US3569802A - Dielectric capacitors with inner barrier layers and low temperature dependence - Google Patents
Dielectric capacitors with inner barrier layers and low temperature dependence Download PDFInfo
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- US3569802A US3569802A US762220A US3569802DA US3569802A US 3569802 A US3569802 A US 3569802A US 762220 A US762220 A US 762220A US 3569802D A US3569802D A US 3569802DA US 3569802 A US3569802 A US 3569802A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 99
- 230000004888 barrier function Effects 0.000 title description 18
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910002113 barium titanate Inorganic materials 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 77
- 239000000126 substance Substances 0.000 claims description 73
- 239000010949 copper Substances 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 16
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052787 antimony Inorganic materials 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 14
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 12
- 229910052779 Neodymium Inorganic materials 0.000 claims description 9
- 229910052772 Samarium Inorganic materials 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 229910052748 manganese Inorganic materials 0.000 claims description 9
- 229910052715 tantalum Inorganic materials 0.000 claims description 9
- 229910052718 tin Inorganic materials 0.000 claims description 9
- 229910052791 calcium Inorganic materials 0.000 claims description 7
- 229910052712 strontium Inorganic materials 0.000 claims description 7
- 239000002344 surface layer Substances 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- 229910052745 lead Inorganic materials 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011872 intimate mixture Substances 0.000 claims description 2
- 238000010298 pulverizing process Methods 0.000 claims description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims 2
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 38
- 238000012360 testing method Methods 0.000 description 18
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000011572 manganese Substances 0.000 description 8
- 230000008901 benefit Effects 0.000 description 6
- 239000011575 calcium Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000010955 niobium Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 238000009837 dry grinding Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000010405 reoxidation reaction Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 2
- 238000003746 solid phase reaction Methods 0.000 description 2
- 238000010671 solid-state reaction Methods 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 230000005343 Curie-Weiss law Effects 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000001238 wet grinding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1272—Semiconductive ceramic capacitors
- H01G4/1281—Semiconductive ceramic capacitors with grain boundary layer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
- C04B35/4684—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase containing lead compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/025—Other inorganic material
Definitions
- Kallam Att0rny-Hill, Sherman, Meroni, Gross & Simpson ABSTRACT Dielectric capacitor structures (and method of making the same) comprising a plurality of bound together crystallites having a barium-titanate perovskite lattice structure of the general formula:
- (B81 -My)OZ(TI1 yML )Og which includes at least two different doping substances, one of which predominantly effects N-conductivity in the interior of the crystallites and the other which predominantly effects P- conductivity on the surface of the crystallites.
- M" is selected from the group consisting of Ca, Sr, Pb, Mg and mixtures thereof; M is selected from the group consisting of Zr, Sn and mixtures thereof; at and y are numerals ranging up to one; z is a number ranging from 1.005 to 1.05 the first doping substance is selected from the group consisting of Bi, Ce, La, Nb, Nd, Pr, Sb, Sm and Ta; and the second doping substance is selected from the group consisting ofCu, Fe and Mn.
- the invention relates to dielectric capacitor bodies having inner barrier layers, more particularly-the invention relates to dielectric capacitor materials and bodies composed thereof having inner barrier layers and a low temperature dependence.
- barrier-layer capacitors have a chemically reduced ceramic body generally composed of barium-titanate materials having dielectric layers therein formed through a reoxidation at the capacitor body surface.
- a disadvantage of these conventional barrier-layer capacitors" is that one can easily detect the thickness of the dielectrically effective layer at the surface of such bodies. This materially limits the application of such barrier-layer capacitors.
- Another disadvantage of the heretofore available barrier-layer capacitors (formed through reduction and surface reoxidation of a ceramic body manufactured in a conventional manner), is that they exhibit extremely small dielectric strength. Further, where an operating voltage of more than v. is contemplated, such known barrier-layer capacitorscannot, generally, be utilized.
- Dielectric capacitor structures having inner barrier layers must have the interior of the crystallites as conductive as possible.
- certain maximum quantities in accordance with recognized teachings in the art, i.e. 0 Saburi, Journal of the Physical Soc. of Japan," vol. 14, No. 9, Sept. 1959, pp. 1159- l 174, particularly page 1173, and W. l'leywang, Journal of the American Ceramic Soc., vol. 47, No. 10, Oct. 1964, pp. 484-490 of such doping substances are necessary to achieve a maximum conductivity in barium-titanate materials.
