US20160008947A1 - Template assembly and method of producing template assembly - Google Patents

Template assembly and method of producing template assembly Download PDF

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Publication number
US20160008947A1
US20160008947A1 US14/771,967 US201414771967A US2016008947A1 US 20160008947 A1 US20160008947 A1 US 20160008947A1 US 201414771967 A US201414771967 A US 201414771967A US 2016008947 A1 US2016008947 A1 US 2016008947A1
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Prior art keywords
template
workpiece
notch
backing pad
depth
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Abandoned
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US14/771,967
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English (en)
Inventor
Michito Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Assigned to SHIN-ETSU HANDOTAI CO., LTD. reassignment SHIN-ETSU HANDOTAI CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATO, MICHITO
Publication of US20160008947A1 publication Critical patent/US20160008947A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Definitions

  • the present invention relates to a template assembly used in polishing of a surface of workpieces, such as various semiconductor wafers starting with silicon wafers, to hold the workpiece and a method of producing the template assembly.
  • the apparatuses that can be mentioned as apparatuses for polishing surfaces of a workpiece such as a silicon wafer are a single-side polishing apparatus to polish one surface of the workpiece at a time and a double-side polishing apparatus to polish both surfaces of the workpiece simultaneously.
  • a typical single-side polishing apparatus 200 as shown in FIG. 8 is constituted of a turn table 203 to which a polishing pad 202 is attached, a polishing agent supply mechanism 204 , a polishing head 201 , and so on.
  • the polishing apparatus 200 holds a workpiece W with the polishing head 201 , rotates the turn table 203 and the polishing head 201 while supplying a polishing agent 205 to the polishing pad 202 from the polishing agent supply mechanism 204 , and brings a surface of the workpiece W into sliding contact with the polishing pad 202 to polish the workpiece W.
  • a polishing head with a retainer ring or a polishing head with a template assembly is used as a means of holding a workpiece.
  • This polishing head with a retainer ring serves a function to press a polishing pad at the periphery of the workpiece by the retainer ring and thereby to prevent compressive deformation of the polishing pad due to the workpiece itself, so as to prevent an outer peripheral sag of the workpiece.
  • the structure of this polishing head however is complicated and makes its cost high.
  • FIG. 9 shows an example of a conventional polishing head with a template assembly.
  • this template assembly has a backing pad 102 and an annular template 103 adhering to the outer circumferential portion of the lower surface of the backing pad.
  • the inner surface of the template and the lower surface of the backing pad 102 define a recess.
  • the polishing head 101 is configured such that this template assembly is stuck to a polishing head body 104 by double-stick tape 105 .
  • Glass epoxy resin for example, is used as the material of the template 103 .
  • the shape of the outer circumference of the wafer W is controlled by a difference between the depth of the recess of the template assembly and the thickness of the wafer W.
  • proper selection of the thickness of the template 103 enables adjustment of the pressure of the workpiece outer circumference during polishing, so the outer peripheral sag can be comparatively readily inhibited without using a polishing head having a complicated structure.
  • the surface of the backing pad is subjected to a buffing process after the backing pad is formed or the template is ground or lapped to improve the variation in the depth of the recess (See Patent Document 1).
  • a template assembly with a PET base is also known (See Patent Document 2).
  • a template 103 subjected to a grinding or lapping process is stuck directly to a PET base 106 and a backing pad 102 having a thickness whose variation is reduced by a buffing process is attached to the inside of the template.
  • the above method of buffing the backing pad or grinding and polishing the template is effective in reducing variation in thickness of each of the backing pad and the template. It is however difficult to improve the precision of adhesion between the template and the backing pad, which is an elastic body. The precision of the template assembly such as in-plane variation in depth of the recess cannot greatly be improved.
  • the recess of a commercially available template assembly has the depth with precision of a variation of ⁇ 20 ⁇ m from the target value. In-plane variation of the depth is about 15 ⁇ m.
  • Variation in thickness from the target thickness of the template can be improved to within ⁇ 3 ⁇ m and in-plane variation in its thickness can be improved to 3 ⁇ m or less after grinding and polishing the template.
  • the recess of the template assembly has the depth with precision of a variation of ⁇ 10 ⁇ m from the target value and the in-plane variation in the depth is degraded to about 10 ⁇ m.
  • the precision of adhesion can comparatively readily be improved because glass epoxy resin used as the template is hard, so the precision of the template assembly can be improved. Since the backing pad having a discoid shape is attached to the inner surface of the template, however, a space is created between the template and the backing pad. During polishing, slurry enters this space. This slurry is a source of generating particles that exerts an adverse effect on the quality of a polished workpiece such as a fine scratch and a defect of the workpiece.
  • the template assembly 110 having the template with an increased thickness has a smaller gap between the template and the polishing pad because the template hardly sinks in during polishing. This results in a shortage of slurry supply to a workpiece surface and may adversely affect the workpiece quality. Accordingly, the template cannot be thickened too much.
  • the present invention was accomplished in view of the above-described problems. It is an object of the present invention to provide a template assembly that can reduce the in-plane variation in depth of the recess and thereby improve flatness of a polished workpiece while inhibiting the occurrence of a scratch and a defect of the workpiece.
  • the present invention provides a template assembly configured to hold a workpiece in polishing of the workpiece, comprising: a polyethylene terephthalate (PET) base; an annular template adhering to an outer circumferential portion of a lower surface of the PET base, the template having an annular notch formed at an upper portion of an inner surface of the template; and a discoid backing pad whose peripheral portion is fitted into the notch, the backing pad adhering to a central portion of the lower surface of the PET base, wherein a recess configured to receive and hold the workpiece during polishing is defined by the inner surface of the template and a lower surface of the backing pad.
  • PET polyethylene terephthalate
  • Such a template assembly has no space between the template and the backing pad and generate no particle during polishing, thereby enabling inhibition of the occurrence of the scratch and defect of the workpiece.
  • this template assembly can reduce in-plane variation in their thickness and hence in-plane variation in depth of the recess and thereby improve the flatness of the polished workpiece.
  • the notch preferably has a thickness equal to or less than a target thickness of the backing pad.
  • Such a template assembly prevents the formation of a space between the template and the backing pad. If the notch has a thickness less than the target thickness of the backing pad, then a polishing pressure of the outer circumferential portion of the workpiece can be reduced and the amount of polishing the outer circumferential portion of the workpiece can thereby be reduced, so the outer peripheral sag can be inhibited.
  • the template is preferably made of glass epoxy resin.
  • Such a template has excellent mechanical properties and can prevent metal contamination and scratch of the workpiece.
  • in-plane variation in depth of the recess is preferably equal to or less than 10 ⁇ m.
  • Such a template assembly can reliably improve the flatness of the polished workpiece.
  • the present invention provides a method of producing the inventive template assembly, comprising: preparing the annular template having the annular notch formed at the upper portion of the inner surface of the template; sticking the discoid backing pad on the central portion of the PET base; and sticking the template on the outer circumferential portion of the lower surface of the PET base such that the peripheral portion of the backing pad is fitted into the notch of the template.
  • This method can produce the inventive template assembly that can reduce the in-plane variation in the thickness of the template and the backing pad and improve the flatness of the polished workpiece while inhibiting the occurrence of the scratch and defect of the workpiece.
  • the step of preparing the template may include: preparing a substrate for the template; cutting the prepared substrate into an annular shape; and then forming the notch by grinding an upper portion of an inner surface of the annular substrate.
  • the step of preparing the template preferably includes: before forming the notch, lapping and/or polishing the template such that in-plane variation in thickness of the template is equal to or less than 10 ⁇ m.
  • the inventive template assembly includes a PET base, an annular template adhering to the outer circumferential portion of the lower surface of the PET base, and a discoid backing pad adhering to the central portion of the lower surface of the PET base; an annular notch is formed at an upper portion of the inner surface of the template; a peripheral portion of the backing pad is fitted into the notch.
  • This template assembly can inhibit the occurrence of the scratch and defect of a workpiece without generating particles during polishing, and reduce the in-plane variation in thickness of the template and the backing pad and hence the in-plane variation in depth of the recess, thereby enabling improvement in flatness of a polished workpiece.
  • FIG. 1 is a schematic diagram of an example of the inventive template assembly
  • FIG. 2 is an enlarged view around the notch having the same thickness as the target thickness of the backing pad of the inventive template assembly
  • FIG. 3 is an enlarged view around the notch having a smaller thickness than the target thickness of the backing pad of the inventive template assembly
  • FIG. 4 is a diagram of the relationship of roll off to variation in depth of the recess from the target value in examples 1 and 2 and comparative examples 1 and 2;
  • FIG. 5 is a diagram showing the average, the maximum, and the minimum of roll off in examples 1 and 2 and comparative examples 1 and 2;
  • FIG. 6 is a radar chart of a difference in position of roll off at eight points in a plane in examples 1 and 2 and comparative examples 1 and 2;
  • FIG. 7 is a diagram showing the number of defects of wafers in examples 1 and 2 and comparative examples 1 and 3;
  • FIG. 8 is a schematic diagram of an example of a common polishing apparatus
  • FIG. 9 is a schematic diagram of an example of a conventional template assembly
  • FIG. 10 is a schematic diagram of another example of a conventional template assembly.
  • FIG. 11 is an explanatory view of a method of measuring the depth of the recess in examples 1 and 2 and comparative examples 1 to 3.
  • the inventive template assembly 1 has a polyethylene terephthalate (PET) base 2 , an annular template 3 , and a discoid backing pad 4 .
  • PET polyethylene terephthalate
  • the thickness and the shape of the PET base 2 are not particularly limited; for example, the shape may be discoid.
  • the backing pad 4 holds a workpiece W by attaching the workpiece W on its lower surface containing water.
  • the backing pad 4 may be made of, for example, foamed polyurethane. This backing pad 4 containing water can reliably hold the workpiece W by surface tension of the wafer contained in the backing pad 4 .
  • the template 3 is stuck on an outer circumferential portion of the lower surface of the PET base 2 .
  • the backing pad 4 is stuck on a central portion of the lower surface of the PET base 2 .
  • the inner surface of the template 3 and the lower surface of the backing pad 4 define a recess 6 .
  • the workpiece W is received in this recess 6 , and the edge and the upper surface of the workpiece W are held on the inner surface of the template 3 and the lower surface of the backing pad 4 , respectively.
  • the template assembly having the template 3 and backing pad 4 that both adhere directly to the PET base 2 in this manner can reduce the difference between the actual depth and the target depth of the recess 6 and the in-plane variation of the depth of the recess 6 . Accordingly, the flatness of the workpiece W polished with the inventive template assembly can be improved especially by reducing the outer peripheral sag of the workpiece W. In particular, when the in-plane variation in depth of the recess is 10 ⁇ m or less, the flatness of the workpiece W can reliably be improved.
  • the template 3 is preferably made of a material that is softer than the workpiece W and has high abrasion resistance that makes it hard to wear when being brought into sliding contact with a polishing pad during polishing, for such a material avoids contamination, a scratch, and an impression of the workpiece W.
  • an exemplary material of the template 3 may be glass epoxy resin.
  • an annular notch 5 is formed at an upper portion of the inner surface of the template 3 .
  • the backing pad 4 is stuck on the central portion of the lower surface of the PET base 2 such that a peripheral portion of the backing pad 4 is fitted into the notch 5 .
  • This configuration allows the template assembly to use the template 3 and the backing pad 4 that are directly stuck on the PET base 2 and have no space between the template 3 and the backing pad 4 .
  • This template assembly can thereby prevent the generation of particles due to slurry entering a space during polishing and inhibit the occurrence of a fine scratch and defect of the workpiece, which are problems of a conventional template assembly.
  • the notch 5 preferably has a thickness d that is equal to or less than the target thickness of the backing pad 4 so that no space is defined between the backing pad 4 and the template.
