US5128538A - Vapor effusion source for epitaxial deposition plants - Google Patents

Vapor effusion source for epitaxial deposition plants Download PDF

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Publication number
US5128538A
US5128538A US07/679,540 US67954091A US5128538A US 5128538 A US5128538 A US 5128538A US 67954091 A US67954091 A US 67954091A US 5128538 A US5128538 A US 5128538A
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US
United States
Prior art keywords
tube
vapor
effusion source
mixing
epitaxial deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07/679,540
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English (en)
Inventor
Fernando Genova
Giuliana Morello
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telecom Italia SpA
Calzaturificio Brixia SpA
Original Assignee
CSELT Centro Studi e Laboratori Telecomunicazioni SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by CSELT Centro Studi e Laboratori Telecomunicazioni SpA filed Critical CSELT Centro Studi e Laboratori Telecomunicazioni SpA
Assigned to CSELT-CENTRO STUDI E LABORATORI TELECOMMUNICAZIONI S.P.A., VIA G. REISS ROMOLI 274, TORINO, ITALY A JOINT STOCK COMPANY OF ITALY reassignment CSELT-CENTRO STUDI E LABORATORI TELECOMMUNICAZIONI S.P.A., VIA G. REISS ROMOLI 274, TORINO, ITALY A JOINT STOCK COMPANY OF ITALY ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: GENOVA, FERNANDO, MORELLO, GIULIANA
Assigned to CALZATURIFICIO BRIXIA S.P.A. reassignment CALZATURIFICIO BRIXIA S.P.A. MERGER (SEE DOCUMENT FOR DETAILS). EFFECTIVE ON 07/30/1990 ITALY Assignors: CALZATURIFICIO BRIXIA S.P.A. (MERGED INTO), HTM ROSE S.P.A. (CHANGED TO)
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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
    • C30B23/066—Heating of the material to be evaporated

Definitions

  • the present invention relates to equipment for preparing crystals for electronic and electro-optic semiconductor devices and more particularly to a vapor effusion source for epitaxial deposition.
  • the materials to be deposited are separately evaporated in an ultrahigh vacuum environment and then sent towards the material to be grown in the shape of a more or less collimated beam.
  • vapors of metal-alkyls of the III group also-called organo-metallic compounds
  • vapour sources ambient temperature these compounds will they present low vapour pressure, differently from the solid metals of the same group, namely Ga, In, Al.
  • the part of the plant relevant to the vapor source can be placed outside of the ultrahigh vacuum zone.
  • ultrahigh vacuum need not be restored whenever the materials to be evaporated are to be handled.
  • vapor state sources can be introduced into the vacuum zones by a single effusion source, wherein they are mixed and directed towards the substrate to be grown, instead of resorting to an effusion source with a separate furnace for each element.
  • the effusion sources generally used are fabricated by using inlet tubes passing through a vacuum flange.
  • the external tube side is equipped with connecting means to vapor lines, while the internal side ends in the zone for mixing the outgoing vapors.
  • This zone is equipped with some baffle plates capable of breaking up the flows outgoing from inlet tubes to enhance vapor mixing, with an outlet nozzle to duly shape the beam directed towards the substrate to be grown and with a heater keeping a constant temperature under the control of an electric thermocouple.
  • an effusion source for epitaxial deposition plants wherein a molecular vapour beam is directed towards a substrate to be grown in ultrahigh vacuum environment, comprises a first tube, hermetically closed at one end by means for carrying vapor inlet tubes and equipped at the other end with baffle plates and with a nozzle for vapor mixing and molecular beam shaping.
  • a second tube with a diameter greater than that of the first tube and supplied with a vacuum flange, is coaxially joined to the first tube through a round washer, so as to obtain an interstice at ambient temperature and pressure between the outer lateral surface of the first tube and the inner lateral surface of the second tube in the vapour mixing and molecular beam shaping zone.
  • the vapor effusion source comprises two tubes having different lengths and diameters TP and TG, soldered at one end to a round washer RO so as to be kept in coaxial position, and with two vacuum flanges FP and FG at the other end.
  • a number of vapor inlet tubes can be introduced into the smaller tube TP.
  • the tubes denoted by TA1, TA2 and TA3, are in number appropriate to the number of vapor to be introduced, namely 4 or more, and are airtight-soldered to another vacuum flange FA, which perfectly matches with flange FP of the smaller diameter tube TP. They have a length allowing them to penetrate beyond half the smaller diameter tube TP in order to avoid a premature mixing of different vapor rays.
  • the ends of inlet tubes, which remain outside the plant have convenient flanges Fl1, Fl2, Fl3 for their connection to the vapor sources.
  • the molecular-beam shaping system Inside the smaller diameter tube TP, in the outgoing vapor mixing zone, there is the molecular-beam shaping system. It consists of one or more baffle plates SR, for interrupting the direct vapor flow and making the vapor strems follow a tortuous path, and a nozzle UG, allowing the exact definition of the molecular beam shape on the basis of the ratio between its diameter and its length. The entire system is simply screwed to the smaller diameter tube TP so as to be easily replaced according to growth plant requirements and geometry.
  • a heating coil RS operated by an electric resistance or by a hot liquid circulation can be provided in the space. Since this coil is not in the ultrahigh vacuum environment, it can be of any commercially available type.
  • the coil input and output pass through the inlet of larger diameter tube TG, which is shorter than the other tube TP.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)
US07/679,540 1990-04-19 1991-04-02 Vapor effusion source for epitaxial deposition plants Expired - Fee Related US5128538A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT67289A IT1240199B (it) 1990-04-19 1990-04-19 Effusore di vapori per impianti di deposizione epitassiale.
IT67289A/90 1990-04-19

Publications (1)

Publication Number Publication Date
US5128538A true US5128538A (en) 1992-07-07

Family

ID=11301182

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/679,540 Expired - Fee Related US5128538A (en) 1990-04-19 1991-04-02 Vapor effusion source for epitaxial deposition plants

Country Status (6)

Country Link
US (1) US5128538A (de)
EP (1) EP0452924A1 (de)
JP (1) JPH04228494A (de)
CA (1) CA2039913A1 (de)
DE (1) DE452924T1 (de)
IT (1) IT1240199B (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5321260A (en) * 1991-08-01 1994-06-14 Alcatel Alsthom Compagnie Generale D'electricite Effusion method and an effusion cell for forming molecular beams
US20020170484A1 (en) * 2001-05-17 2002-11-21 Toshihisa Katamine Method and system for manufacturing III-V Group compound semiconductor and III-V Group compound semiconductor
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
US20100282167A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
US20100285218A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115477366B (zh) * 2022-10-20 2023-11-28 重庆海通环保科技有限公司 一种抗污染反渗透膜装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565158A (en) * 1983-09-05 1986-01-21 Balzers Ag Evaporator cell for vacuum deposition on substrates
US4789779A (en) * 1984-08-01 1988-12-06 The United States Of America As Represented By The Secretary Of Commerce Heat pipe oven molecular beam source
US5016566A (en) * 1988-05-31 1991-05-21 Levchenko Georgy T Apparatus for forming films by evaporation in vacuum

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59156996A (ja) * 1983-02-23 1984-09-06 Koito Mfg Co Ltd 化合物結晶膜の製造方法とその装置
US4550411A (en) * 1983-03-30 1985-10-29 Vg Instruments Group Limited Sources used in molecular beam epitaxy
GB2158843A (en) * 1984-05-14 1985-11-20 Philips Electronic Associated Method of manufacturing a semiconductor device by molecular beam epitaxy
JPH01224295A (ja) * 1988-03-02 1989-09-07 Fujitsu Ltd ガスソース分子線結晶成長装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4565158A (en) * 1983-09-05 1986-01-21 Balzers Ag Evaporator cell for vacuum deposition on substrates
US4789779A (en) * 1984-08-01 1988-12-06 The United States Of America As Represented By The Secretary Of Commerce Heat pipe oven molecular beam source
US5016566A (en) * 1988-05-31 1991-05-21 Levchenko Georgy T Apparatus for forming films by evaporation in vacuum

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5321260A (en) * 1991-08-01 1994-06-14 Alcatel Alsthom Compagnie Generale D'electricite Effusion method and an effusion cell for forming molecular beams
US20020170484A1 (en) * 2001-05-17 2002-11-21 Toshihisa Katamine Method and system for manufacturing III-V Group compound semiconductor and III-V Group compound semiconductor
US6875273B2 (en) * 2001-05-17 2005-04-05 Sumitomo Chemical Company, Limited Method and system for manufacturing III-V Group compound semiconductor and III-V Group compound semiconductor
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
US20100282167A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
US20100285218A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source

Also Published As

Publication number Publication date
CA2039913A1 (en) 1991-10-16
IT1240199B (it) 1993-11-27
EP0452924A1 (de) 1991-10-23
IT9067289A1 (it) 1991-10-19
JPH04228494A (ja) 1992-08-18
DE452924T1 (de) 1992-04-09
IT9067289A0 (it) 1990-04-19

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AS Assignment

Owner name: CSELT-CENTRO STUDI E LABORATORI TELECOMMUNICAZIONI

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:GENOVA, FERNANDO;MORELLO, GIULIANA;REEL/FRAME:005669/0398

Effective date: 19910118

AS Assignment

Owner name: CALZATURIFICIO BRIXIA S.P.A.

Free format text: MERGER;ASSIGNORS:CALZATURIFICIO BRIXIA S.P.A. (MERGED INTO);HTM ROSE S.P.A. (CHANGED TO);REEL/FRAME:006035/0150

Effective date: 19910913

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
FP Lapsed due to failure to pay maintenance fee

Effective date: 19960710

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362