US5785578A - Equipment for the grinding of material samples - Google Patents
Equipment for the grinding of material samples Download PDFInfo
- Publication number
- US5785578A US5785578A US08/592,343 US59234396A US5785578A US 5785578 A US5785578 A US 5785578A US 59234396 A US59234396 A US 59234396A US 5785578 A US5785578 A US 5785578A
- Authority
- US
- United States
- Prior art keywords
- turntable
- grinding
- equipment
- rotation
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/02—Wheels in one piece
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
Definitions
- the present invention relates to equipment for the grinding of material samples, for instance microstructure grinding of a rock sample assembled on a microscope slide.
- the most common grinding method is based on so-called "patching". Silicon carbide grain in a water suspension is supplied to a rotary cast iron disk. The material samples (the microscope slide with the samples) are assembled with one or more rotary holders and are pressed towards the rotary cast iron disk. With this type of equipment and method the silicon carbide grains as such act as a grinding compound, and the thickness of the samples is reduced gradually to about 30 ⁇ m.
- the know method and equipment is, however, encumbered with several disadvantages. Firstly, the grinding grains are pressed into the epoxy plastic in the material samples during the "patching" process and appear as black particles in the pores in the ground material samples. This, in the worst case, may make the samples unsuitable for further analyses. Secondly, the rotary cast iron disk may obtain an oblique surface during the grinding operation and have to be adjusted frequently. This involves considerably more work. The obliquity in the cast iron disk may also lead to considerably unevenness in the material samples in which case they could not be used for further testing.
- a further disadvantage of the known equipment is that it requires supervision by an operator and is therefor expensive to us.
- the equipment according to the invention includes a rotating table (a turntable) on which the material samples are releasably provided.
- the grinding thereby takes place in at least one step by means of at least one vertically moveable grinding spindle arranged above the turntable.
- FIGS. 1(a)-(c) show (a) a front side view, (b) a side view and (c) a top view of grinding equipment in accordance with the invention
- FIG. 2 shows, on a larger scale, a support for a grinding spindle included with the equipment of FIGS. 1(a)-(c);
- FIGS. 3(a) and (b) show, as seen from the top and on an enlarged scale, a turntable according to the present invention and a detail thereof, respectively.
- FIGS. 4 show two examples of material samples, which are ground by means of, in FIG. 4 (a), grinding equipment according to the invention, and in FIG. 4(b), known equipment by "patching" respectively.
- the equipment according to the invention includes, as shown in FIG. 1, four main components, namely, a frame and console structure 1, a grinding spindle arrangement 2, a turntable 3 and a control unit 4.
- the frame and console structure 1 is designed to absorb great amounts of energy, during the grinding operation when the equipment is used, and is therefore made of strong steel beams and stiffeners 5, 6 and 7 to ensure sufficient stability and prevent unevenness of the grinding samples. Concerning further details about the frame and console structure, such details lie within the competence of a person skilled in the art, and will therefore not be further described here.
- the grinding spindle arrangement 2 comprises, as shown in FIG. 1, two grinder spindles provided above the turntable 3, one rough and one fine spindle, each being driven by an electric motor 8.
- Each spindle and motor unit 2, 8 are supported by a sledge or a carriage 9 which is movable in the vertical direction along rails 10 on the console structure.
- Each carriage 9, with a spindle 2 can be moved up or down by means of a high precision nut and screw arrangement 11, which is operated by a servomotor 12.
- the equipment according to the invention is, as mentioned above, designed to be able to finely grind material samples to a thickness of 20-30 ⁇ m and with a precision of ⁇ 1 ⁇ m.
- the grinding spindle is supported in a special support 13 on the sledge 9, which is further shown on an enlarged scale in FIG. 2.
- the cup springs produce a constant pressure toward the bearing 18 and respectively the low thrust bearings 15, 16, which results in that any overheating of the spindle does not create inaccuracy toward the grinding surface.
- the spindle shaft is, in other words, free to expand in the upward direction.
- the Teflon seal has low friction, which creates low heat generation in the spindle housing.
- the grinding spindles as such, they consist of diamond particles bound in a metal material formed as disks 21, and are preferably formed as a cup to obtain good cooling during the grinding operation.
- the use of diamond disks represents an essential advantage of the invention, since the material samples become entirely clean and free from unwanted particles in the structure of the ground material.
- FIGS. 4 are shown two examples of material samples which are ground by the means of, in FIG. 4(a), grinding equipment according to the invention, and in FIG. 4(b), known equipment by "patching", respectively. From FIG. 4(b) it follows that there are several unwanted particles in the material structure. The material samples shown in FIG. 4(a) have no such particles.
- the turntable 3 (see FIGS. 1), which constitutes the third important element in the invention, comprises a circular disk which, via a belt 22 or the like, is driven by an electric motor 23.
- the disk 3 with the drive gear 22, 23 is arranged on a carriage, sledge or the like 24 which is movably provided on rails 25 on the frame structure 5.
- the carriage 24 can be suitably driven by means of a servomotor 27 via a nut and screw arrangement similar to the solution which is used for the raising and lowering of the grinding spindles 2.
- the turntable 3 By arranging the turntable 3 to be movable as mentioned above, there can be provided a combined oscillatory and rotary grinding motion for the material samples which give a smooth and exact (covering totally) grinding of these.
- FIG. 3(a) shows, on an enlarged scale, a turntable 3 in accordance with the invention as seen from the top.
- the turntable is made of brass, free from material tension, and has several holes 28 communicating with grooves or recesses 31 (see FIG. 3(b)) which are arranged in a pattern at some distance from one another and which are connected to a vacuum source (not shown). Totally, the table has forty such holes with grooves, which can hold an equivalent number of such samples.
- water is supplied to the turntable to cool the material samples via one or more nozzles provided above the table. This is not further shown in the figures.
- the fourth important part which is included in the present invention is a programmable logic control (PLC) unit, which constitutes the control system 4.
- PLC programmable logic control
- the operation of the PLC-unit can suitably take place via so-called "touch screen display” where different menus with touch buttons are used to control the grinding equipment.
- the whole control system is provided in connection with a control board arranged on the grinding equipment, or preferably on a separate control board, providing easy access for the operator.
- a sub menu will appear with choices related to the running of the turntable and choices as to which grinding motor it is desirable to use. If fine or rough grinding is chosen, another sub menu will appear where manual running of the grinding procedure is carried out. It is also possible here to get into and save (memorize) reference points, which later can be used for fully automatic grinding with the machine, i.e. by grinding a sample and by saving the reference points, the machine can automatically execute a repetition of the grinding procedure.
- a choice of end positions for the oscillating movements of the turntable is performed on a separate menu. On this menu the speed for automatic grinding also can be programmed.
- the material samples are at first placed on the turntable, and the vacuum and cooling water is turned on. Thereafter automatic glass sample grinding or automatic rock sample grinding is chosen from the main menu.
- the respective sub menus appear and it is possible to start and stop the grinding procedure at any point in the program.
- the whole grinding procedure can be executed with rough and fine grinding and with simultaneous oscillation of the turntable until the grinding operation is finished. Then the turntable will move back to the starting point and the material samples are ready for further treatment and analyses.
- the material samples are rough-grinded to a suitable thickness at first, for instance 100 ⁇ m, with the rough grinding disk, before they are ground by the fine grinding disk to the desired thickness, for instance about 30 ⁇ m.
- the invention as defined in the claims is, however, not limited to two grinding disks, but can be provided with only one, or more than three disks of this kind.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Sampling And Sample Adjustment (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Disintegrating Or Milling (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO942242A NO179238C (no) | 1994-06-15 | 1994-06-15 | Utstyr for tynnsliping av materialpröver |
NO942242 | 1994-06-15 | ||
PCT/NO1995/000101 WO1995034802A1 (en) | 1994-06-15 | 1995-06-14 | Equipement for the grinding of material samples |
Publications (1)
Publication Number | Publication Date |
---|---|
US5785578A true US5785578A (en) | 1998-07-28 |
Family
ID=19897186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/592,343 Expired - Fee Related US5785578A (en) | 1994-06-15 | 1995-06-14 | Equipment for the grinding of material samples |
Country Status (15)
Country | Link |
---|---|
US (1) | US5785578A (ko) |
EP (1) | EP0713575B1 (ko) |
JP (1) | JP3190972B2 (ko) |
KR (1) | KR100383524B1 (ko) |
CN (1) | CN1097726C (ko) |
AT (1) | ATE216071T1 (ko) |
AU (1) | AU692270B2 (ko) |
CA (1) | CA2167400A1 (ko) |
CZ (1) | CZ290918B6 (ko) |
DE (1) | DE69526307T2 (ko) |
DK (1) | DK0713575T3 (ko) |
ES (1) | ES2174949T3 (ko) |
NO (1) | NO179238C (ko) |
RU (1) | RU2134160C1 (ko) |
WO (1) | WO1995034802A1 (ko) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070010171A1 (en) * | 2005-07-05 | 2007-01-11 | Supfina Machine Co., Inc. | Superfinishing machine and method |
EP1779970A1 (en) * | 2005-10-27 | 2007-05-02 | BIESSE S.p.A. | Numerically-controlled work centre for machining plates of glass, stone, marble and the like, with two or more machining heads |
US7891694B2 (en) * | 2005-07-14 | 2011-02-22 | Atomic Austria Gmbh | Method for machining the running surfaces of winter sports appliances |
CN101339114B (zh) * | 2008-09-03 | 2012-05-23 | 石家庄铁道学院 | 陶瓷磨削加工性能测试方法 |
US20160250734A1 (en) * | 2014-09-22 | 2016-09-01 | Guangdong Institute Of Automation | Automated polishing system and method |
US20170138667A1 (en) * | 2014-10-31 | 2017-05-18 | Hunan Sundy Science And Technology Co., Ltd. | Wind Permeation-Type Dryer Capable of Scraping Material |
CN106826518A (zh) * | 2017-01-26 | 2017-06-13 | 武汉科技大学 | 一种金相试样磨样机 |
US10537897B2 (en) * | 2016-09-30 | 2020-01-21 | Industrial Technology Research Institute | Grinding machine and a slight gyration module |
KR102262825B1 (ko) * | 2020-12-16 | 2021-06-09 | 주식회사 알엔비 | 복합 연마기 |
US20210254965A1 (en) * | 2020-02-18 | 2021-08-19 | Metal Industries Research & Development Centre | Measurement device for grinding wheel |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE508604C2 (sv) * | 1997-02-24 | 1998-10-19 | Dentronic Ab | Förfarande och arrangemang för abrasiv precisionsbearbetning av ett ämne |
DE20204088U1 (de) | 2002-03-13 | 2002-06-06 | Müller, Heinrich, 57635 Wölmersen | Oberflächenbearbeitungsvorrichtung für Probekörper |
CN101096074B (zh) * | 2006-06-30 | 2010-11-24 | 上海中晶企业发展有限公司 | 大直径高精度玻璃抛光机的自动移盘机构 |
