US5854846A - Wafer fabricated electroacoustic transducer - Google Patents

Wafer fabricated electroacoustic transducer Download PDF

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Publication number
US5854846A
US5854846A US08/711,444 US71144496A US5854846A US 5854846 A US5854846 A US 5854846A US 71144496 A US71144496 A US 71144496A US 5854846 A US5854846 A US 5854846A
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United States
Prior art keywords
substrate
diaphragm
electrode
transducer
layer
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US08/711,444
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English (en)
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Bob Ray Beavers
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Northrop Grumman Systems Corp
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Northrop Grumman Corp
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Priority to US08/711,444 priority Critical patent/US5854846A/en
Assigned to NORTHROP GRUMMAN CORPORATION reassignment NORTHROP GRUMMAN CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BEAVERS, BOB R.
Priority to DE69730165T priority patent/DE69730165T2/de
Priority to AU41825/97A priority patent/AU727839B2/en
Priority to CA002268053A priority patent/CA2268053A1/en
Priority to KR1019997001880A priority patent/KR20010029481A/ko
Priority to JP10512922A priority patent/JP2001500258A/ja
Priority to ZA9707995A priority patent/ZA977995B/xx
Priority to PCT/US1997/015643 priority patent/WO1998010252A2/en
Priority to EP97939815A priority patent/EP1009977B1/en
Priority to IL12872297A priority patent/IL128722A/en
Priority to TW086112803A priority patent/TW344903B/zh
Priority to US09/183,383 priority patent/US6145186A/en
Publication of US5854846A publication Critical patent/US5854846A/en
Application granted granted Critical
Priority to US09/459,223 priority patent/US6308398B1/en
Assigned to NORTHROP GRUMMAN CORPORATION reassignment NORTHROP GRUMMAN CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BEAVERS, BOB R.
Assigned to NORTHROP GRUMMAN SYSTEMS CORPORATION reassignment NORTHROP GRUMMAN SYSTEMS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NORTHROP GRUMMAN CORPORATION
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F11/00—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
    • G01F11/02—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement
    • G01F11/04—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the free-piston type
    • G01F11/06—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the free-piston type with provision for varying the stroke of the piston
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F11/00—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
    • G01F11/02—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement
    • G01F11/08—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the diaphragm or bellows type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49226—Electret making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece

Definitions

  • This invention relates to electroacoustic transducers, such as microphones, and particularly to capacitive electroacoustic transducers fabricated in batches by means of a wafer manufacturing process.
  • Capacitive electroacoustic transducers are widely used for the measurement of static and dynamic pressures.
  • these capacitive transducers such as employed in a microphone, have been made in such a manner that one electrode of a capacitor structure is formed by an electrically conductive diaphragm.
  • This diaphragm is disposed adjacent to, but insulated from, a stationary electrode forming the other electrode of the capacitor structure.
  • the two electrodes are spaced apart with an air gap in-between.
  • a relatively high DC bias voltage is then applied between the electrodes.
  • Variations in the electrode spacing caused by deflections of the diaphragm in response to the force of acoustic wave energy incident on the diaphragm, produce a change in capacitance.
  • a detection network is connected to the capacitive transducer such that the change in capacitance is detected and transformed into an electrical signal proportional to the force of the acoustic wave energy applied to the diaphragm.
  • the sensitivity and response of a capacitive electroacoustic transducer is also closely tied to its thermal stability. This thermal stability is partially dependent upon the change in the separation between the diaphragm and the stationary electrode caused by expansion or contraction of the transducer components when subjected to changing temperatures.
  • the critical electrode spacing in existing capacitive transducers has been difficult to maintain over a widely varying temperature environment. This is especially true where the differential axial expansion length of the components is large in the first place. For instance, many existing transducers have expansion lengths on the order of 0.25 inch. Large expansion lengths mean that expansion and contraction of the transducer elements produce significant changes in the electrode separation distance. A significant change in this separation distance alters the response of the transducer.