- Sb antimony
- La lanthanum
- Nb niobium
- Bi bismuth
- Nd neodymium
- Ce cerium
- Sm samarium
- Ta tantalum
- other rare earths or similar materials such as niobium (Nb), bismuth (Bi), neodymium (Nd), cerium (Ce), samarium (Sm), tantalum (Ta) and other rare earths or similar materials.
- An important feature of the invention is to provide a dielectric capacitor body consisting of a plurality of crystallites (polycrystalline bound together in a disc-shaped, tube-shaped or foiled-shaped ceramic body composed of barium-titanate material having a pervoskite structure of the general formula:
- M" II is selected from the group consisting essentially of Ca, Sr, Pb, Mg and mixtures thereof; M is selected from the group consisting essentially of Zr, Sn, and mixtures thereof; x and y are numerals ranging from 0 to l, i.e. ranging up to one, and z is a numeral ranging from 1.005 to 1.05.
- This barium-titanate material is provided with at least two different doping substances, one of which predominantly effects N-conductivity on the interior of the crystallites and is selected from the grouping consisting of antimony (Sb), lanthanum (La), niobium (Nb), bismuth (Bi), cerium (Ce), neodymium (Nd), praseodymium (Pr), samarium (Sm) and tantalum (Ta) and the other of which predominantly effects P-conductivity at the surface layer of the crystallites and is selected from the group consisting of copper (Cu), iron (Fe), and manganese (Mn).
- Sb antimony
- La lanthanum
- Nb niobium
- Bi bismuth
- Ce cerium
- Nd neodymium
- Pr praseodymium
- Sm samarium
- Ta tantalum
- Another feature of the invention is to provide a polycrystalline (i.e., a plurality of bonded together crystallites) dielectric capacitor body wherein a plurality of insulating barrier layers are substantially uniformly distributed on the inside of the body and such layers are connected in series. Consequently, these insulating barrier layers provide a plurality of PN- transistions (i.e., PN-junctures) poled in blocking or passing directions.
- a polycrystalline i.e., a plurality of bonded together crystallites
- insulating barrier layers are substantially uniformly distributed on the inside of the body and such layers are connected in series. Consequently, these insulating barrier layers provide a plurality of PN- transistions (i.e., PN-junctures) poled in blocking or passing directions.
- Another object of the invention is to provide a dielectric capacitor body and a method of making the same having inner barrier layers and a low temperature dependence.
- FIG. 1 is a prospective elevational view, with parts broken away, illustrating a disc-shaped capacitor body constructed in accordance with the principles of the invention
- FIG. 2 is an elevated sectional view, with parts broken away, of a tubular-shaped capacitor constructed in accordance with the principles of the invention
- FIG. 3 is an elevational sectional view, with parts broken away, of a stack capacitor body constructed in accordance with the principles of the invention
- FIG. 4 is a sectional fragmentary enlargement taken substantially at the encircled portion designated IV in FIGS. l-3;
- FIG. 5 is a graphical illustration of the DK-value of capacitors of the invention as a function of temperature for different sintering conditions
- FIG. 6 is a graphical illustration of the loss factor of the capacitors of the invention as a function of temperature for different sintering conditions.
- FIGS. 7 and 8 are graphical illustrations of the DK-value and the tangent of the loss angle Bas a function of temperature for capacitors of the present invention as a function of sintering temperature.
- the dielectric capacitor bodies of the invention are composed of a plurality of bonded crystallites in a ceramic form.
- the crystallites are composed of bariumtitanate materials having a perovskite structure or lattice with a general formula of:
- M is a material selected from the group consisting of Ca, Sr, Pb, Mg, and mixtures thereof; M is a material selected from the group consisting of Zr, Sn, and mixtures thereof; x and y are numerals ranging up to one; and z is a numeral in the range of 1.005 to 1.05.
- the quantity of the quadrivalent perovskite forming ingredient is 0.5 to 5 mol. percent greater than the quantity of the bivalent perovskite forming ingredient.
- barium-titanate crystallites contain at least two different doping substances, a first of which is selected from the group consisting essentially of Bi, Ce, La, Nb, Nd, Pr, Sb, Sm and Ta which tend to predominantly effect N-conductivity on the inside or interior of suchcrystallites; and the second of which is selected from the group consisting of Cu, Fe and Mn which tend to predominantly effect P-conductivity on the surface layer or outer peripheral portions of such crystallites.
- the above defined dielectric capacitors of the invention have an increased insulating stability and a relatively low (and variable) dependence on voltage for the DK-value thereof in accordance with their application.
- the amount of the doping substances are calculated on the basis of their respective oxides.
- DK-values discussed hereinbefore and hereinafter in regard to both the known and the now disclosed capacitor bodies are the values for the dielectric constant (DK) and are conventionally designated far above the e-value (dielectric and are to the specified material. These DK-values are obtained by computing a dielectric constant (DK) through measurements of the capacity of such capacitors modified by the physical dimensions of the capacitor body.
- DK dielectric constant
- Control of crystalline growth (a process known to workers skilled in the art) or the addition of tin (with a correspondingly simultaneous shift of Curie Point) are utilized to insure that the crystallites of the instant invention are of a medium size in the range of 20 to 300 my. and preferably in the range of 100 to 300 mp. (millimicrons).
- Such medium sized crystals exhibit an exceptionally large DK-value, however, the voltage dependence of the DK thereof tends to increase.
- dielectric capacitors formed in accordance with the principles of the instant invention from the aforesaid medium sized crystals have exceptional utility, (or applicability) for example, as dielectric amplifiers.
- antimony is utilized as the first doping substance (previously identified) effecting the N-conductivity in amounts ranging from 0.15 to 0.25 percent by weight calculated on the basis of Sb O Copper (Cu) is utilized as the preferred second doping substance (previously identified) effecting the P-conductivity in amounts ranging from 0.01 to 0.15 percent by weight calculated on the basis of CuO.
- Sb antimony
- Cu Copper
- N-conductivity effecting doping substances i.e., Bi, Ce, La, Nb, Nd, Pr, Sb, Sm, Ta, etc.
- P-conductivity effecting doping substances i.e., Cu, Fe, Mn, etc.
- Curie temperatures of the materials utilized as the dielectric capacitors can be adjusted in a conventional manner.
- these metals tend to individually and/or jointly function to shift the Curie temperature of the dielectric capacitor material toward a lower temperature.
- the utilization of la lead as a M" metal in the aforesaid perovskite structure functions to increase the Curie temperatures to values above 120 C.
- the ability to shift toward lower temperatures in accordance with the principles of the invention affords an added advantage of having the operating temperature range lie below the Curie temperature.
- the Curie temperature of a particular composition is 10 C. (such as by inclusion of 20 mol. percent of tin), such as for material having the formula BaO-z(Ti Sn,, .,)O wherein z is a numeral ranging from 1.005 to 1.05
- the operating temperature range lies from 0 C. to far in excess of C.
- the dielectric capacitor bodies of the invention possess, particularly above the Curie temperature, a very high DK-value.
- Such high DK-values because of the operating temperature is in the cubical range, simultaneously decrease the loss factor to a very low value and suppress a decrease of the DK-value for ferroelectric substances (achieved by the increased amount of P-conductivity effecting substances, i.e. Cu, Fe, Mn, etc.) in accordance with the Curie-Weiss law. Consequently, such dielectric capacitor materials have a relatively low temperature coefiicient.
- the crystallites utilized in the formation of the dielectric capacitor bodies of the invention are preferably formed by intermixing suitable quantities of, for example, BaCO and TiO 5 (Ti0,-is generally derived from and utilized in' its raw ore form, i.ei rutile, anatase, or' mixtures thereof).
- suitable quantities of, for example, BaCO and TiO 5 Ti0,-is generally derived from and utilized in' its raw ore form, i.ei rutile, anatase, or' mixtures thereof.
- other perovskite starting materials such as(Ba Pb) Ti 0,; (Ba Ca Ti (Ba Sr) Ti 0,; Pb (Zr Ti) 0,, etc. can also be utilized.
- the perovskitestarting materials are then intermixed with an N-conductivity'effecting doping substance, such as for example, Sb,0 in amounts ranging from 0.15 to 0.25 percent by weight and with a P-conductivity effecting
- an N-conductivity'effecting doping substance such as for example, Sb,0
- P-conductivity effecting such as for example, P-conductivity effecting
- tor values can (as in the case of conventional capacitors) be readily attained through appropriate body shaping without the necessity of having to, produce barrier layers on the finished doping substance, such as for example, CuO in amounts ranging from"0.0l to 0.15 percent by weight.
- This mixture is then generally uniformly pulverized, as by' grinding'ina ball mill for about'l 8 hours while adding about 0.5 mols. of water per mol. of mixture, dried and reacted (a solid-state reaction) at about 950 to 1 100 C.-An important factor in the preparation of the dielectric capacitor crystallites is the uniform initmate mixture of the materials and the attainment of an excess of TiO, (preferably attained through the so-called wet-grinding process described). More generally, (and mother words) it is important to obtain-an excess of about 0.5 to 5 mols. percent of them metals over the M" metals.
- barrier layer capacitor crystallites having substantially equivalent qualities to those previously described may also be attained by utilizing a so-called' dry grinding (or mixing) process.
- the dry grinding process achieves uniformityof the materials but several excess mols. percent of TiO, must be added to the initial mixture.
- the reaction product is again thoroughly pulverized or ground, such as in a ball mill, with the addition of about 0.5 mols. of water (however, dry grinding is also suitable) per mol. or reaction product for approximately 18 hours'to achieve a fine-sized uniform particle mixture.
- This mixture is then dried and combined, in conventional manner, with an organic binding agent, such as for example, polyvinyl alcohol.
- This mixture is then pressed or formed into desired shape orconfiguration.
- the shaped dielectric capacitor bodies are then subjected to a final sintering operation at about l300 to 1400 C.
- the completed capacitor bodies exhibit the values specified in the tables set forth hereinafter inregard to the dielectric" constant DK, the tg8 (dielectric loss angle) and-the voltage strength.
- an exeeptional'advantage of the invention consists in providing a material having an extremely .flargeapparent DK-value in: a form suitable for capacitor use.
- Amspacitorformed from 'su'chniaterials results in'the formation of thin nonconductive layers at the surfaces or peripheries of crystallites, which have a well conducting polycrystalline (a plurality of such crystals bonded together) ceramic body.
- This is, in contrast to the heretofore known barrier layer capacitors, a quasi-volume capacity I wherein a high dielectric strength is achieved (up-to 100 v./mm. in certain cases).
- an additional advantage coupled therewith is that the new capacitor material allows the production of capacitor bodies having extremely small (smallest of all known capaciceramic body through various complicated processes.
- the material of the invention allows the produc tion of so-called stacking or multilayer capacitors by, for example, applying spraying techniques (or other suitable techniques) to alternately spray thin ceramic layers.(composed of, for example, converted BaTiO, basementte metal oxide doping substances added thereto, such as the previously disclosed CuO and Sb,O, in a suitable liquid or viscous form) on top of one another and subjecting such a stack to a sintering operation-toform a parallelly connected electrical barrier layer capacitor body.
- spraying techniques or other suitable techniques
- FIG. 1 generally illustrates a disc-shaped capacitor body 1. which functions as a dielectric and is produced from the novel material of the invention.
- Capacitor coats l2 and 13 are suitably fastened to this material and are provided with suitably fastened external connection means 14 and 15. a 1
- FIG. 2 illustrates a tubular-shaped ceramic body 2!.
- Ceramic body 21 functions as a tubular capacitor and is provided with coatings 22 and 23.
- OuterIcurrent connection means 24 and 25 are suitably fastened to the coatings 22 and 23 respectively.
- g Y i FIG. 3 illustrates a monolithic body 31 which is formed from a layer of ceramic materials of theinvention stacked on top of 'one another in a manner conventional to the formation of ceramic bodies.
- the monolithic block 31 is divided by metallic layers 32and 33 which function as condenser coatings. Layers 32 and 33 are alternatively led to the two connecting sides.
- Metal coatings 34 and 35 respectively, connect layers 32 and 33 with .oneanother.
- FIG. 4 illustrates a'considerably'enlarged segment IV out of the ceramic bodies illustrated atFlGS. 1+3.
- the interior of the crystallites have good N-conductivity characteristics.
- the surface of the peripheral layers 42 are located in surtors) geometric dimensions. This' 'factor is extremely important in current .microtechniqu'e. applications.
- a DK of 10 such as one having its Curie point shifted to a lowternperature
- the capacitor materia'iof the invention offers a 0.3 and athickness of about 0:2
- the first column enumerates the particular test in sequential order.
- the second column identifies the form of titanium oxide utilized in the formation of barium-titanate.
- Columns 3 and 4 specify the amounts of the indicated doping substance utilized.
- the last threecolumns indicate'the electrical qualities of the particdlarmaterial. The values given are average values attained from measuring-40 bodies in the respective tests.
- the DK-values'specitied in brackets below the average DK-valuesrep'resent the highest measured value attained with the highest CuO quantity specified in column 4 for the respective tests.
- the CuO-quantit'y for the individual tests was varied within the two specified limits.
- the last column includes a notation".parti ally conductive" to indicate capacitor only to a limited extent. I
- Starting substance SbzOa, CuO, for the percent percent DK (in accordformation by by ance with the tgoi- S ecific resistance 5 (Ohm cm.) Test Number p31 thfo weight weight given definition) percent easurlng voltage 320 v./mm.
- the graph illustrated at FIG. 5 shows the DK as a function of the temperature at different sintering conditions.
- the abscissa specifies the temperature in degrees centigrade while the ordinate specifies the DK (in accordance with the definition given hereinbefore).
- the material utilized is that of test 6 (identified in the above tables) and is a barium-titanate material (utilizing anatase as the raw material for titanium oxide) having 0.175 percent Sb ll and 0.04 percent CuO as the doping substances therein.
- the measuring frequency was 1 kHz.
- Curve 1 represents the DK of this material after it was sintered at 1350 C. for 30 minutes.
- Curve 2 represents the DK of the material after it was subjected to sintering temperature at 1350" C. for after hour.
- Curve 3 represents the DK of the material after it was sintered at 1360 C. for 2 hours.
- the graph illustrated at FIG. 6 shows the loss factor as a function of the temperature at different sintering conditions.
- the material tested, the measuring frequency, the sintering temperatures and times are substantially identical to those explained in conjunction with FIG. 5 and, therefore, the reference numerals on the curves are the same as those utilized in FIG. 5.
- the graph illustrated at FIG. 7 shows the DK and the tangent of the loss angle 8 on the ordinate as a function of the temperature in degrees centigrade on the abscissa.
- the material utilized was that of test 50 (identified in the above tables), and has the empirical formula of Ba0-z(Ti,, ,-,Sn,, .,)0 containing 0.15 percent by weight of Sb 0 and 0.03 percent by weight of CuO as the doping substances.
- the measuring frequency was again 1 kHz.
- Curve 5 represents the DK trend of the material after it was sintered at 1360 C. for 2 hours.
- curve 6 represents the DK trend of the material after it was sintered at 1350 C. for 1 hour.
- Curve 7 illustrates the trend of the tangent of the loss angle for the material after it was sintered at 13 60 C. forfhoufs and curve 8 illustrates the trend of the tangent of the loss angle for the material sintered at 1350 C. for 1 hour.
- the graph illustrated in FIG. 8 also shows the DK and the tangent of the loss angle 5 on the ordinate as a function of temperature in degrees centigrade on the abscissa.
- the material utilized corresponds to the material of test 46 (identified in the above tables) and has an empirical formula of BaO'z(Ti Sn .,)O containing 0.15 percent by weight of Sb O and 0.06 percent by weight of CuO. The material was subjected to sintering conditions at 1360-C. for 2 hours.
- Curve 9 illustrates the trend of the DK and curve 10 illustrates the trend of the tangent of the loss angle.
- a dielectric capacitor body composed of a plurality of joined together crystallites to form a ceramic body, said crystallites being composed of a barium-titanate material having a perovskite structure of the formula:
- M is a material selected from the group consisting essentially of Ca, Sr, Pb, Mg, and mixtures thereof; M is a material selected from the group consisting essentially of Zr, Sn and mixtures thereof; x and y are numerals ranging up to one; and z is a numeral ranging from 1.005 to 1.05; said barium-titanate material including at least a first and a second doping substance, said first doping substance predominantly producing N-conductivity in the inside of said crystallites and said second doping substance predominatly producing P-condictivity in the surface layers of said crystallites, said first doping substance being present in amounts ranging from 1.5 to 2.5 times greater than the maximum quantity of the substance necessary for producing maximum conductivity in said barium-titanate material and said second doping substance being present in amounts ranging from 0.01 to 0.15 percent by weight determined on the basis of its oxide.
- the first doping substance is a material selected from the group consisting essentially of Bi, Ce, La, Nb, Nd, Sb, Sm and Ta and the second doping substance is a material selected from ,the group consisting essentially of Cu, Fe, and Mn.
- the dielectric capacitor as defined in claim 3 wherein the first doping substance is antimony and the amount thereof is calculated on the basis of Sb2O I 5.
- a dielectric capacitor body composed of a polycrystalline ceramic body the crystallites composing said body consisting essentially of a barium-titanate perovskite material having the formula:
- z is a numeral ranging from 1.005 to 1.05, said barium-titanate material including about 0.15 percent to 0.25 percent by weight Sb O predominantly producing N-conductivity in the inside of said crystallites and about 0.01 to 0.15 percent by weight of CuO predominantly producing P-conductivity in the surface layers of said crystallites.
- the method of producing a dielectric capacitor body comprising: (1) forming a barium-titanate crystallite having a perovskite structure of the formula:
- M is selected from the group consisting essentially of Ca, Sr, Pb, Mg and mixtures thereof; M" is selected from the group consisting essentially of Zr, Sn and mixtures thereof; x and y are numerals ranging up to one, and z is a numeral ranging from 1.005 to 1.05; (2) admixing at least a first and a second doping substance to said crystallites to achieve a substantially uniform intimate mixture thereof, said first doping substance predominantly producing N-conductivity in the inside of the crystallites, said second doping substance predominantly producing P-conductivity in the surface layers of said crystallites; (3) heating said mixture to a temperature in the range of 950 C. to 1100 C.
- step (1) comprises uniformly intermixing an amount of BaCO and an amount of H0 in excess of the aforesaid BaCO amount, said excess amount being in the range of 0.5 to 5 mol. percent.
- the first doping substance is a material selected from the group consisting essentially of Bi, Ce, La, Nb, Nd, Pr, Sb, Sm and Ta and the second doping substance is a material selected from the group consisting essentially of Cu, Fe, and Mn.
- Curve 4 represents the same material after sintering at 1360 C.
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- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0111900 | 1967-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3569802A true US3569802A (en) | 1971-03-09 |
Family
ID=7531301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US762220A Expired - Lifetime US3569802A (en) | 1967-09-20 | 1968-09-16 | Dielectric capacitors with inner barrier layers and low temperature dependence |
Country Status (6)
Country | Link |
---|---|
US (1) | US3569802A (enrdf_load_stackoverflow) |
DE (1) | DE1614605B2 (enrdf_load_stackoverflow) |
FR (1) | FR1581387A (enrdf_load_stackoverflow) |
GB (1) | GB1204436A (enrdf_load_stackoverflow) |
NL (1) | NL141690B (enrdf_load_stackoverflow) |
YU (1) | YU31236B (enrdf_load_stackoverflow) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3670211A (en) * | 1969-08-29 | 1972-06-13 | Hitachi Ltd | Switching condenser element for switching an alternating current |
US4131903A (en) * | 1976-08-03 | 1978-12-26 | Siemens Aktiengesellschaft | Capacitor dielectric with inner blocking layers and method for producing the same |
US4149173A (en) * | 1976-12-30 | 1979-04-10 | Siemens Aktiengesellschaft | Capacitor dielectric with internal barrier layers and a method for its production |
US4148853A (en) * | 1976-09-16 | 1979-04-10 | Siemens Aktiengesellschaft | Process for the manufacture of a capacitor dielectric with inner blocking layers |
US4192840A (en) * | 1976-08-03 | 1980-03-11 | Siemens Aktiengesellschaft | Method for producing a capacitor dielectric with inner blocking layers |
EP0042009A1 (en) * | 1980-06-11 | 1981-12-23 | University of Illinois Foundation | Internal boundary layer ceramic compositions and process for their production |
US4397886A (en) * | 1981-05-06 | 1983-08-09 | Sprague Electric Company | Method for making a ceramic intergranular barrier-layer capacitor |
US4419310A (en) * | 1981-05-06 | 1983-12-06 | Sprague Electric Company | SrTiO3 barrier layer capacitor |
US5065274A (en) * | 1989-11-27 | 1991-11-12 | U.S. Philips Corp. | Ceramic body of a dielectric material on the basis of barium titanate |
US5142437A (en) * | 1991-06-13 | 1992-08-25 | Ramtron Corporation | Conducting electrode layers for ferroelectric capacitors in integrated circuits and method |
US5166759A (en) * | 1989-03-15 | 1992-11-24 | Matsushita Electric Industrial Co., Ltd. | Semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure |
US5191510A (en) * | 1992-04-29 | 1993-03-02 | Ramtron International Corporation | Use of palladium as an adhesion layer and as an electrode in ferroelectric memory devices |
US5206788A (en) * | 1991-12-12 | 1993-04-27 | Ramtron Corporation | Series ferroelectric capacitor structure for monolithic integrated circuits and method |
US5268006A (en) * | 1989-03-15 | 1993-12-07 | Matsushita Electric Industrial Co., Ltd. | Ceramic capacitor with a grain boundary-insulated structure |
US5361187A (en) * | 1993-03-11 | 1994-11-01 | Ferro Corporation | Ceramic dielectric compositions and capacitors produced therefrom |
US6204069B1 (en) | 1993-03-31 | 2001-03-20 | Texas Instruments Incorporated | Lightly donor doped electrodes for high-dielectric-constant materials |
US6242299B1 (en) | 1999-04-01 | 2001-06-05 | Ramtron International Corporation | Barrier layer to protect a ferroelectric capacitor after contact has been made to the capacitor electrode |
US8723654B2 (en) | 2010-07-09 | 2014-05-13 | Cypress Semiconductor Corporation | Interrupt generation and acknowledgment for RFID |
US9092582B2 (en) | 2010-07-09 | 2015-07-28 | Cypress Semiconductor Corporation | Low power, low pin count interface for an RFID transponder |
US9846664B2 (en) | 2010-07-09 | 2017-12-19 | Cypress Semiconductor Corporation | RFID interface and interrupt |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3920781A (en) * | 1971-04-02 | 1975-11-18 | Sprague Electric Co | Method of forming a ceramic dielectric body |
US3933668A (en) * | 1973-07-16 | 1976-01-20 | Sony Corporation | Intergranular insulation type polycrystalline ceramic semiconductive composition |
DE2634896C2 (de) * | 1976-08-03 | 1985-08-14 | Siemens AG, 1000 Berlin und 8000 München | Kondensatordielektrikum mit inneren Sperrschichten und Verfahren zu seiner Herstellung |
JPS5517965A (en) * | 1978-07-25 | 1980-02-07 | Matsushita Electric Ind Co Ltd | Porcelain dielectric substance and method of fabricating same |
JPS56162820A (en) * | 1980-05-20 | 1981-12-15 | Kiyoshi Okazaki | Vapor bank layered laminated ceramic capacitor and method of manufacturing same |
GB2103422B (en) * | 1981-07-30 | 1985-02-27 | Standard Telephones Cables Ltd | Ceramic capacitors |
DE3235886A1 (de) * | 1982-09-28 | 1984-03-29 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung einer sperrschicht-keramik |
JPH0692268B2 (ja) * | 1988-06-03 | 1994-11-16 | 日本油脂株式会社 | 還元再酸化型半導体セラミックコンデンサ素子 |
JPH06102573B2 (ja) * | 1988-07-01 | 1994-12-14 | 日本油脂株式会社 | 還元再酸化型半導体セラミックコンデンサ用組成物 |
JP2642876B2 (ja) * | 1994-08-11 | 1997-08-20 | 工業技術院長 | チタン酸鉛系誘電体薄膜 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US3351500A (en) * | 1963-03-13 | 1967-11-07 | Globe Union Inc | Method of forming a transistor and varistor by reduction and diffusion |
US3386856A (en) * | 1963-12-13 | 1968-06-04 | Philips Corp | Method of making a manganese oxide dielectric coating for barrier-layer capacitors |
US3419760A (en) * | 1967-06-09 | 1968-12-31 | North American Rockwell | Ionic solid state electrochemical capacitor |
US3419759A (en) * | 1965-09-17 | 1968-12-31 | Matsushita Electric Ind Co Ltd | Capacitor comprising ferroelectric ceramic with oxidic silver electrodes and heterojunction barrier layer between electrodes and ceramic |
US3426251A (en) * | 1966-08-01 | 1969-02-04 | Sprague Electric Co | Donor-acceptor ion-modified barium titanate capacitor and process |
US3426249A (en) * | 1966-08-01 | 1969-02-04 | Sprague Electric Co | Donor ion modified batio3 capacitor and process |
-
1967
- 1967-09-20 DE DE1614605A patent/DE1614605B2/de not_active Ceased
-
1968
- 1968-09-04 NL NL686812580A patent/NL141690B/xx not_active IP Right Cessation
- 1968-09-16 US US762220A patent/US3569802A/en not_active Expired - Lifetime
- 1968-09-18 YU YU2182/68A patent/YU31236B/xx unknown
- 1968-09-19 GB GB44572/68A patent/GB1204436A/en not_active Expired
- 1968-09-19 FR FR1581387D patent/FR1581387A/fr not_active Expired
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3351500A (en) * | 1963-03-13 | 1967-11-07 | Globe Union Inc | Method of forming a transistor and varistor by reduction and diffusion |
US3386856A (en) * | 1963-12-13 | 1968-06-04 | Philips Corp | Method of making a manganese oxide dielectric coating for barrier-layer capacitors |
US3419759A (en) * | 1965-09-17 | 1968-12-31 | Matsushita Electric Ind Co Ltd | Capacitor comprising ferroelectric ceramic with oxidic silver electrodes and heterojunction barrier layer between electrodes and ceramic |
