memory device includes a row address buffer for receiving an external row address signal.
  • a column address buffer receives an external column address signal.
  • a row decoder decodes a row address provided by the row address buffer, and generates a word line selecting signal.
  • a column decoder decodes a column address provided by the column address buffer, and generates a bit line selecting signal.
  • a memory cell array has a plurality of memory cells. Each of the plurality of memory cells is activated by a selection of a word line and a bit line by the word line selecting signal and the bit line selecting signal respectively.
  • a redundancy logic cell replaces defect cells in the memory cell array.
  • a plurality of defect cell row address latches store defect cell row addresses corresponding to the defect cells in the memory cell array.
  • the defect cells are detected in a memory test.
  • a plurality of defect cell column address latches store defect cell column addresses corresponding to the defect cells in the memory cell array.
  • the defect cells are detected in the memory test.
  • a plurality of first comparators output row repair signals when a defect cell row address stored in one of the plurality of defect cell row address latches corresponds to the row address provided by the row address buffer in a normal mode.
  • a plurality of second comparators output column repair signals when a defect cell column address stored in one of the plurality of defect cell column address latches corresponds to the column address provided by the column address buffer in the normal mode.
  • a redundancy controller generates a control signal to intercept the word line selecting signal and the bit line selecting signal corresponding to the defect cells in response to a row and a column repair signal, and generates another control signal to enable a read/write operation of the redundancy logic cell in place of the defect cells.
  • a semiconductor memory device includes an address buffer for receiving an external address.
  • a row decoder decodes a row address provided by the address buffer, and generates a word line selecting signal.
  • a column decoder decodes a column address provided. by the address buffer, and generates a bit line selecting signal.
  • a memory cell array has a plurality of memory cells. Each of the plurality of memory cells is activated by a selection of a word line and a bit line by the word line selecting signal and the bit line selecting signal respectively.
  • a redundancy logic cell replaces defect cells in the memory cell array.
  • a plurality of defect cell address storage devices store defect cell addresses corresponding to the defect cells in the memory cell array. The defect cells are detected in a test mode.
  • a plurality of comparison devices output repair signals when an address stored in the plurality of defect cell address storage devices corresponds to the external address received by the address buffer.
  • a plurality of redundancy control devices generate a control signal to intercept the word line selecting signal and the bit line selecting signal corresponding to the defect cells in response to the repair signals, and generate another control signal to enable a read/write operation of the redundancy logic cell, in a normal mode, in place of the defect cells.
  • a semiconductor memory device includes an address buffer for receiving an external address.
  • a row decoder decodes a row address provided by the address buffer, and generates a word line selecting signal.
  • a column decoder decodes a column address provided by the address buffer, and generates a bit line selecting signal.
  • a memory cell array has a plurality of memory cells. Each of the plurality of memory cells is activated by a selection of a word line and a bit line by the word line selecting signal and the bit line selecting signal, respectively.
  • First redundancy logic cells replace defect cells.
  • Second redundancy logic cells replace the defect cells.
  • a plurality of defect cell address latches store defect cell addresses corresponding to the defect cells.
  • the defect cells are detected in a test mode.
  • a plurality of comparators output repair signals when an address stored in the plurality of defect cell address latches corresponds to the external address received from the address buffer.
  • a redundancy controller generates a control signal to intercept a pass of defect cell address signals of the row decoder and the column decoder in response to the repair signal, generates a first control signal to enable a read/write operation of the first redundancy logic cell when the memory cell array has the defect cells, and generates a second control signal to enable a read/write operation of the second redundancy logic cell when the first redundancy logic cell has the defect cells.
  • the generating of the control signal, the first control signal, and the second control signal occurs in a normal mode.
  • FIG. 1 is a diagram illustrating a semiconductor memory device having redundancy logic cells, according to a preferred embodiment of the present invention
  • FIG. 2 is a circuit diagram illustrating a defective-cell-address latch unit 22 and a comparator 24 shown in FIG. 1, according to an illustrative embodiment of the present invention
  • FIG. 3 is a circuit diagram illustrating a redundancy controller 26 and redundancy logic cell 28 shown in FIG. 1, according to a preferred embodiment of the present invention
  • FIG. 4 is a diagram illustrating a semiconductor memory device having redundancy logic cells, according to an alternative preferred embodiment of the present invention.
  • FIG. 5 is a diagram illustrating a semiconductor memory device performing a re-repair process, according to another alternative preferred embodiment of the present invention.
  • FIG. 6 is a flow chart illustrating a repair process for a semiconductor memory device, according to the preferred embodiment of the present invention.
  • FIG. 1 is a diagram illustrating a semiconductor memory device having redundancy logic cells, according to a preferred embodiment of the present invention.
  • the semiconductor memory device includes an address buffer 10 , a row decoder 12 , a column decoder 14 , a memory cell array 16 , a redundancy decoder 18 , a redundancy memory cell 20 , a defect-cell-address latch unit 22 , a comparator 24 , a redundancy controller 26 , and a redundancy logic cell 28 .
  • the address buffer 10 After buffering an external address signal, the address buffer 10 provides a row address for the row decoder 12 , and a column address for the column decoder 14 . In addition, the output terminal of the address buffer 10 is connected to the defective-cell-address latch unit 22 and the comparator 24 .
  • the row decoder 12 decodes an inputted row address, and then selects a word line corresponding to a memory cell in the memory cell array 16 .
  • the column decoder 14 decodes an inputted column address, and then selects a bit line corresponding to a memory cell in the memory cell array 16 .
  • an input signal selects a word line and a bit line
  • the input signal activates a corresponding cell to read data stored in a data bus, or to write data provided from the data bus.
  • the redundancy memory cell 20 is a spare cell manufactured in the same process with that of the memory cell array 16 , and replaces a defect memory cell of the memory cell array 16 when the defect memory cell is found.
  • a laser beam cuts off fuses of the redundancy decoder 18 in a wafer state so that the redundancy memory cell 20 can repair (i.e., replace) a defective memory cell in the memory cell array 16 .
  • the present invention includes the redundancy logic cell 28 , which is disposed in the peripheries of the memory cell array 16 to repair any defect cell in the memory cell array 16 or any defect cell in the redundancy memory cell 20 after packaging.
  • All of the defective-cell-address latch unit 22 , the comparator 24 , and the redundancy controller 26 activate the redundancy logic cell 28 .
  • the defective-cell-address latch unit 22 comprises many latches.
  • the defective-cell-address latch unit 22 latches a defect cell address when a package test finds a malfunctioned cell among the memory cell array 16 and among. repaired cells.
  • the comparator 24 comprises many comparators.
  • the comparator 24 compares a latched address with an address from the outside (i.e., provided externally with respect to the semiconductor memory device), and generates a repair signal when the latched address corresponds to the externally provided address.
  • the redundancy controller 26 responds to the repair signal. Therefore, the redundancy controller 26 generates a redundancy control signal RLC 2 that intercepts an employment of a normal cell address in the row decoder 12 and the column decoder 14 , and generates an enable-signal EN of the redundancy logic cell 28 .
  • the enable-signal activates the redundancy logic cell 28 to read data stored in a data-bus by a read-control signal R, or to write data from a data-bus by a write-control signal W.
  • FIG. 2 is a circuit diagram illustrating a defective-cell-address latch unit 22 and a comparator 24 shown in FIG. 1, according to an illustrative embodiment of the present invention.
  • Each latch Lti in the defective-cell-address latch unit 22 includes inverters INV 1 and INV 2 , and transistors NM 1 and NM 2 .
  • the output terminal of the inverter INV 1 is connected to a node N 1 and the input terminal of the inverter INV 1 is connected to a node N 2 .
  • the output terminal of the inverter INV 2 is connected to the node N 2 and the input terminal of the inverter INV 2 is connected to the node N 1 .
  • An active-signal AC or a read/write-control signal R/W switches the switching.
  • transistor NM 1 between the node N 2 and a node N 3 .
  • a redundancy control signal RLC 1 switches the switching transistor NM 2 placed between the output terminal of the address buffer 10 and the node N 3 .
  • the latch Lti responds to the active signal AC or the read/write signal R/W, and latches the corresponding address bit-signal in test mode.
  • Each comparator in the comparator 24 includes four PMOS transistors PM 1 to PM 4 , four NMOS transistors NM 3 to NM 6 , and inverters INV 3 and INV 4 .
  • the transistor PM 1 has a gate, a source, and a drain respectively connected to the node N 2 , a power voltage VCC, and a node N 4 .
  • the transistor PM 2 has a gate, a source, and a drain respectively connected to the node N 1 , the node N 4 , and a node N 5 .
