US20190178582A1 - Cooling plate - Google Patents

Cooling plate Download PDF

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Publication number
US20190178582A1
US20190178582A1 US15/998,844 US201815998844A US2019178582A1 US 20190178582 A1 US20190178582 A1 US 20190178582A1 US 201815998844 A US201815998844 A US 201815998844A US 2019178582 A1 US2019178582 A1 US 2019178582A1
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Prior art keywords
cooling plate
water
circulating water
channel
air
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Abandoned
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US15/998,844
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English (en)
Inventor
Zenghong Deng
Changle GUAN
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Beijing Chuangyu Technology Co Ltd
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Beijing Chuangyu Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0081—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by a single plate-like element ; the conduits for one heat-exchange medium being integrated in one single plate-like element
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463—Cooling of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
    • F28D1/0472—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being helically or spirally coiled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0366—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by spaced plates with inserted elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/10—Particular layout, e.g. for uniform temperature distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Definitions

  • the present disclosure relates to the technical filed of cooling equipment in the vacuum coating filed, and particularly to a cooling plate.
  • the cooling plate in vacuum coating is usually installed in the processing chamber and wafer-output side of the coating equipment. It can dissipate the heat continuously through the circulating cooling liquid thereof, thereby accelerating the cooling rate of the substrate, effectively reducing the temperature of the substrate when exposed to the atmosphere, and shortening the overall process cycle time of the equipment.
  • the existing cooling plates in the field of vacuum coating mostly adopt a structure directly bent by the single-loop water channels and water pipes machined with deep hole drill in the thick plate.
  • Such structure of the pipes machined with deep hole drill in the thick plate is restricted to the processing technology.
  • Most of them are a single-loop water channel with one inlet and one outlet.
  • the cooling efficiency is low, the temperature difference between the water-inlet side and the water-return side is large, and the temperature uniformity of the entire plate is poor, which seriously affects the overall process cycle time of the equipment; in addition, due to many gaps between each pipe, and the pipes are mostly fixed on the plate when used in a large area, the calandria structure bent by water pipes has a poor heat conduction effect between the pipes and the plate, and needs a lot of maintenance and cleaning work.
  • the present disclosure provides a cooling plate, so as to solve the technical problem of the temperature non-uniformity of the cooling plate.
  • the present disclosure provides a cooling plate, including a cooling plate body and a circulating water channel arranged in the cooling plate body; wherein a water-inlet channel and a water-return channel of the circulating water channel are in parallel.
  • the cooling plate body is divided into a plurality of subsections of an integral structure, each subsection is provided with a set of independent circulating water channel.
  • each subsection of the cooling plate body is a groove having side walls shared by adjacent subsections, each circulating water channel is arranged in the corresponding groove.
  • the circulating water channel comprises water grooves milled on a surface of the groove with parallel water inlet and return, and/or water pipes with parallel water inlet and return.
  • bottom plates are further arranged on the cooling plate body; the cooling plate body is divided into four rectangular grooves with two center lines thereof as base lines; each groove is inlaid with a bottom plate sealingly connected with the groove.
  • a plurality of bosses are arranged on the cooling plate body at positions staggered to the circulating water channel; accommodating holes corresponding to the bosses are arranged on the bottom plate; the boss is disposed in the accommodating hole and is connected to the bottom plate.
  • air distribution pipes are arranged on the bottom plate; penetrated air holes are further arranged on the cooling plate body at positions staggered to the circulating water channel; vent holes corresponding to the air holes are arranged on the bottom plate; air injection holes communicating with the air holes and the vent holes are arranged on the air distribution pipes.
  • an air distribution pipe is arranged on a diagonal line of each bottom plate respectively, and air inlet pipes are arranged on each air distribution pipe.
  • a main air inlet pipe and a plurality of the air distribution pipes are arranged on the bottom plate, the air distribution pipes communicate with the main air inlet pipe.
  • strip bulges are arranged on the circulating water channel in a water flowing direction.
  • the cooling plate body is provided with a thermocouple detecting a temperature uniformity of the cooling plate and/or a flow controllable circulating water bump.
  • the technical solutions of the present disclosure have the following advantages: by arranging the circulating water channel in which the water-inlet channel and the water-return channel are in parallel in the cooling plate body, the cooling plate provided by the present disclosure solves the problem of the temperature non-uniformity of the entire cooling plate due to the temperature difference of the inlet water and returned water.
  • FIG. 1 is an assembly diagram of the cooling plate according to an embodiment of the present disclosure
  • FIG. 2 is a plan sketch of the cooling plate according to an embodiment of the present disclosure
  • FIG. 3 is a sectional view of A-A in FIG. 2 ;
  • FIG. 4 is an enlarged view of part B in FIG. 3 ;
  • FIG. 5 is an enlarged view of part C in FIG. 3 ;
  • FIG. 6 is an enlarged view of part D in FIG. 3 .
  • the terms “mount”, “connect to”, and “connect with” should be understood in a broad sense, for example, they may be fixed connections or may be removable connections, or integrated connections; may be mechanical connections or electrical connections; they may also be direct connections or indirect connections through intermediate medium, or may be internal communication of two components.
  • the specific meanings of the terms above in the present disclosure can be understood according to specific situations.
  • the cooling plate provided by the embodiments of the present disclosure includes a cooling plate body 1 , and a circulating water channel 3 arranged in the cooling plate body 1 ; wherein the circulating water channel 3 is a water channel in which a water-inlet channel and a water-return channel are in parallel.
  • the water-inlet channel and the water-return channel are in parallel means that the water-inlet channel and the water-return channel have a same or similar shape and are adjacent to each other, meanwhile the inlet of the water-inlet channel and the outlet of the water-return channel are at the same end, and the outlet of the water-inlet channel communicates with the inlet of the water-return channel, or the rear end of the water-inlet channel is directly integrated with the front end of the water-return channel.
  • the circulating water channel may be S-shaped.
  • the water-inlet channel and the water-return channel have a same S-shape, the same ends of the two S-shaped channels are respectively a water inlet and a water outlet, the opposite ends are an integrally intercommunicated structure. It is equivalent to a pipeline completed by two S-shapes, and the two openings are a water inlet and a water outlet respectively.
  • the shape of the circulating water channel is not limited to the S-shape above, and can be other shapes such as Z-shape or snake-shape.
  • the heat exchange area between the cooling plate and the liquid in the circulating water channel 3 is increased, thereby improving the heat exchange efficiency of the cooling plate; in another aspect, by applying the circulating water channel 3 in which the water-inlet channel and the water-return channel are in parallel, the problem of the temperature non-uniformity of the entire cooling plate due to the temperature difference of the inlet water and returned water is solved.
  • the circulating water channel in the embodiments of the present disclosure is hollow square.
  • the circulating water channel 3 is directly milled on the bottom surface of the cooling plate body 1 , and a bottom plate is welded on the bottom surface of the cooling plate body to seal the circulating water channel, that is, the circulation water channel 3 is formed by fitting the circulating water grooves on the bottom surface of the cooling plate body 1 with the bottom plate.
  • the circulating water channel 3 includes water pipes arranged on the bottom plate of the cooling plate body. It needs to be noted that the circulating water channel in the form of water pipes may be directly arranged in the grooves of the first specific embodiment, or may be fixed in other forms.
  • the circulating water channel 3 may be a combination of the first specific embodiment and the second specific embodiment, that is, a section of the circulating water channel may be milled grooves, and the other section of the circulating water channel may be in the form of water pipes communicating with the grooves.
  • the fourth specific embodiment of the present disclosure further arranges air holes on the basis of the first specific embodiment, the second specific embodiment or the third specific embodiment. Specifically, a plurality of air holes are provided at the positions on the cooling plate body that stagger to the circulating water channel. It can be understood that, by placing air holes on the cooling plate body, the air can be blown from the bottom to the top when the cooling liquid passes, which effectively dissipates the heat and enhances the heat exchange capacity between the cooling plate and the substrate.
  • the air feed equipment for the air holes may be an air distribution pipe disposed under the cooling plate body, and the air injection holes arranged on the air distribution pipe communicate with the air holes.
  • the air feed equipment of the air holes may also be other components, such as a vent plate, etc.
  • the cooling plate body 1 is divided into a plurality of subsections of an integral structure, and each subsection is provided with a set of independent circulating water channel 3 .
  • the specific arrangement of the circulating water channel of the present embodiment may adopt any of the forms of the first specific embodiment, the second specific embodiment or the third specific embodiment, or arrange the air holes of the fourth specific embodiment.
  • the plurality of subsections can shorten the heat exchange time of the circulating liquid in the cooling plate body 1 , so that a large temperature difference between the circulating liquid and the cooling plate of each part can be maintained, thereby improving the heat exchange efficiency, and accordingly shortening the circulation range of each set of circulating water channel, so as to further improve the temperature uniformity of the cooling plate.
  • the cooling plate of the present disclosure will be described in detail hereinafter by taking an example that the cooling plate body is divided into four subsections to cool respectively.
  • the bottom of the cooling plate body of the cooling plate of the present embodiment is divided into four equally divided grooves with two center lines thereof as base lines, wherein adjacent grooves share side walls, and the grooves form rectangles.
  • the four circulating water channels 3 are respectively arranged in four grooves, each of which is inlaid with a bottom plate 2 .
  • the bottom plates are defined as a first bottom plate 21 , a second bottom plate 22 , a third bottom plate 23 and a fourth bottom plate 24 respectively.
  • the first bottom plate 21 , the second bottom plate 22 , the third bottom plate 23 and the fourth bottom plate 24 are respectively fully welded with the corresponding grooves.
  • reference numeral 25 indicates the welding position of the bottom plate and the cooling plate body.
  • FIG. 6 is a specific schematic diagram of the air hole 12 and the air injection hole 82 .
  • FIG. 6 is a specific schematic diagram of the air hole 12 and the air injection hole 82 .
  • reference numeral 81 indicates the welding position of the air distribution pipe and the bottom plate. It can be understood that, by applying the diagonal line, the maximum air injection range can be formed and at the center of the bottom plate 2 , which facilitates the uniformity of the air coming out of the air holes 12 . At the same time, by using the structure that the air distribution pipe 8 is welded to the bottom plate 2 , the air inlet side of the air injection hole can be sealed.
  • each air distribution pipe 8 is connected with an air inlet pipe 9 .
  • Each air inlet pipe 9 extends to the middle position of the cooling plate and is welded to the side of the air distribution pipe 8 , so as to hermetically seal the air inlet pipe and the air distribution pipe.
  • reference numeral 91 indicates the welding point of the air inlet pipe and the air distribution pipe.
  • a joint is welded at the other end of the air inlet pipe, the joint is preferably to be a VCR male joint 92 on which a VCR male nut 93 is fitted.
  • the air inlet pipe 9 extends to the middle position of the cooling plate, so that the length of the inlet pipe is increased, therefore the inlet pipe is connected with the inlet of the vacuum chamber of air with certain flexibility. That is, the length of the air inlet pipe is increased, so that when it is docked with the inlet of the vacuum chamber, even if the position of the inlet of the vacuum chamber is slightly deviated, the rigid air inlet pipe will not be damaged.
  • the circulating water channel 3 is milled on the surface of the groove. It should be noted that the lower right corner of FIG. 2 is to show the structure of the circulating water channel, therefore the structure of the bottom plate is removed.
  • the milled circulating water channel 3 can avoid the water pipe being bent and damaged easily when used for the disk layout.
  • a plurality of bosses 11 are reserved on the cooling plate body 1 at positions staggered to the circulating water channel 3 , and accommodating holes corresponding to the bosses 11 are arranged on the bottom plate.
  • the boss 11 is disposed in the accommodating hole and is connected to the bottom plate by welding.
  • the welding manner is specifically shown in FIG. 4 . It can be understood that the engagement between the boss 11 and the accommodating hole forms auxiliary welding joints of the bottom plate 2 , and the welding points on the larger surface of the bottom plate 2 are increased, which improves the rigidity of the larger surface of the bottom plate 2 .
  • the bottom surface of the cross section of the circulating water channel 3 is a comb-shaped structure 31 .
  • the comb-shaped structure 31 is a plurality of strip bulges arranged on the circulating water channel 3 and in the flowing direction of the liquid in the circulating water channel 3 . It can be understood that the comb-shaped structure 31 can effectively increase the heat exchange area of the liquid with the cooling plate body 1 when water is flowing, and improve the heat exchange efficiency.
  • the independent circulating water channels are machined in multiple areas of the cooling plate body portion, and the water channels are sealed by welding the bottom plate.
  • Each water-inlet channel and water-return channel of the cooling plate of the embodiments of the present disclosure are parallel, which improves the temperature uniformity of the entire plate due to the temperature difference of inlet water and return water;
  • the cross section of the water channel is a comb-shaped structure, which increases the heat exchange area and improves the heat exchange efficiency;
  • a plurality of areas have independent water circulations, which increases the overall water-flowing capacity of the entire plate, enhances the heat exchange capacity of the cooling plate, and improves the cooling rate of the substrate. Meanwhile, by placing air holes on the cooling plate, the air can be blown from the bottom to the top when the cooling liquid passes, which effectively dissipates the heat and enhances the heat exchange capacity between the cooling plate and the substrate.
  • thermocouple can be arranged on the cooling plate to measure the temperature, so as to detect the uniformity of the cooling plate; in addition to the thermocouple arranged on the cooling plate, a flow controllable circulating water bump also can be supplied to the periphery of the cooling plate, so that an automatic temperature control function of the cooling temperature on the surface of the cooling plate can be achieved. Meanwhile, it is also a feasible solution of the present disclosure that water pipes are arranged in the grooves to form a parallel water inlet and return without sealing the bottom plate.
  • the air inlet thereof is not limited to, as described in the embodiments, that the four air distribution pipes are respectively connected to one air inlet pipe; it may also be achieved by connecting the four air distribution pipes to a main air inlet pipe, that is, one main air inlet pipe communicates with a plurality of air distribution pipes.
  • the arrangement of the air distribution pipe is not limited to, as described above, being arranged on the diagonal line; it may also be that a main air inlet pipe is directly placed at the center, and a plurality of air distribution pipes are connected to the two sides of the main air inlet pipe from different positions; for example, air holes are arranged in an approximate “ ” shape at the positions staggered to the circulating water channel, correspondingly, the plurality of air distribution pipes are also connected to the two sides of the main air inlet pipe to form an approximate “ ” shape.
  • the cooling plate of the embodiments of the present disclosure enhances the cooling effect, improves the efficiency of the cooling plate cooling the substrate, and reduces the effect of the cooling time on the overall process cycle time of the equipment; in addition, the overall temperature uniformity of the cooling plate of the embodiments of the present disclosure is better; and a welded integrated structure is adopted, which facilitates the maintenance at a later stage.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
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CN109489319A (zh) * 2018-12-15 2019-03-19 湖南玉丰真空科学技术有限公司 一种真空室用降温装置
CN110195952A (zh) * 2019-04-25 2019-09-03 浙江大学 一种迷宫槽式冷却的热场外罩
CN110828938A (zh) * 2019-11-25 2020-02-21 江苏理工学院 一种双层流道动力电池液冷板控制系统及其控制方法
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CN113135023A (zh) * 2021-03-23 2021-07-20 新沂崚峻光电科技有限公司 一种用于压印膜印刷的装置

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