US3426251A (en) * | 1966-08-01 | 1969-02-04 | Sprague Electric Co | Donor-acceptor ion-modified barium titanate capacitor and process |
US3426249A (en) * | 1966-08-01 | 1969-02-04 | Sprague Electric Co | Donor ion modified batio3 capacitor and process |
US3419760A (en) * | 1967-06-09 | 1968-12-31 | North American Rockwell | Ionic solid state electrochemical capacitor |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3670211A (en) * | 1969-08-29 | 1972-06-13 | Hitachi Ltd | Switching condenser element for switching an alternating current |
US4131903A (en) * | 1976-08-03 | 1978-12-26 | Siemens Aktiengesellschaft | Capacitor dielectric with inner blocking layers and method for producing the same |
US4192840A (en) * | 1976-08-03 | 1980-03-11 | Siemens Aktiengesellschaft | Method for producing a capacitor dielectric with inner blocking layers |
US4148853A (en) * | 1976-09-16 | 1979-04-10 | Siemens Aktiengesellschaft | Process for the manufacture of a capacitor dielectric with inner blocking layers |
US4149173A (en) * | 1976-12-30 | 1979-04-10 | Siemens Aktiengesellschaft | Capacitor dielectric with internal barrier layers and a method for its production |
EP0042009A1 (en) * | 1980-06-11 | 1981-12-23 | University of Illinois Foundation | Internal boundary layer ceramic compositions and process for their production |
US4397886A (en) * | 1981-05-06 | 1983-08-09 | Sprague Electric Company | Method for making a ceramic intergranular barrier-layer capacitor |
US4419310A (en) * | 1981-05-06 | 1983-12-06 | Sprague Electric Company | SrTiO3 barrier layer capacitor |
US5166759A (en) * | 1989-03-15 | 1992-11-24 | Matsushita Electric Industrial Co., Ltd. | Semiconductor-type laminated ceramic capacitor with a grain boundary-insulated structure |
US5268006A (en) * | 1989-03-15 | 1993-12-07 | Matsushita Electric Industrial Co., Ltd. | Ceramic capacitor with a grain boundary-insulated structure |
US5065274A (en) * | 1989-11-27 | 1991-11-12 | U.S. Philips Corp. | Ceramic body of a dielectric material on the basis of barium titanate |
US5142437A (en) * | 1991-06-13 | 1992-08-25 | Ramtron Corporation | Conducting electrode layers for ferroelectric capacitors in integrated circuits and method |
US5206788A (en) * | 1991-12-12 | 1993-04-27 | Ramtron Corporation | Series ferroelectric capacitor structure for monolithic integrated circuits and method |
US5191510A (en) * | 1992-04-29 | 1993-03-02 | Ramtron International Corporation | Use of palladium as an adhesion layer and as an electrode in ferroelectric memory devices |
US5361187A (en) * | 1993-03-11 | 1994-11-01 | Ferro Corporation | Ceramic dielectric compositions and capacitors produced therefrom |
US6204069B1 (en) | 1993-03-31 | 2001-03-20 | Texas Instruments Incorporated | Lightly donor doped electrodes for high-dielectric-constant materials |
US6319542B1 (en) * | 1993-03-31 | 2001-11-20 | Texas Instruments Incorporated | Lightly donor doped electrodes for high-dielectric-constant materials |
US6593638B1 (en) * | 1993-03-31 | 2003-07-15 | Texas Instruments Incorporated | Lightly donor doped electrodes for high-dielectric-constant materials |
US6242299B1 (en) | 1999-04-01 | 2001-06-05 | Ramtron International Corporation | Barrier layer to protect a ferroelectric capacitor after contact has been made to the capacitor electrode |
US8723654B2 (en) | 2010-07-09 | 2014-05-13 | Cypress Semiconductor Corporation | Interrupt generation and acknowledgment for RFID |
US9092582B2 (en) | 2010-07-09 | 2015-07-28 | Cypress Semiconductor Corporation | Low power, low pin count interface for an RFID transponder |
US9846664B2 (en) | 2010-07-09 | 2017-12-19 | Cypress Semiconductor Corporation | RFID interface and interrupt |
Also Published As
Publication number | Publication date |
---|---|
NL141690B (nl) | 1974-03-15 |
DE1614605A1 (de) | 1972-03-02 |
DE1614605B2 (de) | 1974-06-27 |
FR1581387A (enrdf_load_stackoverflow) | 1969-09-12 |
NL6812580A (enrdf_load_stackoverflow) | 1969-03-24 |
YU31236B (en) | 1973-02-28 |
GB1204436A (en) | 1970-09-09 |
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