US20150160041A1 - Encoder, manufacturing method of encore scale manufacturing method of encoder, and driving apparatus - Google Patents
Encoder, manufacturing method of encore scale manufacturing method of encoder, and driving apparatus Download PDFInfo
- Publication number
- US20150160041A1 US20150160041A1 US14/368,355 US201214368355A US2015160041A1 US 20150160041 A1 US20150160041 A1 US 20150160041A1 US 201214368355 A US201214368355 A US 201214368355A US 2015160041 A1 US2015160041 A1 US 2015160041A1
- Authority
- US
- United States
- Prior art keywords
- encoder
- pattern
- passive state
- manufacturing
- state member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 229940082150 encore Drugs 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 19
- 239000007769 metal material Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 75
- 239000010410 layer Substances 0.000 claims description 66
- 238000012545 processing Methods 0.000 claims description 27
- 238000005530 etching Methods 0.000 claims description 23
- 230000031700 light absorption Effects 0.000 claims description 16
- 239000011241 protective layer Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- -1 aluminum compound Chemical class 0.000 claims description 2
- 238000002161 passivation Methods 0.000 claims description 2
- 238000003780 insertion Methods 0.000 description 17
- 230000037431 insertion Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 15
- 239000007788 liquid Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 11
- 230000007423 decrease Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/16—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
- G01D5/165—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance by relative movement of a point of contact or actuation and a resistive track
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
- G01D5/34707—Scales; Discs, e.g. fixation, fabrication, compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/02—Casings or enclosures characterised by the material thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
- G01D5/3473—Circular or rotary encoders
Definitions
- the present invention relates to an encoder, a manufacturing method of an encoder scale, a manufacturing method of an encoder, and a driving apparatus.
- an encoder As an apparatus which detects rotation information such as a rotating speed, a rotation angle, and a rotation position of a rotating body including a rotating shaft or the like of a motor, an encoder is known.
- a reflection type optical encoder As one kind of encoder, for example, a reflection type optical encoder is known (for example, refer to Patent Document 1).
- the reflection type optical encoder includes a disk member in which a reflection region and a non-reflection region are formed on the surface, detects light reflected from the reflection region by a light-receiving element, and detects the rotation information.
- a light absorption layer is patterned on a surface of a substrate, which is formed in a mirror surface form, by a method such as a photolithography method. For example, after a multilayer film is formed on the surface of the substrate, a process of immersing the substrate into etching liquid and then etching the multilayer film is performed.
- Patent Document 1 Japanese Unexamined Patent Application, First Publication No. 2007-121142
- a substrate is formed using a material which dissolves in an etching liquid, such as untreated aluminum (for example, pure aluminum), a portion of a substrate is dissolved when the substrate is immersed into the etching liquid, and the dissolved aluminum remains between patterns, which may interfere with the etching processing. Accordingly, patterning accuracy may be decreased, and a decrease in a yield rate may occur.
- a material which dissolves in an etching liquid such as untreated aluminum (for example, pure aluminum)
- An object of aspects of the present invention is to provide an encoder, a manufacturing method of an encoder, and a driving apparatus capable of preventing a decrease in a yield rate.
- an encoder including: a scale unit having a substrate configured of a metal material and in which a pattern is formed on a first surface of the substrate and a passive state member is formed on a second surface different from the first surface in the substrate; and a detection unit that is configured to move relative to the scale unit and detects the pattern.
- a manufacturing method of an encoder scale including: a passive state member-forming process of forming a passive state member on a second surface different from a first surface on which a pattern is formed in a substrate configured of a metal material; a pattern layer-forming process of forming a pattern layer on the first surface; and an etching process which immerses the substrate into an etching solution, removes a portion of the pattern layer, and forms the pattern.
- a manufacturing method of an encoder including: the manufacturing method of an encoder scale according to the second aspect of the present invention; and a detection unit-forming process of forming a detection unit which detects the pattern.
- a driving apparatus including the encoder according to the first aspect of the present invention.
- FIG. 1 is a diagram showing a configuration of a driving apparatus (motor apparatus) according to an embodiment of the present invention.
- FIG. 2 is a diagram showing a configuration of a portion of an encoder according to the present embodiment.
- FIG. 3 is a diagram showing the configuration of a portion of the encoder according to the present embodiment.
- FIG. 4 is a flowchart showing a manufacturing method of an encoder according to the present embodiment.
- FIG. 5 is a process diagram showing a manufacturing process of the encoder according to the present embodiment.
- FIG. 6 is a process diagram showing the manufacturing method of the encoder according to the present embodiment.
- FIG. 7 is a process diagram showing the manufacturing method of the encoder according to the present embodiment.
- FIG. 8 is a process diagram showing the manufacturing method of the encoder according to the present embodiment.
- FIG. 9 is a process diagram showing the manufacturing method of the encoder according to the present embodiment.
