TWI577501B - Template assembly and template component manufacturing method - Google Patents

Template assembly and template component manufacturing method Download PDF

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Publication number
TWI577501B
TWI577501B TW103108183A TW103108183A TWI577501B TW I577501 B TWI577501 B TW I577501B TW 103108183 A TW103108183 A TW 103108183A TW 103108183 A TW103108183 A TW 103108183A TW I577501 B TWI577501 B TW I577501B
Authority
TW
Taiwan
Prior art keywords
template
polishing
thickness
spacer
workpiece
Prior art date
Application number
TW103108183A
Other languages
English (en)
Chinese (zh)
Other versions
TW201505761A (zh
Inventor
Michito Sato
Original Assignee
Shin-Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co Ltd filed Critical Shin-Etsu Handotai Co Ltd
Publication of TW201505761A publication Critical patent/TW201505761A/zh
Application granted granted Critical
Publication of TWI577501B publication Critical patent/TWI577501B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW103108183A 2013-03-22 2014-03-10 Template assembly and template component manufacturing method TWI577501B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013060418A JP5821883B2 (ja) 2013-03-22 2013-03-22 テンプレートアセンブリ及びテンプレートアセンブリの製造方法

Publications (2)

Publication Number Publication Date
TW201505761A TW201505761A (zh) 2015-02-16
TWI577501B true TWI577501B (zh) 2017-04-11

Family

ID=51579672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108183A TWI577501B (zh) 2013-03-22 2014-03-10 Template assembly and template component manufacturing method

Country Status (8)

Country Link
US (1) US20160008947A1 (de)
JP (1) JP5821883B2 (de)
KR (1) KR102058923B1 (de)
CN (1) CN105102189B (de)
DE (1) DE112014001031T5 (de)
SG (1) SG11201507321WA (de)
TW (1) TWI577501B (de)
WO (1) WO2014147969A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6398939B2 (ja) * 2015-10-07 2018-10-03 信越半導体株式会社 テンプレートの測定方法及び評価方法
JP6508003B2 (ja) * 2015-11-06 2019-05-08 信越半導体株式会社 テンプレートアセンブリの製造方法及びこのテンプレートアセンブリを用いた研磨方法並びにテンプレートアセンブリ
JP6394569B2 (ja) * 2015-11-06 2018-09-26 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008093811A (ja) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
TW201240770A (en) * 2010-12-22 2012-10-16 Shinetsu Handotai Kk Polishing method, polishing apparatus, and polishing cloth

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JP2849533B2 (ja) 1993-08-18 1999-01-20 長野電子工業株式会社 ウェーハの研磨方法
JP3042293B2 (ja) * 1994-02-18 2000-05-15 信越半導体株式会社 ウエーハのポリッシング装置
JP3072962B2 (ja) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 研磨のための被加工物の保持具及びその製法
US6146259A (en) * 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
JPH11333711A (ja) * 1998-05-21 1999-12-07 Nikon Corp 研磨ヘッド及びそれを用いた研磨装置
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
JP2000233363A (ja) * 1999-02-16 2000-08-29 Ebara Corp ポリッシング装置及び方法
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
JP3969069B2 (ja) * 2000-12-04 2007-08-29 株式会社東京精密 ウェーハ研磨装置
TWI261009B (en) * 2001-05-02 2006-09-01 Hitoshi Suwabe Polishing machine
US6835125B1 (en) * 2001-12-27 2004-12-28 Applied Materials Inc. Retainer with a wear surface for chemical mechanical polishing
DE10247179A1 (de) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
US7063604B2 (en) * 2004-03-05 2006-06-20 Strasbaugh Independent edge control for CMP carriers
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
JP2006068882A (ja) * 2004-09-06 2006-03-16 Nitta Haas Inc 被加工物保持部材
JP2008093810A (ja) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd リテーナリング及び研磨ヘッド並びに研磨装置
JP5169321B2 (ja) 2008-03-04 2013-03-27 信越半導体株式会社 ワークの研磨方法
JP5143151B2 (ja) * 2010-02-01 2013-02-13 富士紡ホールディングス株式会社 研磨加工方法
CN101934495A (zh) * 2010-07-30 2011-01-05 清华大学 嵌入式化学机械抛光用的保持环
WO2012142305A2 (en) * 2011-04-13 2012-10-18 Applied Materials, Inc. Carrier head with shims
JP5789869B2 (ja) * 2011-07-28 2015-10-07 東邦エンジニアリング株式会社 研磨パッド用補助板および研磨パッド用補助板を備えた研磨装置
KR101597870B1 (ko) * 2012-04-02 2016-02-25 강준모 화학 기계적 연마 장치 용 캐리어 헤드
US9368371B2 (en) * 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US10252397B2 (en) * 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008093811A (ja) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
TW201240770A (en) * 2010-12-22 2012-10-16 Shinetsu Handotai Kk Polishing method, polishing apparatus, and polishing cloth

Also Published As

Publication number Publication date
CN105102189B (zh) 2017-05-10
WO2014147969A1 (ja) 2014-09-25
SG11201507321WA (en) 2015-10-29
KR102058923B1 (ko) 2019-12-24
KR20150133714A (ko) 2015-11-30
DE112014001031T5 (de) 2015-12-17
CN105102189A (zh) 2015-11-25
US20160008947A1 (en) 2016-01-14
TW201505761A (zh) 2015-02-16
JP2014184511A (ja) 2014-10-02
JP5821883B2 (ja) 2015-11-24

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