US20160152020A1 - Screen printing apparatus and component mounting line - Google Patents

Screen printing apparatus and component mounting line Download PDF

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Publication number
US20160152020A1
US20160152020A1 US14/867,079 US201514867079A US2016152020A1 US 20160152020 A1 US20160152020 A1 US 20160152020A1 US 201514867079 A US201514867079 A US 201514867079A US 2016152020 A1 US2016152020 A1 US 2016152020A1
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United States
Prior art keywords
region
substrate
screen printing
mask
printing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US14/867,079
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English (en)
Inventor
Masayuki Mantani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
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Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. reassignment PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MANTANI, MASAYUKI
Publication of US20160152020A1 publication Critical patent/US20160152020A1/en
Priority to US15/333,663 priority Critical patent/US9724911B2/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0804—Machines for printing sheets
    • B41F15/0813—Machines for printing sheets with flat screens
    • B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B41F15/46—Squeegees or doctors with two or more operative parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/11—Registering devices
    • B41P2215/114—Registering devices with means for displacing the article
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • One or more embodiments of the present invention relate to a screen printing apparatus which prints a paste on a substrate by using a mask in which an opening is formed, and to a component mounting line which is provided with the screen printing apparatus.
  • a screen printing apparatus prints a paste on a substrate by filling an opening with the paste by a printing head after bringing a mask, in which an opening is formed, into contact with the substrate.
  • the thickness of the paste printed on the substrate can be set according to the thickness of the mask, and the thickness of the paste on one substrate is generally a single thickness (one type).
  • the substrate on which a small-sized component, such as a chip component, and a large-sized component, such as a connector coexist, since a larger amount of paste is necessary when bonding the large-sized component than that of when bonding the small-sized component, there is also a case where two types of pastes which have different thicknesses are necessary to be printed on the substrate.
  • two masks which have different thicknesses from each other and in which openings are respectively formed are installed in parallel in the screen printing apparatus, and after performing the printing by the mask which is thinner than the other, the printing is performed by a mask which is thicker than the other (for example, refer to JP-A-2014-120745).
  • an object of one or more embodiments of the present invention is to provide a screen printing apparatus which can print two types of pastes which have different thicknesses from each other without increasing the size of the apparatus, and a component mounting line.
  • a screen printing apparatus including: a mask which has a first opening provided in a first region, and a second opening provided in a second region which is thicker than the first region; and a printing head which fills the first opening with a paste in a state where a substrate is in contact with the first region, and fills the second opening with the paste in a state where the substrate is in contact with the second region.
  • a component mounting line including: the screen printing apparatus; and a component mounting apparatus which mounts a component onto a substrate on which the paste is printed by the screen printing apparatus.
  • FIG. 1 is a plan view of a component mounting line according to a first embodiment of the present invention.
  • FIG. 2 is a plan view of a substrate on which the component mounting line performs component-mounting according to the first embodiment of the present invention.
  • FIG. 3 is a plan view of a screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 4 is a side view of the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 5 is a plan view of a mask which is provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 6 is a side sectional view of the mask which is provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 7A and 7B are partial side views of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 8A and 8B are side sectional views of the mask and a substrate which are provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 9 is a block diagram illustrating a control system of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 10A and 10B are views illustrating an operation of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 11A and 11B are views illustrating an operation of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 12A and 12B are views illustrating the mask and the substrate which are provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 13A and 13B are views illustrating an operation of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 14A and 14B are views illustrating the mask and the substrate which are provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 15A and 15B are views illustrating an operation of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 16A and 16B are views illustrating an operation of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 17A and 17B are views illustrating the mask and the substrate which are provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 18A and 18B are views illustrating an operation of the screen printing apparatus according to the first embodiment of the present invention.
  • FIGS. 19A and 19B are views illustrating the mask and the substrate which are provided in the screen printing apparatus according to the first embodiment of the present invention.
  • FIG. 20 is a side view of a screen printing apparatus according to a second embodiment of the present invention.
  • FIG. 21 is a side view of a mask which is provided in the screen printing apparatus according to the second embodiment of the present invention.