- FIG. 10 is a process diagram showing the manufacturing method of the encoder according to the present embodiment.
- FIG. 11 is a process diagram showing the manufacturing method of the encoder according to the present embodiment.
- FIG. 12 is a process diagram showing the manufacturing method of the encoder according to the present embodiment.
- FIG. 1 is a cross-sectional diagram showing a configuration of a motor apparatus MTR as an example of a driving apparatus (measuring target).
- the motor apparatus MTR includes a moving shaft (rotating shaft) SF which is a moving body (rotor), a motor main body BD which is a driving unit rotating the rotating shaft SF, and an encoder EC which detects movement information (for example, rotation information) of the rotating shaft SF.
- the encoder EC includes a scale unit (rotatory member, scale) R and a detection unit D which moves relative to the scale unit.
- the encoder EC is used in a state where the rotatory member R is accommodated in a casing 30 configuring the detection unit D.
- the encoder EC of the present embodiment is configured so that the scale unit (rotatory member) R moves in a movement direction (for example, rotation direction).
- the rotatory member R includes a disk member (substrate) S and a magnet member M.
- the disk member S is fixed to the rotating shaft SF.
- the disk member S is integrally rotated with respect to the rotating shaft SF with the rotating shaft SF as a central axis.
- the disk member S is formed in a disk shape from a metal material such as aluminum or an aluminum compound.
- a constituent material of the disk member S other metal materials (for example, stainless steel, titanium, nickel, brass, or a combination thereof) may be used.
- the disk member S includes a hub 20 , a pattern-forming portion 21 , a protrusion part 22 , and a groove portion 23 .
- An insertion hole 20 a (fixing portion to be fixed) is formed at the lower surface side of the hub 20 at a center portion in plan view.
- the insertion hole 20 a is formed so that the rotating shaft SF of the motor apparatus MTR is inserted into the insertion hole 20 a.
- the hub 20 includes a fixing mechanism (not shown) which fixes a portion between the rotating shaft SF and the hub 20 in a state where the rotating shaft SF is inserted into the insertion hole 20 a.
- the pattern-forming portion 21 is an annular portion which is provided at the peripheral edge part of the hub 20 .
- a first surface Sa (pattern surface) of the disk member S is formed at the upper surface side of the pattern-forming portion 21 .
- the first surface Sa is mirror-processed so as to be formed to be flat.
- a light reflection pattern 24 is formed at the first surface Sa.
- the light reflection pattern 24 is one-rotation information which is annularly formed along the circumferential direction of the disk member S.
- the protrusion part 22 is provided at a center in plan view of the hub 20 , and is formed to protrude toward the upper surface side of the hub 20 .
- the groove portion 23 is a portion which is annularly formed between the pattern-forming portion 21 and the protrusion part 22 at the upper surface side of the hub 20 .
- a fixing member (not shown) which fixes the disk member S to the rotating shaft SF is mounted on the protrusion part 22 .
- the magnet member M is accommodated in the groove portion 23 of the disk member S.
- the magnet member M is a permanent magnet which is annularly formed along the rotation direction of the disk member S.
- a predetermined magnetic pattern is formed on the magnet member M.
- the magnetic pattern is multi-rotation information which is annularly formed along the circumferential direction of the magnet member M.
- the magnetic pattern of the magnet member M there is a magnetic pattern in which a half annular region when viewed in an axial direction of the rotating shaft SF is magnetized to the N pole and the other half annular region is magnetized to the S pole, or the like.
- the magnetic pattern is formed at the first surface Sa side of the rotatory member R which is formed in a disk shape.
- a portion between disk member S and the magnet member M is fixed via an adhesive agent (not shown) or the like.
- the detection unit D is a portion which detects a magnetic field by the light reflection pattern 24 and the magnet member M.
- the detection unit D includes a casing 30 , a light sensor 31 , and a magnetic sensor 32 .
- the casing 30 is formed in a circular cup shape (cylindrical shape) in plan view.
- the casing 30 is fixed to the motor main body BD which rotates the rotating shaft SF in the motor apparatus MTR, and is not fixed to the rotating shaft SF. Accordingly, even when the rotating shaft SF is rotated, a relative position between the casing 30 and the motor apparatus MTR is not changed.
- the casing 30 accommodates the disk member S and the magnet member M which are integrally formed. When viewed in the axial direction of the rotating shaft SF, the disk member S and the magnet member M are accommodated in a state where each center of the disk member S and the magnet member M is positioned to coincide with the center of the casing 30 .
- the light sensor 31 is a sensor which emits light toward the light reflection pattern 24 and detects the light reflection pattern 24 by reading the reflected light.
- the light sensor 31 is disposed at a position at which the light sensor overlaps with the light reflection pattern 24 of the disk member S when viewed in the axial direction of the rotating shaft SF.
- the light sensor 31 includes a light-emitting unit emitting light and a light-receiving unit receiving the reflected light.
- a LED or the like is used as the light-receiving unit.
- a photoelectric element or the like is used as an electrical signal.
- Each unit configuring the light sensor 31 is held in the casing 30 .
- a pair of magnetic sensors 32 are disposed at a position at which the magnetic sensors overlap with the magnet member M when viewed in the axial direction of the rotating shaft SF.
- Each of the magnetic sensors 32 A and 32 B includes a bias magnet (not shown) and a magnetic resistance element (not shown).
- Each of the magnetic sensors 32 A and 32 B is held in the casing 30 .
- the bias magnet is a magnet which forms a composite magnetic field between a magnetic field of the magnet member M and the bias magnet.
- a rare-earth magnet having a large magnetic force such as samarium cobalt or the like is used as a material configuring the bias magnet.
- the bias magnet is disposed at a position at which the bias magnet is not in contact with or is not adjacent to the magnetic resistance element.
- the magnetic resistance element includes two orthogonally repeated patterns which are formed by metal lines or the like.
- an electrical resistance decreases if the direction of the magnetic field approaches a direction perpendicular to the direction of the current flowing in the repeated pattern.
- the magnetic resistance element converts the direction of the magnetic field into an electrical signal by using the decrease in the electrical resistance.
- the magnetic resistance element detects the composite magnetic field by the magnetic field of the magnet member M and the magnetic field of the bias magnet. The detected result is sent to the controller (not shown) as an electrical signal.
- the detection unit D detects the one-rotation information by the light sensor 31 as movement information (for example, rotation information) and detects the multi-rotation information in the magnetic sensor 32 .
- the controller performs processing in which the rotation angle of the rotating shaft SF is obtained based on the one-rotation information output from the light sensor 31 and the rotating speed of the rotating shaft SF is obtained based on the multi-rotation information output from the magnetic sensors 32 A and 32 B.
- FIG. 2 is an enlarged diagram showing the cross-section of the rotatory member R.
- the illustration of the magnet member M is omitted.
- a passive state member 25 is formed on a second surface Sb which is different from the first surface Sa in the disk member S.
- the second surface Sb includes a side portion (first side portion 26 or second side portion 27 ) of the disk member S which is a side surface with respect to the first surface Sa, a first rear surface 28 which is positioned at the rear side of the first surface Sa, a second rear surface 29 which is positioned at the rear side of the groove portion 23 , a surface of the hub 20 , a surface of the insertion hole 20 a, or the like.
- the passive state member 25 is a coating film subjected to passivation processing and is an oxide film which covers the second surface Sb of the disk member S.
- the disk member S is formed using aluminum and the passive state member 25 is an aluminum oxide film (Al 2 O 3 ).
- the passive state member 25 has a property in which the passive state member is not easily dissolved with respect to a solution (acid solution or alkali solution) of approximately pH 2 to 14.
- the passive state member 25 has higher hardness than that of pure aluminum material. Accordingly, for example, when the passive state member comes into contact with a tool from the outside, the passive state member is not easily damaged and is not easily deformed.
- the passive state member 25 is formed on approximately the entire surface of the second surface Sb. Accordingly, approximately the entire surface of the second surface Sb is not easily dissolved with acid solution and alkali solution. In addition, approximately the entire surface of the second surface Sb is not easily damaged and is not easily deformed. Accordingly, a burden on a worker can be decreased in a process of manufacturing the disk member S of the encoder EC, a process of mounting the encoder EC on the rotating shaft SF, or the like.
- FIG. 3 is a cross-sectional diagram showing a configuration (film configuration) of the light reflection pattern 24 .
- the light reflection pattern 24 includes a light reflection layer 61 , a protective layer 62 , and a light absorption layer 63 .
- Each of the light reflection layer 61 , the protective layer 62 , and the light absorption layer 63 has a predetermined layer thickness.
- the light reflection layer 61 is formed on the first surface Sa of the disk member S.
- the light reflection layer 61 has a light reflection surface 61 a.
- the light reflection surface 61 a reflects the light emitted from a light-emitting element 31 a of the light sensor 31 toward a light-receiving element 31 b.
- the light reflection layer 61 is formed using a metal material having high light reflectivity such as aluminum.
- other metal materials for example, stainless steel, silver, a combination thereof, or the like may also be used.
- the protective layer 62 has light transparency and is formed on the light reflection surface 61 a of the light reflection layer 61 .
- the protective layer 62 covers the light reflection surface 61 a.
- the protective layer 62 is formed using a material having high light transparency such as silicon dioxide (SiO 2 ).
- the protective layer 62 protects the light reflection surface 61 a from corrosion or the like while transmitting the light from the light-emitting element 31 a.
- a resin material such as acrylic resin, other oxide films, or the like may be used.
- the light absorption layer 63 is patterned on the surface 62 a of the protective layer 62 .
- the light absorption layer 63 has lower light reflectivity than that of the light reflection layer 61 .
- the light absorption layer 63 is formed using a metal such as chromium (Cr) or a metal compound such as chromium oxide (for example, Cr 2 O 3 and the like) or chromium nitride (for example, CrN), having high light absorptivity.
- An opening portion 63 a is formed at the light absorption layer 63 .
- the opening portion 63 a is formed in a predetermined shape along the circumferential direction of the disk member S.
- the opening portion 63 a makes the light from the light-emitting element 31 a pass through.
- FIG. 4 is a flowchart showing a process of manufacturing the scale (rotatory member) R of the encoder EC.
- FIGS. 5 to 12 are diagrams showing manners of the manufacturing process of the rotatory member R.
- the manufacturing method of the rotatory member R of the encoder EC will be described with reference to FIGS. 4 to 12 .
- a disk member S including the first surface Sa and the second surface Sb is formed using an aluminum material (S 1 : shape-processing process).
- the passive state member is formed on the disk member S (S 2 : passive state member-forming process).
- the passive state member-forming process for example, the entire disk member S is immersed into an electrolyte solution, and electrolysis (electroplating) is performed in a state where the disk member S is set to an anode.
- an aluminum oxide film (Al 2 O 3 ) having a predetermined film thickness is formed on the entire surface of the disk member S including the first surface Sa and the second surface Sb.
- This oxide film is a passive state member 25 .
- a method of forming the passive state member is not limited to electroplating, and various methods can be applied.
- a masking process may be performed.
- the passive state member-forming process can be performed at an arbitrary timing.
- the passive state member can be formed during a pattern layer-forming process (for example, after a resist application process (baking process)) described below or after the pattern layer-forming process.
- mirror surface processing is performed on at least the first surface Sa of the disk member S (S 3 : mirror surface-processing process).
- the first surface Sa side of the disk member S, in which the passive state member 25 is formed on the entire surface is cut or polished.
- a portion 25 a, (refer to FIG. 6 ) which is formed on the first surface Sa in the passive state member 25 is removed by polishing, and as shown in FIG. 7 , the first surface Sa is exposed. Thereafter, the exposed first surface Sa is further polished, and the first surface Sa becomes a mirror surface.
- the operation of removing the portion 25 a formed on the first surface Sa in the passive state member 25 is also performed.
- the mirror surface processing may be selectively performed on a predetermined portion (for example, at least the first surface Sa) of the disk member S by cutting, polishing, or the like.
- each layer (pattern layer 66 ) configuring the light reflection pattern 24 is formed on the first surface Sa (pattern layer-forming process (S 5 to S 11 )).
- the first side portion 26 of the disk member S is held by a tool 70 .
- the disk member S may be held in a state where a portion of the tool 70 is inserted into the insertion hole 20 a of the hub 20 .
- the light reflection layer 61 , the protective layer 62 , and the light absorption layer 63 are laminated on the first surface Sa in this order by a vapor deposition method (S 5 : vapor deposition process).
- S 5 vapor deposition process
- the first side portion 26 may be damaged or deformed by the tool 70 .
- scratches indentations may be formed in the inner portion of the insertion hole 20 a by the tool 70 .
- the indentations become dimension errors when the rotating shaft SF is inserted into the insertion hole 20 a.
- the passive state member 25 is formed on the entire surface of the second surface Sb of the disk member S including the surfaces of the first side portion 26 and the insertion hole 20 a, for example, even when the tool 70 or the like comes into contact with the surface from the outside, scratches are not easily generated and deformation is not easily caused.
- a resist layer 80 is coated on the light absorption layer 63 by a spin coat method (S 6 : resist application process).
- prebaking processing is performed on the resist layer 80
- the resist layer 80 is dried (S 7 : baking process).
- exposure processing is performed on the resist layer 80 (S 8 : exposure process).
- exposure light irradiates the portion forming the pattern of a high reflection region in the resist layer 80 .
- the exposure may be performed on a negative type resist layer, and the exposure may be performed on a positive type resist layer.
- the resist layer may be either a negative type resist or a positive type resist.
- the portion of the light absorption layer 63 which is exposed from the opening portion 80 a of the resist layer 80 , is removed by an etching method (S 10 : etching process).
- S 10 etching process
- the entire disk member S is immersed into the etching liquid in the state where the resist layer 80 including the pattern layer 66 and the opening portion 80 a is formed.
- the etching liquid for example, a solution (acid solution or alkali solution) of approximately pH 2 to pH 14 is used.
- the portion of the light absorption layer 63 exposed from the opening portion 80 a is dissolved in the etching liquid, and thus, as shown in FIG. 11 , the opening portion 63 a is formed and the light reflection pattern 24 is formed.
- the shape of the opening portion 63 a of the light absorption layer 63 can be adjusted.
- the dissolved portion floats around the etching liquid, and may enter the opening portion 80 a and may be fixed to the opening portion.
- the fixed aluminum component functions as an etching mask, and a portion of the light absorption layer 63 is not removed and remains on the opening portion 63 a.
- detection errors of the encoder EC may occur.
- the passive state member 25 is formed on the approximately entire surface of the second surface Sb of the disk member S, the disk member S being dissolved in the etching liquid can be avoided. Accordingly, a problem in the rotation accuracy or a problem in the detection error can be avoided or be decreased.
- the resist layer 80 is removed (S 11 : resist removal process).
- the removal method of the resist layer 80 for example, there is a method in which the disk member S, on which the resist layer 80 is formed, is immersed into a resist-peeling liquid, or the like.
- the resist-peeling liquid can be appropriately selected according to the kind of photoresist used.
- immersion processing conditions can be appropriately set according to the kind of resist-peeling liquid used.
- the rotatory member R is obtained by mounting the magnet member M on the groove portion 23 of the disk member S.
- a second protective film having light transparency may be formed so as to cover the light reflection pattern 24 .
- the encoder EC can be obtained by separately forming (detection unit-forming process) the detection unit D.
- the rotatory member R (disk member S) of the encoder EC is mounted on the rotating shaft SF of the motor apparatus MTR
- the detection unit D is mounted on the driving unit AC of the motor apparatus MTR, and thus, the motor apparatus MTR on which the encoder EC shown in FIG. 1 is mounted can be obtained.
- the encoder EC includes the rotatory member R which has the disk member S fixed to the rotating shaft SF of the motor apparatus MTR formed using a metal material, and in which the light reflection pattern 24 is formed on the first surface Sa of the disk member S and the passive state member 25 is formed on the second surface Sb different from the first surface Sa in the disk member S; and the detection unit D which detects the light reflection pattern 24 , and thus, the approximately entire surface of the second surface Sb is protected from an acid solution or an alkali solution. Accordingly, when the etching processing is performed by the process of manufacturing the disk member S of the encoder EC, a decrease in patterning accuracy can be avoided, and thus, a decrease in the yield rate can be prevented.
- the passive state member 25 is an aluminum oxide film (Al 2 O 3 ), the hardness on the approximately entire surface of the second surface Sb of the disk member S is increased. Accordingly, scratches do not easily occur on the approximately entire surface of the second surface Sb and the entire surface is not easily deformed. Therefore, when the tool 70 or the like comes into contact with the disk member S from the outside in the process of manufacturing the disk member S of the encoder EC or in the process in which the encoder EC is mounted on the rotating shaft SF, occurrence of dimensional errors can be prevented.
- the configuration in which the light reflection layer 61 is formed on the first surface Sa of the mirror-surface-processed disk member S is described as an example.
- the present invention is not limited thereto.
- a configuration may be adopted in which the light reflection layer 61 is not formed, the mirror-surface-processed first surface Sa is set to the light reflection layer, and the protective layer 62 is directly formed on the first surface Sa.
- the light reflection layer 61 and the mirror-surface-processed first surface Sa may be configured as the light reflection layer.
- the encoder EC in the above-described embodiment is configured as a rotary encoder.
- the encoder may be configured as a linear encoder.
- the scale unit (scale) in the encoder EC of the above-described embodiment may be not only a disk-shaped rotary scale but also a linear scale.
- MTR motor apparatus
- SF rotating shaft
- BD motor main body
- EC encoder
- R rotatory member
- D detection unit
- S disk member
- M magnet member
- Sa first surface
- Sb second surface
- AC driving unit
- 20 hub
- 20 a insertion hole
- 24 light reflection pattern
- 25 passive state member
- 26 first side portion
- 27 second side portion
- 28 first rear surface
- 29 second rear surface
- 31 light sensor
- 31 a light-emitting element
- 31 b light-receiving element
- 61 light reflection layer
- 61 a light reflection surface
- 62 protective layer
- 63 light absorption layer
- 63 a opening portion
- 66 pattern layer
- 70 tool
- 80 resist layer
- 80 a opening portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optical Transform (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011287350 | 2011-12-28 | ||
JP2011-287350 | 2011-12-28 | ||
PCT/JP2012/083897 WO2013100061A1 (ja) | 2011-12-28 | 2012-12-27 | エンコーダ、エンコーダ用スケールの製造方法、エンコーダの製造方法及び駆動装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/083897 A-371-Of-International WO2013100061A1 (ja) | 2011-12-28 | 2012-12-27 | エンコーダ、エンコーダ用スケールの製造方法、エンコーダの製造方法及び駆動装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/446,714 Division US10234308B2 (en) | 2011-12-28 | 2017-03-01 | Encoder, manufacturing method of encoder scale, manufacturing method of encoder, and driving apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
US20150160041A1 true US20150160041A1 (en) | 2015-06-11 |
Family
ID=48697540
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/368,355 Abandoned US20150160041A1 (en) | 2011-12-28 | 2012-12-27 | Encoder, manufacturing method of encore scale manufacturing method of encoder, and driving apparatus |
US15/446,714 Active 2033-06-29 US10234308B2 (en) | 2011-12-28 | 2017-03-01 | Encoder, manufacturing method of encoder scale, manufacturing method of encoder, and driving apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/446,714 Active 2033-06-29 US10234308B2 (en) | 2011-12-28 | 2017-03-01 | Encoder, manufacturing method of encoder scale, manufacturing method of encoder, and driving apparatus |
Country Status (4)
Country | Link |
---|---|
US (2) | US20150160041A1 (zh) |
JP (2) | JP6086070B2 (zh) |
CN (1) | CN104094087B (zh) |
WO (1) | WO2013100061A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150047212A1 (en) * | 2012-03-08 | 2015-02-19 | Hella Kgaa Hueck & Co. | Level Sensor |
US20150185005A1 (en) * | 2012-07-05 | 2015-07-02 | Hella Kgaa Hueck & Co. | Level sensor |
US20160054151A1 (en) * | 2014-08-19 | 2016-02-25 | Mitutoyo Corporation | Encoder scale and method of manufacturing the same |
US20170146365A1 (en) * | 2015-11-23 | 2017-05-25 | Baumer Hübner GmbH | Shaft encoder arrangement |
US9863790B1 (en) * | 2015-06-08 | 2018-01-09 | X Development Llc | Devices and methods for a rotary encoder |
US11162820B2 (en) * | 2019-09-04 | 2021-11-02 | Delta Electronics, Inc. | Optical reflective component and optical encoder using same |
US11609106B2 (en) * | 2018-07-17 | 2023-03-21 | Mitsubishi Electric Corporation | Reflective optical encoder comprising a hub with an adhesive surface with a step structure |
US20230126475A1 (en) * | 2020-03-31 | 2023-04-27 | Dai Nippon Printing Co., Ltd. | Reflection-type optical encoder scale and reflection-type optical encoder |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9612136B1 (en) * | 2015-09-30 | 2017-04-04 | Mitutoyo Corporation | Absolute position encoder including a redundant spatial phase signal |
JP6628266B1 (ja) * | 2018-10-17 | 2020-01-08 | 株式会社プロセス・ラボ・ミクロン | 光学式エンコーダ用反射板とその製造方法 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4803354A (en) * | 1986-04-09 | 1989-02-07 | Hitachi Medical Corp. | Circuit for correcting output phase of rotary encoder |
US4954218A (en) * | 1988-09-08 | 1990-09-04 | Kabushiki Kaisha Toshiba | Method for etching a pattern |
US5754341A (en) * | 1995-06-08 | 1998-05-19 | Matsushita Electric Industrial Co., Ltd. | Phase grating, its fabricating method, optical encoder, motor using the optical encoder, and robot using the motor |
US20050078015A1 (en) * | 2003-10-10 | 2005-04-14 | Jordi Ferran | Encoding system |
US20050207013A1 (en) * | 2004-01-26 | 2005-09-22 | Mitutoyo Corporation | Photoelectric encoder and method of manufacturing scales |
US20050285026A1 (en) * | 2004-06-25 | 2005-12-29 | Fanuc Ltd | Linear encoder |
US20070101571A1 (en) * | 2003-12-05 | 2007-05-10 | Mitsui Mining & Smelting Co., Ltd. | Printed wiring board, its manufacturing method and circuit device |
US20090120904A1 (en) * | 2005-09-06 | 2009-05-14 | Canon Kabushiki Kaisha | Method and device for manufacturing structure having pattern, and method for manufacturing mold |
US20090170274A1 (en) * | 2007-12-31 | 2009-07-02 | Tdk Corporation | Method of forming metal trench pattern in thin-film device |
US20090267803A1 (en) * | 2008-04-25 | 2009-10-29 | Mitutoyo Corporation | Scale for photoelectric encoder |
US20100193671A1 (en) * | 2007-09-05 | 2010-08-05 | Nikon Corporation | Reflection plate for optical encoder and manufacturing method thereof, and optical encoder |
US20100301843A1 (en) * | 2007-11-09 | 2010-12-02 | SUMIDA Components & Modules GmbH | Position encoder comprising a plastic element |
US20110273166A1 (en) * | 2009-01-27 | 2011-11-10 | Rls Merilna Tehnika D.O.O. | Magnetic encoder scale |
US20120064709A1 (en) * | 2010-09-13 | 2012-03-15 | Jeon Kyung-Yub | Method of forming semiconductor device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56118606A (en) * | 1980-02-22 | 1981-09-17 | Mitsutoyo Mfg Co Ltd | Metal scale and manufacture thereof |
JPS61243321A (ja) * | 1985-04-22 | 1986-10-29 | Alps Electric Co Ltd | エンコ−ダのコ−ドホイ−ルの製法 |
US5155355A (en) * | 1991-04-25 | 1992-10-13 | Mitutoyo Corporation | Photoelectric encoder having a grating substrate with integral light emitting elements |
JP2003279381A (ja) * | 2002-01-21 | 2003-10-02 | Mitsubishi Electric Corp | エンコーダ用コード板、エンコーダ、エンコーダ用コード板のための金型製造方法、および、エンコーダ用コード板の製造方法 |
JP2005241248A (ja) * | 2004-01-30 | 2005-09-08 | Aronshiya:Kk | 光学式エンコーダに用いられる反射板及びその製造方法 |
JP4394515B2 (ja) * | 2004-05-06 | 2010-01-06 | 株式会社ミツトヨ | スケール製造方法 |
JP4877573B2 (ja) * | 2005-10-28 | 2012-02-15 | 株式会社ニコン | エンコーダディスクおよびエンコーダ |
CN101484780B (zh) * | 2007-06-01 | 2011-07-06 | 株式会社三丰 | 反射型编码器、其标尺以及标尺的制造方法 |
JP5076676B2 (ja) * | 2007-06-26 | 2012-11-21 | 株式会社ニコン | 反射型エンコーダ及びモータ |
SG10201502625RA (en) * | 2007-07-18 | 2015-05-28 | Nikon Corp | Measuring Method, Stage Apparatus, And Exposure Apparatus |
JP2010133713A (ja) * | 2008-12-02 | 2010-06-17 | Nikon Corp | 角度測定装置 |
JP2010271174A (ja) * | 2009-05-21 | 2010-12-02 | Nikon Corp | エンコーダ |
JP5846686B2 (ja) * | 2011-11-22 | 2016-01-20 | 株式会社ミツトヨ | 光電式エンコーダのスケールの製造方法 |
-
2012
- 2012-12-27 CN CN201280069186.5A patent/CN104094087B/zh active Active
- 2012-12-27 WO PCT/JP2012/083897 patent/WO2013100061A1/ja active Application Filing
- 2012-12-27 US US14/368,355 patent/US20150160041A1/en not_active Abandoned
- 2012-12-27 JP JP2013551797A patent/JP6086070B2/ja active Active
-
2016
- 2016-07-28 JP JP2016148386A patent/JP6319374B2/ja active Active
-
2017
- 2017-03-01 US US15/446,714 patent/US10234308B2/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4803354A (en) * | 1986-04-09 | 1989-02-07 | Hitachi Medical Corp. | Circuit for correcting output phase of rotary encoder |
US4954218A (en) * | 1988-09-08 | 1990-09-04 | Kabushiki Kaisha Toshiba | Method for etching a pattern |
US5754341A (en) * | 1995-06-08 | 1998-05-19 | Matsushita Electric Industrial Co., Ltd. | Phase grating, its fabricating method, optical encoder, motor using the optical encoder, and robot using the motor |
US20050078015A1 (en) * | 2003-10-10 | 2005-04-14 | Jordi Ferran | Encoding system |
US20070101571A1 (en) * | 2003-12-05 | 2007-05-10 | Mitsui Mining & Smelting Co., Ltd. | Printed wiring board, its manufacturing method and circuit device |
US20050207013A1 (en) * | 2004-01-26 | 2005-09-22 | Mitutoyo Corporation | Photoelectric encoder and method of manufacturing scales |
US20050285026A1 (en) * | 2004-06-25 | 2005-12-29 | Fanuc Ltd | Linear encoder |
US20090120904A1 (en) * | 2005-09-06 | 2009-05-14 | Canon Kabushiki Kaisha | Method and device for manufacturing structure having pattern, and method for manufacturing mold |
US20100193671A1 (en) * | 2007-09-05 | 2010-08-05 | Nikon Corporation | Reflection plate for optical encoder and manufacturing method thereof, and optical encoder |
US20100301843A1 (en) * | 2007-11-09 | 2010-12-02 | SUMIDA Components & Modules GmbH | Position encoder comprising a plastic element |
US20090170274A1 (en) * | 2007-12-31 | 2009-07-02 | Tdk Corporation | Method of forming metal trench pattern in thin-film device |
US20090267803A1 (en) * | 2008-04-25 | 2009-10-29 | Mitutoyo Corporation | Scale for photoelectric encoder |
US20110273166A1 (en) * | 2009-01-27 | 2011-11-10 | Rls Merilna Tehnika D.O.O. | Magnetic encoder scale |
US20120064709A1 (en) * | 2010-09-13 | 2012-03-15 | Jeon Kyung-Yub | Method of forming semiconductor device |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150047212A1 (en) * | 2012-03-08 | 2015-02-19 | Hella Kgaa Hueck & Co. | Level Sensor |
US9316497B2 (en) * | 2012-03-08 | 2016-04-19 | Hella Kgaa Hueck & Co. | Level sensor |
US20150185005A1 (en) * | 2012-07-05 | 2015-07-02 | Hella Kgaa Hueck & Co. | Level sensor |
US9719783B2 (en) * | 2012-07-05 | 2017-08-01 | Hella Kgaa Hueck & Co. | Level sensor |
US20160054151A1 (en) * | 2014-08-19 | 2016-02-25 | Mitutoyo Corporation | Encoder scale and method of manufacturing the same |
US9651402B2 (en) * | 2014-08-19 | 2017-05-16 | Mitutoyo Corporation | Encoder scale and method of manufacturing the same |
US9863790B1 (en) * | 2015-06-08 | 2018-01-09 | X Development Llc | Devices and methods for a rotary encoder |
US20170146365A1 (en) * | 2015-11-23 | 2017-05-25 | Baumer Hübner GmbH | Shaft encoder arrangement |
US10168182B2 (en) * | 2015-11-23 | 2019-01-01 | Baumer Hübner GmbH | Shaft encoder with magnetic shield |
US11609106B2 (en) * | 2018-07-17 | 2023-03-21 | Mitsubishi Electric Corporation | Reflective optical encoder comprising a hub with an adhesive surface with a step structure |
US11162820B2 (en) * | 2019-09-04 | 2021-11-02 | Delta Electronics, Inc. | Optical reflective component and optical encoder using same |
US20230126475A1 (en) * | 2020-03-31 | 2023-04-27 | Dai Nippon Printing Co., Ltd. | Reflection-type optical encoder scale and reflection-type optical encoder |
Also Published As
Publication number | Publication date |
---|---|
CN104094087B (zh) | 2016-07-20 |
US20170176216A1 (en) | 2017-06-22 |
JPWO2013100061A1 (ja) | 2015-05-11 |
JP6319374B2 (ja) | 2018-05-09 |
WO2013100061A1 (ja) | 2013-07-04 |
JP2016183983A (ja) | 2016-10-20 |
US10234308B2 (en) | 2019-03-19 |
CN104094087A (zh) | 2014-10-08 |
JP6086070B2 (ja) | 2017-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10234308B2 (en) | Encoder, manufacturing method of encoder scale, manufacturing method of encoder, and driving apparatus | |
JP5240198B2 (ja) | 光学式エンコーダ用反射板およびその製造方法、ならびに光学式エンコーダ | |
JP5812246B2 (ja) | ロータリエンコーダの製造方法 | |
US7907505B2 (en) | Code disk with a plurality of tracks having different patterns | |
US20190017848A1 (en) | Method of manufacturing rotary scale, rotary scale, rotary encoder, driving apparatus, image pickup apparatus and robot apparatus | |
JP5076676B2 (ja) | 反射型エンコーダ及びモータ | |
JP2010271174A (ja) | エンコーダ | |
JP2013002832A (ja) | エンコーダ用スケールの製造方法、エンコーダの製造方法、エンコーダ及びモータ装置 | |
JP5577975B2 (ja) | 光学式エンコーダ用反射板、エンコーダ及び光学式エンコーダ用反射板の製造方法 | |
JP5343592B2 (ja) | エンコーダ | |
JP2012063201A (ja) | 光学式エンコーダ用反射板、エンコーダ及び光学式エンコーダ用反射板の製造方法 | |
JP5443452B2 (ja) | 光学スケール、および、これを備える光学ユニット | |
JP2010210287A (ja) | エンコーダ | |
JP2005241248A (ja) | 光学式エンコーダに用いられる反射板及びその製造方法 | |
JP4332514B2 (ja) | エンコーダ用コード板、エンコーダ、エンコーダ用コード板のための金型製造方法、エンコーダ用コード板のための金型、及びエンコーダ用コード板の製造方法 | |
US20130221212A1 (en) | Coding Members With Embedded Metal Layers For Encoders | |
JP2011252783A (ja) | 光学式エンコーダ用反射板の製造方法 | |
JP2011123014A (ja) | 光学式エンコーダ用スケール及びその製造方法 | |
JP2013117512A (ja) | 光学式エンコーダに用いられる反射板及びその製造方法 | |
JP6797582B2 (ja) | 反射型エンコーダスケール | |
JP2010025832A (ja) | 回転数計測装置 | |
KR20230043879A (ko) | 옵티컬 포지션 인코더를 제조하기 위한 방법 | |
JP2020134233A (ja) | エンコーダスケール、エンコーダスケールユニットおよびエンコーダスケールの製造方法 | |
JP2010249721A (ja) | エンコーダ | |
JPH10141997A (ja) | オプティカルエンコーダ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: NIKON CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HIKICHI, SHINTARO;SUGIYAMA, HIDEAKI;REEL/FRAME:034823/0765 Effective date: 20140926 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |