US20140250927A1 - Adsorption heat pump system and method of driving adsorption heat pump - Google Patents

Adsorption heat pump system and method of driving adsorption heat pump Download PDF

Info

Publication number
US20140250927A1
US20140250927A1 US14/282,694 US201414282694A US2014250927A1 US 20140250927 A1 US20140250927 A1 US 20140250927A1 US 201414282694 A US201414282694 A US 201414282694A US 2014250927 A1 US2014250927 A1 US 2014250927A1
Authority
US
United States
Prior art keywords
condenser
heat pump
adsorption heat
adsorber
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/282,694
Other languages
English (en)
Inventor
Hiroaki Yoshida
Noriyasu Aso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of US20140250927A1 publication Critical patent/US20140250927A1/en
Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ASO, NORIYASU, YOSHIDA, HIROAKI
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B15/00—Sorption machines, plants or systems, operating continuously, e.g. absorption type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B17/00—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
    • F25B17/08—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type the absorbent or adsorbent being a solid, e.g. salt
    • F25B17/083—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type the absorbent or adsorbent being a solid, e.g. salt with two or more boiler-sorbers operating alternately
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/04—Arrangement or mounting of control or safety devices for sorption type machines, plants or systems
    • F25B49/046—Operating intermittently
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
    • Y02A30/27—Relating to heating, ventilation or air conditioning [HVAC] technologies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the embodiments discussed herein are related to an adsorption heat pump system and a method of driving an adsorption heat pump.
  • a large amount of data has been handled by a computer, and many computers have been often placed and collectively managed in a single room in a facility such as a data center.
  • a large number of racks (server racks) are placed in a computer room and many computers (servers) are stored in each of the racks. Then, a large amount of jobs are efficiently processed by organically distributing the jobs to the computers according to their respective operating statuses.
  • the room temperature is usually adjusted by using fans to discharge the heat generated from the computers to the outside of the racks and also using an air conditioner.
  • an adsorption heat pump system including: an adsorption heat pump including a condenser configured to condense a vapor of a refrigerant; an air-cooling device configured to air-cool a coolant discharged from the condenser in the adsorption heat pump and to resupply the air-cooled coolant to the condenser; and a controller configured to control a flow rate of the coolant to be supplied to the condenser according to a difference in temperature between the coolant supplied to the condenser and the coolant discharged from the condenser.
  • a method of driving an adsorption heat pump configured to cool a coolant discharged from a condenser in the adsorption heat pump by using an air-cooling device.
  • the method includes: controlling a flow rate of the coolant to be supplied to the condenser such that a difference in temperature between the coolant supplied to the condenser and the coolant discharged from the condenser is equal to or more than a set value.
  • FIG. 1 is a schematic view illustrating an example of an adsorption heat pump
  • FIG. 2 is a schematic view illustrating an adsorption heat pump system according to a first embodiment
  • FIGS. 3A and 3B are schematic views illustrating air-cooling devices of Modified Example 1;
  • FIG. 4 is a view (Part 1) illustrating an adsorption heat pump system of Modified Example 2;
  • FIG. 5 is a view (Part 2) illustrating the adsorption heat pump system of Modified Example 2;
  • FIG. 6 is a view illustrating an adsorption heat pump system of Modified Example 3.
  • FIG. 7 is a view illustrating an adsorption heat pump system of an experimental example.
  • FIG. 8 is a schematic view illustrating an adsorption heat pump system according to a second embodiment.
  • FIG. 1 is a schematic view illustrating an example of an adsorption heat pump.
  • An adsorption heat pump 10 illustrated in FIG. 1 includes an evaporator 11 , a condenser 12 disposed above the evaporator 11 , and adsorbers 13 a and 13 b disposed in parallel between the evaporator 11 and the condenser 12 .
  • a space inside the adsorption heat pump 10 is depressurized to about 1/100 atm to 1/10 atm, for example.
  • a cooling water pipe 11 a through which cooling water passes and a tray 11 b to store a refrigerant are provided in the evaporator 11 . While water, alcohol or the like is used as the refrigerant, water is used here as the refrigerant.
  • a heat-transfer pipe 14 and an adsorbent (desiccant) 15 are provided in each of the adsorbers 13 a and 13 b .
  • the adsorber 13 a and the evaporator 11 are connected through a valve 16 a
  • the adsorber 13 b and the evaporator 11 are connected through a valve 16 b .
  • the adsorbent 15 activated carbon, silica gel, zeolite or the like is used, for example.
  • a cooling water pipe 12 a with a number of plate fins attached thereto is disposed in the condenser 12 .