  • the transistor NM 3 has a gate, a source, and a drain respectively connected to the node N 1 , the node N 5 , and a node N 6 .
  • the transistor NM 4 has a gate, a source, and a drain respectively connected to the node N 2 , the node N 6 , and a ground voltage VSS.
  • the transistor PM 3 has a gate, a source, and a drain respectively connected to the output terminal of the address buffer 10 , the power voltage VCC, and the node N 4 .
  • the transistor PM 4 has a gate, a source, and a drain respectively connected to the output terminal of the address buffer 10 through an inverter INV 3 , the node N 4 , and the node N 5 .
  • the transistor NM 5 has a gate, a source, and a drain respectively connected to the output terminal of the address buffer 10 , the node N 5 , and the node N 6 .
  • the transistor NM 6 has a gate, a source, and a drain respectively connected to the output terminal of the address buffer 10 through the inverter INV 3 , the node N 6 , and the ground voltage VSS.
  • An input terminal of the inverter INV 4 is connected to the node N 5 .
  • the inverter INV 4 converts the signal of the node N 5 to the output signal of the comparator 24 .
  • FIG. 3 is a circuit diagram illustrating a redundancy controller 26 and redundancy logic cell 28 shown in FIG. 1, according to a preferred embodiment of the present invention.
  • each address buffer 10 possesses each row address buffer 10 A and each column address buffer 10 B.
  • the row address buffer 10 A comprises each row address bit buffer RAB 0 to RABi.
  • the output of each row address bit buffer is supplied to row defect-cell-address latch unit RLT 0 to RLTi, and row comparators RCOM 0 to RCOMi.
  • the outputs of the row comparators are supplied to the row decoder 12 as a row repair signal.
  • the column address buffer 10 B comprises each column address bit buffer CAB 0 to CABi.
  • the output of each column address bit buffer is supplied to column defect-cell-address latch unit CLT 0 to CLTi, and column comparators CCOM 0 to CCOMi.
  • the outputs of the column comparators are supplied to the column decoder 14 as a column repair signal.
  • the redundancy controller 26 includes a redundancy row decoder RRD, a redundancy column decoder RCD, and an enable signal generator ENG.
  • the redundancy row decoder RRD includes multiple NAND gates, a NOR gate, and multiple input transistors RT 0 to RTi for receiving the output of each row comparator.
  • the redundancy control signal RLC 2 is activated to a “high” logic level when the redundancy logic cell 28 is employed, and then the redundancy control signal RLC 2 turns on each input transistor RT 0 to RTi.
  • the redundancy row decoder RRD activates a,row interception signal WLDEN to the “low” logic level when the output of every row comparator is at the “low” logic level.
  • the redundancy column decoder RCD includes multiple NAND gates, a NOR gate, and multiple input transistors CT 0 to CTi for receiving the output of each column comparator.
  • the redundancy control signal RLC 2 is activated to the “high” logic level when the redundancy logic cell is employed, and then the redundancy control signal RLC 2 turns on each input transistor CT 0 to CTi.
  • the redundancy column decoder RCD activates a column interception signal CSLDEN to the “low” logic level when the output of every column comparator is at the “low” logic level.
  • the enable signal generator ENG includes a first latch circuit LTA, a second latch circuit LTB, and a logic circuit G.
  • the first latch circuit LTA latches the row interception signal WLDEN.
  • the second latch circuit LTB latches the column interception signal CSLDEN.
  • the logic circuit G combines the data latched in the first latch circuit LTA and the second latch circuit LTB, and then generates an enable-control signal EN of the redundancy logic cell 28 .
  • the redundancy logic cell 28 includes inverters INV 5 and INV 6 , NMOS transistors NM 7 and NM 8 , and NAND gates G 1 and G 2 .
  • the inverter INV 5 has an output terminal connected to a node N 7 and an input terminal connected to a node N 8 .
  • the inverter INV 6 has an output terminal connected to the node N 8 and an input terminal connected to the node N 7 .
  • the transistor NM 7 is placed between the node N 7 and a write pass.
  • the transistor NM 8 is placed between the node N 8 and a read pass.
  • the NAND gate G 1 combines the enable-control signal EN and the write-control signal W, and then switches the transistor NM 7 .
  • the NAND gate G 2 combines the enable-control signal EN and the read-control signal R, and then switches the transistor NM 8 .
  • FIG. 4 is a diagram illustrating a semiconductor memory device having redundancy logic cells, according to an alternative preferred embodiment of the present invention.
  • the alternative preferred embodiment includes redundancy logic cell 28 A and 28 B.
  • the redundancy logic cell 28 A is associated with a defective-cell-address latch unit 22 A, a comparator 24 A, and a redundancy controller 26 A.
  • the redundancy logic cell 28 B is associated with a defective-cell-address latch unit 22 B, a comparator 24 B, and a redundancy controller 26 B.
  • a redundancy control signal RLC 11 is applied to the defective-cell-address latch unit 22 A.
  • a redundancy control signal RLC 12 is applied to the defective-cell-address latch unit 22 B.
  • the first address signal from the address buffer 10 is latched to the latch unit 22 A when the redundancy control signal RLC 11 is activated, and the second address signal from the address buffer 10 is latched to the latch unit 22 B when the redundancy control signal RLC 12 is activated.
  • the first redundancy logic cell 28 A is activated in the case that the first redundancy logic cell 28 A receives the first enable-control signal EN 1
  • the second redundancy logic cell 28 B is activated in the case that the second redundancy logic cell 28 B receives the second enable-control signal EN 2 .
  • FIG. 5 is a diagram illustrating a semiconductor memory device performing a re-repair process, according to another alternative preferred embodiment of the present invention.
  • the other alternative preferred embodiment includes a pair of redundancy logic cells 28 A and 28 B.
  • the pair of redundancy logic cell are associated with a defective-cell-address latch unit 22 , a comparator 24 , and a redundancy controller 26 C.
  • the redundancy controller 26 C includes a redundancy row decoder RRD, a redundancy column decoder RCD, an enable signal generator ENG, and a re-repair unit RRP.
  • the re-repair unit RRP includes transistors NM 9 and NM 10 , and an inverter INV 7 .
  • the transistor NM 9 is connected between an output terminal of the enable-control signal generator ENG and an input terminal of an enable-control signal EN 1 in the first redundancy logic cell 28 A.
  • the transistor NM 10 is connected between the output terminal of the enable-control signal:generator ENG and an input terminal of an enable-control signal EN 2 in the second redundancy logic cell 28 B.
  • a third redundancy control signal RLC 3 is applied to a gate of the transistor NM 10 , and to a gate of the transistor NM 9 through the inverter INV 7 .
  • the enable-control signal EN is only applied to the first redundancy logic cell 28 A.
  • the enable-control signal EN is only applied to the second redundancy logic cell 28 B.
  • the third redundancy control signal RLC 3 is activated to the “high” logic level so that the second redundancy logic cell 28 B can replace the defect cell in the first redundancy logic cell 28 A.
  • FIG. 6 is a flow chart illustrating a repair process for a semiconductor memory device, according to the preferred embodiment of the present invention.
  • Numerous semiconductor memory devices are produced on the wafer (step 100 ). Tests for semiconductor memory devices are performed at the wafer state (step 102 ). When any of the memory devices have no defects, these memory devices pass the test performed at step 102 to perform a package process, and then these devices are delivered to customers after the package process (step 104 ).
  • laser repair equipment employs the redundancy memory cell to repair the defect memory device (step 106 ).
  • These repaired memory devices are tested again in the package state (step 108 ). In the case that the test performed at the package state does not detect a defect, these devices are delivered to customers per step 104 .
  • the defective device is reviewed to determine whether or not the defect is due to a malfunction in the memory cells (step 112 ).
  • a redundancy logic cell is employed to repair the defective memory device by latching a defect cell address to a defect-cell-address latch unit (step 114 ). Repaired semiconductor memory devices employing the redundancy logic cell are treated as normal products.
  • repairing the delivered defective device is also performed through steps 112 and 114 .
  • another alternative preferred embodiment of the present invention illustrates “re-repairing” a malfunctioned redundancy logic cell of a semiconductor memory device.
  • the present invention performs a memory test in the package state to detect defective memory cells.
  • the defect cell address is stored to a defective-cell-address latch in the case that the defect cell is found.
  • the defect cell is replaced with a redundancy logic cell in the case that the accessed address from the outside corresponds to the latched address.
  • the repair of any defective memory cells of a semiconductor memory device may be performed without constraint.
  • the redundancy logic cell established in the peripheries of a memory cell array has different physical structures from the memory cell array, which drastically decreases the probability of defects in the redundancy logic cell as compared with a semiconductor memory device having a conventional redundancy cell.

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