CN105102189B - 模板组件及模板组件的制造方法 - Google Patents

模板组件及模板组件的制造方法 Download PDF

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Publication number
CN105102189B
CN105102189B CN201480016816.1A CN201480016816A CN105102189B CN 105102189 B CN105102189 B CN 105102189B CN 201480016816 A CN201480016816 A CN 201480016816A CN 105102189 B CN105102189 B CN 105102189B
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China
Prior art keywords
template
template portion
liner
notch part
ring
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CN201480016816.1A
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Chinese (zh)
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CN105102189A (zh
Inventor
佐藤三千登
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Shin Etsu Handotai Co Ltd
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Shin Etsu Handotai Co Ltd
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Publication of CN105102189A publication Critical patent/CN105102189A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201480016816.1A 2013-03-22 2014-02-26 模板组件及模板组件的制造方法 Active CN105102189B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-060418 2013-03-22
JP2013060418A JP5821883B2 (ja) 2013-03-22 2013-03-22 テンプレートアセンブリ及びテンプレートアセンブリの製造方法
PCT/JP2014/000997 WO2014147969A1 (ja) 2013-03-22 2014-02-26 テンプレートアセンブリ及びテンプレートアセンブリの製造方法

Publications (2)

Publication Number Publication Date
CN105102189A CN105102189A (zh) 2015-11-25
CN105102189B true CN105102189B (zh) 2017-05-10

Family

ID=51579672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480016816.1A Active CN105102189B (zh) 2013-03-22 2014-02-26 模板组件及模板组件的制造方法

Country Status (8)

Country Link
US (1) US20160008947A1 (de)
JP (1) JP5821883B2 (de)
KR (1) KR102058923B1 (de)
CN (1) CN105102189B (de)
DE (1) DE112014001031T5 (de)
SG (1) SG11201507321WA (de)
TW (1) TWI577501B (de)
WO (1) WO2014147969A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6398939B2 (ja) * 2015-10-07 2018-10-03 信越半導体株式会社 テンプレートの測定方法及び評価方法
JP6508003B2 (ja) * 2015-11-06 2019-05-08 信越半導体株式会社 テンプレートアセンブリの製造方法及びこのテンプレートアセンブリを用いた研磨方法並びにテンプレートアセンブリ
JP6394569B2 (ja) * 2015-11-06 2018-09-26 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5588902A (en) * 1994-02-18 1996-12-31 Shin-Etsu Handotai Co., Ltd. Apparatus for polishing wafers
CN101934495A (zh) * 2010-07-30 2011-01-05 清华大学 嵌入式化学机械抛光用的保持环
JP5143151B2 (ja) * 2010-02-01 2013-02-13 富士紡ホールディングス株式会社 研磨加工方法

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JP2849533B2 (ja) 1993-08-18 1999-01-20 長野電子工業株式会社 ウェーハの研磨方法
JP3072962B2 (ja) * 1995-11-30 2000-08-07 ロデール・ニッタ株式会社 研磨のための被加工物の保持具及びその製法
US6146259A (en) * 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
JPH11333711A (ja) * 1998-05-21 1999-12-07 Nikon Corp 研磨ヘッド及びそれを用いた研磨装置
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
JP2000233363A (ja) * 1999-02-16 2000-08-29 Ebara Corp ポリッシング装置及び方法
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
JP3969069B2 (ja) * 2000-12-04 2007-08-29 株式会社東京精密 ウェーハ研磨装置
TWI261009B (en) * 2001-05-02 2006-09-01 Hitoshi Suwabe Polishing machine
US6835125B1 (en) * 2001-12-27 2004-12-28 Applied Materials Inc. Retainer with a wear surface for chemical mechanical polishing
DE10247179A1 (de) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
US7063604B2 (en) * 2004-03-05 2006-06-20 Strasbaugh Independent edge control for CMP carriers
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
JP2006068882A (ja) * 2004-09-06 2006-03-16 Nitta Haas Inc 被加工物保持部材
JP2008093811A (ja) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
JP2008093810A (ja) * 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd リテーナリング及び研磨ヘッド並びに研磨装置
JP5169321B2 (ja) 2008-03-04 2013-03-27 信越半導体株式会社 ワークの研磨方法
JP2012130993A (ja) * 2010-12-22 2012-07-12 Shin Etsu Handotai Co Ltd 研磨方法、研磨装置及び研磨布
WO2012142305A2 (en) * 2011-04-13 2012-10-18 Applied Materials, Inc. Carrier head with shims
JP5789869B2 (ja) * 2011-07-28 2015-10-07 東邦エンジニアリング株式会社 研磨パッド用補助板および研磨パッド用補助板を備えた研磨装置
KR101597870B1 (ko) * 2012-04-02 2016-02-25 강준모 화학 기계적 연마 장치 용 캐리어 헤드
US9368371B2 (en) * 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US10252397B2 (en) * 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5588902A (en) * 1994-02-18 1996-12-31 Shin-Etsu Handotai Co., Ltd. Apparatus for polishing wafers
JP5143151B2 (ja) * 2010-02-01 2013-02-13 富士紡ホールディングス株式会社 研磨加工方法
CN101934495A (zh) * 2010-07-30 2011-01-05 清华大学 嵌入式化学机械抛光用的保持环

Also Published As

Publication number Publication date
WO2014147969A1 (ja) 2014-09-25
SG11201507321WA (en) 2015-10-29
TWI577501B (zh) 2017-04-11
KR102058923B1 (ko) 2019-12-24
KR20150133714A (ko) 2015-11-30
DE112014001031T5 (de) 2015-12-17
CN105102189A (zh) 2015-11-25
US20160008947A1 (en) 2016-01-14
TW201505761A (zh) 2015-02-16
JP2014184511A (ja) 2014-10-02
JP5821883B2 (ja) 2015-11-24

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