  • a valve 17 a is disposed between the condenser 12 and the adsorber 13 a
  • a valve 17 b is disposed between the condenser 12 and the adsorber 13 b.
  • valves 16 a , 16 b , 17 a and 17 b are opened and closed by electrical signals to be outputted from a controller (not illustrated), for example.
  • the condenser 12 and the evaporator 11 are connected by a pipe 18 .
  • valve 16 a between the evaporator 11 and the adsorber 13 a and the valve 17 b between the adsorber 13 b and the condenser 12 are both open in an initial state.
  • valve 16 b between the evaporator 11 and the adsorber 13 b and the valve 17 a between the adsorber 13 a and the condenser 12 are both closed.
  • cooling water is supplied to the cooling water pipe 12 a in the condenser 12 and that hot water heated by heat discharged from an electronic device is supplied to the heat-transfer pipe 14 in the adsorber 13 b.
  • the pressure inside the adsorber 13 a is lowered as the adsorbent 15 adsorbs moisture in the atmosphere. Since the valve 16 a between the adsorber 13 a and the evaporator 11 is open, the pressure inside the evaporator 11 is also reduced. Accordingly, the water stored in the tray 11 b evaporates, depriving the cooling water pipe 11 a of latent heat. As a result, the temperature of the water passing through the cooling water pipe 11 a is lowered, and thus low-temperature cooling water is discharged from the cooling water pipe 11 a .
  • This cooling water is used for room air conditioning, cooling of electronic devices, and the like, for example.
  • a water vapor generated by the evaporator 11 enters into the adsorber 13 a through the valve 16 a , and is adsorbed by the adsorbent 15 .
  • a restoration process is carried out in the other adsorber 13 b to restore (dry) the adsorbent 15 . More specifically, in the adsorber 13 b , the moisture adsorbed onto the adsorbent 15 is heated and turned into a water vapor by the hot water passing through the heat-transfer pipe 14 , and then separates from the adsorbent 15 . The water vapor generated in the adsorber 13 b passes through the open valve 17 b and then enters into the condenser 12 .
  • the water vapor that has entered into the condenser 12 from the adsorber 13 b is cooled by the cooling water passing through the cooling water pipe 12 a, and is condensed into a liquid around the cooling water pipe 12 a. This liquid moves to the evaporator 11 through the pipe 18 and is stored in the tray 11 b.
  • the controller switches the hot water supply destination from the adsorber 13 b to the adsorber 13 a , and also closes the valves 16 a and 17 b and opens the valves 16 b and 17 a.
  • moisture adsorption by the adsorbent 15 is started in the adsorber 13 b , and the adsorbent 15 in the adsorber 13 a is restored by moisture evaporation from the adsorbent 15 .
  • the adsorption heat pump 10 operates continuously by switching the hot water supply destination between the adsorbers 13 a and 13 b at intervals of a certain period of time as described above.
  • the cooling water is supplied to the cooling water pipe 12 a in the condenser 12 .
  • circulating water is used as the cooling water to be supplied to the condenser 12 , and a cooling device cools the circulating water so as not to increase the temperature thereof.
  • the cooling device consumes a large amount of power, an energy-saving effect achieved by the use of the adsorption heat pump is reduced. For this reason, a sprinkler cooling tower with relatively low power consumption is often used as the cooling device.
  • the sprinkler cooling tower occupies a relatively large space for installation, making it difficult to use the adsorption heat pump described above in a relatively small-scale facility.
  • FIG. 2 is a schematic view illustrating an adsorption heat pump system according to a first embodiment.
  • An adsorption heat pump 20 includes an evaporator 21 , a condenser 22 disposed above the evaporator 21 , adsorbers 23 a and 23 b disposed in parallel between the evaporator 21 and the condenser 22 , and a controller 30 .
  • a space inside the adsorption heat pump 20 is depressurized to about 1/100 atm to 1/10 atm, for example.
  • the adsorption heat pump system includes the adsorption heat pump 20 described above, an air-cooling device 29 and a cooling water circulating pump 31 .
  • the adsorption heat pump 20 is disposed near an electronic device or the like which discharges waste heat, for example.
  • the air-cooling device 29 and the cooling water circulating pump 31 are disposed outdoors.
  • a cooling water pipe 21 a through which cooling water passes and a tray 21 b to store a refrigerant are provided in the evaporator 21 . While water, alcohol or the like is used as the refrigerant, water is used as the refrigerant in this embodiment.
  • a heat-transfer pipe 24 and an adsorbent (desiccant) 25 are provided in each of the adsorbers 23 a and 23 b .
  • a valve 26 a is disposed between the adsorber 23 a and the evaporator 21
  • a valve 26 b is disposed between the adsorber 23 b and the evaporator 21 .
  • the adsorbent 25 activated carbon, silica gel, zeolite or the like is used, for example.
  • a pressure sensor 41 a to detect a pressure inside the adsorber 23 a is disposed in the adsorber 23 a
  • a pressure sensor 41 b to detect a pressure inside the adsorber 23 b is disposed in the adsorber 23 b . Signals to be outputted from these pressure sensors 41 a and 41 b are transmitted to the controller 30 .
  • a cooling water pipe 22 a with a number of plate fins attached thereto is disposed in the condenser 22 .
  • a valve 27 a is disposed between the condenser 22 and the adsorber 23 a
  • a valve 27 b is disposed between the condenser 22 and the adsorber 23 b .
  • the condenser 22 and the evaporator 21 are connected by a pipe 28 .
  • a pressure sensor 22 b to detect a pressure inside the condenser 22 is disposed in the condenser 22 .
  • a signal to be outputted from this pressure sensor 22 b is also transmitted to the controller 30 .
  • valves 26 a , 26 b , 27 a and 27 b magnetic valves controlled to be opened and closed by the controller 30 may be used.
  • differential pressure-driven valves are used in this embodiment, which are automatically opened and closed by a pressure difference, thereby achieving further power saving.
  • the air-cooling device 29 includes a pipe 29 b with a number of plate fins 29 a attached thereto and a blast fan 29 c.
  • the air-cooling device 29 cools cooling water (refrigerant) passing through the pipe 29 b by blowing the outside air between the plate fins 29 a from the blast fan 29 c.
  • An inlet of the air-cooling device 29 is connected to an outlet of the cooling water pipe 22 a in the condenser 22 through a pipe 35 a
  • an outlet of the air-cooling device 29 is connected to the suction side of the cooling water circulating pump 31 through a pipe 35 b.
  • the ejection side of the cooling water circulating pump 31 is connected to an inlet of the cooling water pipe 22 a in the condenser 22 through a pipe 35 c.
  • a temperature sensor 42 a to detect a temperature of cooling water to be supplied to the cooling water pipe 22 a in the condenser 22 and a flow rate sensor 43 to detect a flow rate of the cooling water are disposed in the pipe 35 c .
  • a temperature sensor 42 b to detect a temperature of the cooling water to be discharged from the condenser 22 is disposed in the pipe 35 a . Signals to be outputted from these temperature sensors 42 a and 42 b and the flow rate sensor 43 are also transmitted to the controller 30 .
  • the controller 30 adjusts the flow rate of the cooling water to be supplied to the condenser 22 by controlling the cooling water circulating pump 31 based on the signals outputted from the pressure sensors 22 b , 41 a and 41 b , the temperature sensors 42 a and 42 b and the flow rate sensor 43 . Also, the controller 30 supplies hot water alternately to the heat-transfer pipe 24 in the adsorber 23 a and the heat-transfer pipe 24 in the adsorber 23 b repeatedly each for the certain period of time, the hot water being heated by heat discharged from the electronic device or the like.
  • the adsorbent 25 in the adsorber 23 a is in a dried state, while the adsorbent 25 in the adsorber 23 b is in a moisture-adsorbing state. It is also assumed that hot water heated to 60° C. to 90° C. by the heat discharged from the electronic device is supplied to the heat-transfer pipe 24 in the adsorber 23 b.
  • the water vapor that has entered into the condenser 22 from the adsorber 23 b is cooled by the cooling water passing through the cooling water pipe 22 a , and is condensed into a liquid. This liquid moves to the evaporator 21 through the pipe 28 and is stored in the tray 21 b.
  • a water vapor generated inside the evaporator 21 enters into the adsorber 23 a through the valve 26 a , and is adsorbed by the adsorbent 25 .
  • the adsorbent 25 it is preferable to cool the adsorbent 25 by passing the cooling water through the heat-transfer pipe 24 in the adsorber (the adsorber 23 a or the adsorber 23 b ) carrying out the adsorption process.
  • some of the cooling water to be discharged from the air-cooling device 29 may be passed through the heat-transfer pipe 24 in the adsorber carrying out the adsorption process, or another air-cooling device may be separately provided for the adsorber.
  • the controller 30 switches the hot water supply destination from the adsorber 23 b to the adsorber 23 a . Then, in the adsorber 23 a , the moisture adsorbed by the adsorbent 25 evaporates, and thus the pressure inside the adsorber 23 a is increased to close the valve 26 a and open the valve 27 a . Thus, a vapor generated in the adsorber 23 a enters into the condenser 22 .
  • the stop of hot water supply reduces the pressure inside the adsorber 23 b .
  • the valve 27 b is closed and the valve 26 b is opened, causing the vapor generated in the evaporator 21 to enter into the adsorber 23 b.
  • the adsorption heat pump 20 operates continuously by switching the hot water supply destination between the adsorbers 23 a and 23 b at the intervals of the certain period of time as described above.
  • the flow rate of the cooling water to be supplied to the condenser 22 is adjusted by controlling the cooling water circulating pump 31 such that the temperature of the cooling water discharged from the condenser 22 is higher than the outside air temperature by 2° C. or more, preferably 5° C. or more.
  • the amount of moisture to be condensed inside the condenser 22 is reduced and dew condensation occurs on an inner wall surface of the adsorber (the adsorber 23 a or the adsorber 23 b ) carrying out the restoration process.
  • the moisture condensed into dew drops on the inner wall surface of the adsorber evaporates from the inner wall surface and is adsorbed by the adsorbent 25 in the next adsorption process.
  • the moisture evaporation inside the adsorber does not contribute to cooling of the cooling water passing through the cooling water pipe 21 a in the evaporator 21 , leading to performance degradation of the adsorption heat pump 20 .
  • the pressure inside the condenser 22 and the pressure inside the adsorber (the adsorber 23 a or the adsorber 23 b ) carrying out the restoration process are measured by the pressure sensors 22 b , 41 a and 41 b disposed in the condenser 22 and the adsorbers 23 a and 23 b .
  • the controller 30 controls an ejection amount of the cooling water circulating pump 31 such that the difference between the pressure inside the condenser 22 and the pressure inside the adsorber carrying out the restoration process is within the predetermined range.
  • a small difference between the pressure inside the condenser 22 and the pressure inside the adsorber carrying out the restoration process means a small amount of moisture to be condensed in the condenser 22 and a high likelihood of occurrence of dew condensation in the adsorber. It is preferable that there is a large difference between the pressure inside the condenser 22 and the pressure inside the adsorber carrying out the restoration process. However, the difference between the pressure inside the condenser 22 and the pressure inside the adsorber carrying out the restoration process is limited by the outside air temperature and is not increased more than a certain level.
  • the amount of cooling water to be supplied to the condenser 22 is adjusted by controlling the cooling water circulating pump 31 such that the difference in pressure between the condenser 22 and the adsorber (the adsorber 23 a or the adsorber 23 b ) carrying out the restoration process falls within the range of 1 kPa to 2 kPa.
  • an appropriate range of the difference in pressure between the condenser 22 and the adsorber (the adsorber 23 a or the adsorber 23 b ) carrying out the restoration process varies depending on the temperature of the hot water to be supplied to the adsorption heat pump 20 , the kind of the adsorbent 25 , and the like. It is preferable that an appropriate pressure range which meets conditions is obtained beforehand by an experiment or the like and recorded in the controller 30 .
  • the cooling water discharged from the condenser 22 is cooled by the air-cooling device 29 including the pipe 29 b with the fins 29 a attached thereto and the blast fan 29 c.
  • the air-cooling device 29 including the pipe 29 b with the fins 29 a attached thereto and the blast fan 29 c.
  • the flow rate of cooling water to be supplied to the condenser 22 is adjusted such that the difference between the pressure inside the condenser 22 and the pressure inside the adsorber 23 a or 23 b falls within the predetermined range.
  • the heat-exchange efficiency of the air-cooling device may be increased to enable further power saving.
  • dew condensation of moisture (refrigerant) may be prevented in the adsorber 23 a or 23 b carrying out the restoration process.
  • the performance degradation of the adsorption heat pump 20 is avoided.
  • the cooling water is cooled by blowing the outside air onto the fins 29 a from the blast fan 29 c in the air-cooling device 29 .
  • a spray pipe 51 a may be provided as illustrated in FIG. 3A , for example, to spray water onto the fins 29 a.
  • the water deprives the fins 29 a of latent heat during vaporization.
  • cooling capacity of the air-cooling device 29 is increased compared with the case where the outside air is simply blown onto the fins 29 a.
  • water may be sprayed from a spray pipe 51 b disposed between the blast fan and the fins 29 a , and air of which temperature is lowered by vaporization heat may be sprayed onto the fins 29 a .
  • the cooling capacity of the air-cooling device 29 is increased compared with the case where the outside air is simply blown onto the fins 29 a , as in the case of FIG. 3A .
  • whether or not there is dew condensation in the adsorber is determined based on the difference between the pressure inside the condenser 22 and the pressure inside the adsorber (the adsorber 23 a or the adsorber 23 b ) carrying out the restoration process.
  • humidity sensors 52 a and 52 b may be disposed inside the adsorbers 23 a and 23 b , and the controller 30 may determine whether or not there is dew condensation based on outputs from the humidity sensors 52 a and 52 b.
  • dew condensation sensors 53 a and 53 b whose electrical conductivity is changed by dew condensation may be disposed inside the adsorbers 23 a and 23 b , and the controller 30 may determine whether or not there is dew condensation based on outputs from the dew condensation sensors 53 a and 53 b.
  • temperature sensors 54 a and 54 b to detect the temperature of hot water supplied to the adsorbers 23 a and 23 b and temperature sensors 55 a and 55 b to detect the temperature of hot water discharged from the adsorbers 23 a and 23 b are provided as illustrated in FIG. 6 .
  • flow rate sensors 56 a and 56 b are provided to detect flow rates of hot water passing through the heat-transfer pipes 24 in the adsorbers 23 a and 23 b.
  • the controller 30 calculates an amount of heat absorbed by the adsorber (the adsorber 23 a or the adsorber 23 b ) carrying out the restoration process from the outputs from the temperature sensors 54 a , 54 b , 55 a and 55 b and the flow rate sensors 56 a and 56 b .
  • the controller 30 also calculates an amount of condensation heat in the condenser 22 from the outputs from the temperature sensors 42 a and 42 b and the flow rate sensor 43 . Then, the controller 30 adjusts the cooling water circulating pump 31 such that the amount of heat absorbed by the adsorber and the amount of condensation heat in the condenser 22 become the same.
  • the same effects as those achieved by the above embodiment may be achieved.
  • FIG. 7 an adsorption heat pump system illustrated in FIG. 7 is manufactured.
  • the same components as those in FIGS. 2 and 4 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.
  • each of adsorbers 23 a and 23 b five copper corrugated fin heat exchangers are disposed, each filled with 200 g of activated carbon subjected to hydrophilic treatment. Also, dew condensation sensors 53 a and 53 b are disposed inside the adsorbers 23 a and 23 b.
  • copper plate fin heat exchangers having the same shape as those disposed in the adsorbers 23 a and 23 b are disposed. Note, however, that the heat exchangers in the evaporator 21 and the condenser 22 are filled with no activated carbon.
  • valves 26 a and 26 b between the evaporator 21 and the adsorbers 23 a and 23 b and valves 27 a and 27 b between the condenser 22 and the adsorbers 23 a and 23 b are used.
  • a temperature sensor 42 a to detect the temperature of cooling water to be supplied to the condenser 22 and a flow rate sensor 43 to detect the flow rate of the cooling water are disposed in a pipe 35 c on the inlet side of the condenser 22 .
  • a temperature sensor 42 b to detect the temperature of the cooling water to be discharged from the condenser 22 is disposed in a pipe 35 a on the outlet side of the condenser 22 . Signals to be outputted from these temperature sensors 42 a and 42 b and the flow rate sensor 43 are inputted to a controller 30 .
  • temperature sensors 54 a and 54 b and flow rate sensors 56 a and 56 b are disposed on the inlet side of heat-transfer pipes 24 in the adsorbers 23 a and 23 b , and temperature sensors 55 a and 55 b are disposed on the outlet side thereof. Signals to be outputted from these temperature sensors 54 a , 54 b , 55 a and 55 b and the flow rate sensors 56 a and 56 b are also inputted to the controller 30 . Furthermore, a temperature sensor 57 is provided to detect the outside air temperature, and a signal to be outputted from the temperature sensor 57 is also inputted to the controller 30 .
  • cooling water at 18° C. is supplied to a cooling water pipe 21 a in the evaporator 21 .
  • hot water at 60° C. is supplied to the adsorber 23 b which carries out the restoration process, and cooling water cooled to 26° C. by the air-cooling device 29 is supplied to the condenser 22 and the adsorber 23 a which carries out the adsorption process.
  • the flow rate of the cooling water supplied to the condenser 22 is controlled such that a pressure difference between the condenser 22 and the adsorber 23 b is within the range of 1 kPa to 2 kPa. Note that the outside air temperature in this event is 25° C.
  • the flow rate of the cooling water supplied to the condenser 22 is set to 4 L/min.
  • the temperature of the cooling water discharged from the condenser 22 is 27.4° C.
  • the flow rate of the cooling water supplied to the condenser 22 is set to 1 L/min to 2 L/min, the temperature of the cooling water discharged from the condenser 22 becomes 28.8° C. to 31.6° C.
  • the flow rate of the cooling water is set to 1 L/min or less, the temperature of the cooling water discharged from the condenser 22 becomes 34° C. In this event, occurrence of dew condensation inside the adsorber 23 b is confirmed by the dew condensation sensor 53 b . Therefore, the flow rate of the cooling water supplied to the condenser 22 is set back to 2 L/min.
  • the flow rate of the cooling water supplied to the condenser 22 is appropriately adjusted based on the presence or absence of dew condensation and a difference in cooling water temperature between the inlet side and outlet side of the condenser 22 .
  • the cooling water discharged from the condenser 22 may be cooled using the outside air while avoiding the dew condensation in the adsorber 23 b .
  • the cooling capacity of the air-cooling device 29 may be improved by spraying a small amount of water onto the fins 29 a as described above.
  • FIG. 8 is a schematic view illustrating an adsorption heat pump system according to a second embodiment.
  • the adsorption heat pump system illustrated in FIG. 8 includes two adsorption heat pumps 60 a and 60 b , a controller 70 , air-cooling devices 81 and 84 , a hot water supply source 82 , a cooling water tank 83 and switching units 71 and 72 . Note that although pumps are actually connected to the air-cooling devices 81 and 84 , the hot water supply source 82 and the cooling water tank 83 , respectively, FIG. 8 omits the illustration of those pumps.
  • Each of the adsorption heat pumps 60 a and 60 b includes an evaporator and condenser 61 and an adsorber 62 .
  • the insides of the adsorption heat pumps 60 a and 60 b are depressurized to about 1/100 atm to 1/10 atm, for example.
  • the evaporator and condenser 61 includes a heat-transfer pipe 63 through which cooling water passes and a tray 64 to store a refrigerant.
  • the heat-transfer pipe 63 has plate fins 63 a provided thereto.
  • a temperature sensor 75 a and a flow rate sensor 76 are disposed on the inlet side of the heat-transfer pipe 63 , and a temperature sensor 75 b is disposed on the outlet side thereof.
  • the adsorber 62 includes a heat-transfer pipe 65 and an adsorbent 66 .
  • a temperature sensor 73 a and a flow rate sensor 74 are disposed on the inlet side of the heat-transfer pipe 65 , and a temperature sensor 73 b is disposed on the outlet side thereof.
  • the adsorber 62 is disposed above the evaporator and condenser 61 in FIG. 8 , the adsorber 62 may be disposed lateral to the evaporator and condenser 61 . Also in this embodiment, water is used as the refrigerant enclosed in the adsorption heat pumps 60 a and 60 b.
  • Each of the air-cooling devices 81 and 84 includes a pipe with plate fins attached thereto and a blast fan for blowing the outside air toward the plate fins.
  • the hot water supply source 82 supplies hot water heated by heat discharged from an electronic device or the like.
  • the cooling water tank 83 stores cooling water cooled by the adsorption heat pumps 60 a and 60 b.
  • the cooling water stored in the cooling water tank 83 is used for room air conditioning, cooling of electronic devices, and the like.
  • the controller 70 controls the switching unit 72 to allow the adsorption heat pumps 60 a and 60 b to alternately carry out the adsorption process and the restoration process.
  • the controller 70 controls the switching unit 71 to connect the adsorber 62 in the adsorption heat pump 60 a with the hot water supply source 82 and to connect the adsorber 62 in the adsorption heat pump 60 b with the air-cooling device 81 .
  • the controller 70 controls the switching unit 72 to connect the evaporator and condenser 61 in the adsorption heat pump 60 a with the air-cooling device 84 and to connect the evaporator and condenser 61 in the adsorption heat pump 60 b with the cooling water tank 83 .
  • the hot water is supplied to the adsorber 62 in the adsorption heat pump 60 a and a water vapor is generated by evaporation of moisture adsorbed on the adsorbent 66 .
  • This water vapor is cooled into a liquid by the evaporator and condenser 61 and then stored in the tray 64 .
  • the adsorption heat pump 60 b moisture is adsorbed onto the adsorbent 66 in the adsorber 62 and thus the pressure inside the adsorption heat pump 60 b is reduced. Accordingly, the water stored in the tray 64 evaporates to deprive the heat-transfer pipe 63 of latent heat. As a result, the temperature of the cooling water passing through the heat-transfer pipe 63 is lowered.
  • the controller 70 controls the switching unit 71 to connect the adsorber 62 in the adsorption heat pump 60 a with the air-cooling device 81 and to connect the adsorber 62 in the adsorption heat pump 60 b with the hot water supply source 82 .
  • the controller 70 controls the switching unit 72 to connect the evaporator and condenser 61 in the adsorption heat pump 60 a with the cooling water tank 83 and to connect the evaporator and condenser 61 in the adsorption heat pump 60 b with the air-cooling device 84 .
  • the adsorption heat pump 60 a moisture is adsorbed onto the adsorbent 66 in the adsorber 62 and thus the pressure inside the adsorption heat pump 60 a is reduced. Accordingly, the water stored in the tray 64 evaporates to deprive the heat-transfer pipe 63 of latent heat. As a result, the temperature of the cooling water passing through the heat-transfer pipe 63 is lowered.
  • the hot water is supplied to the adsorber 62 in the adsorption heat pump 60 b and a water vapor is generated by evaporation of moisture adsorbed on the adsorbent 66 .
  • This water vapor is cooled and condensed into a liquid by the evaporator and condenser 61 and then stored in the tray 64 .
  • the low-temperature cooling water is continuously supplied to the cooling water tank 83 by the controller 70 controlling the switching units 71 and 72 at intervals of a certain period of time as described above.
  • the controller 70 acquires the temperatures of the cooling water or hot water on the inlet and outlet sides of the heat-transfer pipes 65 and 63 in the adsorption heat pumps 60 a and 60 b from the temperature sensors 73 a , 73 b , 75 a and 75 b , and the flow rates of the cooling water or hot water from the flow rate sensors 74 and 76 . Then, the controller 70 adjusts the amount of cooling water to be supplied to the evaporator and condenser 61 from the air-cooling device such that the amount of heat adsorbed by the adsorber 62 carrying out the adsorption process becomes equal to the amount of condensation heat in the evaporator and condenser 61 carrying out the restoration process.
  • the adsorption heat pump system according to this embodiment also uses no large-size equipment such as a sprinkler cooling tower and thus may be used even in a small-scale facility.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sorption Type Refrigeration Machines (AREA)
US14/282,694 2011-11-22 2014-05-20 Adsorption heat pump system and method of driving adsorption heat pump Abandoned US20140250927A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/076864 WO2013076805A1 (ja) 2011-11-22 2011-11-22 吸着式ヒートポンプシステム及び吸着式ヒートポンプの駆動方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/076864 Continuation WO2013076805A1 (ja) 2011-11-22 2011-11-22 吸着式ヒートポンプシステム及び吸着式ヒートポンプの駆動方法

Publications (1)

Publication Number Publication Date
US20140250927A1 true US20140250927A1 (en) 2014-09-11

Family

ID=48469286

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/282,694 Abandoned US20140250927A1 (en) 2011-11-22 2014-05-20 Adsorption heat pump system and method of driving adsorption heat pump

Country Status (4)

Country Link
US (1) US20140250927A1 (ja)
JP (1) JP5725201B2 (ja)
CN (1) CN103946648B (ja)
WO (1) WO2013076805A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160320101A1 (en) * 2015-04-28 2016-11-03 Rocky Research Systems and methods for controlling refrigeration cycles
US9765998B2 (en) 2013-03-15 2017-09-19 Oxicool Inc. Adsorption cooling systems and methods
US9772132B2 (en) 2013-03-15 2017-09-26 Oxicool Inc. Cooling systems and methods
WO2017217970A1 (en) * 2016-06-14 2017-12-21 Oxicool Inc. Cooling system
EP3348431A1 (en) * 2017-01-16 2018-07-18 Toyota Jidosha Kabushiki Kaisha Vehicular air-conditioning apparatus provided with adsorption heat pump
EP3825627A1 (fr) * 2019-11-22 2021-05-26 Elektron Gri Systeme de refroidissement/chauffage par adsorption/desorption en cascade
CN114877558A (zh) * 2022-04-28 2022-08-09 上海交通大学 一种沙漠用太阳驱动的吸附式冷热电水联产系统及其方法
US11441823B2 (en) * 2016-04-06 2022-09-13 Fahrenheit Gmbh Adsorption heat pump and method for operating an adsorption heat pump
US20220390150A1 (en) * 2019-11-08 2022-12-08 Oxicool Inc. Cooling system with reduced valves
US20230305609A1 (en) * 2019-02-12 2023-09-28 Fulian Precision Electronics (Tianjin) Co., Ltd. Immersion cooling tank

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103615831B (zh) * 2013-11-15 2016-06-22 无锡雪浪环境科技股份有限公司 一种蒸汽压力升降吸附法及使用该方法的热泵
CN111023230A (zh) * 2019-12-25 2020-04-17 海南捷信环境工程有限公司 一种多罐吸附式污水源热泵
JP7478014B2 (ja) 2020-04-08 2024-05-02 ホシザキ株式会社 消毒保管庫

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09152221A (ja) * 1995-11-29 1997-06-10 Denso Corp 吸着式冷凍機
JP2002257250A (ja) * 2001-03-01 2002-09-11 Denso Corp 流体バルブ
US20030167925A1 (en) * 2002-03-06 2003-09-11 Yasukazu Aikawa Heat storage system for vehicle, with adsorbent
CN1493826A (zh) * 2002-11-01 2004-05-05 严振华 风冷式空调器
JP2005127632A (ja) * 2003-10-24 2005-05-19 Toyota Motor Corp 吸着式ヒートポンプ
CN201474940U (zh) * 2009-05-04 2010-05-19 腾辉电子（苏州）有限公司 冰水机冷却泵流量控制装置
JP4617433B2 (ja) * 2005-06-15 2011-01-26 国立大学法人九州大学 吸着式冷凍機

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3592374B2 (ja) * 1994-07-27 2004-11-24 株式会社前川製作所 吸着式冷却装置及びその冷熱出力制御方法
JP2002031376A (ja) * 2000-07-19 2002-01-31 Aisin Seiki Co Ltd 空調システム
JP4167190B2 (ja) * 2004-02-20 2008-10-15 三菱重工業株式会社 冷凍システムおよびその運転方法
JP2006138523A (ja) * 2004-11-11 2006-06-01 Matsushita Electric Ind Co Ltd 結露センサとそれを用いたヒートポンプシステム
JP2008209070A (ja) * 2007-02-27 2008-09-11 Toho Gas Co Ltd 熱交換器および密閉式冷却塔
JP4946894B2 (ja) * 2008-01-30 2012-06-06 富士通株式会社 廃熱利用システム
JP5412775B2 (ja) * 2008-09-10 2014-02-12 富士通株式会社 吸着式冷凍機とその制御方法、及び冷却システム
JP5315893B2 (ja) * 2008-09-24 2013-10-16 富士通株式会社 吸着式ヒートポンプ
JP5347620B2 (ja) * 2009-03-24 2013-11-20 富士通株式会社 ヒートポンプ、ヒートポンプの動作方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09152221A (ja) * 1995-11-29 1997-06-10 Denso Corp 吸着式冷凍機
JP2002257250A (ja) * 2001-03-01 2002-09-11 Denso Corp 流体バルブ
US20030167925A1 (en) * 2002-03-06 2003-09-11 Yasukazu Aikawa Heat storage system for vehicle, with adsorbent
CN1493826A (zh) * 2002-11-01 2004-05-05 严振华 风冷式空调器
JP2005127632A (ja) * 2003-10-24 2005-05-19 Toyota Motor Corp 吸着式ヒートポンプ
JP4617433B2 (ja) * 2005-06-15 2011-01-26 国立大学法人九州大学 吸着式冷凍機
CN201474940U (zh) * 2009-05-04 2010-05-19 腾辉电子（苏州）有限公司 冰水机冷却泵流量控制装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Machine Translation of JP 2002-257250, Saegusa et al., 09/2002. *
Machine Translation of JP09152221A, Tanaka, 6/1997 *

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9765998B2 (en) 2013-03-15 2017-09-19 Oxicool Inc. Adsorption cooling systems and methods
US9772132B2 (en) 2013-03-15 2017-09-26 Oxicool Inc. Cooling systems and methods
US20180003416A1 (en) * 2013-03-15 2018-01-04 Oxicool Inc. Cooling system
US9903630B2 (en) 2013-03-15 2018-02-27 Oxicool Inc. Cooling systems and methods
US10876779B2 (en) 2013-03-15 2020-12-29 Oxicool Inc. Cooling systems and methods
US10808972B2 (en) * 2013-03-15 2020-10-20 Oxicool Inc. Adsorption-based cooling system
US20160320101A1 (en) * 2015-04-28 2016-11-03 Rocky Research Systems and methods for controlling refrigeration cycles
US9982931B2 (en) * 2015-04-28 2018-05-29 Rocky Research Systems and methods for controlling refrigeration cycles of sorption reactors based on recuperation time
US11441823B2 (en) * 2016-04-06 2022-09-13 Fahrenheit Gmbh Adsorption heat pump and method for operating an adsorption heat pump
US20190170418A1 (en) * 2016-06-14 2019-06-06 Oxicool Inc. Cooling system
US11346590B2 (en) * 2016-06-14 2022-05-31 Oxicool Inc. Cooling system
WO2017217970A1 (en) * 2016-06-14 2017-12-21 Oxicool Inc. Cooling system
CN108357332A (zh) * 2017-01-16 2018-08-03 丰田自动车株式会社 具备吸附式热泵的车辆用空调装置
US20180201096A1 (en) * 2017-01-16 2018-07-19 Toyota Jidosha Kabushiki Kaisha Vehicular air-conditioning apparatus provided with adsorption heat pump
EP3348431A1 (en) * 2017-01-16 2018-07-18 Toyota Jidosha Kabushiki Kaisha Vehicular air-conditioning apparatus provided with adsorption heat pump
US20230305609A1 (en) * 2019-02-12 2023-09-28 Fulian Precision Electronics (Tianjin) Co., Ltd. Immersion cooling tank
US20220390150A1 (en) * 2019-11-08 2022-12-08 Oxicool Inc. Cooling system with reduced valves
EP3825627A1 (fr) * 2019-11-22 2021-05-26 Elektron Gri Systeme de refroidissement/chauffage par adsorption/desorption en cascade
WO2021099546A1 (fr) * 2019-11-22 2021-05-27 Elektron Gri Système de refroidissement/chauffage par adsorption/désorption en cascade
CN114877558A (zh) * 2022-04-28 2022-08-09 上海交通大学 一种沙漠用太阳驱动的吸附式冷热电水联产系统及其方法

Also Published As

Publication number Publication date
JPWO2013076805A1 (ja) 2015-04-27
WO2013076805A1 (ja) 2013-05-30
JP5725201B2 (ja) 2015-05-27
CN103946648A (zh) 2014-07-23
CN103946648B (zh) 2016-03-02

Similar Documents

Publication Publication Date Title
US20140250927A1 (en) Adsorption heat pump system and method of driving adsorption heat pump
US9820412B2 (en) Modular data center
CN100526741C (zh) 空调系统
US7418825B1 (en) IT equipment cooling
JP4780479B2 (ja) 電子機器の冷却システム
US9408333B2 (en) Method of controlling adsorption heat pump, information processing system, and control device
JP4816974B2 (ja) 電子機器の冷却システム
US20110314853A1 (en) Cooling system
US20130050931A1 (en) System and method for cooling a processing system
JP2009216295A (ja) 電子機器の冷却システム及びその運転方法
CN110809698B (zh) 用于管理封闭空间中的条件的系统和方法
JP2010190553A (ja) 電子機器の冷却システム
US9622381B2 (en) Adsorption heat pump and method of driving the same
JP6083123B2 (ja) 吸着式ヒートポンプシステム及び吸着式ヒートポンプの駆動方法
JP2011155301A (ja) 電子機器の冷却システム
JP2010065922A (ja) 吸着式冷凍機及びその制御方法
JP2013127343A (ja) デシカント換気扇
JP5881424B2 (ja) 空気調和装置
CN114353292A (zh) 用于双制冷式空调的控制方法、控制装置及双制冷式空调
JP2010232689A (ja) 電子機器の冷却システム
CN112393401A (zh) 用于双制冷式空调的控制方法、控制装置及双制冷式空调
JP5724753B2 (ja) 吸着式ヒートポンプの制御方法、情報処理システム及び制御装置
WO2021005657A1 (ja) 空気調和装置
CN112393404A (zh) 用于双制冷式空调的控制方法、控制装置及双制冷式空调
JP2015048986A (ja) 空気調和装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: FUJITSU LIMITED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YOSHIDA, HIROAKI;ASO, NORIYASU;REEL/FRAME:042185/0085

Effective date: 20140519

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION