US20150003038A1 - Led assembly with omnidirectional light field - Google Patents

Led assembly with omnidirectional light field Download PDF

Info

Publication number
US20150003038A1
US20150003038A1 US14/309,828 US201414309828A US2015003038A1 US 20150003038 A1 US20150003038 A1 US 20150003038A1 US 201414309828 A US201414309828 A US 201414309828A US 2015003038 A1 US2015003038 A1 US 2015003038A1
Authority
US
United States
Prior art keywords
transparent
light emitting
emitting diode
led
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/309,828
Other languages
English (en)
Inventor
Hong-Zhi LIU
Yi-Ting Kuo
Tzu-Chi Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaistar Lighting Xiamen Co Ltd
Epistar Corp
Original Assignee
Huga Optotech Inc
Interlight Optotech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huga Optotech Inc, Interlight Optotech Corp filed Critical Huga Optotech Inc
Assigned to HUGA OPTOTECH INC., INTERLIGHT OPTOTECH CORPORATION reassignment HUGA OPTOTECH INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, TZU-CHI, KUO, YI-TING, LIU, Hong-zhi
Publication of US20150003038A1 publication Critical patent/US20150003038A1/en
Assigned to EPISTAR CORPORATION reassignment EPISTAR CORPORATION MERGER (SEE DOCUMENT FOR DETAILS). Assignors: EPISTAR CORPORATION, FORMOSA EPITAXY INC., HUGA OPTOTECH INC.
Assigned to EPISTAR CORPORATION, KAISTAR LIGHTING (XIAMEN) CO., LTD. reassignment EPISTAR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INTERLIGHT OPTOTECH CORPORATION
Priority to US17/091,938 priority Critical patent/US11543081B2/en
Priority to US18/091,922 priority patent/US20230142465A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/56—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L33/50—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12035—Zener diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

Definitions

  • the present disclosure relates generally to light emitting diode (LED) assemblies, and more specifically, to LED assembly that has an omnidirectional light field.
  • LED light emitting diode
  • LED has been used in different kinds of appliances in our daily life, such as traffic lights, car headlights, street lamps, computer indicators, flashlights, LCD backlight modules, and so on. Beside the semiconductor manufacturing process in the front end, the LED chips used in these appliances should go through LED packaging in the back end.
  • LED packaging mainly provides mechanical, electrical, thermal, and optical supports to LED chips.
  • LED chips which are a kind of semiconductor products, are prone to performance degradation, or aging, if exposed for a long time in an atmosphere full of humidity or chemical.
  • Epoxy resin is commonly used in LED packaging to cover or seal LED chips, such that LED chips are effectively isolated from detrimental atmosphere.
  • LED packaging should take heat dissipation and luminance extraction into consideration, in order to make LED assembly more power-saving and reliable. Heat generated in an LED chip must be dissipated efficiently. Otherwise, heat accumulated in the PN junction of an LED chip will damage or degrade its performance, shortening its lifespan.
  • Optical design is also a key factor when designing of LED packaging. Light emitted from an LED chip must be transmitted in a way that results in certain luminance distribution with certain intensity.
  • the design for packaging a white LED further needs to consider color temperature, color rendering index, phosphor, etc.
  • the white LED could be provided by phosphor converting a portion of blue light from a blue LED chip into green/yellow light such that the mixture of the lights is perceived as white light by human eyes. Because human eyes are vulnerable to high-intensity blue light, the blue light from a blue LED chip in a white LED package should not go outside directly without its intensity being attenuated. In other words, the blue light should be kind of “sealed” or “capsulated” so as to prevent blue light leakage to human eyes.
  • LED package manufactures constantly pursue packaging processes which are reliable, low-cost, and high-yield.
  • the present disclosure provides a light emitting diode assembly.
  • the light emitting diode assembly comprises a transparent substrate, comprising first and second surfaces facing to opposite orientations respectively; light emitting diode chips, mounted on the first surface; a circuit electrically connecting the light emitting diode chips; a transparent capsule with a phosphor dispersed therein, formed on the first surface and substantially enclosing the circuit and the light emitting diode chips; and first and second electrode plates, formed on the first or second surface, and electrically connected to the light emitting diode chips.
  • FIG. 1 illustrates an LED assembly according to embodiments of the disclosure
  • FIG. 2A demonstrates a top view of the LED assembly in FIG. 1 ;
  • FIG. 2B demonstrates a bottom view of the LED assembly in FIG. 1 ;
  • FIG. 3A demonstrates a cross-sectional view of the LED assembly in FIG. 2A along line AA, and FIG. 3B demonstrates that along line BB;
  • FIG. 4 shows a light bulb using several LED assemblies assembled therein as its lighting sources
  • FIG. 5A demonstrates that the LED assembly is fixed on a circuit board by solder joints
  • FIG. 5B demonstrates a clamp with two metal jaws to grasp and hold one LED assembly vertically on a circuit board
  • FIG. 6 illustrates a manufacturing process for producing the LED assembly of FIGS. 3A and 3B ;
  • FIGS. 7A and 7B demonstrate top and bottom views of an LED assembly respectively, according to embodiments of the disclosure.
  • FIGS. 8A and 8B show two cross-sectional views of the LED assembly in FIG. 7A along line AA and line BB;
  • FIGS. 8C and 8D show two cross-sectional views of an LED assembly
  • FIG. 9 exemplifies a manufacturing method to produce an LED assembly
  • FIG. 10 is a drawing of LED assembly in one embodiment of the disclosure.
  • FIGS. 11A and 11B are top and bottom views of an LED assembly respectively
  • FIG. 12A demonstrates a cross-sectional view of the LED assembly along line AA in FIG. 11A ;
  • FIG. 12B demonstrates a cross-sectional view of the LED assembly along line BB in FIG. 11A ;
  • FIG. 12C shows another LED assembly 400 b
  • FIG. 13 is a drawing of an LED assembly in one embodiment of the disclosure.
  • FIGS. 14 and 15 are a top view and a cross-sectional view of an LED assembly, respectively;
  • FIGS. 16 and 17 are a top view and a cross-sectional view of an LED assembly, respectively;
  • FIG. 18 is a cross-sectional view of an LED assembly and FIG. 19 demonstrates a method for manufacturing it;
  • FIG. 20 is a pictorial drawing of an LED assembly
  • FIGS. 21A and 21B are a top view and a cross-sectional view of an LED assembly, respectively;
  • FIG. 22 demonstrates a cross-sectional view of an LED assembly
  • FIG. 23 demonstrates a cross-sectional view of LED assembly
  • FIG. 24 is a drawing of an LED assembly
  • FIG. 25A shows a top view of the LED assembly
  • FIG. 25B shows a top view of the LED assembly
  • FIG. 26A is a pictorial drawing of an LED assembly in one embodiment of the disclosure.
  • FIGS. 26B and 26C are a top view and a cross-sectional view of the LED assembly in FIG. 26A , respectively;
  • FIG. 27A illustrates an LED lamp using LED assembly as its filament
  • FIG. 27B illustrates an LED lamp using LED assembly as its filament.
  • the LED assembly 100 has a transparent substrate 106 , which is for example an electrically non-conductive glass.
  • the transparent substrate 106 has a top surface 102 and a bottom surface 104 facing to opposite orientations respectively.
  • the transparent substrate 106 is substantially in the form of a thin and longitudinal strip with two ends 114 and 116 .
  • the term, transparent only means admitting the passage of light and could also be referred to as translucent or semitransparent.
  • Objects situated behind a transparent material in this specification might be distinctly or indistinctly seen.
  • the transparent substrate 106 is sapphire, ceramic material (ex. Al 2 O 3 or AlN), silicon carbide (SiC), or diamond-like carbon (DLC). It is noted that the transparent substrate 106 can contain a plurality of thermal-conduction particles or other components for reducing process temperature during its manufacturing process.
  • FIG. 2A demonstrates a top view of an LED assembly 100 a , which exemplifies the LED assembly 100 in one embodiment.
  • Mounted on the top surface 102 are several blue LED chips 108 electrically connected to each other through a circuit mainly composed of bonding wires 110 , which provide interconnection to the blue LED chips 108 .
  • Each blue LED chip 108 could have only one single LED cell, whose forward voltage is about 2 to 3 volts, and this kind of LED chip is referred to as a low-voltage LED chip hereinafter.
  • each blue LED chip 108 might include several LED cells connected in series, and is referred to as a high-voltage LED chip hereinafter, because its forward voltage could be as high as 12V, 24V, or 48V, much higher than that of a low-voltage LED chip.
  • each LED cell has a light-emitting layer in a diode formed on a substrate, which could be an epitaxial or non-epitaxial substrate. More specifically, the LED cells in a high-voltage LED chip are electrically connected to each other on a common substrate, not by wire bonding but by some patterned conductive strips produced by semiconductor processes, such as metallization or lithography that processes all the LED cells at the same time.
  • semiconductor processes such as metallization or lithography
  • the blue LED chips 108 are arranged in two rows beside a longitudinal line that links two ends 114 and 116 of the transparent substrate 106 .
  • the bonding wires 110 electrically connect the blue LED chips 108 in series, generating an equivalent LED device with a high forward voltage.
  • the blue LED chips 108 are not limited to connect in series and arrange in two rows though. In some other embodiments, the blue LED chips 108 might be arranged to any kind of patterns and could be electrically connected in series, in parallel, in series-parallel, in bridge or in the combination thereof.
  • the transparent substrate 106 has a conductive via 107 close to the end 114 .
  • the conductive via 107 has a via hole tunneling through the transparent substrate 106 and the via hole is formed with electrically-conductive material filled therein or coated on its sidewall, so as that the conductive via 107 is capable of coupling or connecting an electric component on the top surface 102 to another on the bottom surface 104 .
  • Nearby the end 114 has a conductive electrode plate 118 on the top surface 102 .
  • the conductive electrode plate 118 locates between the end 114 and the conductive via 107 .
  • the conductive electrode plate 118 does not directly contact with conductive via 107 .
  • One of the blue LED chips 108 is close to the end 114 and has a bonding wire 110 thereon to electrically connect to the electrode plate 118 .
  • Another blue LED chip 108 b which is close to the end 114 , is electrically connected to the conductive via 107 by another bonding wire 110 .
  • the transparent body 112 is epoxy resin or silicone, for example. Dispersed in the transparent body 112 is at least one kind of phosphor that is capable of converting portion of the blue light from blue LED chips 108 (having a peak wavelength about 430 nm to 480 nm) into yellow light (having a peak wavelength from about 570 nm to 590 nm) or yellowish green light (having a peak wavelength about 540 nm to 570 nm), such that human eyes perceive white light from the mixture.
  • the transparent body 112 comprises two kinds of phosphors dispersed therein.
  • One of the phosphors is capable of converting portion of the blue light from blue LED chips 108 into yellow light or yellowish green light or green (having a peak wavelength from about 520 nm to 590 nm) and the other of the phosphors is capable of converting portion of the blue light from blue LED chips 108 into red light (having a peak wavelength from about 610 nm to 680 nm).
  • FIG. 1 is illustrative to show blue LED chips 108 and bonding wires 110 clearly visible under transparent body 112 .
  • the term, transparent only means admitting the passage of light and could also be referred to as translucent or semitransparent. Therefore, the transparent body 112 can be translucent or semitransparent such that the LED chips 108 and the bonding wires 110 could be distinctly or indistinctly seen behind the transparent body 112 . In another embodiment, the LED chips 108 and the bonding wires 110 could be invisible because of the phosphor dispersed inside the transparent body 112 and the transparent body 112 appears the color of the phosphor dispersed therein.
  • FIG. 2B demonstrates a bottom view of the LED assembly 100 a .
  • no blue LED chips are mounted on the bottom surface 104 .
  • another electrode plate 120 Formed on the bottom surface 104 nearby the end 114 is another electrode plate 120 , which electrically connects to the conductive via 107 .
  • the electrode plate 120 geometrically overlaps and physically contacts with the conductive via 107 .
  • the conductive via 107 and the electrode plate 120 do not overlap, and a conductive device, such as a bonding wire or a metal strip, is located therebetween to electrically connect them to each other.
  • FIG. 2B also shows an optional electrode plate 122 formed on the bottom surface 104 nearby the end 116 .
  • This kind of design could have the electrode plates 122 and 120 coplanar, and therefore the LED assembly 100 a , during handling or transportation, could be steadier to avoid flipping or falling.
  • the electrode plate 122 electrically floats in this embodiment. In other words, the electrode plate 122 does not electrically couple or connect to any electric devices or elements in the LED assembly 100 a .
  • the electrode plate 122 helps stabilize the LED assembly 100 a.
  • the embodiment shown in FIGS. 2A and 2B has the electrode plates 120 and 118 located completely within the top surface 102 or the bottom surface 104 as the electrode plates 120 and 118 do not extend across the edges of the top surface 102 and the bottom surface 104 .
  • the electrode plates 120 and 118 are not required to be rectangular or to have the same size.
  • one of the electrode plates 120 and 118 could be about rectangular, indicating a cathode of the LED assembly 100 a
  • the other is about spherical, indicating an anode of the LED assembly 100 a.
  • the blue LED chips 108 and the conductive via 107 are connected in series between the electrode plates 120 and 118 , which are two power input nodes for powering the LED assembly 100 a .
  • a conventional power supply (not shown) would have two power output terminals respectively contacting the electrode plates 120 and 118 to drive and illuminate the blue LED chips 108 .
  • FIG. 3A demonstrates a cross-sectional view of the LED assembly 100 a in FIG. 2A along line AA
  • FIG. 3B demonstrates that along line BB.
  • FIG. 3A Shown in FIG. 3A , a bonding wire 110 connects the blue LED chip 108 b to the conductive via 107 , which in turn connects to the electrode plate 120 on the bottom surface 104 .
  • FIG. 3B another bonding wire 110 connects the blue LED chip 108 a to the electrode plate 118 .
  • FIG. 4 shows a light bulb using several LED assemblies 100 as its lighting sources.
  • the light bulb in FIG. 4 includes a lamp shell 180 , the LED assemblies 100 , a circuit board 192 , a heat dissipation apparatus 182 and an electrical connection structure 183 .
  • each LED assembly 100 fixes on the circuit board 192 , which firmly mounts on the heat dissipation apparatus 182 such that the heat generated by the LED assembly 100 could be dissipated efficiently.
  • the heat dissipation apparatus 182 stays firmly on the electrical connection structure 183 , which is for example an Edison screw base capable of screwing into a matching socket.
  • electrically-conductive blocks such as solder joints 190 , can electrically connect the electrode plates 120 and 118 to two different terminals on the circuit board 192 , respectively, as shown in FIG. 5A .
  • the solder joints 190 also provide mechanical support to the end 114 , to hold the LED assembly 100 up straight on the circuit board 192 , so the LED assembly 100 , if illuminating, could generate an omnidirectional light field to its surrounding.
  • one LED assembly 100 stands, but is not limited to stand, almost vertically, only by way of the mechanical support provided by the solder joints 190 , which also transmit any necessary electric power from the circuit board 192 to the LED assembly 100 .
  • FIG. 5B demonstrates a clamp with two metal jaws 194 to grasp and hold one LED assembly 100 vertically on the circuit board 192 .
  • the metal jaws 194 provide both electrical connection and mechanical support to one LED assembly 100 , simplifying the manufacture processes required to secure the LED assembly 100 on the circuit board 192 .
  • an LED assembly 100 stands on the circuit board 192 with a sloping position.
  • a vertically-conducting device 130 placed on the top surface 102 above the conductive via 107 .
  • the vertically-conductive device 130 conducts current vertically, and is by way of examples a PN junction diode (such as a vertical-type light-emitting diode, a schottky diode or a zener diode), a resistor, or simply a metal ingot, adhering on the conductive via 107 via a conductive silver paste.
  • the vertically-conducting device 130 and the conductive silver paste demonstrated in FIG. 3A could be omitted and a bonding wire 110 bonding on both the conductive via 107 and the blue LED chip 108 b provides necessary electric connection.
  • each blue LED chip 108 has a transparent adhesive layer 132 thereunder, each adhering only one corresponding blue LED chip 108 on the top surface 102 of the transparent substrate 106 .
  • there are several transparent adhesive layers 132 on the top surface 102 and at least one of the adhesive layers carries several blue LED chips 108 .
  • the design of both the area size of one transparent adhesive layer 132 and the number of the blue LED chips 132 carried on by one transparent adhesive layer 132 depends on actual applications and might vary.
  • some particles with excellent thermal conductivity such as alumina powder, diamond-like carbon, or silicon carbide, whose thermal conductivity is more than 20 W/mK, are dispersed in one transparent adhesive layer 132 . These particles help not only dissipate heat, but also scatter the light from the blue LED chips 108 .
  • the transparent adhesive layers 132 could be epoxy resin or silicone, and mix with phosphor similar with or different from that of the transparent body 112 .
  • the phosphor is, for example, yttrium aluminum garnet (YAG) or terbium aluminum garnet (TAG).
  • YAG yttrium aluminum garnet
  • TAG terbium aluminum garnet
  • the transparent body 112 with phosphor covers above and surrounds each blue LED chip 108 while the transparent adhesive layers 132 locates under each blue LED chips 108 .
  • the transparent body 112 and the transparent adhesive layers 132 sandwich blue LED chips 108 .
  • the transparent body 112 and the transparent adhesive layers 132 together as a whole become a kind of transparent capsule that encloses all blue LED chips 108 , but leaves a portion of electrode plate 118 exposed for external electric connection.
  • the blue or UV light from any blue LED chip 108 inevitably experiences conversion, so that human eyes could avoid damage or stress caused by over high intensity of the blue or UV light.
  • a transparent substrate 106 is provided with a conductive via 107 formed in advance.
  • a laser beam could be used to melt a small area of the transparent substrate 106 so as to form a via hole on the transparent substrate 106 .
  • An electrically-conductive material could fill in the via hole or be coated on the via hole to form the conductive via 107 .
  • the transparent substrate 106 is pre-cut, forming some trenches or grooves thereon, which geometrically partition LED assemblies 100 that are formed and separated in the end.
  • electrode plates 118 and 120 are attached respectively on top and bottom surfaces ( 102 , 104 ) of the transparent substrate 106 , both nearby the end 114 . Incase that an electrode plate 112 is expected, it is formed nearby the end 116 in step 152 .
  • electrode plates would be formed by screen printing and/or lift-off process, to generate specific conductive patterns on the top and bottom surfaces ( 102 , 104 ) of the transparent substrate 106 .
  • one or more transparent adhesive layers 132 with phosphor is formed on the top surface 102 by gluing, printing, spraying, dispensing, or coating, for example.
  • blue LED chips 108 are mounted on the transparent adhesive layers 132 .
  • a vacuum nuzzle for example, picks up blue LED chips 108 one by one and then put them to adhere onto specific locations of the transparent adhesive layers 132 .
  • each blue LED chip 108 is completely surrounded by the periphery of one transparent adhesive layer 132 , so as to form a phosphor capsule in the end to totally seal a blue LED chip 108 therein.
  • the transparent adhesive layer 132 has a flat area larger than the total area of all blue LED chips 108 , so as to completely cover the backsides of all blue LED chips 108 .
  • a silver paste can be used to attach a vertically-conductive device 130 on the top surface 102 and adhere it to the conductive via 107 .
  • Bonding wires 110 are formed in step 156 , to provide an electric connection between every two blue LED chips 108 , between the blue LED chip 108 a and the electrode plate 118 , and between the blue LED chip 108 b and the vertically-conductive device 130 .
  • a transparent body 112 with phosphor is formed on the top surface 102 , to encapsulate the bonding wires 110 and the blue LED chips 108 , by way of dispensing or screen printing.
  • Step 158 a singulation process is performed, where the transparent substrate 106 is cut to form a plurality of individual LED assemblies 100 , by way of saw cutting along the previously-formed trenches or grooves for example.
  • step 152 the electrode plates 120 or 122 are formed on the bottom surface 104 .
  • step 154 - 157 all the transparent adhesive layer 132 , the LED chips 108 , the bonding wires 110 and the transparent body 112 are formed on the top surface 102 . Therefore, only large patterns like the electrode plates 120 and 122 are formed on the bottom surface 104 , which are immune from casual tiny scratches.
  • holders, carriers, or robot arms for transporting or holding the transparent substrate 106 could physically contact the bottom surface 104 to avoid any damage to the fine patterned structures on the top surface 102 , such that yield improvement is foreseeable.
  • Embodiments exemplified in FIGS. 3A , 3 B, and 6 do not restrain the direction where the light from a blue LED chip 108 goes.
  • the light from a blue LED chip 108 could go downward through the transparent adhesive layer 132 and the transparent substrate 106 to provide light that appears white.
  • the light from a blue LED chip 108 could go upward or vertically through the transparent body 112 to provide white light as well. Therefore, the LED assembly 100 a is a lighting device that has an omnidirectional white light field.
  • the lamp in FIG. 4 uses the LED assemblies 100 as its light resources, it could be an omnidirectional white lighting apparatus, which is possible to replace a traditional incandescent lamp.
  • FIGS. 7A and 7B demonstrate top and bottom views of an LED assembly 100 b respectively, according to one embodiment of the disclosure. Two cross-sectional views of the LED assembly 100 b are shown in FIGS. 8A and 8B , and a manufacturing method to produce the LED assembly 100 b is exemplified in FIG. 9 .
  • FIGS. 7A , 7 B, 8 A, 8 B and 9 correspond to FIGS. 2A , 2 B, 3 A, 3 B, and 6 , where devices, elements or steps with similar or the same symbols represent those with the same or similar functions and could be omitted in the following explanation for brevity.
  • FIG. 7A additionally includes a submount 160 positioning inside the periphery of a transparent adhesive layer 132 (from the perspective of a top view) and sandwiched between the transparent adhesive layer 132 and the blue LED chips 108 .
  • Submount 160 could be glass, sapphire, SiC, or diamond-like carbon.
  • all or a portion of blue LED chips in FIGS. 8A and 8B are mounted on the submount 160 , which is adhered onto the transparent substrate 106 through the transparent adhesive layer 132 .
  • FIG. 9 uses steps 154 a and 155 a to replace steps 154 and 155 in FIG. 6 .
  • the submount 160 is fixed on the transparent substrate 106 using the transparent adhesive layer 132 with phosphor.
  • the transparent adhesive layer 132 first adheres to the backside of the submount 160 , followed by attaching the submount 160 on the transparent substrate 106 .
  • the transparent adhesive layer 132 first adheres to the top surface 102 of the transparent substrate 106 and the submount 160 is then attached over the transparent adhesive layer 132 .
  • the blue LED chips 108 are mounted on the submount 160 .
  • the blue LED chips 108 in FIGS. 7A , 7 B, 8 A, 8 B, and 9 could be mounted on the submount 160 using the material the same or similar with that of the transparent adhesive layer 132 , but the disclosure is not limited to. Eutectic alloy or transparent glue without phosphor could be used to attach the blue LED chips 108 onto the submount 160 .
  • the top surface of the submount 160 has patterned conductive strips, over which the blue LED chips 108 are mounted by way of flip chip technique. As known in the art, flip chip technique, which has semiconductor chips facing downward on interconnection metal strips for example, needs no bonding wires shown in step 156 in FIG. 9 might be skipped.
  • the bonding wires 100 or the silver paste might be used in some embodiments for electrically connecting the blue LED chip 108 b to the conductive via 107 , or the blue LED chip 108 a to the electrode plate 118 .
  • an anisotropic conductive polymer (ACP) or an anisotropic conductive film (ACF) is used to mount the blue LED chips 108 on the submount 160 .
  • the LED assembly 100 b in FIGS. 7A , 7 B, 8 A, 813 , and 9 could enjoy the same advantages as the LED assembly 100 a in FIGS. 2A , 2 B, 3 A, 313 , and 6 does.
  • the solder joints 190 alone can fix the end 114 of the LED assembly 100 b onto a printed circuit board and also deliver electric power from the printed circuit board to the LED assembly 100 b .
  • the bottom surface 104 of the LED assembly 100 b has only large patterns and could be immune from scratch damage, resulting in considerable yield improvement.
  • the blue LED chips 108 in the LED assembly 100 b are enclosed by a transparent material with phosphor, so as to prevent blue light leakage.
  • An omnidirectional lighting apparatus using the LED assembly 100 b as its lighting sources could replace a conventional incandescent lamp.
  • FIGS. 8C and 8D are two cross-sectional views of a LED assembly 100 c , alternatives to FIGS. 8A and 8B respectively.
  • the LED assembly 100 c in FIGS. 8C and 8D uses two transparent adhesive layers 132 and 133 for mounting the submount 160 on the transparent substrate 106 , and at least one of the transparent adhesive layers 132 and 133 has phosphor.
  • the transparent adhesive layer 132 has phosphor, and the transparent adhesive layer 133 does not.
  • the transparent adhesive layer 133 could be epoxy resin or silicone.
  • the transparent adhesive layer 133 has no phosphor, it could provide better adhesion to stick on the transparent substrate 106 .
  • the transparent adhesive layers 132 and 133 might have the same or different major substance.
  • another transparent adhesive layer 133 could be formed between the submount 160 and the transparent adhesive layer 132 to improve the adhesion therebetween.
  • FIG. 10 is a drawing of a LED assembly 400 in one embodiment of the disclosure, where blue LED chips 108 are mounted on the top surface 102 using a flip chip technique.
  • FIGS. 11A and 11B are top and bottom views of the LED assembly 400 a respectively
  • FIG. 12A demonstrates a cross-sectional view of the LED assembly 400 a along line AA in FIG. 11A
  • FIG. 12B demonstrates a cross-sectional view of the LED assembly 400 a along line BB in FIG. 11A
  • FIGS. 10 , 11 A, 11 B, 12 A, and 12 B correspond to FIGS. 1 , 2 A, 2 B, 3 A, and 3 B, respectively, where devices or elements with similar or the same symbols refer to those with the same or similar functions and could be omitted in the following explanation for brevity.
  • FIGS. 12A and 12B have electrically-conductive strips 402 printed on the top surface 102 of the transparent substrate 106 and these strips 402 connects blue LED chips 108 to each other.
  • the LED assembly 400 b could be used as a light source for an omnidirectional lighting apparatus.
  • FIG. 12C shows another LED assembly 400 b , which has an additional phosphor layer 131 coated or attached on the bottom surface 104 of the transparent substrate 106 .
  • Phosphor layer 131 can convert the blue light from blue LED chips 108 into light with a different color, so as to reduce the possibility of blue light leakage from the bottom surface 104 .
  • all blue LED chips 108 in the LED assembly 400 a are replaced by white LED chips, each substantially being a blue LED chip coated with a phosphor layer, and accordingly blue light leakage problem might be avoided.
  • each of the LED assemblies 100 a , 100 b , 100 c , and 400 a has a conductive via 107 , which is a part of a circuit and makes it possible that the electrode plates 120 and 118 over the top and bottom surfaces ( 102 and 104 ) act as two power input terminals for driving, but this disclosure is not limited to.
  • FIG. 13 is a drawing of a LED assembly 200 in one embodiment of the disclosure.
  • FIGS. 14 and 15 are a top view and a cross-sectional view of the LED assembly 200 a , respectively.
  • the LED assembly 200 a in FIGS. 14 and 15 has an electrode plate 119 at the end 116 .
  • the electrode plates 118 and 119 extend across the ends 114 and 116 , respectively.
  • the LED assembly 200 a has no conductive via 107 .
  • the way to produce the LED assemblies 200 or 200 a in FIGS. 13 , 14 and 15 can be derived from the aforementioned teaching and therefore is omitted herein for brevity.
  • the blue LED chips 108 are one-on-one mounted on the transparent adhesive layers 132 , but this disclosure is not limited to. In some other embodiments, some blue LED chips 108 could share one of several transparent adhesive layers 132 to mount on the transparent substrate 106 . Alternatively, all blue LED chips 108 might have only one single transparent adhesive layers 132 to mount on the transparent substrate 106 in another embodiment.
  • FIGS. 16 and 17 are a top view and a cross-sectional view of the LED assembly 200 b , respectively.
  • FIGS. 16 and 17 have nevertheless a submount 160 , which carries the blue LED chips 108 mounted thereabove and fix on to the transparent substrate 106 via the transparent adhesive layer 132 .
  • Detail of the LED assembly 200 b is omitted herein and could be derived from the teaching in reference to the LED assembly 100 b in FIGS. 8A and 8B .
  • FIG. 18 is a cross-sectional view of a LED assembly 200 c and FIG. 19 demonstrates a method for manufacturing it.
  • the top view of the LED assembly 200 c could be similar with FIG. 16
  • FIGS. 18 and 19 are similar to FIGS. 17 and 9 , respectively.
  • FIG. 18 has the transparent adhesive layer 132 to provide adhesion between the transparent substrate 106 and each of the electrode plates 118 and 119 .
  • step 151 the transparent adhesive layer 132 forming on the transparent substrate 106 is inserted between steps 150 and 152 .
  • the transparent adhesive layer 132 could be prior to attaching the electrode plates 118 and 119 on to the transparent substrate 106 .
  • the transparent adhesive layer 132 is epoxy resin or silicone, for example, in which phosphor is dispersed.
  • the phosphor in the transparent adhesive layer 132 could be the same with or similar to that in the transparent body 112 .
  • the phosphor is YAG or TAG.
  • One single transparent adhesive layer 132 is used to mount the submount 160 on the transparent substrate 106 in the LED assemblies 200 b and 200 c of FIGS. 17 and 18 , but this disclosure is not limited to. Alteration could be introduced to the LED assemblies 200 b and 200 c , to have both the transparent adhesive layers 132 and 133 (of FIGS. 8C and 8D ) between the submount 160 and the transparent substrate 106 . In another embodiment, the transparent adhesive layer 133 without phosphor could be positioned between the submount 160 and transparent adhesive layer 132 to enhance adhesion therebetween.
  • the LED assembly 200 a , 200 b , or 200 c has no patterns on the bottom surface 104 , which accordingly does not care any scratches thereon.
  • the LED assemblies 200 a , 200 b , and 200 c all are suitable for omnidirectional lighting applications and possibly free from blue light leakage.
  • a bulb according to an embodiment of the disclosure can use solder joints or electrically-conductive clamps to fix and power the electrode plates 118 and 119 respectively nearby two ends 114 and 116 .
  • FIG. 20 is a drawing of an LED assembly 300
  • FIGS. 21A and 21B are a top view and a cross-sectional view of the LED assembly 300 a , respectively.
  • FIG. 22 demonstrates a cross-sectional view of the LED assembly 300 a .
  • Formed on the bottom surface 104 of the transparent substrate 106 of the LED assembly 300 a are two electrode plates 120 and 122 , at two ends 114 and 116 respectively.
  • the LED assembly 300 a has two conductive vias 107 A and 107 B, respectively formed somewhere close to two ends 114 and 116 .
  • the electrode plate 120 uses conductive via 107 A for electrically connecting to one blue LED chip 108 on the top surface 102 , while the electrode plate 122 uses the conductive via 107 B for electrically connecting to another blue LED chip 108 .
  • the blue LED chips 108 are electrically connected in series between the conductive vias 107 A and 107 B, or, in other words, between the electrode plates 120 and 122 . Details of the LED assembly 300 a and possible alternatives or variations thereto could be derived in reference to other embodiments disclosed in this specification and are omitted herein.
  • FIG. 23 demonstrates a cross-sectional view of an LED assembly 300 b , where the submount 160 is placed under the blue LED chips and above the transparent adhesive layer 132 . Details of the LED assembly 300 b and possible alternatives or variations thereto could be derived in reference to other embodiments disclosed in this specification and are omitted herein.
  • FIG. 24 is a drawing of a LED assembly 600 .
  • FIG. 25A shows the LED assembly 600 a , which could be a top view of the LED assembly 600 and has the electrode plates 118 and 119 , each having an edge aligned with an edge of the transparent substrate 106 .
  • FIG. 25B shows an LED assembly 600 b , which could be another top view of the LED assembly 600 and has the electrode plates 118 and 119 completely inside the edges of the transparent substrate 106 .
  • FIG. 26A is a drawing of an LED assembly 700 in one embodiment of the disclosure.
  • FIG. 26B is a top view of the LED assembly 700 .
  • FIG. 26C is a cross-sectional view of the LED assembly 700 along line CC in FIG. 26B .
  • the LED assembly 700 in FIGS. 26A and 26B has both electrode plates 118 and 123 on the top surface 102 at the end 114 , and has nothing on the bottom surface 104 of the transparent substrate 106 . Extending from the electrode plates 118 and 123 toward the end 116 are conductive strips 198 and 196 . Blue LED chips 108 are mounted on the top surface 102 and between the conductive strips 198 and 196 .
  • each blue LED chip 108 are electrically connected to the conductive strips 198 and 196 with bonding wires 110 . Accordingly, the blue LED chips 108 in FIGS. 26A , 26 B and 26 C are connected in parallel between the electrode plates 118 and 123 , which therefore acts as two power input nodes for the LED assembly 700 .
  • the blue LED chips 108 can be electrically connected to the conductive strips 198 and 196 by way of flip chip technique, that is, the blue LED chips 108 are electrically connected to the conductive strips 198 and 196 without using the bonding wires 110 . As shown in FIG.
  • the blue LED chips 108 are substantially encapsulated by the transparent adhesive layer 132 and the transparent body 112 , both having at least one kind of phosphor dispersed therein.
  • the blue LED chips 108 are totally enclosed by the transparent adhesive layer 132 and the transparent body 112 , however, the bonding wires 110 could be still exposed from the transparent adhesive layer 132 and the transparent body 112 .
  • the transparent body 112 comprises two kinds of phosphors dispersed therein.
  • One of the phosphors is capable of converting portion of the blue light (having a peak wavelength about 430 nm to 480 nm) from blue LED chips 108 into yellow light or yellowish green light or green light (having a peak wavelength from about 520 nm to 590 nm) and the other of the phosphors is capable of converting portion of the blue light from blue LED chips 108 into red light (having a peak wavelength from about 610 nm to 680 nm).
  • the phosphor emitting yellow light or yellowish green light or green light comprises aluminum oxide (such as YAG or TAG), silicate, vanadate, alkaline-earth metal selenide, or metal nitride.
  • the phosphor emitting red light comprises silicate, vanadate, alkaline-earth metal sulfide, metal nitride oxide, a mixture of tungstate and molybdate.
  • the method to produce the LED assembly 700 in FIG. 26A , 26 B, or 26 C can be derived from the aforementioned teaching and therefore is omitted herein for brevity.
  • the blue LED chips 108 could be mounted on a submount, which adheres to the transparent substrate 106 via at least one transparent adhesive layer with or without a phosphor dispersed therein.
  • FIG. 27A illustrates an LED lamp 500 a using only one LED assembly 300 as its filament.
  • the LED lamp 500 a has two clamps 502 , and each clamp 502 is in a shape of V or Y. In another embodiment, each clamp 502 could be substantially rectangular in shape, but has a notch in one of its edges for fixing the LED assembly 300 thereon. Two jaws of each clamps 502 vise one electrode plate at one end of the LED assembly 300 , making the top surface 102 of the transparent substrate 106 in the LED assembly 300 face upward (the direction Z shown in FIG. 27A ).
  • clamps 502 are made of electrically-conductive material, so as to electrically connect the electrode plates in the LED assembly 300 to the Edison screw base of the LED assembly 500 a , which could drain electric power from an Edison socket to power the LED assembly 300 .
  • FIG. 27B is similar with FIG. 27A , but the LED lamp 500 b in FIG. 27B uses one LED assembly 600 as its filament. Different from the LED lamp 500 a which has the LED assembly 300 facing upward, the LED assembly 600 in the LED lamp 500 b has its top surface 102 facing the direction Y, which is vertical to the axis (Z axis) of the LED lamp 500 b . Any of the assemblies 300 and 600 in FIGS. 27A and 27B could be replaced by the LED assembly 200 , details or alternatives of which could be derived in reference to the teaching disclosed in this specification and are omitted herein.
  • the bottom surface 104 of the LED assembly 300 a or 300 b has only the electrode plates 120 and 122 occupied in a large area, which is immune to casual scratches, such that yield improvement is expectable.
  • Each of the LED assemblies 600 a and 600 b has no pattern on its bottom surface 104 , and therefore scratches on the bottom surface 104 could not impact the yield of LED assemblies 600 a and 600 b .
  • Each of the LED assemblies 300 a , 300 b , 600 a , and 600 b could be suitable for applications to generate an omnidirectional light field, and could prevent any blue light leakage.
  • the aforementioned embodiments all employ only blue LED chips as their lighting resource, but this disclosure is not limited to. In some embodiments, some or all blue LED chips are replaced with red or green LED chips, for example.
  • the LED assemblies in some embodiments could have an omnidirectional light field and be suitable for applications to generate an omnidirectional light field.
  • the blue LED chips 108 in some embodiments are substantially encapsulated by the transparent adhesive layer 132 and transparent body 112 with phosphor, to avoid blue light leakage.
  • One embodiment of the disclosure has a LED assembly with only one end fixed on a circuit board to provide both electric power and mechanic support. Nevertheless, a LED assembly of another embodiment has two ends, both fixed for mechanic support and coupled for receiving electric power from a power source.
  • An LED assembly according to some embodiments has no fine patterns on its bottom surface, immune to scratch damage and convenient for the LED assembly transportation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
US14/309,828 2013-06-27 2014-06-19 Led assembly with omnidirectional light field Abandoned US20150003038A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/091,938 US11543081B2 (en) 2013-06-27 2020-11-06 LED assembly with omnidirectional light field
US18/091,922 US20230142465A1 (en) 2013-06-27 2022-12-30 Led assembly with omnidirectional light field

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW102122873 2013-06-27
TW102122873 2013-06-27
TW103111887A TWI651871B (zh) 2013-06-27 2014-03-27 發光組件及製作方法
TW103111887 2014-03-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/091,938 Continuation US11543081B2 (en) 2013-06-27 2020-11-06 LED assembly with omnidirectional light field

Publications (1)

Publication Number Publication Date
US20150003038A1 true US20150003038A1 (en) 2015-01-01

Family

ID=52115413

Family Applications (3)

Application Number Title Priority Date Filing Date
US14/309,828 Abandoned US20150003038A1 (en) 2013-06-27 2014-06-19 Led assembly with omnidirectional light field
US17/091,938 Active 2034-07-22 US11543081B2 (en) 2013-06-27 2020-11-06 LED assembly with omnidirectional light field
US18/091,922 Abandoned US20230142465A1 (en) 2013-06-27 2022-12-30 Led assembly with omnidirectional light field

Family Applications After (2)

Application Number Title Priority Date Filing Date
US17/091,938 Active 2034-07-22 US11543081B2 (en) 2013-06-27 2020-11-06 LED assembly with omnidirectional light field
US18/091,922 Abandoned US20230142465A1 (en) 2013-06-27 2022-12-30 Led assembly with omnidirectional light field

Country Status (4)

Country Link
US (3) US20150003038A1 (enrdf_load_stackoverflow)
JP (1) JP2015012292A (enrdf_load_stackoverflow)
CN (2) CN104253200B (enrdf_load_stackoverflow)
TW (1) TWI651871B (enrdf_load_stackoverflow)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150325762A1 (en) * 2014-05-06 2015-11-12 Genesis Photonics Inc. Package structure and manufacturing method thereof
CN106151905A (zh) * 2016-08-15 2016-11-23 浙江阳光美加照明有限公司 一种led发光灯丝及使用该led发光灯丝的led球泡灯
DE102015112536A1 (de) * 2015-07-30 2017-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Steckmodul und Beleuchtungsanordnung für den Innenraum einer Fahrzeugkabine
WO2017085063A1 (de) * 2015-11-19 2017-05-26 Osram Opto Semiconductors Gmbh Led-filamente, verfahren zur herstellung von led-filamenten und retrofitlampe mit led-filament
US20170285242A1 (en) * 2016-03-30 2017-10-05 Panasonic Liquid Crystal Display Co., Ltd. Liquid crystal display device
CN110121772A (zh) * 2017-05-31 2019-08-13 首尔半导体株式会社 发光二极管封装件组件以及包括其的发光二极管灯泡
TWI712188B (zh) * 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法
WO2021089493A1 (en) * 2019-11-07 2021-05-14 Signify Holding B.V. Light-emitting diode filament comprising three types of leds
US20220078892A1 (en) * 2014-09-28 2022-03-10 Zhejiang Super Lighting Electric Appliance Co.,Ltd Led filament and led light bulb
US20220196214A1 (en) * 2019-05-02 2022-06-23 Signify Holding B.V. Led filament lamp
US11482510B2 (en) * 2017-06-26 2022-10-25 Koninklijke Philips N.V. Apparatus and a method of manufacturing an apparatus
US11629825B2 (en) 2014-09-28 2023-04-18 Zhejiang Super Lighting Electric Appliance Co., Lt LED light bulb with curved filament
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11690148B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11892127B2 (en) 2014-09-28 2024-02-06 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED bulb lamp
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US12060455B2 (en) 2018-04-17 2024-08-13 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US12313227B2 (en) 2014-09-28 2025-05-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US12359779B1 (en) * 2015-09-25 2025-07-15 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106369367A (zh) * 2015-07-23 2017-02-01 晶元光电股份有限公司 发光装置
JP6551009B2 (ja) * 2015-07-27 2019-07-31 ウシオ電機株式会社 光源装置
TW201721053A (zh) * 2015-12-02 2017-06-16 羅冠傑 燈殼整合型發光二極體及其製作方法
CN106449618A (zh) * 2016-01-29 2017-02-22 罗冠杰 灯壳整合型发光二极管装置及其制作方法
KR101995000B1 (ko) * 2016-05-16 2019-07-01 엘지이노텍 주식회사 발광소자 패키지 및 조명장치
JP7508782B2 (ja) * 2020-01-20 2024-07-02 株式会社リコー 電子デバイス及びその製造方法、画像形成方法、並びに画像形成装置

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5924784A (en) * 1995-08-21 1999-07-20 Chliwnyj; Alex Microprocessor based simulated electronic flame
US20050040511A1 (en) * 1998-03-31 2005-02-24 Kinsman Larry D. Back-to-back semiconductor device assemblies
US20060261364A1 (en) * 2003-03-10 2006-11-23 Yoshinobu Suehiro Solid element device and method for manufacturing thereof
US20070139949A1 (en) * 2005-12-16 2007-06-21 Nichia Corporation Light emitting device
JP2008251664A (ja) * 2007-03-29 2008-10-16 Toshiba Lighting & Technology Corp 照明装置
US20090258515A1 (en) * 2008-04-15 2009-10-15 Fujitsu Limited Connector
US20110147776A1 (en) * 2009-12-22 2011-06-23 Kabushiki Kaisha Toshiba Light emitting device
US20110163681A1 (en) * 2011-02-22 2011-07-07 Quarkstar, Llc Solid State Lamp Using Modular Light Emitting Elements
US20120069543A1 (en) * 2010-09-21 2012-03-22 Catcher Technology Co., Ltd. Led illuminator module with high heat-dissipating efficiency and manufacturing method therefor
US8143634B2 (en) * 2007-09-17 2012-03-27 Samsung Led Co., Ltd. Light emitting diode package with a phosphor substrate
US20130147348A1 (en) * 2010-10-22 2013-06-13 Panasonic Corporation Mounting board, light emitting device and lamp
US20130214247A1 (en) * 2012-02-22 2013-08-22 Jianhua Hu Ac led device and its manufacturing process for general lighting applications

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000347601A (ja) * 1999-06-02 2000-12-15 Toshiba Electronic Engineering Corp 発光装置
JP3400958B2 (ja) 1999-07-07 2003-04-28 株式会社シチズン電子 多色発光ダイオード
JP4709405B2 (ja) 2001-03-15 2011-06-22 シチズン電子株式会社 発光ダイオード
JP3716252B2 (ja) * 2002-12-26 2005-11-16 ローム株式会社 発光装置及び照明装置
JP4905009B2 (ja) 2006-09-12 2012-03-28 豊田合成株式会社 発光装置の製造方法
JP4986735B2 (ja) * 2007-06-25 2012-07-25 京セラ株式会社 照明用光源
CN101562139B (zh) * 2008-04-15 2011-09-28 宏齐科技股份有限公司 避免降低发光效率的发光芯片封装结构及其制作方法
JP2009267289A (ja) 2008-04-30 2009-11-12 Citizen Electronics Co Ltd 発光装置
JP5067631B2 (ja) * 2008-09-22 2012-11-07 東芝ライテック株式会社 照明装置
CN101800270A (zh) * 2009-02-11 2010-08-11 亿光电子工业股份有限公司 发光二极管装置及其封装方法
JP2011071242A (ja) * 2009-09-24 2011-04-07 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP5340879B2 (ja) * 2009-10-13 2013-11-13 スタンレー電気株式会社 発光装置
JP5528900B2 (ja) * 2010-04-30 2014-06-25 ローム株式会社 発光素子モジュール
CN202281057U (zh) * 2011-05-11 2012-06-20 浙江锐迪生光电有限公司 一种LED芯片4π出光的高效率LED发光管
ES2531050T5 (es) * 2010-09-08 2021-05-04 Zhejiang Ledison Optoelectronics Co Ltd Bombilla LED y barra de iluminación LED capaz de emitir luz por encima de 4 PI
JP2012099726A (ja) 2010-11-04 2012-05-24 Stanley Electric Co Ltd Ｌｅｄモジュール及びｌｅｄランプ
CN103052839A (zh) * 2010-11-04 2013-04-17 松下电器产业株式会社 灯泡型灯及照明装置
JP5073107B2 (ja) * 2010-12-24 2012-11-14 パナソニック株式会社 電球形ランプ及び照明装置
JP2012146738A (ja) * 2011-01-07 2012-08-02 Stanley Electric Co Ltd Ｌｅｄモジュール及びｌｅｄランプ
WO2012095931A1 (ja) * 2011-01-14 2012-07-19 パナソニック株式会社 ランプ及び照明装置
KR101843501B1 (ko) * 2011-03-30 2018-03-29 서울반도체 주식회사 발광장치
CN102842667B (zh) * 2011-06-24 2015-02-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
CN102956625A (zh) * 2011-08-18 2013-03-06 鸿富锦精密工业（深圳）有限公司 发光装置
JPWO2013073181A1 (ja) 2011-11-15 2015-04-02 パナソニックＩｐマネジメント株式会社 発光モジュールおよびこれを用いたランプ
CN102496674A (zh) * 2011-12-23 2012-06-13 惠州市华阳多媒体电子有限公司 一种新型达成白光的led封装结构及封装方法
JP5895166B2 (ja) 2012-02-13 2016-03-30 パナソニックＩｐマネジメント株式会社 発光モジュール、ランプ及び照明装置
TWI499031B (zh) * 2012-03-22 2015-09-01 Kun Hsin Technology Inc 發光裝置
WO2014041721A1 (ja) * 2012-09-11 2014-03-20 パナソニック株式会社 照明用光源及び照明装置
JP2014129754A (ja) * 2012-12-28 2014-07-10 Nissan Motor Co Ltd 排熱回収装置
TWM455263U (zh) 2013-01-28 2013-06-11 Harvatek Corp 複數個藍光發光二極體的白光封裝

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5924784A (en) * 1995-08-21 1999-07-20 Chliwnyj; Alex Microprocessor based simulated electronic flame
US20050040511A1 (en) * 1998-03-31 2005-02-24 Kinsman Larry D. Back-to-back semiconductor device assemblies
US20060261364A1 (en) * 2003-03-10 2006-11-23 Yoshinobu Suehiro Solid element device and method for manufacturing thereof
US20070139949A1 (en) * 2005-12-16 2007-06-21 Nichia Corporation Light emitting device
JP2008251664A (ja) * 2007-03-29 2008-10-16 Toshiba Lighting & Technology Corp 照明装置
US8143634B2 (en) * 2007-09-17 2012-03-27 Samsung Led Co., Ltd. Light emitting diode package with a phosphor substrate
US20090258515A1 (en) * 2008-04-15 2009-10-15 Fujitsu Limited Connector
US20110147776A1 (en) * 2009-12-22 2011-06-23 Kabushiki Kaisha Toshiba Light emitting device
US20120069543A1 (en) * 2010-09-21 2012-03-22 Catcher Technology Co., Ltd. Led illuminator module with high heat-dissipating efficiency and manufacturing method therefor
US20130147348A1 (en) * 2010-10-22 2013-06-13 Panasonic Corporation Mounting board, light emitting device and lamp
US20110163681A1 (en) * 2011-02-22 2011-07-07 Quarkstar, Llc Solid State Lamp Using Modular Light Emitting Elements
US20130214247A1 (en) * 2012-02-22 2013-08-22 Jianhua Hu Ac led device and its manufacturing process for general lighting applications

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150325762A1 (en) * 2014-05-06 2015-11-12 Genesis Photonics Inc. Package structure and manufacturing method thereof
US20220078892A1 (en) * 2014-09-28 2022-03-10 Zhejiang Super Lighting Electric Appliance Co.,Ltd Led filament and led light bulb
US12066155B2 (en) 2014-09-28 2024-08-20 Zhejiang Super Lighting Electric Ap LED bulb lamp
US11690148B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US12313227B2 (en) 2014-09-28 2025-05-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11892127B2 (en) 2014-09-28 2024-02-06 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED bulb lamp
US11629825B2 (en) 2014-09-28 2023-04-18 Zhejiang Super Lighting Electric Appliance Co., Lt LED light bulb with curved filament
DE102015112536A1 (de) * 2015-07-30 2017-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Steckmodul und Beleuchtungsanordnung für den Innenraum einer Fahrzeugkabine
US12359779B1 (en) * 2015-09-25 2025-07-15 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
WO2017085063A1 (de) * 2015-11-19 2017-05-26 Osram Opto Semiconductors Gmbh Led-filamente, verfahren zur herstellung von led-filamenten und retrofitlampe mit led-filament
US20170285242A1 (en) * 2016-03-30 2017-10-05 Panasonic Liquid Crystal Display Co., Ltd. Liquid crystal display device
CN106151905A (zh) * 2016-08-15 2016-11-23 浙江阳光美加照明有限公司 一种led发光灯丝及使用该led发光灯丝的led球泡灯
US12034031B2 (en) 2017-05-31 2024-07-09 Seoul Semiconductor Co., Ltd. LED package set and LED bulb including same
CN110121772A (zh) * 2017-05-31 2019-08-13 首尔半导体株式会社 发光二极管封装件组件以及包括其的发光二极管灯泡
EP3618111B1 (en) * 2017-05-31 2024-01-24 Seoul Semiconductor Co., Ltd. Led bulb including led package set
US11482510B2 (en) * 2017-06-26 2022-10-25 Koninklijke Philips N.V. Apparatus and a method of manufacturing an apparatus
US12060455B2 (en) 2018-04-17 2024-08-13 Jiaxing Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11674644B2 (en) * 2019-05-02 2023-06-13 Signify Holding B.V. LED filament lamp
US20220196214A1 (en) * 2019-05-02 2022-06-23 Signify Holding B.V. Led filament lamp
CN114641646A (zh) * 2019-11-07 2022-06-17 昕诺飞控股有限公司 包括三个类型的led的发光二极管灯丝
WO2021089493A1 (en) * 2019-11-07 2021-05-14 Signify Holding B.V. Light-emitting diode filament comprising three types of leds
US11302678B2 (en) 2019-11-13 2022-04-12 Lextar Electronics Corporation Light-emitting package structure
TWI712188B (zh) * 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法

Also Published As

Publication number Publication date
CN111457260A (zh) 2020-07-28
CN111457260B (zh) 2022-06-07
CN104253200A (zh) 2014-12-31
TWI651871B (zh) 2019-02-21
US11543081B2 (en) 2023-01-03
TW201501364A (zh) 2015-01-01
US20210054972A1 (en) 2021-02-25
JP2015012292A (ja) 2015-01-19
US20230142465A1 (en) 2023-05-11
CN104253200B (zh) 2020-04-07

Similar Documents

Publication Publication Date Title
US11543081B2 (en) LED assembly with omnidirectional light field
US9157579B2 (en) LED assembly with omnidirectional light field
US11450791B2 (en) LED assembly for omnidirectional light applications
US9546762B2 (en) LED assembly
US20110175511A1 (en) Light emitting diode and light source module having same
CN104282671B (zh) 发光二极管组件及制作方法
CN104282817B (zh) 发光二极管组件及制作方法
US20120273809A1 (en) Light emitting diode device
TWI711188B (zh) 發光二極體組件
TWI774091B (zh) 發光二極體組件
TWI676300B (zh) 發光二極體組件

Legal Events

Date Code Title Description
AS Assignment

Owner name: INTERLIGHT OPTOTECH CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, HONG-ZHI;KUO, YI-TING;CHENG, TZU-CHI;REEL/FRAME:033271/0348

Effective date: 20140312

Owner name: HUGA OPTOTECH INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIU, HONG-ZHI;KUO, YI-TING;CHENG, TZU-CHI;REEL/FRAME:033271/0348

Effective date: 20140312

AS Assignment

Owner name: EPISTAR CORPORATION, TAIWAN

Free format text: MERGER;ASSIGNORS:EPISTAR CORPORATION;HUGA OPTOTECH INC.;FORMOSA EPITAXY INC.;REEL/FRAME:046577/0652

Effective date: 20161117

Owner name: EPISTAR CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTERLIGHT OPTOTECH CORPORATION;REEL/FRAME:046577/0672

Effective date: 20180403

Owner name: KAISTAR LIGHTING (XIAMEN) CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:INTERLIGHT OPTOTECH CORPORATION;REEL/FRAME:046577/0672

Effective date: 20180403

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION