US20160178182A1 - Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink - Google Patents

Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink Download PDF

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Publication number
US20160178182A1
US20160178182A1 US14/971,971 US201514971971A US2016178182A1 US 20160178182 A1 US20160178182 A1 US 20160178182A1 US 201514971971 A US201514971971 A US 201514971971A US 2016178182 A1 US2016178182 A1 US 2016178182A1
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United States
Prior art keywords
electrically conductive
conductive member
led package
led
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/971,971
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English (en)
Inventor
Anthony Maglica
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Mag Instrument Inc
Original Assignee
Mag Instrument Inc
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Filing date
Publication date
Application filed by Mag Instrument Inc filed Critical Mag Instrument Inc
Priority to US14/971,971 priority Critical patent/US20160178182A1/en
Assigned to MAG INSTRUMENT, INC. reassignment MAG INSTRUMENT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAGLICA, ANTHONY
Priority to US15/015,009 priority patent/US9494285B2/en
Priority to US15/148,505 priority patent/US9453625B2/en
Priority to US15/182,396 priority patent/US9494308B1/en
Publication of US20160178182A1 publication Critical patent/US20160178182A1/en
Priority to US15/285,426 priority patent/US9671102B2/en
Priority to US15/585,321 priority patent/US10012376B2/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/005—Electric lighting devices with self-contained electric batteries or cells the device being a pocket lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022—Pocket lamps
    • F21L4/027—Pocket lamps the light sources being a LED
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/08—Electric lighting devices with self-contained electric batteries or cells characterised by means for in situ recharging of the batteries or cells
    • F21L4/085—Pocket lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/04—Resilient mountings, e.g. shock absorbers 
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0414—Arrangement of electric circuit elements in or on lighting devices the elements being switches specially adapted to be used with portable lighting devices
    • F21V23/0428—Arrangement of electric circuit elements in or on lighting devices the elements being switches specially adapted to be used with portable lighting devices the switch being part of, or disposed on the lamp head portion thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/623—Portable devices, e.g. mobile telephones, cameras or pacemakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/64—Heating or cooling; Temperature control characterised by the shape of the cells
    • H01M10/643—Cylindrical cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/213—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F21Y2101/02—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0481—Compression means other than compression means for stacks of electrodes and separators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/509—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the type of connection, e.g. mixed connections
    • H01M50/51—Connection only in series
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/514—Methods for interconnecting adjacent batteries or cells
    • H01M50/516—Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • LEDs are mounted on laminated printed circuit boards. Some are mounted on special metal back or ceramic printed circuit boards in an attempt to conduct heat away from the LED.
  • the invention is generally directed to a lighting apparatus in which at least one LED is mounted to the top surface of a heat sink held within an outer casing that is thermally and electrically conductive, the LED having a first conductive member which is thermally and electrically directly connected to the heatsink without the use of a printed circuit board and a second electrically conductive member which is electrically isolated from the heatsink by an electrical insulating material held within the heatsink.
  • the second electrically conductive member of the LED can be soldered to a terminal held within the electrical insulating material while the first electrically conductive member of the LED can also be soldered to the heat sink and the resulting heat sink assembly can be press fit into a tube or barrel (such as an aluminum flashlight barrel) or inserted into the tube or barrel and then removably retained by a mechanical means such as a nut threaded to the tube or barrel.
  • the heatsink can be integrally formed with the tube or barrel.
  • FIGS. 1A-D show a heatsink and insulating core installed in a metal tube or flashlight barrel having the following identified elements:
  • FIG. 1B is a cross sectional view which is shown exploded in FIG. 1D while FIGS. 1A and 1C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 1B .
  • FIGS. 2A-D show a variation on FIGS. 1A-D in which the heatsink and insulating core are installed in a metal tube or flashlight barrel having the following identified elements:
  • FIG. 2B is a cross sectional view which is shown exploded in FIG. 2D while FIGS. 2A and 2C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 2B .
  • FIGS. 3A-D show a one-piece heatsink similar to that shown in FIGS. 2A-D having the following identified elements:
  • FIG. 3B is a cross sectional view which is shown exploded in FIG. 3D while FIGS. 3A and 3C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 3B .
  • FIGS. 4A-D show a variation on the heatsink and insulating core in FIGS. 1A-D .
  • there is a printed circuit board between the LED and the other end of the assembly having the following identified elements:
  • FIG. 4B is a cross sectional view which is shown exploded in FIG. 4D while FIGS. 4A and 4C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 4B .
  • FIGS. 5A-D show a variation of the assembly shown in FIGS. 4A-D having the following identified elements:
  • FIG. 5B is a cross sectional view which is shown exploded in FIG. 5D while FIGS. 5A and 5C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 5B .
  • FIGS. 6A-D show a heatsink similar to that in FIGS. 3A-D but containing a printed circuit board having the following identified elements:
  • FIG. 6B is a cross sectional view which is shown exploded in FIG. 6D while FIGS. 6A and 6C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 6B .
  • FIGS. 7A-D show a circular array of LEDs mounted on a common heatsink. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 7A-D have the following identified elements:
  • FIG. 7B is a cross sectional view which is shown exploded in FIG. 7D while FIGS. 7A and 7C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 7B .
  • FIGS. 8A-D show a circular array of LEDs mounted to a common heatsink with printed circuit boards in the insulating member. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 8A-D have the following identified elements:
  • FIG. 8B is a cross sectional view which is shown exploded in FIG. 8D while FIGS. 8A and 8C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 8B .
  • FIGS. 9A-C show a linear array of LEDs on a common heatsink. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 9A-C have the following identified elements:
  • FIG. 9B is a cross sectional view of a single LED and FIGS. 9A and 9C are, respectively, top and bottom views of a linear array of four LEDs.
  • FIGS. 10A-C show a linear array of LEDs similar to those on FIGS. 9A and 9C but containing printed circuit boards. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 10A-C have the following identified elements:
  • FIG. 10B is a cross sectional view of a single LED and FIGS. 10A and 10C are, respectively, top and bottom views of a linear array of four LEDs.
  • FIG. 11 is a cross sectional magnified view from FIG. 1B which shows the top of heatsink 5 without the LED in place having the following identified elements:
  • FIGS. 12A-E show a typical prior art LED assembly showing the LED soldered to a PC board and the multiple thermal junctions required to conduct heat to ambient air having the following identified elements:
  • FIG. 12B is a cross sectional view which is shown exploded in FIG. 12E while FIGS. 12A and 12C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 12B and FIG. 12D is an enlarged cutaway view of FIG. 12B .
  • FIGS. 13A-D show a widely used prior art star type, metal and ceramic backed PC board to which the LED is mounted and the multiple thermal junctions required to conduct heat to ambient air having the following identified elements:
  • FIG. 13B is a cross sectional view which is shown exploded in FIG. 13D while FIGS. 13A and 13C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 13B .
  • FIG. 14 is a block diagram of a typical heatsink mounted LED with positive polarity heatsink.
  • FIG. 15 is a block diagram of a typical heatsink mounted LED with negative polarity heatsink.
  • FIG. 16 is a block diagram of a typical heatsink mounted LED with a positive polarity heatsink that incorporates a PC board with LED drive electronics.
  • FIG. 17 is a block diagram of a typical heatsink mounted LED with a negative polarity heatsink that incorporates a PC board with LED drive electronics.
  • FIG. 18 is a comparison of the performance of four different heatsinking methods or systems.
  • FIG. 2 curve is for the present invention and demonstrates superior performance with minimal drop off in lumens output over time.
  • FIGS. 19A-B illustrate a process for manufacturing a heat sink assembly in accordance with the present invention in which solder S 1 and S 2 is used to solder pads of an LED 5 to a top surface of a heat sink 2 to form a heat sink assembly 200 .
  • FIGS. 19 C-D illustrate a press fit step of inserting heat sink assembly 200 into a tube or barrel 1 .
  • FIGS. 20A and 20B show variations on FIGS. 19C-D in which the heatsink and insulating core are installed in a metal tube or flashlight barrel having the following identified elements:
  • the present invention utilizes a thermally and electrically conductive metal outer member, a heatsink.
  • the interior of the heatsink, or core is an electrical insulating material that positions and electrically isolates a second electrically conductive member that extends out the end opposite from the LED to provide an electrical connection point.
  • the top surface of this assembly provides a mounting surface for the LED.
  • the anode or cathode side of the LED, and in some cases a dedicated thermal pad, is bonded to the top surface of the heatsink by soldering or some other thermally and electrically conductive method or material.
  • the electrically opposite side of the LED package is bonded to the isolated second member. Power from an appropriate electrical circuit is applied to the heatsink and the isolated terminal to turn on the LED.
  • FIGS. 1A through 11 depict variations on the design described above.
  • the heatsink can be different shapes depending on the application.
  • a heatsink can also support multiple LEDs in a variety of configurations; a circular array and a linear array are only two of many possibilities.
  • Electronics with a suitable interconnect method can also be suspended in the insulating core. It is also possible in all cases to provide electrically insulating material that positions and electrically isolates two electrically conductive members that extend out the end opposite from the LED to provide electrical connection points. In these cases the cathode and anode LED pads are bonded to corresponding isolated pads and the LED thermal pad is bonded to the invention's heatsink surface.
  • the improved heatsink method depicted in FIGS. 1A through 11 does not utilize a PC board for mounting the LED; instead, the LED is mounted directly to the metal surface of the heatsink. This method produces much improved heat transfer and a cooler operating, higher lumens LED, compared to PC board mounted LED designs.
  • the present invention provides a direct efficient path to conduct heat away from an LED to ambient air outside of a flashlight or any other lighting device such as a headlamp, lantern or spotlight, as well as all types of area lighting that utilize high powered LEDs as a light source.
  • Other heatsinking methods produce thermal paths that are interrupted by a large number of thermal junctions, some of which have poor thermal conductivity or high thermal resistance. Examples of prior art heatsinking methods are illustrated in FIGS. 12A through 13D .
  • Unique to the present invention is the ability to solder the terminal and heatsink directly to the electrical and thermal pads of the LED. No thermal grease or adhesives are required.
  • the equivalent heatsinking and electrical contact pads are on a PC board which results in more, less efficient, thermal junctions and longer, smaller cross section, thermal paths to ambient air.
  • the use of thermal grease and adhesives in these less efficient designs helps heat transfer to some degree but not to the level of attaching the LED directly to the heatsink.
  • the result of the much improved heat transfer possible with the invention is that the LED operates much cooler and therefore much more efficiently.
  • Higher lumens are possible with no increase in power over conventional systems. It is also possible to maintain lumens at the same level as other less efficient systems but consume far less power. This is especially important in battery powered lighting systems as on-time is extended without reducing lumens.
  • the superior performance of the present invention is demonstrated by the lumens output 60 seconds after applying a constant 4 amps of current to the LED. The invention was better than other systems as follows:
  • FIGS. 2A-D produced 19 percent more lumens than the system in FIGS. 13A-D (typical star, metal backed PC board mounted LED);
  • FIGS. 2A-D produced 93 percent more lumens than the system in FIGS. 12A-D (multi-layer conventional PC board with extra copper traces and vias to attempt to conduct heat away from the LED).
  • the efficiency of the present invention can be increased or optimized, with the aid of the present disclosure, by increasing or maximizing the surface area exposure between the heatsink and the thermally and electrically conductive outer casing while also designing the heatsink to have a sufficient mass to effectively and efficiently conduct heat between the heatsink and the outer casing.
  • heatsink 2 in FIGS. 2A-D will have better results than heatsink 2 of FIGS. 1A-D
  • FIGS. 3A-D illustrate an embodiment in which the heatsink is integrally formed with the outer casing, which should result in better results than the heatsink of FIGS. 2A-D .
  • outer casing which is illustrated in the exemplary embodiments depicted in FIGS. 1-11 as a tube or barrel, need not be thermally and electrically conductive over its entire outer surface, although an outer casing which is thermally and electrically conductive over its entire outer surface may achieve better results.
  • the advantages obtained by the more efficient cooling of one or more LEDs obtained by the present invention can be used to create a flashlight mode use of increased lumens, or a flashlight mode with increased on-time, or one or more modes that alternate between such modes or combine elements of both such modes.
  • a heat sink assembly 200 is created by soldering two electrically conductive members of an LED 5 to a top surface of heatsink 2 .
  • Commercially available LEDs typically have three pads (see, e.g., FIG. 11D where second electrical connection 7 has one rectangular pad while thermal junction and first electrical connection between LED 5 and heatsink 2 have two rectangular pads) which can all be used for soldering (solder S 1 in FIG. 19A is for one pad whereas solder S 2 in FIG. 19A is for two pads).
  • heat sink assembly 200 After heat sink assembly 200 is created, it can be press fit into a tube or barrel 1 as illustrated in FIGS. 19C and 19D or it can be removably inserted into tube or barrel 1 and then held in place by a removable holding mechanism, an example of which is nut 1 B illustrated in FIGS. 20A and 20B .
  • tube or barrel 1 and heat sink 2 are made of aluminum
  • heat sink 2 is coated with a metallic plating (e.g., nickel) that helps promote the soldering process
  • a skin cut is made of the aluminum where heat sink 2 comes into contact with a top surface 1 AT of shoulder 1 A formed in tube or barrel 1 (so as to promote more efficient thermal heat transfer).

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Biophysics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Battery Mounting, Suspending (AREA)
US14/971,971 2013-01-13 2015-12-16 Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink Abandoned US20160178182A1 (en)

Priority Applications (6)

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US14/971,971 US20160178182A1 (en) 2014-12-22 2015-12-16 Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink
US15/015,009 US9494285B2 (en) 2013-01-13 2016-02-03 Lighting devices
US15/148,505 US9453625B2 (en) 2014-12-22 2016-05-06 LED flashlight with improved heat sink and battery protection
US15/182,396 US9494308B1 (en) 2014-12-22 2016-06-14 LED flashlight with improved heatsink
US15/285,426 US9671102B2 (en) 2014-12-22 2016-10-04 LED flashlight with improved heat sink
US15/585,321 US10012376B2 (en) 2014-12-22 2017-05-03 LED flashlight with improved heat sink

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US201462095733P 2014-12-22 2014-12-22
US14/971,971 US20160178182A1 (en) 2014-12-22 2015-12-16 Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink

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US14/869,628 Continuation-In-Part US9368767B1 (en) 2013-01-13 2015-09-29 Method and apparatus for minimizing battery corrosive electrolyte leakage

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US14/153,970 Continuation-In-Part US9255696B2 (en) 2013-01-13 2014-01-13 Lighting devices
US14/869,962 Continuation-In-Part US9368768B1 (en) 2013-01-13 2015-09-29 Method and apparatus for minimizing battery corrosive electrolyte leakage
US15/148,505 Continuation-In-Part US9453625B2 (en) 2014-12-22 2016-05-06 LED flashlight with improved heat sink and battery protection

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US15/148,505 Active US9453625B2 (en) 2014-12-22 2016-05-06 LED flashlight with improved heat sink and battery protection
US15/182,396 Active US9494308B1 (en) 2014-12-22 2016-06-14 LED flashlight with improved heatsink
US15/285,426 Active US9671102B2 (en) 2014-12-22 2016-10-04 LED flashlight with improved heat sink
US15/585,321 Active 2036-04-05 US10012376B2 (en) 2014-12-22 2017-05-03 LED flashlight with improved heat sink

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US15/148,505 Active US9453625B2 (en) 2014-12-22 2016-05-06 LED flashlight with improved heat sink and battery protection
US15/182,396 Active US9494308B1 (en) 2014-12-22 2016-06-14 LED flashlight with improved heatsink
US15/285,426 Active US9671102B2 (en) 2014-12-22 2016-10-04 LED flashlight with improved heat sink
US15/585,321 Active 2036-04-05 US10012376B2 (en) 2014-12-22 2017-05-03 LED flashlight with improved heat sink

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EP3238278B1 (en) 2020-03-04
US20170023227A1 (en) 2017-01-26
JP7036883B2 (ja) 2022-03-15
CN107112401A (zh) 2017-08-29
CN107112401B (zh) 2019-05-17
US20170248299A1 (en) 2017-08-31
CA2971717C (en) 2021-08-24
US10012376B2 (en) 2018-07-03
US9453625B2 (en) 2016-09-27
US20160252221A1 (en) 2016-09-01
US20160356480A1 (en) 2016-12-08
DK3238278T3 (da) 2020-06-08
EP3238278A4 (en) 2018-06-06
US9494308B1 (en) 2016-11-15
JP2021036527A (ja) 2021-03-04
CA2971717A1 (en) 2016-06-30
HRP20200833T1 (hr) 2020-08-07
JP2018505537A (ja) 2018-02-22
WO2016106053A1 (en) 2016-06-30
US9671102B2 (en) 2017-06-06
EP3238278A1 (en) 2017-11-01

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