  • the notch 5 may have a thickness d less than the target thickness of the backing pad 4 so that the outer peripheral sag of the workpiece is more effectively inhibited.
  • the peripheral portion of the backing pad 4 that is held by the template 3 is compressed annularly, resulting in reduction in polishing pressure of the outer circumferential portion of the workpiece. This reduction reduces the amount of polishing the outer circumferential portion of the workpiece and thereby enables the inhibition of the outer peripheral sag of the workpiece.
  • the inventive template assembly with the notch 5 can adjust the polishing pressure of the outer circumferential portion of the workpiece by adjusting the thickness of the notch 5 without changing the thickness of the template 3 .
  • the template assembly can therefore inhibit a shortage of slurry supply due to a decreased space between the template 3 and the polishing pad, thereby enabling the inhibition of the occurrence of surface defects of the workpiece.
  • This configuration also allows for the combination with the method of forming an annular groove in the backing pad 4 .
  • the annular template 3 having the annular notch 5 formed at the upper portion of its inner surface is first prepared. This step may be performed for example as follows:
  • a substrate for the template such as a glass epoxy resin substrate is prepared. This substrate is lapped and/or polished so as to have the target thickness.
  • the in-plane variation in thickness of the template 3 is preferably reduced to 10 ⁇ m or less. In this manner, the surface shape of the outer circumferential portion of the workpiece can be inhibited from partially degrading during polishing of the workpiece.
  • exemplary abrasive grains that can be used are alumina or SiC abrasive grains. If polishing is performed at this time, then an alkali solution containing colloidal silica, for example, can be used.
  • the substrate is then cleaned to remove the abrasive grains and/or alkali solution attached in the lapping and/or polishing.
  • the substrate is next cut into the annular template 3 , for example, by a numerical control.
  • the notch 5 is then formed by grinding the upper portion of the inner surface of the annular template 3 . In this grinding, the thickness of the notch 5 is adjusted to a prescribed thickness that is equal to or less than the target thickness of the backing pad 4 , as described above.
  • the discoid backing pad 4 is stuck on the central portion of the PET base 2 .
  • the diameter of the backing pad 4 is adjusted such that the backing pad can be fitted into the annular notch 5 formed as above.
  • the template 3 is stuck on the outer circumferential portion of the lower surface of the PET base 2 such that the peripheral portion of the backing pad 4 is fitted into the notch 5 of the template 3 .
  • This inventive method can produce the inventive template assembly.
  • the inventive template assembly as shown in FIG. 1 was produced according to the inventive producing method to evaluate the precision of the depth of the recess.
  • the precision of the depth of the recess was evaluated by the difference in depth from the target depth and the in-plane variation in depth.
  • a glass epoxy resin substrate was lapped so as to have a thickness close to the target thickness.
  • the substrate was then polished with a slurry containing about 1 ⁇ m of cerium oxide powder and cut into an annular shape with a prescribed size.
  • the notch having the same thickness as the backing pad was then formed by annularly grinding the substrate up to a position of 5 mm away from the inner circumference with a lathe.
  • the template thus produced was stuck to the PET base on which the backing pad was stuck on its central portion to complete the production of the template assembly.
  • the depth of the recess of this template assembly was measured. As shown in Table 1, the difference from the target depth was an average (Ave) of ⁇ 0.51 ⁇ m, and a maximum of 4.8 ⁇ m on the plus side (Max) and 6.5 ⁇ m on the minus side (Min). As shown in Table 2, the in-plane variation in depth was an average (Ave) of 5.3 ⁇ m and a maximum (Max) of 7 ⁇ m in terms of the range of eight measurement points. It was revealed from these results that the precision of the depth of the recess was greatly improved compared with the results in comparative examples 1 and 2 as described later.
  • the depth of the recess was measured in the following manner.
  • the workpiece was marked at eight points in its plane within 1 to 2 mm away from its outer circumference.
  • the thickness of the marked portions was measured (this measured thickness is referred to as workpiece thickness).
  • This workpiece was put into the recess of the template assembly.