  • FIG. 22 is a side view of a screen printing apparatus according to a third embodiment of the present invention.
  • FIG. 23 is a side view of a mask which is provided in the screen printing apparatus according to the third embodiment of the present invention.
  • FIGS. 24A and 24B are partial side views of the screen printing apparatus according to the third embodiment of the present invention.
  • FIG. 1 illustrates a component mounting line 1 according to a first embodiment of the present invention.
  • the component mounting line 1 mounts a component 3 onto a substrate 2 and manufactures a mounted substrate 2 J, and is provided with a screen printing apparatus 4 and a component mounting apparatus 5 which is disposed on a downstream process side thereof.
  • the screen printing apparatus 4 receives the substrate 2 which is input from an upstream process side, screen-prints a paste Pst on an electrode 2 D of the substrate 2 , and delivers the substrate 2 to the component mounting apparatus 5 .
  • the component mounting apparatus 5 receives the substrate 2 from the screen printing apparatus 4 , and mounts the component 3 onto the electrode 2 D on which the paste Pst is printed.
  • a horizontal direction of the component mounting line 1 when viewed from an operator OP is considered as an X-axis direction, and the substrate 2 flows from a left side to a right side in the X-axis direction.
  • a longitudinal direction of the component mounting line 1 when viewed from the operator OP is considered as a Y-axis direction, and a vertical direction is considered as a Z-axis direction.
  • the electrode 2 D of the substrate 2 includes two types of electrodes (a first type electrode 2 a and a second type electrode 2 b ).
  • the first type electrode 2 a is an electrode on which a small-sized component 3 , such as a chip component, is mounted
  • the second type electrode 2 b is an electrode on which a large-sized component 3 , such as a connector, is mounted.
  • a larger amount of paste Pst is necessary on the second type electrode 2 b than that which is necessary on the first type electrode 2 a, and, on the second type electrode 2 b, the screen printing apparatus 4 prints the paste Pst which is thicker than that which is printed on the first type electrode 2 a .
  • a region S 1 illustrated in FIG. 2 indicates a region on the substrate 2 provided with the first type electrode 2 a
  • a region S 2 indicates a region on the substrate 2 provided with the second type electrode 2 b.
  • the screen printing apparatus 4 is provided with a substrate holding and moving mechanism 12 on a base 11 , and a mask 13 is provided above the substrate holding and moving mechanism 12 .
  • a carrying-in conveyor 14 which receives the substrate 2 input from the outside of the screen printing apparatus 4 and carries the substrate 2 to the substrate holding and moving mechanism 12 is provided.
  • a carrying-out conveyor 15 which receives the substrate 2 from the substrate holding and moving mechanism 12 and carries the substrate 2 to an apparatus (here, the component mounting apparatus 5 ) on the downstream process side is provided.
  • a camera 16 is provided below the mask 13
  • a printing head 17 is provided above the mask 13 .
  • the substrate holding and moving mechanism 12 includes a substrate holding portion 21 and a moving table portion 22 .
  • the substrate holding portion 21 is provided with a positioning conveyor 31 (refer to FIG. 3 ), a lower receiving portion 32 , and one pair of clampers 33 (refer to FIG. 3 ).
  • the positioning conveyor 31 positions the substrate 2 which is sent from the carrying-in conveyor 14 , to a predetermined clamping position.
  • the lower receiving portion 32 supports the substrate 2 which is positioned to the clamping position by the positioning conveyor 31 from below, and the pair of the dampers 33 clamps the substrate 2 from the Y-axis direction. In this manner, the substrate 2 is held by the lower receiving portion 32 and the pair of clampers 33 .
  • the moving table portion 22 includes a table mechanism which is stacked in multiple layers, and moves the substrate holding portion 21 which holds the substrate 2 in a direction within a horizontal surface and in the vertical direction.
  • the mask 13 has a shape of a rectangular plate which widens on an XY surface. An outer circumference of the mask 13 is supported by a frame member 13 w .
  • the thicknesses in a region on a front side and in a region on a rear side of the mask 13 are different from each other, and the thickness in the region on the rear side is thicker than the thickness in the region on the front side.
  • a front masking region R 1 (first region) which is a region that comes into contact with the substrate 2 is included in the region on the front side of the mask 13
  • a rear masking region R 2 (second region) which is a region that comes into contact with the substrate 2 is included in the region on the rear side of the mask 13
  • a region between the front masking region R 1 and the rear masking region R 2 includes an intermediate region Rm which has a difference (step) in thickness between the front masking region R 1 and the rear masking region R 2 .
  • a lower surface of the front masking region R 1 and a lower surface of the rear masking region R 2 are the same plane, and the height of the lower surface of the front masking region R 1 and the height of the lower surface of the rear masking region R 2 are equivalent to each other ( FIG. 6 ).
  • a first type opening K 1 (first opening) is provided in the front masking region R 1 .
  • a second type opening K 2 (second opening) is provided in the rear masking region R 2 .
  • the first type opening K 1 is provided in a first pattern which corresponds to the disposition of the first type electrode 2 a
  • the second type opening K 2 is provided in a second pattern which corresponds to the disposition of the second type electrode 2 b.
  • the mask 13 has the first type opening K 1 in the front masking region R 1
  • the camera 16 is provided with an upper imaging portion 16 a in which an imaging visual field faces upward, and a lower imaging portion 16 b in which an image visual field faces downward.
  • the camera 16 is driven by a camera moving mechanism 16 K and moves on the XY surface.
  • the upper imaging portion 16 a of the camera 16 images mask-side marks 13 m ( FIG. 5 ) which are respectively provided in the front masking region R 1 and the rear masking region R 2 of the mask 13 , from below.
  • the lower imaging portion 16 b of the camera 16 images substrate-side marks 2 m ( FIG. 3 ) of the substrate 2 held by the substrate holding portion 21 , from above.
  • the substrate holding and moving mechanism 12 raises the substrate 2 and brings the substrate 2 into contact with a lower surface of the mask 13 after positioning the substrate 2 with respect to mask 13 referring to a relative position of the mask-side mark 13 m and the substrate-side mark 2 m which are imaged by the camera 16 .
  • the substrate holding and moving mechanism 12 raises the substrate 2 and brings the substrate 2 into contact with a lower surface of the mask 13 after positioning the substrate 2 with respect to mask 13 referring to a relative position of the mask-side mark 13 m and the substrate-side mark 2 m which are imaged by the camera 16 .
  • the substrate holding and moving mechanism 12 raises the substrate 2 and brings the substrate 2 into contact with a lower surface of the mask 13 after positioning the substrate 2 with respect to mask 13 referring to a relative position of the mask-side mark 13 m and the substrate-side mark 2 m which are imaged by the camera 16 .
  • the front clamper 33 F is positioned in front of the front masking region R 1
  • the rear clamper 33 R is positioned in the intermediate region Rm which is behind the front masking region R 1 ( FIG. 7A ).
  • the rear clamper 33 R is positioned behind the rear masking region R 2
  • the front clamper 33 F is positioned in the intermediate region Rm which is in front of the rear masking region R 2 ( FIG. 7B ).
  • the paste Pst is supplied to the intermediate region Rm when the printing is started ( FIG. 5 ).
  • a thickness T 1 of the mask 13 in the front masking region R 1 is a thickness of the paste Pst when the paste Pst is printed on the first type electrode 2 a as it is.
  • the second type electrode 2 b matches the second type opening K 2 of the mask 13 , and is exposed on the upper surface side of the mask 13 through the second type opening K 2 ( FIG. 8B ).
  • a thickness T 2 of the mask 13 in the rear masking region R 2 is a thickness of the paste Pst when the paste Pst is printed on the second type electrode 2 b as it is.
  • the printing head 17 includes a moving base 41 which extends in the X-axis direction, two squeegees 42 which are disposed to face each other in the Y-axis direction below the moving base 41 , and two squeegee raising and lowering cylinders 43 which raise and lower each squeegee 42 provided in the moving base 41 with respect to the moving base 41 .
  • the moving base 41 is driven by a printing head moving mechanism 17 K and moves in the Y-axis direction, and accordingly, each squeegee 42 is moved in the Y-axis direction.
  • a squeegee which is positioned on a front side (right side of a paper surface of FIG. 4 ) is called a front squeegee 42 F
  • a squeegee which is positioned on a rear side (left side of the paper surface of FIG. 4 ) is called a rear squeegee 42 R.
  • the screen printin apparatus 4 includes a control device 50 ( FIG. 9 ).
  • the control device 50 may include, e.g., a memory configured to store instructions; and at least one processor configured to execute the instructions to cause the screen printing apparatus 4 to perform at least one of the operations thereof.
  • a control of each of a carrying operation of the substrate 2 by the carrying-in conveyor 14 , holding and moving operations of the substrate 2 by the substrate holding and moving mechanism 12 , and a carrying operation of the substrate 2 by the carrying-out conveyor 15 is performed by the control device 50 which is provided in the screen printing apparatus 4 .
  • a control of each of a moving operation of the camera 16 by the camera moving mechanism 16 K, a moving operation of the printing head 17 by the printing head moving mechanism 17 K, a raising and lowering operation of each squeegee 42 by the squeegee raising and lowering cylinder 43 , and an imaging operation of the camera 16 is also performed by the control device 50 .
  • Image data obtained by the imaging of the camera 16 is sent to the control device 50 , and image recognition processing is performed in an image processing unit 50 a ( FIG. 9 ) of the control device 50 .
  • the screen printing apparatus 4 prints (secondary printing) the paste Pst on the second type electrode 2 b by using the second type opening K 2 of the rear masking region R 2 after printing (primary printing) the paste Pst on the first type electrode 2 a by using the first type opening K 1 of the front masking region R 1 .
  • the carrying-in conveyor 14 receives the substrate 2 , and delivers the substrate 2 to the substrate holding portion 21 .
  • the substrate holding portion 21 positions the substrate 2 received from the carrying-in conveyor 14 to the predetermined clamping position by the positioning conveyor 31 , supports the substrate 2 by the lower receiving portion 32 from below, and then, clamps the substrate 2 by the pair of clampers 33 (illustrated with an arrow A in FIG. 10A ).
  • the substrate holding and moving mechanism 12 moves the substrate holding portion 21 , and positions the substrate 2 below the front masking region R 1 (illustrated with an arrow B 1 in FIG. 10B ).
  • the camera 16 moves, images the mask-side mark 13 m in the front masking region R 1 by the upper imaging portion 16 a, and images the substrate-side mark 2 m by the lower imaging portion 16 b ( FIG. 11A ).
  • the substrate holding and moving mechanism 12 moves and raises the substrate 2 so that the obtained mask-side mark 13 m and the substrate-side mark 2 m match each other when viewed in a plan view, and brings the substrate 2 into contact with the front masking region R 1 (illustrated with an arrow C 1 in FIG. 11B ).
  • each first type electrode 2 a matches the inside of the corresponding first type opening K 1 , and is exposed on the upper surface side of the mask 13 . Meanwhile, each second type electrode 2 b is in a state of being covered with the mask 13 ( FIG. 12A to FIG. 12B ).
  • the printing head 17 lowers the rear squeegee 42 R, and a lower end thereof abuts against the intermediate region Rm of the mask 13 .
  • the rear squeegee 42 R is slidably moved on the front masking region R 1 (illustrated with an arrow D 1 in FIGS. 13A and 14A ).
  • the substrate holding and moving mechanism 12 lowers the substrate holding portion 21 (illustrated with an arrow C 2 in FIG. 15A ), and snapping-off is performed. Accordingly, a layer of the paste Pst having a thickness which corresponds to the thickness T 1 of the mask 13 of the front masking region R 1 is formed on each first type electrode 2 a of the substrate 2 ( FIG. 14B ), and the primary printing is finished.
  • the substrate holding and moving mechanism 12 moves the substrate holding portion 21 , and positions the substrate 2 below the rear masking region R 2 (illustrated with an arrow B 2 in FIG. 15B ).
  • the camera 16 moves, images the mask-side mark 13 m in the rear masking region R 2 by the lower imaging portion 16 a , and images the substrate-side mark 2 m by the lower imaging portion 16 b ( FIG. 16A ).
  • the substrate holding and moving mechanism 12 moves and raises the substrate 2 so that the obtained mask-side mark 13 m and the substrate-side mark 2 m match each other when viewed in a plan view, and brings the substrate 2 into contact with the rear masking region R 2 (illustrated with an arrow C 1 in FIG. 16B ). Accordingly, each second type electrode 2 b matches the corresponding second type opening K 2 , and is exposed on the upper surface side of the mask 13 . Meanwhile, the paste Pst printed on the first type electrode 2 a is stored inside a hollow H for avoiding interference which is provided in the rear masking region R 2 ( FIG. 17A to FIG. 17B ). In addition, after finishing the primary printing, the front squeegee 42 F is maintained in a state where the lower end thereof abuts against the intermediate region Rm and is stopped.
  • the above-described hollow H is provided in a pattern (that is, in the first pattern) which corresponds to the disposition of the first type electrode 2 a in the rear masking region R 2 , and when the substrate 2 comes into contact with the rear masking region R 2 , the hollow H completely stores the pastes Pst which is printed on the upper surface of the first type electrode 2 a. For this reason, during the secondary printing, the paste Pst printed on the first type electrode 2 a in the primary printing is prevented from coming into contact with the lower surface of the mask 13 .
  • the printing head 17 moves the front squeegee 42 F on the rear masking region R 2 by moving the front squeegee 42 F from the intermediate region Rm to the region on the rear side of the rear masking region R 2 (illustrated with an arrow E 1 in FIG. 18A ).
  • the front squeegee 42 F is moved up to the rear region of the rear masking region R 2 , after the printing head 17 raises the front squeegee 42 F, now, the rear squeegee 42 R is lowered, and the lower end thereof abuts against the mask 13 .
  • each second type opening K 2 is filled with the paste Pst as the squeegee 42 slidably moves ( FIG. 19A )
  • the substrate holding and moving mechanism 12 lowers the substrate holding portion 21 , and the snapping-off is performed.
  • a layer of the paste Pst having a thickness which corresponds to the thickness T 2 of the mask 13 of the rear masking region R 2 is formed on each second type electrode 2 b of the substrate 2 ( FIG. 19B ), and the secondary printing is finished.
  • the squeegee 42 stops in the intermediate region Rm between the front masking region R 1 and the rear masking region R 2 .
  • the second type opening K 2 is filled with the paste Pst.
  • the squeegee 42 (specifically, the front squeegee 42 F) is not separated from the mask 13 between a sliding operation on the front masking region R 1 and a sliding operation on the rear masking region R 2 . For this reason, it is possible to smoothly and efficiently print two types of pastes Pst (two types of thicknesses) having different thicknesses from each other.
  • the substrate holding and moving mechanism 12 opens the pair of the clampers 33 and releases the held state of the substrate 2 .
  • the positioning conveyor 31 is operated, the substrate 2 is delivered on the carrying-out conveyor 15 , and the carrying-out conveyor 15 carries out the received substrate 2 to the component mounting apparatus 5 on the upstream process side.
  • the component mounting apparatus 5 is provided with a substrate carrying conveyor 71 for carrying and positioning the substrate 2 , a parts feeder 72 which supplies the component 3 , and a mounting mechanism 74 which picks up the component 3 supplied by the parts feeder 72 by a mounting head 73 , and mounts the component 3 onto the substrate 2 positioned by the substrate carrying conveyor 71 .
  • the component mounting apparatus 5 mounts the small-sized component, such as a chip component, on the first type electrode 2 a, and mounts the large-sized component, such as the connector, on the second type electrode 2 b.
  • the component mounting apparatus 5 operates the substrate carrying conveyor 71 , and carries out the substrate 2 to the downstream process side. In this manner, the mounted substrate 2 J is manufactured by the component mounting line 1 .
  • FIG. 20 illustrates the screen printing apparatus 4 according to a second embodiment of the present invention.
  • the screen printing apparatus 4 according to the second embodiment has substantially the same operation during the screen printing as that of the screen printing apparatus 4 according to the first embodiment, but the configurations of the mask 13 are different from each other.
  • the mask 13 of the screen printing apparatus 4 according to the second embodiment is provided with an inclination surface 13 S in which the upper surface of the intermediate region Rm in the mask 13 according to the first embodiment connects the upper surface of the front masking region R 1 and the upper surface of the rear masking region R 2 to each other (refer to FIG. 21 ).
  • FIG. 22 illustrates the screen printing apparatus 4 according to a third embodiment of the present invention.
  • the screen printing apparatus 4 according to the third embodiment also has substantially the same operation during the screen printing as that of the screen printing apparatus 4 according to the first embodiment, but the configurations of the mask 13 are different from each other.
  • the upper surface of the front masking region R 1 and the upper surface of the rear masking region R 2 are the same plane, and the height of the upper surface of the front masking region R 1 and the height of the upper surface of the rear masking region R 2 are equivalent to each other (refer to FIG. 23 ).
  • the movement of the paste Pst on the mask 13 becomes smooth, and a scraping operation of the paste Pst becomes smooth.
  • the height of the lower surface of the rear masking region R 2 is lower than the height of the lower surface of the front masking region R 1 , and the step between both regions is formed on the lower surface side of the mask 13 .
  • the rear clamper 33 R comes into contact with the inside of the front masking region R 1 ( FIG. 24A ).
  • the front clamper 33 F comes into contact with the inside of the rear masking region R 2 ( FIG. 24B ).
  • the height when the substrate 2 comes into contact with the front masking region R 1 is the same as the height when the substrate 2 comes into contact with the rear masking region R 2 , but in the third embodiment, the height when the substrate 2 comes into contact with the front masking region R 1 is different from the height when the substrate 2 comes into contact with the rear masking region R 2 only by the amount of the step.
  • the screen printing apparatus 4 includes the mask 13 which has the first type opening K 1 (first opening) in the front masking region R 1 (first region), and the second type opening K 2 (second opening) in the rear masking region R 2 (second region).
  • the first type opening K 1 is filled with the paste Pst in a state where the substrate 2 is brought into contact with the front masking region R 1
  • the second type opening K 2 is filled with the paste Pst in a state where the substrate 2 is brought into contact with the rear masking region R 2 . According to this, it is possible to print two types of pastes Pst which have different thicknesses from each other on the substrate 2 .
  • one mask 13 performs a function which corresponds to that of two masks, and only one prepared mask 13 may be employed. For this reason, according to the screen printing apparatus 4 according to the first to the third embodiments, it is possible to print two types of pastes Pst which have different thicknesses from each other without increasing the size of the apparatus.
  • the printing head 17 is provided with the squeegee 42 which slidably moves on the mask 13 , and fills the first type opening K 1 and the second type opening K 2 with the paste Pst, but the printing head 17 may not be necessarily provided with the squeegee 42 .
  • a printing head which moves on the mask 13 and fills the first type opening K 1 and the second type opening K 2 with the paste Pst while ejecting the paste Pst sealed in a cartridge may be employed.
  • the moving direction of the printing head 17 may be arbitrary.
  • two regions which have different thicknesses from each other are provided to be aligned in the longitudinal direction of the mask 13 , but this is merely an example, and may be provided to be aligned in a direction other than the longitudinal direction of the mask 13 .
  • a screen printing apparatus which can print two types of pastes which have different thicknesses from each other without increasing the size of the entire apparatus, and a component mounting line.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Methods (AREA)
US14/867,079 2014-12-01 2015-09-28 Screen printing apparatus and component mounting line Abandoned US20160152020A1 (en)

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JP2014-242811 2014-12-01

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CN111315147B (zh) 2022-10-14
CN105657980A (zh) 2016-06-08
JP6424334B2 (ja) 2018-11-21
JP2016104517A (ja) 2016-06-09
US20170036435A1 (en) 2017-02-09
CN111315147A (zh) 2020-06-19
CN105657980B (zh) 2020-04-14
US9724911B2 (en) 2017-08-08

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