  • a capacitive electroacoustic transducer which includes an electrically insulative substrate, a layer of conductive material disposed on a portion of a top surface of the substrate forming a first electrode of the transducer, a conductive diaphragm forming a second electrode of the transducer which is deflectable in relation to the first electrode, and a structure for electrically and physically separating the first and second electrodes in a spaced relationship so as to constitute a capacitor.
  • This electrical and physical separation allows an electric field formed between the first and second electrodes to vary in relationship with deflections of the second electrode to permit conversion between electrical and acoustic signals.
  • the substrate and first electrode can include at least one through-hole for allowing air trapped in the space formed between the diaphragm and the top surfaces of the substrate and first electrode to escape to a region adjacent a back surface of the substrate.
  • the number and diameter of these holes determines the resistance to the aforementioned air flow, and thus partially determines the response characteristics of the transducer.
  • the diaphragm includes a vent hole for equalizing relative pressure between ambient air exterior of the diaphragm and air interior of the diaphragm. This equalization is required to provide stable transducer performance characteristics in the face of variations in the external air pressure.
  • the vent hole size can be varied to tune the response characteristics of the transducer.
  • the separating structure is a diaphragm mounting ring disposed about the periphery of the top surface of the substrate and separated from the first electrode.
  • the ring is thicker than the first electrode by an amount corresponding to a desired separation between the diaphragm and the first electrode.
  • the diaphragm is also peripherally bonded to this diaphragm mounting ring.
  • a compensation ring can be disposed on an opposite side of the substrate in an area corresponding to the diaphragm mounting ring on the top surface of the substrate. This compensation ring has the same physical size as the diaphragm mounting ring and is made of the same material.
  • the purpose of the compensation ring is to balance out any stress caused in the substrate by the thermal expansion and contraction of the diaphragm mounting ring. Further, the diaphragm mounting ring and compensation ring can be electrically conductive and electrically connected, thereby allowing connection of the mounting ring to ground or to electronic components from the backside of the substrate.
  • a layer of conductive material is disposed on the sides of the through-holes and on a bottom surface of the substrate to provide an electrical pathway between the first electrode and the layer of conductive material on the bottom surface of the substrate. This pathway facilitates the connection of the first electrode to the electronics of the transducer.
  • the above-described transducer exhibits a high degree of thermal stability.
  • the stability is partly due to the substrate and diaphragm being made of materials having closely matched thermal expansion coefficients. This feature ensures that the tension in the diaphragm stays constant even with varying temperatures, thereby maintaining a constant transducer sensitivity.
  • the substrate is made of FORSTERITE ceramic material and the diaphragm is made of titanium foil, which have closely matched thermal expansion coefficients.
  • the distance separating the first and second electrodes is minimized so as to create a short thermal expansion path. This short path length minimizing changes in the response of the transducer due to variations in temperature.
  • the distance separating the first and second electrodes is approximately 0.001 inches.
  • the substrate and diaphragm be made of materials having dissimilar thermal expansion coefficients
  • another method of thermal compensation can be employed.
  • a first layer of a thermally compensating material is interposed between the first electrode and the substrate, and a second layer of the thermally compensating material is disposed on an opposite side of the substrate in an area corresponding to the first layer on the top surface of the substrate.
  • the thermally compensating material exhibits a thermal coefficient of expansion such that the substrate is induced to expand and contract at a rate substantially similar to that of the diaphragm.
  • the sensitivity of the transducer remains constant under varying temperatures.
  • a third layer of thermally compensating material can be interposed between the substrate and the diaphragm mounting ring, and a fourth layer of thermally compensating material can be disposed on the opposite side of the substrate in an area corresponding the location of the third layer on the top surface of the substrate.
  • the capacitive electroacoustic transducer according to the present invention is produced by a method including the steps of forming the electrically insulative substrate, forming the first electrode over a portion of a top surface of the substrate, forming the structure for electrically and physically separating the first electrode from the diaphragm, and attaching the diaphragm.
  • the step of forming the electrically insulative substrate includes cutting a circular slot through a wafer made of an electrically insulating material.
  • the circular slot is interrupted by at least two tabs connecting a circular area enclosed by the circular slot and constituting the substrate, with the reminder of the wafer. These tabs are breakable so as to release the substrate from the remainder of the wafer.
  • the step of forming the first electrode over a portion of a top surface of the substrate includes depositing a layer of metal in a central region thereof.
  • the step of forming the structure for electrically and physically separating the first electrode from the diaphragm includes depositing a layer of metal to form the diaphragm mounting ring.
  • the center conductor and diaphragm mounting ring could alternately be formed by first depositing a layer of metal over the top surface of the substrate, and then, etching the metal to form the first electrode and diaphragm mounting ring.
  • the aforementioned step of attaching a conductive diaphragm preferably entails bonding the periphery of the diaphragm to the diaphragm mounting ring by thermal diffusion.
  • conventional adhesives can be used if desired.
  • the method of producing a capacitive electroacoustic transducer can also include forming the aforementioned one or more holes in the substrate and first electrode for allowing air trapped in a space between the diaphragm and the top surfaces of the substrate and first electrode to escape to a region adjacent a back surface of the substrate. Additionally, the aforementioned layer of conductive material on the sides of the through-holes and on a bottom surface of the substrate can be formed by depositing metal on these surfaces. Further, the step of forming the layer of conductive material on the bottom surface of the substrate can include forming a first layer of material in a central region of the substrate and a second layer of material constituting a compensation ring.
  • the compensation ring is disposed about the periphery of the bottom surface of the substrate and separated from the first layer.
  • the first layer can have the same physical size as the first electrode and be made of the same material
  • the compensation ring can have the same physical size as the diaphragm mounting ring and be made of the same material.
  • the diaphragm mounting ring and the compensation ring can also be electrically connected.
  • the above described production method is not limited to manufacturing one transducer at a time. Rather the method is conducive to producing many transducers simultaneously. This is accomplished by forming a plurality of electrically insulative substrates by cutting a plurality of circular slots through a larger wafer. Each circular slot is interrupted by at least two tabs, as before. This facilitates the release the substrates from the remainder of the wafer by breaking the tabs. Additionally, a layer of conductive material is formed over a portion of a top surface of each substrate to form the first electrode of each transducer. Similarly, the structure for electrically and physically separating the first electrode from a second electrode is formed over a portion of the top surface of each substrate by depositing a layer of metal to form the diaphragm mounting ring.
  • the conductive diaphragm constituting the second electrode of the transducer is attached to each diaphragm mounting ring. This is accomplished by stretching a single sheet of a material comprising a material making up the diaphragm to a desired tension, and then, placing the stretched sheet of material onto the wafer such that portions of the sheet come into contact with each of the diaphragm mounting rings disposed on the wafer. The portions of the stretched sheet of material contacting each diaphragm mounting ring are then bonded to each ring, respectively. And finally, the excess portions of the stretched sheet existing outside an outer edge of each diaphragm mounting ring are cut away.
  • FIG. 1A is a perspective view of a capacitive electroacoustic transducer incorporating features of the present invention.
  • FIG. 1B is a cross-sectional view of the transducer of FIG. 1A.
  • FIG. 2 is a partially cut-away view of a microphone incorporating the transducer of FIG. 1A.
  • FIGS. 3A-D are perspective views of the transducer of FIG. 1A during various stages of fabrication in accordance with method features of the present invention.
  • FIGS. 4A-B are perspective views of a plurality of the transducers of FIG. 1A being simultaneously batch produced during different stages of fabrication in accordance with method features of the present invention.
  • FIG. 5 is a cross-sectional view of an alternate embodiment of a transducer in accordance with the present invention wherein layers of a thermally compensating material are employed.
  • FIG. 1A-B shows a capacitive electroacoustic transducer 10 in accordance with a preferred embodiment of the present invention.
  • the transducer 10 includes a cylindrical substrate 12 made of a insulative material. This insulative material is preferably FORSTERITE ceramic, and the substrate 12 preferably has a diameter of approximately 0.30 inches and a uniform thickness of about 0.025 inches.
  • the center portion of the substrate 12 is covered with a thin conductive layer to form a center electrode 16 of the transducer 10.
  • this conductive layer is a thin layer of gold having a thickness in the range of about 1000 ⁇ -0.5 mils.
  • the center electrode 16 have a circular shape with a diameter of approximately 0.2 inches.
  • the periphery of the substrate 12 is covered with an annular conductive layer which forms the diaphragm mounting ring 18.
  • this ring is also made of gold.
  • the ring 18 is thicker than the conductive layer of the center electrode 16, and separated from it by a annular space 20, which is preferably about 0.2 inches wide.
  • This compensation ring 17 has the same physical dimensions and placement as the mounting ring 18, and is made of the same material (preferably gold).
  • This ring 17 is used to equalize potential stresses placed on the substrate 12 by the mounting ring 18 due to its thermal expansion or contraction, assuming the substrate 12 and mounting ring 18 have difference coefficients of expansion.
  • the mounting ring 18 and compensation ring 17 can be electrically connected via a metalization layer 19 around the edge of the substrate. This metalization layer 19 allows the mounting ring 18 to be connected to ground, or to electronic components, from the backside of the transducer 10. The advantage of this backside connection scheme will be discussed more fully below in connection with a description of the packaging the transducer in a microphone.
  • a thin conductive diaphragm 22 stretches over the center electrode 16 and is attached at its edges to the ring 18, as best shown in FIG. 1B.
  • This diaphragm 22 is preferably made of an approximately 0.0001 inch thick titanium foil. Titanium foil of this thickness will provide the necessary sensitivity to the acoustic input, while at the same time providing the mechanical strength required to ensure the diaphragm 22 is structurally sound.
  • the mounting ring 18 is thicker than the center electrode 16 to cause the diaphragm 22 to be spaced above the center electrode 16 by an air gap 24. This creates a capacitive structure with the center electrode 16 forming a stationary electrode, and the diaphragm 22 forming a movable electrode.
  • the annular space 20 between the diaphragm mounting ring 18 and the center electrode 16 forms an electrical surface barrier between the elements to complete the capacitive structure.
  • the separation between the two electrodes 16, 22 is about 0.001 inches.
  • the mounting ring 18 is preferably about 0.001 inches thicker than the center electrode 16.
  • a small vent hole 26 is formed in the diaphragm 22 to equalize the pressure between the ambient air exterior of the diaphragm 22 and the air gap 24 behind the diaphragm 22. This prevents unwanted deflection of the diaphragm 22 due to changes in the ambient pressure.
  • the diameter of the vent hole 26 determines the low frequency cut-off point in the transducer's response. It is preferred that this vent hole 26 be approximately 0.0015 inches in diameter. A conventional laser trimming process can be employed to produce a hole 26 of this diameter in the diaphragm 22.
  • the number of holes 14 and their respective diameters partially determine the response of the transducer 10. Assuming a hole diameter of about 0.025 inches, when a large number of holes 14 are formed (i.e. preferably 12), there is very little resistance to the movement of air from the space formed between the diaphragm 22 and the top surfaces of the substrate 12 and center electrode 16. This results in a transducer response having a substantially constant phase, but a large peak in the response at resonance. These characteristics are desirable in applications where a constant phase in required.
  • the voltage spike can be smoothed using filtering electronics. If, however, fewer holes 14 are employed, the resistance to the movement of air increases. This higher flow resistance smoothes out the voltage spike in the transducer's response, but does not provide the aforementioned constancy in phase. The smoother response characteristics of this latter approach has advantage in some applications.
  • the above-described capacitive electroacoustic transducer 10 employing the preferred dimensions, and twelve through-holes 14, will exhibit a response in a range of about 5 Hz-10 kHz, and will have a sensitivity of about -40 dB v .
  • these performance characteristics can be modified to suit the application by employing different transducer dimensions.
  • the holes 14, and the surface of the substrate 12 opposite the center electrode 16 are also metalized to provide an electrical pathway between the center electrode 16 and the bottom of the substrate 12. This facilitates the packaging of the transducer 10 in a microphone as exemplified by FIG. 2.
  • the transducer 10 is installed in a conductive casing 28 which also contains the electronic components 30 necessary to detect and process changes in the capacitance of the transducer 10 caused by the force of the acoustic waves impacting the diaphragm 22.
  • the center electrode is connected to the electronics 30 by means of a spring-mounted contact 32 touching the aforementioned metalization on the opposite side of the substrate 12. Whereas, the electrical pathway between the diaphragm 22 and the electronics 30 is provided via the conductive casing 28, or the compensation ring described previously.
  • the diaphragm 22 is electrically connected to the casing 28 by a conductive spacer ring 34 disposed between the casing 28 and the periphery of the diaphragm 22.
  • This spacer ring 34 additionally separates the vibrating portion of the diaphragm 22 from the top of the casing 28 to prevent interference between the two structures.
  • the top of the casing 28 is perforated. The perforations allow the acoustic waves to pass through and impinge on the diaphragm 22.
  • the bottom of the casing 28 is sealed to prevent sound waves from entering and impinging on the rear side of the diaphragm 22. Without such a provision the function of the device would be destroyed as the sound waves acting on the front and back of the diaphragm 22 would dampen or reduce its vibration.
  • FIGS. 3A-D illustrate the preferred sequence for fabricating a capacitive electroacoustic transducer in accordance with the present invention.
  • the process begins with a wafer 102.
  • the wafer 102 is laser machined to create the through-holes 104 and to form the circular outer edge 106 of the transducer's substrate 108 as shown in FIG. 3A.
  • the substrate 108 is connected to the remainder of the wafer 102 by two thin spokes 110 so that it can be easily separated by breaking the spokes 110 after the transducer manufacturing processes are complete.
  • two spokes 110 are preferred, more or less may be used if desired. Since the finished transducer can be mechanically broken free, there is no need for sawing the wafer 102. Sawing would require that the transducer have a generally square shape, instead of the more practical circular shape according to the present invention. In addition, the creation of potentially harmful dust from the sawing process is eliminated.
  • FIG. 3B illustrates the first metalization step of the process.
  • a thin metal layer is deposited on the top of the substrate 108 to form the center electrode 112 and the base 114 of the diaphragm mounting ring.
  • the metal is deposited on the sides of the through-holes 104 and on the bottom of the substrate 108 opposite the center electrode 112.
  • the second metalization step is illustrated in FIG. 3C.
  • metal is deposited on top of the diaphragm mounting ring base to build-up the ring 116.
  • the built-up ring 116 is then made completely uniform in height, for example, by lapping its top surface with a fixture employing a diamond stop.
  • the diaphragm 118 is then stretched to the desired tension, preferably about 1000 N/m, and bonded to the top surface of the diaphragm mounting ring 116, as shown in FIG. 3D.
  • the diaphragm 118 could be bonded to the ring 116 using conventional adhesives, it is preferred that a thermal diffusion process be employed. Any excess diaphragm material extending past the perimeter of the ring 116 is removed after bonding to prevent peeling during subsequent processing.
  • a tested embodiment of the present invention twenty-three (23) transducers were simultaneously produced on a 2 ⁇ 2 inch square wafer.
  • a 2 ⁇ 2 inch wafer was chosen for the tested embodiment so that a commercially available 3.5 inch wide sheet of titanium foil could be stretched over the wafer and bonded to the individual diaphragm mounting rings.
  • larger wafers and titanium foil sheets could be employed, as available, to simultaneously produced many more transducers than in the aforementioned tested embodiment. It is envisioned that 100 or more transducers could be produced on a single appropriately sized wafer. This batch processing will result in considerable cost savings over the hand crafting methods typical of the prior art.
  • each of the transducers produced on the wafer will have essentially identical structural dimensions. Accordingly, the resulting response and sensitivity performance characteristics of each transducer so produced will mirror those of every other transducer from the wafer. Additionally, the same characteristics can be maintained from one wafer to the next, thus making it possible to consistently produce transducers with repeatable and predetermined response and sensitivity performance characteristics. It is also noted that although the preferred materials and dimensional specifications were provided above, these can be easily modified to alter the performance characteristics of the transducer. Thus, production methods according to the present invention additionally make it possible to customize the performance characteristic of a transducer with little difficulty.
  • Capacitive electroacoustic transducers produced in accordance with the preferred embodiments of the present invention also exhibit excellent thermal stability.
  • thermal stability is partially dependent on the change in the separation between the diaphragm and the stationary electrode caused by expansion or contraction of the transducer components due to a change in temperature.
  • the smaller the separation between the diaphragm and the electrode the relatively less change that will occur due to the aforementioned expansion and contraction.
  • this separation, or thermal expansion path length is extremely short, i.e. only about 0.001 inches. Thus, very little change is experienced in the response of the transducer due to expansion and contraction, even in a widely varying temperature environment.
  • the aforementioned matching of thermal expansion coefficients is the preferred method of maintaining a constant diaphragm tension
  • another method could be used instead.
  • This alternate method entails depositing a layer of thermally compensating material on the substrate which modifies the element's rate of expansion. For instance, as shown in FIG. 5, if a substrate having a lower coefficient of expansion than the diaphragm is employed, a layer of thermally compensating material 302 exhibiting a high rate of expansion could be deposited on the substrate 304 under the center electrode 306, and possibly the diaphragm mounting ring 308, and on corresponding areas of the opposite side of the substrate 304. When subjected to a change in temperature, this added material causes the underlying substrate material to expand or contract at a faster rate.
  • the material would be chosen so as to accelerate the rate of expansion or contraction to closely match that of the diaphragm. Thus, the tension on the diaphragm would be maintained, and so the transducer's sensitivity. It is noted that the layer of thermally compensating material deposited on the bottom of the substrate is needed to equalize the resulting modified expansion and contraction of the substrate. If the material were placed only on the top, the expansion and contraction of the upper part of the substrate would differ from that of the lower part. This would cause the substrate to distort and affect the uniformity of the spacing between the center electrode and the diaphragm.
US08/711,444 1996-09-06 1996-09-06 Wafer fabricated electroacoustic transducer Expired - Lifetime US5854846A (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
US08/711,444 US5854846A (en) 1996-09-06 1996-09-06 Wafer fabricated electroacoustic transducer
EP97939815A EP1009977B1 (en) 1996-09-06 1997-09-05 Wafer-fabricated electroacoustic transducer
TW086112803A TW344903B (en) 1996-09-06 1997-09-05 Wafer fabricated electroacoustic transducer
CA002268053A CA2268053A1 (en) 1996-09-06 1997-09-05 Wafer fabricated electroacoustic transducer
KR1019997001880A KR20010029481A (ko) 1996-09-06 1997-09-05 웨이퍼로 제조된 전기음향 변환기
JP10512922A JP2001500258A (ja) 1996-09-06 1997-09-05 ウェーハ製造された電気音響トランスデューサ
ZA9707995A ZA977995B (en) 1996-09-06 1997-09-05 Wafer fabricated electroacoustic transducer.
PCT/US1997/015643 WO1998010252A2 (en) 1996-09-06 1997-09-05 Wafer fabricated electroacoustic transducer
DE69730165T DE69730165T2 (de) 1996-09-06 1997-09-05 Auf einer substratscheibe hergestellter elektroakustischer wandler
IL12872297A IL128722A (en) 1996-09-06 1997-09-05 Alcoacoustic transducer produced in slice form
AU41825/97A AU727839B2 (en) 1996-09-06 1997-09-05 Wafer fabricated electroacoustic transducer
US09/183,383 US6145186A (en) 1996-09-06 1998-10-30 Wafer fabricated electroacoustic transducer
US09/459,223 US6308398B1 (en) 1996-09-06 1999-12-10 Method of manufacturing a wafer fabricated electroacoustic transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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WO2002052894A1 (en) * 2000-12-22 2002-07-04 Brüel & Kjær Sound & Vibration Measurement A/S A micromachined capacitive transducer
EP1246502A1 (en) * 2001-03-30 2002-10-02 Phone-Or Ltd Microphone
EP1261234A2 (en) * 2001-05-15 2002-11-27 Citizen Electronics Co., Ltd. Condenser microphone and method for manufacturing condenser microphones
EP1343353A1 (en) * 2000-10-20 2003-09-10 Brüel & Kjaer Sound & Vibration Measurement A/S A capacitive transducer
US20030174850A1 (en) * 2000-10-20 2003-09-18 Gullov Jens Ole Capacitive transducer
US20040184633A1 (en) * 2000-12-20 2004-09-23 Shure Incorporated Condenser microphone assembly
US20040238267A1 (en) * 2001-06-19 2004-12-02 Yoshio Sakamoto Diaphragm structure of light sound converter
US20080275124A1 (en) * 2002-02-22 2008-11-06 Ajinomoto Co., Inc. Powder of amino acids and method for producing the same
US20130230199A1 (en) * 2010-11-12 2013-09-05 Phonak Ag Hearing device with a microphone
USD866517S1 (en) * 2017-09-12 2019-11-12 Pioneer Corporation Speaker for automobile
US10888897B2 (en) 2016-10-27 2021-01-12 Cts Corporation Transducer, transducer array, and method of making the same

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JP3445536B2 (ja) * 1999-10-04 2003-09-08 三洋電機株式会社 半導体装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6097821A (en) * 1996-11-27 2000-08-01 Nagano Keiki Co., Ltd. Electrostatic capacitance type transducer
EP1343353A1 (en) * 2000-10-20 2003-09-10 Brüel & Kjaer Sound & Vibration Measurement A/S A capacitive transducer
WO2002034008A1 (en) * 2000-10-20 2002-04-25 Brüel & Kjær Sound & Vibration Measurement A/S A capacitive transducer
US6944308B2 (en) 2000-10-20 2005-09-13 Bruel & Kjaer Sound & Vibration Measurement A/S Capacitive transducer
US20030174850A1 (en) * 2000-10-20 2003-09-18 Gullov Jens Ole Capacitive transducer
US7218742B2 (en) 2000-12-20 2007-05-15 Shure Incorporated Condenser microphone assembly
US20040184633A1 (en) * 2000-12-20 2004-09-23 Shure Incorporated Condenser microphone assembly
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EP1246502A1 (en) * 2001-03-30 2002-10-02 Phone-Or Ltd Microphone
EP1261234A2 (en) * 2001-05-15 2002-11-27 Citizen Electronics Co., Ltd. Condenser microphone and method for manufacturing condenser microphones
EP1261234A3 (en) * 2001-05-15 2007-11-07 Citizen Electronics Co., Ltd. Condenser microphone and method for manufacturing condenser microphones
US20040238267A1 (en) * 2001-06-19 2004-12-02 Yoshio Sakamoto Diaphragm structure of light sound converter
US7418109B2 (en) * 2001-06-19 2008-08-26 Kabushiki Kaisha Kenwood Diaphragm structure of light sound converter
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US7662799B2 (en) 2002-02-22 2010-02-16 Ajinomoto Co., Inc. Powder of amino acids and method for producing the same
US20130230199A1 (en) * 2010-11-12 2013-09-05 Phonak Ag Hearing device with a microphone
US9232318B2 (en) * 2010-11-12 2016-01-05 Sonova Ag Hearing device with a microphone
US10888897B2 (en) 2016-10-27 2021-01-12 Cts Corporation Transducer, transducer array, and method of making the same
USD866517S1 (en) * 2017-09-12 2019-11-12 Pioneer Corporation Speaker for automobile

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ZA977995B (en) 1998-03-02
JP2001500258A (ja) 2001-01-09
WO1998010252A3 (en) 1998-07-02
WO1998010252A2 (en) 1998-03-12
TW344903B (en) 1998-11-11
US6145186A (en) 2000-11-14
EP1009977B1 (en) 2004-08-04
DE69730165T2 (de) 2005-08-11
DE69730165D1 (de) 2004-09-09
IL128722A0 (en) 2000-01-31
CA2268053A1 (en) 1998-03-12
AU727839B2 (en) 2001-01-04
EP1009977A2 (en) 2000-06-21
AU4182597A (en) 1998-03-26
KR20010029481A (ko) 2001-04-06
IL128722A (en) 2002-12-01
US6308398B1 (en) 2001-10-30

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