  • the thickness of the marked portions of the workpiece was measured while a load of 100 g/cm 2 was applied to the workpiece (this measured thickness is referred to as workpiece-portion thickness).
  • the thickness of the template was also measured at a position of 1 to 2 mm away from the inner circumference of the template toward the outer circumference (this measured thickness is referred to as template thickness).
  • the portion of 3 to 6 mm away from the outer circumference was regarded as a reference surface to calculate the value of roll off.
  • the roll off was measured on four wafers at 0.5 mm, 0.7 mm, 1.0 mm, and 2.0 mm away from their outer circumference.
  • Table 3 shows the average of roll off values at these points.
  • Table 4 shows the relationship between the difference in the recess depth from the target depth shown in Table 1 and the roll off shown in Table 3. As shown in FIG. 4 , the difference in the recess depth from the target depth was a minus value (the recess depth was shallower). As the absolute value of this difference increased, the template was more difficult to reduce the polishing pressure of the outer circumferential portion of the workpiece. In particular, the roll off was significantly changed at 0.5 mm away from the outer circumference, which is easy to be affected by the recess depth.
  • FIG. 5 shows the average (Ave), the maximum (Max), and the minimum (Min) of the roll off at 0.5 mm away from the outer circumference of each wafer.
  • FIG. 6 shows radar charts that demonstrate how the positions of the roll off were changed at the measured eight points in the plane.
  • example 1 carried out a further improvement in the roll off and a greater improvement in the in-plane variation compared with comparative examples 1 and 2 as described later, because example 1 achieved substantially the same recess depth as the target depth.
  • the radar chart exhibits substantially concentric circles, which means that the in-plane variation in the roll off was inhibited.
  • FIG. 7 shows the result of the surface defects of the wafers. As shown in FIG. 7 , the occurrence of the surface defects of the wafers was inhibited compared with the result in comparative example 3 as described later.
  • the surface defects were evaluated with Magics 350 made by Lasertec Corporation as values converted such that the total number of defects in comparative example 1 was regarded as 1.0.
  • the inventive template assembly was produced in the same manner as example 1 except that the thickness of the template was 10 ⁇ m thinner than the thickness in example 1 and the thickness of the notch was 20 ⁇ m thinner than the thickness of the backing pad.
  • the same evaluation as example 1 was conducted. It is to be noted that the thickness of this notch was adjusted such that although the used template was 10 ⁇ m thinner than the thickness in example 1, the depth of the recess when a load of 100 g/cm 2 was applied to the workpiece became substantially the same as in example 1 by pressing the peripheral portion of the backing pad with the template.
  • the depth of the recess of this template assembly was measured. As shown in Table 1, the difference from the target depth was an average of ⁇ 0.43 ⁇ m, and a maximum of 2.0 ⁇ m on the plus side and 2.8 ⁇ m on the minus side. As shown in Table 2, the in-plane variation in depth was an average of 5.8 ⁇ m and a maximum of 7 ⁇ m in terms of the range of eight measurement points. It was revealed from these results that the precision of the depth of the recess was greatly improved compared with the results in comparative examples 1 and 2 as described later.
  • example 2 used the template having the different thickness from the thickness in example 1 as above, since the recess depth was substantially the same as example 1, the same result of the roll off of the polished wafers was obtained. It was revealed from the radar chart shown in FIG. 6 that the in-plane variation in roll off was inhibited as in example 1.
  • FIG. 7 shows the result of the surface defects of the wafers. As shown in FIG. 7 , the occurrence of the surface defects of the wafers was inhibited compared with the result in comparative example 3 as described later.
  • the roll off values of the polished wafers in examples 1 and 2 were on the same level.
  • the in-plane variations of the roll off were also on the same level. More specifically, even when the template is thinned like example 2, the recess having the target depth can be formed by adjusting the thickness of the notch. This allows the template to have a thinner thickness than the conventionally required thickness, even when a deep recess, which may reduce slurry supply to the wafer surface during polishing, is chosen, for example, in consideration for the effect of the compressibility of a polishing pad to be used. The roll off and the surface defects of the wafers can thereby be improved while the reduction in slurry supply to the workpiece surface is inhibited during polishing.
  • the depth of the recess of this template assembly was measured. As shown in Table 1, the difference from the target depth was an average of ⁇ 4.46 ⁇ m, and a maximum of 11.0 ⁇ m on the plus side and 16.9 ⁇ m on the minus side. As shown in Table 2, the in-plane variation in depth was an average of 15.63 ⁇ m and a maximum of 26 ⁇ m in terms of the range of eight measurement points. It was revealed from these results that the precision of the depth of the recess was considerably worse compared with the results in examples 1 and 2.
  • FIG. 7 shows the result of the surface defects of the wafers. As shown in FIG. 7 , since the template assembly used in comparative example 1 had no space between the template and the backing pad unlike FIG. 10 , the occurrence of the surface defects of the wafers was inhibited compared with comparative example 3.
  • the depth of the recess of this template assembly was measured. As shown in Table 1, the difference from the target depth was an average of ⁇ 3.04 ⁇ m, and a maximum of 8.9 ⁇ m on the plus side and 10.9 ⁇ m on the minus side. As shown in Table 2, the in-plane variation in depth was an average of 9.77 ⁇ m and a maximum of 16 ⁇ m in terms of the range of eight measurement points.
  • the inventive template assembly can also improve this in-plane variation as above.
  • Table 1 shows summarized results of the difference in the recess depth from the target depth in examples 1 and 2 and comparative examples 1 and 2.
  • Table 2 shows summarized results of the in-plane variation in the recess depth in examples 1 and 2 and comparative examples 1 and 2.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US14/771,967 2013-03-22 2014-02-26 Template assembly and method of producing template assembly Abandoned US20160008947A1 (en)

Applications Claiming Priority (3)

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JP2013060418A JP5821883B2 (ja) 2013-03-22 2013-03-22 テンプレートアセンブリ及びテンプレートアセンブリの製造方法
JP2013-060418 2013-03-22
PCT/JP2014/000997 WO2014147969A1 (ja) 2013-03-22 2014-02-26 テンプレートアセンブリ及びテンプレートアセンブリの製造方法

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JP (1) JP5821883B2 (de)
KR (1) KR102058923B1 (de)
CN (1) CN105102189B (de)
DE (1) DE112014001031T5 (de)
SG (1) SG11201507321WA (de)
TW (1) TWI577501B (de)
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190126431A1 (en) * 2016-05-13 2019-05-02 Shin-Etsu Handotai Co., Ltd. Method for selecting template assembly, method for polishing workpiece, and template assembly
US10661410B2 (en) 2015-10-07 2020-05-26 Shin-Etsu Handotai Co., Ltd. Method for measuring template and method for evaluating same
US10744615B2 (en) 2015-11-06 2020-08-18 Shin-Etsu Handotai Co., Ltd. Method for polishing wafer and polishing apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6508003B2 (ja) * 2015-11-06 2019-05-08 信越半導体株式会社 テンプレートアセンブリの製造方法及びこのテンプレートアセンブリを用いた研磨方法並びにテンプレートアセンブリ
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6146259A (en) * 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US20020081956A1 (en) * 2000-09-08 2002-06-27 Applied Materials, Inc. Carrier head with vibration dampening
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US20040018806A1 (en) * 2000-12-04 2004-01-29 Minoru Numoto Wafer polisher
US6835125B1 (en) * 2001-12-27 2004-12-28 Applied Materials Inc. Retainer with a wear surface for chemical mechanical polishing
US20050202765A1 (en) * 2004-03-05 2005-09-15 Strasbaugh Independent edge control for CMP carriers
US20050215182A1 (en) * 2004-03-05 2005-09-29 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US20120264360A1 (en) * 2011-04-13 2012-10-18 Stacy Meyer Carrier Head With Shims
US20130260654A1 (en) * 2012-04-02 2013-10-03 Joon Mo Kang Carrier head for chemical mechanical polishing system
US20150303070A1 (en) * 2014-04-22 2015-10-22 Applied Materials, Inc. Retaining Ring Having Inner Surfaces with Facets
US20160121453A1 (en) * 2014-10-30 2016-05-05 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2849533B2 (ja) 1993-08-18 1999-01-20 長野電子工業株式会社 ウェーハの研磨方法
JP3042293B2 (ja) * 1994-02-18 2000-05-15 信越半導体株式会社 ウエーハのポリッシング装置
JP3072962B2 (ja) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 研磨のための被加工物の保持具及びその製法
JPH11333711A (ja) * 1998-05-21 1999-12-07 Nikon Corp 研磨ヘッド及びそれを用いた研磨装置
JP2000233363A (ja) * 1999-02-16 2000-08-29 Ebara Corp ポリッシング装置及び方法
TWI261009B (en) * 2001-05-02 2006-09-01 Hitoshi Suwabe Polishing machine
DE10247179A1 (de) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
JP2006068882A (ja) * 2004-09-06 2006-03-16 Nitta Haas Inc 被加工物保持部材
JP2008093810A (ja) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd リテーナリング及び研磨ヘッド並びに研磨装置
JP2008093811A (ja) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
JP5169321B2 (ja) 2008-03-04 2013-03-27 信越半導体株式会社 ワークの研磨方法
JP5143151B2 (ja) * 2010-02-01 2013-02-13 富士紡ホールディングス株式会社 研磨加工方法
CN101934495A (zh) * 2010-07-30 2011-01-05 清华大学 嵌入式化学机械抛光用的保持环
JP2012130993A (ja) * 2010-12-22 2012-07-12 Shin Etsu Handotai Co Ltd 研磨方法、研磨装置及び研磨布
JP5789869B2 (ja) * 2011-07-28 2015-10-07 東邦エンジニアリング株式会社 研磨パッド用補助板および研磨パッド用補助板を備えた研磨装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6146259A (en) * 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US20020081956A1 (en) * 2000-09-08 2002-06-27 Applied Materials, Inc. Carrier head with vibration dampening
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US20040018806A1 (en) * 2000-12-04 2004-01-29 Minoru Numoto Wafer polisher
US6835125B1 (en) * 2001-12-27 2004-12-28 Applied Materials Inc. Retainer with a wear surface for chemical mechanical polishing
US20050202765A1 (en) * 2004-03-05 2005-09-15 Strasbaugh Independent edge control for CMP carriers
US20050215182A1 (en) * 2004-03-05 2005-09-29 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US20120264360A1 (en) * 2011-04-13 2012-10-18 Stacy Meyer Carrier Head With Shims
US20130260654A1 (en) * 2012-04-02 2013-10-03 Joon Mo Kang Carrier head for chemical mechanical polishing system
US20150303070A1 (en) * 2014-04-22 2015-10-22 Applied Materials, Inc. Retaining Ring Having Inner Surfaces with Facets
US20160121453A1 (en) * 2014-10-30 2016-05-05 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP-11-333711 *
JP-2008-93811 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10661410B2 (en) 2015-10-07 2020-05-26 Shin-Etsu Handotai Co., Ltd. Method for measuring template and method for evaluating same
US10744615B2 (en) 2015-11-06 2020-08-18 Shin-Etsu Handotai Co., Ltd. Method for polishing wafer and polishing apparatus
US20190126431A1 (en) * 2016-05-13 2019-05-02 Shin-Etsu Handotai Co., Ltd. Method for selecting template assembly, method for polishing workpiece, and template assembly
US11731236B2 (en) * 2016-05-13 2023-08-22 Shin-Etsu Handotai Co., Ltd. Method for selecting template assembly, method for polishing workpiece, and template assembly

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CN105102189A (zh) 2015-11-25
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KR102058923B1 (ko) 2019-12-24
WO2014147969A1 (ja) 2014-09-25
KR20150133714A (ko) 2015-11-30
TWI577501B (zh) 2017-04-11
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TW201505761A (zh) 2015-02-16
CN105102189B (zh) 2017-05-10

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