CN103033403B (zh) * | 2011-09-29 | 2015-09-02 | 鞍钢股份有限公司 | 一种薄板金属薄膜试样的制备方法 |
CN103308363B (zh) * | 2013-06-24 | 2015-02-18 | 黄河勘测规划设计有限公司 | 岩体制样变形测试方法 |
CN104406828B (zh) * | 2014-10-30 | 2017-01-25 | 东北石油大学 | 含弱界面低强度岩石试样制备装置及其制备试样方法 |
CN104551897B (zh) * | 2015-01-04 | 2017-01-18 | 中国矿业大学 | 一种适应不同外形尺寸岩样批量打磨的加工设备及方法 |
CN105709904B (zh) * | 2016-02-01 | 2017-10-31 | 上海化工研究院有限公司 | 一种均匀式微量样品研磨装置 |
JP6584532B2 (ja) * | 2016-02-09 | 2019-10-02 | 東京エレクトロン株式会社 | 研削装置および研削方法 |
CN107631898A (zh) * | 2016-07-19 | 2018-01-26 | 广东石油化工学院 | 一种立式多功能岩石加工系统 |
CN106584239B (zh) * | 2016-12-07 | 2018-11-02 | 杭州正驰达精密机械有限公司 | 一种机械手表摆锤的自动磨削机床 |
CN106826405A (zh) * | 2016-12-27 | 2017-06-13 | 中国石油天然气股份有限公司 | 岩石磨片方法 |
CN108801724B (zh) * | 2018-03-26 | 2021-09-24 | 翟如扬 | 一种污水污染物检验用样品处理装置 |
CN109176304A (zh) * | 2018-08-28 | 2019-01-11 | 南京理工大学 | 一种平面磨削用试验台 |
CN109682659B (zh) * | 2019-01-14 | 2021-01-15 | 邢华铭 | 一种农药残留检测用研磨设备 |
CN110328605B (zh) * | 2019-07-09 | 2021-06-11 | 业成科技(成都)有限公司 | 治具、研磨装置及样品块的研磨方法 |
DE102022125705A1 (de) | 2022-10-05 | 2024-04-11 | Atm Qness Gmbh | Teller-Schleif-/Poliergerät |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2869292A (en) * | 1957-05-29 | 1959-01-20 | Klugman Ira Louis | Precision grinding machine |
US3534506A (en) * | 1968-05-17 | 1970-10-20 | Us Army | Lens polishing apparatus |
DE1798139A1 (de) * | 1968-08-29 | 1971-11-04 | Telefunken Patent | Vorrichtung zum Polieren von Proben |
US3653854A (en) * | 1969-09-29 | 1972-04-04 | Toyoda Machine Works Ltd | Digitally controlled grinding machines |
US3704554A (en) * | 1971-04-26 | 1972-12-05 | Bausch & Lomb | Lens processing machine with movable workpiece spindle |
US3732647A (en) * | 1971-08-05 | 1973-05-15 | Coburn Manuf Co Inc | Polisher-finer machine |
GB1422908A (en) * | 1973-05-02 | 1976-01-28 | Cone Blanchard Machine Co | Grinding machines |
JPS5937037A (ja) * | 1982-08-26 | 1984-02-29 | Toshiba Corp | 立軸回転テ−ブル形平面研削盤 |
JPS61230853A (ja) * | 1985-04-03 | 1986-10-15 | Shibayama Kikai Kk | 半導体ウエハの自動平面研削盤における連続ダウンフイ−ド方式 |
EP0209764A2 (de) * | 1985-07-22 | 1987-01-28 | Alfred Biermann | Verfahren und Vorrichtung zur Herstellung von für die mikroskopische Untersuchung im Durchlicht geeigneten Dünnschliffen aus Proben mit harten Bestandteilen |
US4760668A (en) * | 1986-07-02 | 1988-08-02 | Alfred Schlaefli | Surface grinding machine and method |
US5035087A (en) * | 1986-12-08 | 1991-07-30 | Sumitomo Electric Industries, Ltd. | Surface grinding machine |
US5245793A (en) * | 1989-02-23 | 1993-09-21 | Supfina Maschinenfabrik Hentzen Gmbh & Co. Kg | Method and apparatus for fine working or microfinishing |
US5542874A (en) * | 1993-09-20 | 1996-08-06 | Nec Corporation | Wafer polishing apparatus |
-
1994
- 1994-06-15 NO NO942242A patent/NO179238C/no unknown
-
1995
- 1995-06-14 CA CA002167400A patent/CA2167400A1/en not_active Abandoned
- 1995-06-14 RU RU96105927A patent/RU2134160C1/ru not_active IP Right Cessation
- 1995-06-14 WO PCT/NO1995/000101 patent/WO1995034802A1/en active IP Right Grant
- 1995-06-14 AT AT95922789T patent/ATE216071T1/de not_active IP Right Cessation
- 1995-06-14 CZ CZ1996773A patent/CZ290918B6/cs not_active IP Right Cessation
- 1995-06-14 AU AU27550/95A patent/AU692270B2/en not_active Ceased
- 1995-06-14 DE DE69526307T patent/DE69526307T2/de not_active Expired - Fee Related
- 1995-06-14 EP EP95922789A patent/EP0713575B1/en not_active Expired - Lifetime
- 1995-06-14 DK DK95922789T patent/DK0713575T3/da active
- 1995-06-14 KR KR1019960700248A patent/KR100383524B1/ko not_active IP Right Cessation
- 1995-06-14 ES ES95922789T patent/ES2174949T3/es not_active Expired - Lifetime
- 1995-06-14 US US08/592,343 patent/US5785578A/en not_active Expired - Fee Related
- 1995-06-14 JP JP50197896A patent/JP3190972B2/ja not_active Expired - Fee Related
- 1995-06-14 CN CN95190560.0A patent/CN1097726C/zh not_active Expired - Fee Related
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US2869292A (en) * | 1957-05-29 | 1959-01-20 | Klugman Ira Louis | Precision grinding machine |
US3534506A (en) * | 1968-05-17 | 1970-10-20 | Us Army | Lens polishing apparatus |
DE1798139A1 (de) * | 1968-08-29 | 1971-11-04 | Telefunken Patent | Vorrichtung zum Polieren von Proben |
US3653854A (en) * | 1969-09-29 | 1972-04-04 | Toyoda Machine Works Ltd | Digitally controlled grinding machines |
US3704554A (en) * | 1971-04-26 | 1972-12-05 | Bausch & Lomb | Lens processing machine with movable workpiece spindle |
US3732647B1 (ko) * | 1971-08-05 | 1986-02-11 | ||
US3732647A (en) * | 1971-08-05 | 1973-05-15 | Coburn Manuf Co Inc | Polisher-finer machine |
GB1422908A (en) * | 1973-05-02 | 1976-01-28 | Cone Blanchard Machine Co | Grinding machines |
JPS5937037A (ja) * | 1982-08-26 | 1984-02-29 | Toshiba Corp | 立軸回転テ−ブル形平面研削盤 |
JPS61230853A (ja) * | 1985-04-03 | 1986-10-15 | Shibayama Kikai Kk | 半導体ウエハの自動平面研削盤における連続ダウンフイ−ド方式 |
EP0209764A2 (de) * | 1985-07-22 | 1987-01-28 | Alfred Biermann | Verfahren und Vorrichtung zur Herstellung von für die mikroskopische Untersuchung im Durchlicht geeigneten Dünnschliffen aus Proben mit harten Bestandteilen |
US4760668A (en) * | 1986-07-02 | 1988-08-02 | Alfred Schlaefli | Surface grinding machine and method |
US5035087A (en) * | 1986-12-08 | 1991-07-30 | Sumitomo Electric Industries, Ltd. | Surface grinding machine |
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US5542874A (en) * | 1993-09-20 | 1996-08-06 | Nec Corporation | Wafer polishing apparatus |
Non-Patent Citations (4)
Title |
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Patent Abstracts of Japan, vol. 11, No. 76, M 569, abstract of & JP, A, 61 230853 (Shibayama Kikai K.K.), 15 Oct. 1986. * |
Patent Abstracts of Japan, vol. 11, No. 76, M-569, abstract of JP, A, 61-230853 (Shibayama Kikai K.K.), 15 Oct. 1986. |
Patent Abstracts of Japan, vol. 8, No. 136, M 340, abstract of & JP, A, 59 037037 Tokyo Shibaura Denki K.K.), 29 Feb. 1984. * |
Patent Abstracts of Japan, vol. 8, No. 136, M-340, abstract of JP, A, 59-37037 Tokyo Shibaura Denki K.K.), 29 Feb. 1984. |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7785173B2 (en) | 2005-07-05 | 2010-08-31 | Supfina Machine Co. | Superfinishing machine and method |
US20070010171A1 (en) * | 2005-07-05 | 2007-01-11 | Supfina Machine Co., Inc. | Superfinishing machine and method |
US7891694B2 (en) * | 2005-07-14 | 2011-02-22 | Atomic Austria Gmbh | Method for machining the running surfaces of winter sports appliances |
EP1779970A1 (en) * | 2005-10-27 | 2007-05-02 | BIESSE S.p.A. | Numerically-controlled work centre for machining plates of glass, stone, marble and the like, with two or more machining heads |
US20070099543A1 (en) * | 2005-10-27 | 2007-05-03 | Biesse S.P.A. | Numeric-control work-centre for machining plates of glass, stone, marble or the like, with two or more machining heads |
US7416473B2 (en) | 2005-10-27 | 2008-08-26 | Biesse S.P.A. | Numeric-control work-centre for machining plates of glass, stone, marble or the like, with two or more machining heads |
CN101339114B (zh) * | 2008-09-03 | 2012-05-23 | 石家庄铁道学院 | 陶瓷磨削加工性能测试方法 |
US10144108B2 (en) * | 2014-09-22 | 2018-12-04 | Guangdong Institute Of Intelligent Manufacturing | Automated polishing system and method |
US20160250734A1 (en) * | 2014-09-22 | 2016-09-01 | Guangdong Institute Of Automation | Automated polishing system and method |
US20170138667A1 (en) * | 2014-10-31 | 2017-05-18 | Hunan Sundy Science And Technology Co., Ltd. | Wind Permeation-Type Dryer Capable of Scraping Material |
US9970707B2 (en) * | 2014-10-31 | 2018-05-15 | Hunan Sundy Science And Technology Co., Ltd | Wind permeation-type dryer capable of scraping material |
US10537897B2 (en) * | 2016-09-30 | 2020-01-21 | Industrial Technology Research Institute | Grinding machine and a slight gyration module |
CN106826518A (zh) * | 2017-01-26 | 2017-06-13 | 武汉科技大学 | 一种金相试样磨样机 |
US20210254965A1 (en) * | 2020-02-18 | 2021-08-19 | Metal Industries Research & Development Centre | Measurement device for grinding wheel |
US11486695B2 (en) * | 2020-02-18 | 2022-11-01 | Metal Industries Research & Development Centre | Measurement device for grinding wheel |
KR102262825B1 (ko) * | 2020-12-16 | 2021-06-09 | 주식회사 알엔비 | 복합 연마기 |
Also Published As
Publication number | Publication date |
---|---|
NO179238B (no) | 1996-05-28 |
CN1129981A (zh) | 1996-08-28 |
JP3190972B2 (ja) | 2001-07-23 |
NO942242L (no) | 1995-12-18 |
CN1097726C (zh) | 2003-01-01 |
RU2134160C1 (ru) | 1999-08-10 |
DE69526307D1 (de) | 2002-05-16 |
EP0713575A1 (en) | 1996-05-29 |
CZ290918B6 (cs) | 2002-11-13 |
NO179238C (no) | 1996-09-04 |
CA2167400A1 (en) | 1995-12-21 |
KR100383524B1 (ko) | 2003-07-07 |
EP0713575B1 (en) | 2002-04-10 |
ATE216071T1 (de) | 2002-04-15 |
WO1995034802A1 (en) | 1995-12-21 |
DE69526307T2 (de) | 2002-11-07 |
NO942242D0 (no) | 1994-06-15 |
JPH09502275A (ja) | 1997-03-04 |
AU2755095A (en) | 1996-01-05 |
AU692270B2 (en) | 1998-06-04 |
CZ77396A3 (en) | 1996-11-13 |
ES2174949T3 (es) | 2002-11-16 |
DK0713575T3 (da) | 2002-08-05 |
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