US20180138810A1 - Power conversion circuit board and electric compressor - Google Patents

Power conversion circuit board and electric compressor Download PDF

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Publication number
US20180138810A1
US20180138810A1 US15/567,283 US201615567283A US2018138810A1 US 20180138810 A1 US20180138810 A1 US 20180138810A1 US 201615567283 A US201615567283 A US 201615567283A US 2018138810 A1 US2018138810 A1 US 2018138810A1
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US
United States
Prior art keywords
circuit board
power conversion
conversion circuit
voltage
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/567,283
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English (en)
Inventor
Makoto Hattori
Hiroyuki Kamitani
Hiroto Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Thermal Systems Ltd
Original Assignee
Mitsubishi Heavy Industries Automotive Thermal Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Mitsubishi Heavy Industries Automotive Thermal Systems Co Ltd filed Critical Mitsubishi Heavy Industries Automotive Thermal Systems Co Ltd
Assigned to Mitsubishi Heavy Industries Automotive Thermal Systems Co., Ltd. reassignment Mitsubishi Heavy Industries Automotive Thermal Systems Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HATTORI, MAKOTO, HIGUCHI, HIROTO, KAMITANI, HIROYUKI
Publication of US20180138810A1 publication Critical patent/US20180138810A1/en
Assigned to MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD. reassignment MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: Mitsubishi Heavy Industries Automotive Thermal Systems Co., Ltd.
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors

Definitions

  • the present invention relates to a power conversion circuit board and an electric compressor.
  • a vehicle-mounted air conditioner needs to save a large space due to the need for housing various structural devices in a confined space in a vehicle, for example.
  • an integrated electric compressor has been provided for the purpose of saving a larger space in recent years (for example, see Patent Documents 1 and 2).
  • a compressor that forms a vehicle-mounted air conditioner, a motor for driving the compressor, and a circuit board for controlling the compressor are integrally formed.
  • Patent Document 1 JP-A-2008-099480
  • Patent Document 2 JP-A-2011-229397
  • the vehicle-mounted electric compressor described above includes the compressor, the motor, and the circuit board in close contact to one another. Accordingly, a degree of vibration propagated to the circuit board increases during operation. The circuit board thus needs to have higher vibration resistance as space savings proceed.
  • the present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a power conversion circuit board and an electric compressor capable of reducing an influence of electromagnetic noise on an external device and further improving vibration resistance.
  • One aspect of the present invention is a power conversion circuit board that is a circuit board on which a power conversion circuit configured to convert a direct current into an alternating current is mounted.
  • a low-voltage circuit to which a low voltage is applied and a high-voltage circuit to which a high voltage is applied are disposed in different areas on the same circuit board surface.
  • Fixing holes are formed at least in four corners of the circuit board surface and in an area other than the four corners, and a grounding land provided at an edge of each of the fixing hole is formed.
  • the high-voltage circuit includes series capacitor groups each formed of a plurality of capacitor elements connected in series between power source wiring and ground wiring.
  • the series capacitor groups are mounted in the vicinity of the fixing holes.
  • a position grounded through the land provided at the edge of the fixing hole is close to a position connected to the series capacitor group on the ground wiring in the high-voltage circuit. This can further stabilize the ground potential of the whole ground wiring of the high-voltage circuit, and thus an influence of the electromagnetic noise on the external device can be further suppressed.
  • the series capacitor groups are mounted in the same positions on each of a front surface side and a back surface side of the circuit board. Two groups of the series capacitor groups mounted in the same positions on the front surface side and the back surface side are mounted with the plurality of capacitor elements having the same arrangement pattern.
  • the series capacitor groups on the front surface side and the back surface side can have the same capacitance value, which also includes floating capacitance according to the arrangement pattern.
  • wiring of the high-voltage circuit from high-voltage input terminals to switching elements is formed on the circuit board surface while wiring of the high-voltage circuit from the switching elements to high-voltage output terminals is constituted by a bus bar provided at a predetermined distance from the circuit board surface.
  • the electromagnetic noise generated by driving the switching elements is absorbed between the wiring formed on the circuit board surface and the bus bar provided at the predetermined distance from the circuit board surface. This can suppress the electromagnetic noise to be emitted to the outside.
  • the wiring from the high-voltage input terminals to the switching elements and the wiring from the switching elements to the high-voltage output terminals are disposed crossing each other.
  • the electromagnetic noise generated by driving the switching elements is effectively absorbed by a portion where the wirings cross each other. This can further suppress the electromagnetic noise to be emitted to the outside.
  • the region where the wirings overlap with each other allows the region of the power conversion circuit board occupied by the high-voltage circuit to be compact and integrated into one. Therefore, the whole power conversion circuit board can further save space.
  • One aspect of the present invention is an electric compressor that includes:
  • the power conversion circuit board and the electric compressor described above can reduce an influence of the electromagnetic noise on the external device and further improve the vibration resistance.
  • FIG. 1 is a perspective view of a power conversion circuit board according to a first embodiment.
  • FIG. 2 is a plan view of the power conversion circuit board according to the first embodiment.
  • FIG. 3 is a bottom view of the power conversion circuit board according to the first embodiment.
  • FIG. 4 is a side view of the power conversion circuit board according to the first embodiment.
  • FIG. 5 is a front view of the power conversion circuit board according to the first embodiment.
  • FIG. 6A is a first drawing for explaining characteristics of a series capacitor group according to the first embodiment.
  • FIG. 6B is a second drawing for explaining characteristics of the series capacitor group according to the first embodiment.
  • FIG. 7 is a drawing for explaining operational effects based on a structure of a high-voltage circuit according to the first embodiment.
  • a power conversion circuit board according to a first embodiment is described below while referencing FIGS. 1 to 7 .
  • FIG. 1 is a perspective view of the power conversion circuit board according to the first embodiment.
  • FIG. 2 is a plan view of the power conversion circuit board according to the first embodiment.
  • FIG. 3 is a bottom view of the power conversion circuit board according to the first embodiment.
  • FIG. 4 is a side view of the power conversion circuit board according to the first embodiment.
  • FIG. 5 is a front view of the power conversion circuit board according to the first embodiment.
  • a power conversion circuit board 1 according to the first embodiment is a circuit board that forms an inverter for converting a DC power supplied from the outside through an input terminal (described later) into a three-phase AC power.
  • the power conversion circuit board 1 according to the first embodiment is integrally mounted on an electric compressor with an AC motor that operates on the basis of the three-phase AC power output by the power conversion circuit board 1 .
  • the electric compressor is used in, for example, an air conditioner mounted in a vehicle (car air conditioner).
  • the electric compressor (the power conversion circuit board 1 ) receives an input of the DC power from, for example, a battery mounted in the vehicle.
  • the power conversion circuit board 1 includes a circuit board main portion 10 and a bus bar support member 20 .
  • the circuit board main portion 10 is a circuit board on which various circuit elements are mounted.
  • the circuit elements form a power conversion circuit (inverter) that converts a direct current into an alternating current.
  • a power conversion circuit inverter
  • part of a high-voltage circuit 10 a to which a high voltage is applied and a low-voltage circuit 10 b to which a low voltage is applied are separately disposed in different areas on a circuit board surface of the circuit board main portion 10 (including both of a surface on a +Z direction side and a surface on a ⁇ Z direction side).
  • the high-voltage circuit 10 a is a high-power circuit to which a high voltage needed for driving the AC motor, which is not illustrated, is applied. Specifically, a DC high voltage input from, for example, the battery mounted in the vehicle is applied to the high-voltage circuit 10 a . The input DC high voltage is converted into a three-phase AC power for driving the AC motor through switching elements SW.
  • Each of the switching elements SW switches between an ON state that allows a flow of current and an OFF state that shuts off current on the basis of a driving signal (gate input) from the low-voltage circuit 10 b (described later).
  • Two switching elements SW are provided for each of an U phase, a V phase, and a W phase that constitute a three-phase alternating current. Accordingly, six switching elements SW in total are mounted on the circuit board surface of the circuit board main portion 10 .
  • Each of the switching elements SW repeats ON and OFF at prescribed timing to supply the three-phase (U phase, V phase, and W phase) AC power to the AC motor.
  • the switching element SW is typified by, for example, an insulated gate bipolar transistor (IGBT), but may be a bipolar transistor or a metal-oxide-semiconductor field effect transistor (MOSFET), for example.
  • IGBT insulated gate bipolar transistor
  • MOSFET metal-oxide-semiconductor field effect transistor
  • the low-voltage circuit 10 b is a small-signal circuit that operates by a voltage lower than that of the high-voltage circuit 10 a .
  • a control chip such as a microcomputer and various sensors such as a current sensor are mounted on the low-voltage circuit 10 b , and the low-voltage circuit 10 b operates by the application of a DC low voltage.
  • the microcomputer mounted on the low-voltage circuit 10 b outputs a predetermined driving signal in response to detection results of the various sensors to each of the switching elements SW to control the switching element SW such that a desired three-phase AC power is generated according to situations.
  • the circuit board main portion 10 is a multilayer wiring circuit board that includes a plurality of layers layered. In the area of the circuit board main portion 10 where the high-voltage circuit 10 a is mounted, at least a power source pattern layer and a ground (GND) pattern layer are layered.
  • the power source pattern layer is patterned with power source wiring to which the above-described high voltage is applied.
  • the GND pattern layer is patterned with ground wiring that is grounded.
  • the high-voltage circuit 10 a is formed of high-voltage input terminals 10 a 1 , an RC circuit 10 a 2 , the switching elements SW, the bus bar support member 20 , a capacitor C, and an inductor L that are electrically connected to one another.
  • an +X direction side in FIG. 3 is indicated as a left side (left end side) and an ⁇ X direction side therein is indicated as a right side (right end side).
  • a +Y direction side in FIG. 3 is indicated as an upper side (upper end side) and a ⁇ Y direction side therein is indicated as a lower side (lower end side).
  • the high-voltage input terminals 10 a 1 are mounted on the circuit board surface on a back surface side ( ⁇ Z direction side) of the circuit board main portion 10 and on the left end side (+X direction side) of the circuit board main portion 10 (see FIG. 3 ).
  • the high-voltage input terminals 10 a 1 are electrically connected to a separately mounted battery, and a DC high voltage is applied to the high-voltage input terminals 10 a 1 from the battery.
  • the capacitor C and the inductor L for high voltage are mounted on the circuit board surface on the side (+Z direction side) opposite from the surface on which the high-voltage input terminals 10 a 1 are mounted (see FIG. 2 ).
  • the capacitor C and the inductor L for high voltage can stabilize the DC high voltage from the battery.
  • the DC high voltage input from the high-voltage input terminals 10 a 1 is input, through the RC circuit 10 a 2 disposed on the right end side ( ⁇ X direction side) of the high-voltage circuit 10 a , to the six switching elements SW mounted on the same right end side.
  • the RC circuit 10 a 2 is a circuit that includes a resistance element and a capacitor element electrically connected to each other, and functions as a filter.
  • the RC circuit 10 a 2 is mounted on the circuit board surface of the circuit board main portion 10 , and at least part of the RC circuit 10 a 2 is mounted in a space between the bus bar support member 20 , which will be described below, and the circuit board main portion 10 (see FIG. 3 , for example).
  • the six switching elements SW are mounted on the lower side ( ⁇ Y direction side) of the RC circuit 10 a 2 on the circuit board main portion 10 .
  • the bus bar support member 20 is disposed on the circuit board surface on the back surface side ( ⁇ Z direction side) of the circuit board main portion 10 and disposed so as to be adjacent to the left side (+X direction side) of the area on which the six switching elements SW are mounted.
  • the bus bar support member 20 is disposed in a position at a predetermined distance from the circuit board surface on the back surface side of the circuit board main portion 10 (see FIG. 4 ). Three bus bars corresponding to each of the U phase, the V phase, and the W phase are mounted in the bus bar support member 20 .
  • the three bus bars mounted in the bus bar support member 20 extend from bus bar connection terminals 20 a located on the lower end side ( ⁇ Y direction side) of the bus bar support member 20 to high-voltage output terminals 20 b located on the upper end side (+Y direction side) of the bus bar support member 20 while maintaining a constant distance from the circuit board surface of the circuit board main portion 10 .
  • the above-described three bus bars are disposed so as to cross over the high-voltage circuit 10 a mounted from the left end side to the right end side of the circuit board surface of the circuit board main portion 10 .
  • the three bus bars mounted in the bus bar support member 20 are electrically connected to wiring mounted on the circuit board surface of the circuit board main portion 10 at the bus bar connection terminals 20 a .
  • the AC power of each phase generated by driving the switching elements SW to be turned on or turned off is input to each corresponding bus bar via the bus bar connection terminal 20 a .
  • the AC power corresponding to each of the U phase, the V phase, and the W phase is output from the high-voltage output terminal 20 b of each phase through the bus bar that extends from the bus bar connection terminal 20 a located on the lower end side of the bus bar support member 20 to the upper end side thereof.
  • wiring of the high-voltage circuit 10 a from the high-voltage input terminals 10 a 1 to the switching elements SW and wiring thereof from the switching elements SW to the high-voltage output terminals 20 b are disposed so as to cross each other in the high-voltage circuit 10 a mounted on the power conversion circuit board 1 .
  • the circuit board main portion 10 includes a plurality of series capacitor groups 10 a 3 , each of which is a capacitor element provided for the purpose of reducing electromagnetic noise, connected between the power source wiring to which a high voltage in the high-voltage circuit 10 a is applied and the ground wiring that is grounded.
  • the series capacitor group 10 a 3 is formed of a plurality of (for example, five) capacitor elements (for example, the order of several thousand pF per one element) that are connected in series (see FIGS. 2 and 3 ).
  • Each of the capacitor elements may be, for example, a general ceramic capacitor.
  • the series capacitor groups 10 a 3 are mounted in the same positions (positions overlapping with each other when seen from the +Z direction side or the ⁇ Z direction side) on each of the front surface side (surface on the +Z direction side) of the circuit board main portion 10 and the back surface side (surface on the ⁇ Z direction side) of the circuit board main portion 10 .
  • Two groups of the series capacitor groups 10 a 3 mounted in the same positions on the front surface side and the back surface side are mounted such that the plurality of capacitor elements have the same arrangement pattern.
  • the circuit board main portion 10 is provided with fixing holes 11 for attaching the circuit board main portion 10 to a housing of the electric compressor, which is not illustrated.
  • the power conversion circuit board 1 is screwed to the housing of the electric compressor through the fixing holes 11 .
  • One fixing hole 11 is provided in each of four corners of the circuit board main portion 10 , and the plurality of fixing holes 11 are also provided near the center of the circuit board main portion 10 (see FIGS. 2 and 3 ).
  • a grounding land connected to the ground wiring is provided at the edge of the fixing hole 11 . In this way, by being screwed through the fixing holes 11 , the power conversion circuit board 1 is grounded through the grounding land provided at the edge of the fixing hole 11 .
  • the series capacitor group 10 a 3 described above is mounted in the vicinity of the fixing hole 11 corresponding to each of the fixing holes 11 (see FIGS. 2 and 3 ).
  • FIG. 6A is a first drawing for explaining characteristics of a series capacitor group according to the first embodiment.
  • FIG. 6B is a second drawing for explaining characteristics of the series capacitor group according to the first embodiment.
  • a graph shown in FIG. 6A shows an example of frequency characteristics of electromagnetic noise generated by the power conversion circuit board 1 (the vertical axis shows intensity of noise [dB] and the horizontal axis shows frequency [Hz]).
  • a graph shown in FIG. 6B shows an example of frequency characteristics of impedance of each of the capacitor elements that form the series capacitor group 10 a 3 (the vertical axis shows impedance [Q] and the horizontal axis shows frequency [Hz]).
  • the electromagnetic noise emitted from the power conversion circuit board 1 herein has frequency characteristics peculiar to a product due to, for example, characteristics of mounted elements, their circuit patterns, applied voltage, and operating frequency.
  • the electromagnetic noise of the power conversion circuit board 1 shows intensity higher than a prescribed value TH at a plurality of different frequencies f 1 , f 2 .
  • the five capacitor elements that form the series capacitor group 10 a 3 are selected so as to reduce the electromagnetic noise at the plurality of frequencies f 1 , 12 at which the electromagnetic noise is higher than or equal to the prescribed value TH corresponding to the plurality of frequencies f 1 , f 2 .
  • the impedance ( ⁇ ) of the capacitor element has frequency characteristics as shown in FIG. 6B .
  • the impedance locally decreases in a frequency band due to resonance characteristics.
  • the frequency characteristics of the impedance of the capacitor element differ from one another depending on a kind of a selected capacitor element.
  • the frequency characteristics of the different impedance of each of the capacitor elements that form the series capacitor group are combined corresponding to the frequencies f 1 , f 2 at which the electromagnetic noise is intense. This can effectively reduce the electromagnetic noise at a desired frequency (such as the frequencies f 1 , 12 ).
  • FIG. 7 is a drawing for explaining operational effects based on a structure of a high-voltage circuit according to the first embodiment.
  • the power conversion circuit board 1 is characterized in that the low-voltage circuit 10 b to which a low voltage is applied and the high-voltage circuit 10 a to which a high voltage is applied are separately disposed in the different areas on the same circuit board surface.
  • the high-voltage circuit 10 a and the low-voltage circuit 10 b are separately disposed. This can reduce a degree of interference of the electromagnetic noise emitted from the high-voltage circuit 10 a with the low-voltage circuit 10 b . Furthermore, the high-voltage circuit 10 a and the low-voltage circuit 10 b are disposed on the same circuit board surface, which can thus save space.
  • the power conversion circuit board 1 can reduce an influence of the electromagnetic noise while saving space.
  • the wiring of the high-voltage circuit 10 a from the high-voltage input terminals 10 a 1 to the switching elements SW (wiring through which a direct current Id flows) is formed on the circuit board surface of the circuit board main portion 10 while the wiring thereof from the switching elements SW to the high-voltage output terminals 20 b (wiring through which an alternating current Ia flows) is constituted by the bus bar provided at the predetermined distance from the circuit board surface.
  • the electromagnetic noise (such as ringing noise) generated by driving the switching elements SW is absorbed between the wiring formed on the circuit board surface of the circuit board main portion 10 and the bus bar provided at the predetermined distance from the circuit board surface in addition to the RC circuit 10 a 2 . This can suppress the electromagnetic noise to be emitted to the outside.
  • the wiring from the high-voltage input terminals 10 a 1 to the switching elements SW and the wiring from the switching elements SW to the high-voltage output terminals 20 b are disposed so as to cross each other. That is to say, the wiring of the high-voltage circuit 10 a through which the direct current Id flows (wiring mounted on the circuit board surface of the circuit board main portion 10 a ) and the wiring of the high-voltage circuit 10 a through which the alternating current Id flows (bus bar supported by the bus bar support member 20 ) three-dimensionally cross each other in the structure.
  • the electromagnetic noise generated by driving the switching elements SW is effectively absorbed by a portion where the wirings cross with each other. This can further suppress the electromagnetic noise to be emitted to the outside.
  • the above-described structure in which the wirings three-dimensionally cross with each other allows the region of the power conversion circuit board 1 occupied by the high-voltage circuit 10 a to be compact and integrated into one. Therefore, the whole power conversion circuit board 1 can be further reduced in size (can further save space).
  • At least part of the RC circuit 10 a 2 is provided in a space between the wiring from the high-voltage input terminals 10 a 1 to the switching elements SW and the wiring from the switching elements SW to the high-voltage output terminals.
  • the effect of eliminating the electromagnetic noise can be obtained on the basis of the function of the RC circuit 10 a 2 as a low-pass filter. Furthermore, the space provided between the wiring from the high-voltage input terminals 10 a 1 to the switching elements SW and the wiring from the switching elements SW to the high-voltage output terminals can be effectively used to secure space needed for mounting the RC circuit 10 a 2 . Therefore, the power conversion circuit board 1 can further save space.
  • the power conversion circuit board 1 is characterized in that the high-voltage circuit 10 a includes the series capacitor groups 10 a 3 each formed of the plurality of capacitor elements connected in series between the power source wiring and the ground wiring.
  • the voltage applied to one capacitor element is divided and reduced, so that the high-voltage circuit 10 a can have higher withstand voltage characteristics. Even if one of the capacitor elements is destroyed and short-circuited, the other capacitor elements connected in series can prevent a short circuit between the power source wiring and the ground wiring.
  • each of the capacitor elements that form the series capacitor group 10 a 3 can be selected as desired, so that the impedance characteristics of the whole series capacitor group 10 a 3 can be appropriately controlled according to the electromagnetic noise peculiar to a product.
  • an influence of the electromagnetic noise on the external device can be reduced, and the withstand voltage characteristics can be further increased.
  • each of the capacitor elements that form the series capacitor group 10 a 3 has different impedance characteristics (frequency characteristics of impedance) capable of reducing the electromagnetic noise at the plurality of frequencies at which the electromagnetic noise is higher than or equal to the prescribed value TH ( FIG. 6A ), corresponding to the plurality of frequencies.
  • the frequency characteristics of the different impedance are combined corresponding to the frequencies at which the electromagnetic noise is intense (the frequencies f 1 , f 2 in FIG. 6A ). This can effectively reduce the electromagnetic noise at a desired frequency.
  • the series capacitor groups 10 a 3 are mounted in the same positions on each of the front surface side and the back surface side of the circuit board main portion 10 .
  • Two groups of the series capacitor groups 10 a 3 mounted in the same positions on the front surface side and the back surface side of the circuit board main portion 10 are mounted such that the plurality of capacitor elements have the same arrangement pattern.
  • the series capacitor groups 10 a 3 on the front surface side and the back surface side can have the same capacitance value, which also includes the floating capacitance according to the arrangement pattern.
  • the fixing holes 11 are formed in at least four corners of the circuit board surface and in the area (near the center) other than the four corners, and the grounding land provided at the edge of the fixing hole 11 is formed.
  • the plurality of series capacitor groups 10 a 3 are mounted in the vicinity of the fixing holes 11 .
  • the wiring from the high-voltage input terminals 10 a 1 to the switching elements SW and the wiring from the switching elements SW to the high-voltage output terminals 20 b are disposed so as to cross with each other in the power conversion circuit board 1 , but a configuration is not limited to such a configuration in the other embodiments.
  • the wiring from the high-voltage input terminals 10 a 1 to the switching elements SW and the wiring from the switching elements SW to the high-voltage output terminals 20 b may not necessarily cross with each other in the power conversion circuit board 1 according to the other embodiments.
  • at least part of both wirings may overlap with each other and extend.
  • the RC circuit 10 a 2 is connected for the purpose of reducing the electromagnetic noise in response to the drive of the switching elements SW in the power conversion circuit board 1 , but a configuration is not limited to this aspect in the other embodiments.
  • the power conversion circuit board 1 according to the other embodiments may not include the RC circuit 10 a 2 . Also in this case, the power conversion circuit board 1 according to the other embodiments may only include a land on which the RC circuit I 0 a 2 can be mounted.
  • the power conversion circuit board and the electric compressor described above can reduce an influence of the electromagnetic noise while saving space.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inverter Devices (AREA)
  • Structure Of Printed Boards (AREA)
US15/567,283 2015-04-20 2016-02-15 Power conversion circuit board and electric compressor Abandoned US20180138810A1 (en)

Applications Claiming Priority (3)

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JP2015086292A JP6516357B2 (ja) 2015-04-20 2015-04-20 電力変換用回路基板及び電動圧縮機
JP2015-086292 2015-04-20
PCT/JP2016/054257 WO2016170826A1 (ja) 2015-04-20 2016-02-15 電力変換用回路基板及び電動圧縮機

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JP (1) JP6516357B2 (zh)
CN (1) CN107710583B (zh)
DE (1) DE112016001823T5 (zh)
WO (1) WO2016170826A1 (zh)

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US10270357B2 (en) * 2014-12-22 2019-04-23 Mitsubishi Electric Corporation Printed wiring board, circuit board, and control unit
US11375607B2 (en) * 2019-03-28 2022-06-28 Apple Inc. Mirrored voltage regulator for high-current applications and method the same
US12015330B2 (en) 2019-04-18 2024-06-18 Mitsubishi Heavy Industries Thermal Systems, Ltd. Vehicle-mounted electric compressor

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US12015330B2 (en) 2019-04-18 2024-06-18 Mitsubishi Heavy Industries Thermal Systems, Ltd. Vehicle-mounted electric compressor

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JP2016208626A (ja) 2016-12-08
WO2016170826A1 (ja) 2016-10-27
CN107710583A (zh) 2018-02-16
DE112016001823T5 (de) 2018-01-18
CN107710583B (zh) 2020-05-05
US11418111B2 (en) 2022-08-16
US20200059156A1 (en) 2020-02-20
JP6516357B2 (ja) 2019-05-22

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