US20130183776A1 - Uv-curable adhesive silicone composition, uv-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same - Google Patents

Uv-curable adhesive silicone composition, uv-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same Download PDF

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US20130183776A1
US20130183776A1 US13/731,920 US201213731920A US2013183776A1 US 20130183776 A1 US20130183776 A1 US 20130183776A1 US 201213731920 A US201213731920 A US 201213731920A US 2013183776 A1 US2013183776 A1 US 2013183776A1
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curable adhesive
sio
silicone composition
adhesive silicone
group
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Tsutomu Kashiwagi
Toshio Shiobara
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Assigned to SHIN-ETSU CHEMICAL CO., LTD. reassignment SHIN-ETSU CHEMICAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KASHIWAGI, TSUTOMU, SHIOBARA, TOSHIO
Publication of US20130183776A1 publication Critical patent/US20130183776A1/en
Priority to US14/728,441 priority Critical patent/US9268227B2/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds

Definitions

  • the present invention relates to a UV-curable adhesive silicone composition, a UV-curable adhesive silicone composition sheet, an optical semiconductor apparatus, and a method for manufacturing the same.
  • a silicone resin is excellent in the light resistance, it gathers an attention as a material for covering for sealing and protecting a light-emitting diode (LED) device (see Patent Literature 1). Further, in a field of light-emitting diodes, it is well known to use a phosphor as a wavelength converter (see Patent Literature 2). As a film in which a phosphor is dispersed, a thermosetting silicone resin is put into practical use (see Patent Literature 3). However, since a hydrosilylation reaction is used to cure, in many cases, a platinum-based catalyst is added in advance in a thermosetting silicone resin composition.
  • Patent Literature 4 a photocurable organopolysiloxane composition containing (methylcyclopentadienyl)trimethyl platinum as a curing catalyst is disclosed.
  • the (methylcyclopentadienyl)trimethyl platinum is activated only when light is irradiated thereon; accordingly, under a non-irradiated state, the viscosity of the organopolysiloxane composition does not increase and the pot life is excellent.
  • the Patent Literature 4 discloses a method where, upon irradiation of a light in an irradiation wavelength region of 200 nm to 400 nm, the (methylcyclopentadienyl)trimethyl platinum catalyst is activated to cure the organopolysiloxane composition.
  • an optical semiconductor device an LED chip, for example
  • a film that can be patterned by lithography which is not the conventional thermal curing type, is in demand.
  • a resin layer that covers a LED chip is demanded to have also high thermal resistance and UV-ray resistance. Further, it is convenient when such a resin layer can be formed according to an existing manufacturing apparatus.
  • Patent Document 1 Japanese Patent Laid-Open Publication No. 2004-339482
  • Patent Document 2 Japanese Translation of PCT International Application No. 2005-524737
  • Patent Document 3 Japanese Patent Laid-Open Publication No. 2009-235368
  • Patent Document 4 Japanese Patent Laid-Open Publication No. 2010-47646
  • the present invention was carried out in view of the above situation, and it is an object of the invention to provide a UV-curable adhesive silicone composition that can be cured while maintaining an initial shape without allowing a resin composition to flow during heat-curing, and, further, a UV-curable adhesive silicone composition that can form an adhesive silicone composition sheet that (1) is in a plastic solid state or a semi-solid state in an uncured state at room temperature and can be readily handled, (2) when containing a phosphor therein, can uniformly disperse the phosphor and has a stable dispersion state thereof with time, and (3) can readily cover a surface of a semiconductor device (including an optical semiconductor device such as an LED device and so on) and, by curing only a necessary portion with a UV light source and a mask, can readily form a resin cured layer.
  • a semiconductor device including an optical semiconductor device such as an LED device and so on
  • a UV-curable adhesive silicone composition that includes
  • Such the UV-curable adhesive silicone composition becomes a UV-curable adhesive silicone composition that can be cured while maintaining an initial shape without allowing the resin composition to flow during heat-curing.
  • a UV-curable adhesive silicone composition sheet that; is in a plastic solid state or a semi-solid state in an uncured state (that is, under non-heat treatment) at room temperature and can be readily handled; and, can readily cover a surface of an optical semiconductor device, and by curing only a necessary portion with a UV-light source and a mask, can readily form a resin cured layer can be formed.
  • the “semi-solid” means a state that does not have the fluidity while having the plasticity and shows a liquid or solid property depending on an external stress such as temperature, stress, and strain.
  • room temperature shows an environmental temperature in a usual state, usually in the range of 15 to 30° C., and typically 25° C.
  • the UV-curable adhesive silicone composition preferably further contains (D) a phosphor.
  • the UV-curable adhesive silicone composition contains the (D) phosphor like this, a resin cured layer in which the phosphor is uniformly dispersed and the dispersion state thereof is stable with time can be obtained.
  • the UV-curable adhesive silicone composition preferably contains 0.1 to 100 parts by mass of the phosphor of the (D) component with respect to 100 parts by mass of a sum total of the (A) to (C) components.
  • a resin cured layer obtained from the UV-curable adhesive silicone composition can more surely absorb a light from the optical semiconductor device and can convert into a light of different wavelength.
  • a particle size of the (D) phosphor is preferable to be 10 nm or more.
  • a particle size of the phosphor of the (D) component is preferable to be 10 nm or more, more preferable to be 10 nm to 10 ⁇ m, and particularly preferable to be 10 nm to about 1 ⁇ m.
  • the UV-curable adhesive silicone composition preferably contains an amount of 0.1 to 4.0 by mole ratio of the total number of moles of hydrogen atoms directly bonded to silicon atoms in the (B) component with respect to the total number of moles of vinyl groups and allyl groups in the (A) component.
  • At least one of the R 1 , R 2 and R 3 can be a hydroxyl group.
  • a silanol group can be contained in the (A) component and/or the (B) component of the composition of the invention.
  • a UV-curable adhesive silicone composition sheet obtained by forming the UV-curable adhesive silicone composition into sheet-form is provided.
  • a UV-curable adhesive silicone composition sheet obtained by forming the UV-curable adhesive silicone composition of the present invention into sheet-form is easy to handle and excellent in the workability, and can be readily adhered by stacking on a surface of an optical semiconductor device such as an LED chip. Further, the UV-curable adhesive silicone composition sheet is in a plastic solid state or a semi-solid state in an uncured state; accordingly, charged phosphor does not cause separation and precipitation during storage. Accordingly, a resin cured layer where the phosphor is uniformly dispersed therein can be stably formed.
  • the present invention provides an optical semiconductor apparatus manufactured by using the UV-curable adhesive silicone composition sheet.
  • a resin cured layer that covers an optical semiconductor device has high heat resistance and light transmittance. Further, an optical semiconductor apparatus having an optical semiconductor device that is covered with the resin cured layer in which the phosphor is uniformly dispersed is obtained.
  • the present invention provides a method of manufacturing an optical semiconductor apparatus, which includes a step of disposing the UV-curable adhesive silicone composition sheet on a surface of an optical semiconductor device, a step of irradiating light, and a step of heating after that.
  • the UV-curable adhesive silicone composition sheet of the present invention When the UV-curable adhesive silicone composition sheet of the present invention is disposed on a surface of an optical semiconductor device such as an LED chip or the like, the LED chip can be readily covered. Further, when lithography is applied with a UV-light source and a mask on the sheet, only a necessary portion can be cured in gel, and, after that, by dissolving and developing an unnecessary uncured portion with a solvent, a resin cured layer can be formed only on a necessary portion.
  • a UV-curable adhesive silicone composition of the present invention can be cured while maintaining an initial shape without allowing the resin composition to flow during heating and curing. Further, since a UV-curable adhesive silicone composition sheet obtained by forming the composition in sheet is in a plastic solid state or a semi-solid state in an uncured state, it can be readily handled and is excellent in the workability, and can be readily stacked and adhered to a surface of a semiconductor device even with a mounting machine such as a usual die bonding machine. Further, a charged phosphor does not separate and precipitate during storage. Then, when the composition sheet is cured, a resin cured layer in which the phosphor is uniformly dispersed can be efficiently and stably formed with a uniform layer thickness.
  • the mass productivity is excellent.
  • the phosphor is uniformly dispersed; accordingly, color deviation is difficult to occur, that is, the color rendering properties are excellent.
  • the resulted cured material becomes a cured material (resin cured layer) that is, while being a hard resin, excellent in the flexibility and less in surface tackiness.
  • FIG. 1 is a schematic diagram illustrating an LED apparatus having a flip-chip structure, which is prepared for measuring chromaticity in an example.
  • a composition for covering an optical semiconductor device had a problem that the composition flows before completion of curing to result in being unable to obtain a cured material having a target shape and a problem that the dispersion of the phosphor in the resin layer becomes irregular or is deviated.
  • a UV-curable adhesive silicone composition that can be cured while maintaining an initial shape without causing the resin composition to flow during heat-curing, and that can form an adhesive silicone composition sheet that is easy to handle, in which the phosphor is uniformly dispersed and a dispersion state thereof is stable with time is in demand.
  • the present invention is a DV-curable adhesive silicone composition characterized by including:
  • Me, Et, Ph and Vi respectively represent a methyl group, an ethyl group, a phenyl group and a vinyl group.
  • An organopolysiloxane having a resin structure which is, three-dimensional network structure
  • a resin structure that is, three-dimensional network structure
  • R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 a R 4 b SiO (4-a-b)/2 units (wherein R 1 , R 2 and R 3 each independently represent any one of a hydroxyl group, a methyl group, an ethyl group, a propyl group, a cyclohexyl group, and a phenyl group, R 4 represents a vinyl group or an allyl group, a represents 0, 1 or 2, b represents 1, 2 or 3, and a+b represents 2 or 3)
  • the organopolysiloxane partially includes a structure where at least a part of R 2 2 SiO 2/2 units is continuously repeated and the number of repetitions thereof is 5 to 300
  • R 2 represents the same as that in the above, and m represents an integer of 5 to 300.
  • organopolysiloxane of an (A) component preferably 50% by mole or more (50 to 100% by mole), particularly 80% by mole or more (80 to 100% by mole) preferably forms a chain architecture represented by such a formula (1) in a molecule.
  • R 2 2 SiO 2/2 units work to linearly stretch a polymer molecule, and R 1 SiO 3/2 units make a polymer molecule to branch or form a three-dimensional network structure.
  • R 4 (vinyl group or allyl group) in R 3 a R 4 b SiO (4-a-b)/2 units plays, by undergoing a hydrosilylation addition reaction with a hydrogen atom bonded to a silicon atom (that is, SiH group) of R 3 c H d SiO (4-c-d)/2 units that the (B) component described below has, a role of curing the composition of the present invention.
  • a mole ratio of indispensable three kinds of siloxane units that constitute the (A) component is preferable to be 90 to 24:75 to 9:50 to 1, and particularly preferable to be 70 to 28:70 to 20:10 to 2 (sum total thereof is 100) from the viewpoint of the characteristics of the resulted cured material.
  • an weight average molecular weight of the (A) component in terms of polystyrene according to gel permeation chromatography (GPC) with tetrahydrofuran (THF) as an eluent is in the range of 3,000 to 1,000,000, in particular, 10,000 to 100,000, the polymer is more surely in a plastic solid state or a semi-solid state and suitable from the viewpoint of workability and curability.
  • the organopolysiloxane having such the resin structure can be synthesized in such a manner that compounds that is raw materials of the respective units are combined so that the three kinds of siloxane units may be a predetermined mole ratio in a generated polymer, and, for example, under the presence of acid, a cohydrolysis condensation is conducted.
  • chlorosilanes such as MeSiCl 3 , EtSiCl 3 , PhSiCl 3 , propyltrichlorosilane and cyclohexyl trichlorosilane, and alkoxysilanes such as methoxysilanes corresponding to the respective chlorosilanes can be exemplified.
  • R 3 a R 4 b SiO (4-a-b)/2 units indicate one kind of siloxane unit selected from R 3 R 4 SiO 2/2 , R 3 2 R 4 SiO 1/2 , R 4 2 SiO 2/2 and R 3 R 4 2 SiO 1/2 units or a combination of two or more kinds of the siloxane units selected therefrom.
  • chlorosilanes such as Me 2 ViSiCl, MeViSiCl 2 , Ph 2 ViSiCl, and PhViSiCl 2
  • alkoxysilanes such as methoxysilanes corresponding to each of these chlorosilanes can be exemplified.
  • R 1 SiO 3/2 units, R 2 2 SiO 2/2 units, and/or R 3 a R 4 b SiO (4-a-b)/2 units may contain a siloxane unit having a silanol group. That is, there is a case where a siloxane unit where at least one of R 1 , R 2 and R 3 is a hydroxyl group is contained.
  • the organopolysiloxane of the (A) component may contain such the silanol group-containing siloxane unit, with respect to an entire siloxane units, usually by 10% by mole or less (0 to 10% by mole), preferably by 5% by mole or less (0 to 5% by mole).
  • silanol group-containing siloxane units include R 1 (HO)SiO 2/2 , R 1 (HO) 2 SiO 1/2 , R 2 2 (HO)SiO 1/2 , R 3 R 4 (HO)SiO 1/2 , and R 4 2 (HO)SiO 1/2 units, wherein R 1 to R 4 are the same as that described above.
  • An organohydrogenpolysiloxane having a resin structure (that is, three-dimensional network structure), which is an important (B) component of the UV-curable adhesive silicone composition of the present invention is an organohydrogenpolysiloxane that has a resin structure that consists of R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 c H d SiO (4-c-d)/2 units (Here, R 1 , R 2 and R 3 are the same as that described above, c represents 0, 1 or 2, d represents 1 or 2, and c+d represents 2 or 3, desirably among R 3 c H d SiO (4-c-d)/2 units, c represents 2 and d represents 1), the organohydrogenpolysiloxane partially contains a linear siloxane structure where at least a part of R 2 2 SiO 2/2 units is continuously repeated and the number of repetitions is 5 to 300, preferably 10 to 300, more preferably 15 to 200, and still preferably 20 to 100.
  • the structure where at least a part of R 2 2 SiO 2/2 units is continuously repeated and the number of repetitions thereof is 5 to 300 means that at least a part of R 2 2 SiO 2/2 units present in the (B) component, preferably 50% by mole or more (50 to 100% by mole) thereof, particularly 80% by mole or more (80 to 100% by mole) thereof forms a linear diorganopolysiloxane chain architecture represented by the formula (1) in the molecule of the (B) component.
  • R 2 2 SiO 2/2 units work to linearly stretch a polymer molecule
  • R 1 SiO 3/2 units make a polymer molecule to branch or form a three-dimensional network structure.
  • a hydrogen atom bonded to silicon in R 3 c H d SiO (4-c-d)/2 units plays, by undergoing a hydrosilylation addition reaction with an alkenyl group that the (A) component has, a role of curing a composition of the present invention.
  • a mole ratio of indispensable three kinds of siloxane units that constitute the (B) component is preferable to be 90 to 24:75 to 9:50 to 1, and particularly preferable to be 70 to 28:70 to 20:10 to 2 (sum total thereof is 100) from the viewpoint of the characteristics of the resulted cured material.
  • a weight average molecular weight of the (B) component in terms of polystyrene according to the GPC with tetrahydrofuran (THF) as an eluent is in the range of 3,000 to 1,000,000, in particular, 10,000 to 100,000, the polymer is suitable from the viewpoint of workability and characteristics of the cured material.
  • the organohydrogenpolysiloxane having such the resin structure can be synthesized in such a manner that compounds that is raw materials of the respective units are combined so that the three kinds of siloxane units may be a predetermined mole ratio in a generated polymer, and, a cohydrolysis is conducted.
  • R 3 c H d SiO (4-c-d)/2 units indicates one kind of siloxane unit selected from R 3 HSiO 2/2 , R 3 2 HSiO 1/2 , H 2 SiO 2/2 and R 3 H 2 SiO 1/2 units or an optional combination of two or more kinds of siloxane units selected therefrom.
  • chlorosilanes such as Me 2 HSiCl, MeHSiCl 2 , Ph 2 HSiCl, and PhHSiCl 2
  • alkoxysilanes such as methoxysilanes corresponding to each of the chlorosilanes can be exemplified.
  • R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 c H d SiO (4-c-d)/2 units may contain a siloxane unit having a silanol group. That is, in some cases, there is a case where a siloxane unit where at least one of R 1 , R 2 and R 3 is a hydroxyl group is contained.
  • the organohydrogenpolysiloxane of the (B) component may contain such the silanol group-containing siloxane unit, usually, with respect to an entire siloxane units, by an amount of 10% by mole or less (0 to 10% by mole), preferably 5% by mole or less (0 to 5% by mole).
  • the silanol group-containing siloxane units include R 1 (HO)SiO 2/2 , R 1 (HO) 2 SiO 1/2 , R 2 2 (HO)SiO 1/2 , R 3 H(HO)SiO 1/2 , and H 2 (HO)SiO 1/2 units, wherein R 1 to R 3 are the same as that described above.
  • a compounding amount of the organohydrogenpolysiloxane of the (B) component is, in terms of a mole ratio of hydrogen atoms bonded to silicon atoms (SiH groups) in the (B) component with respect to a total amount of vinyl groups and ally groups in the (A) component, preferably an amount to be 0.1 to 4.0, particularly preferably an amount to be 0.5 to 3.0, and still more preferably an amount to be 0.8 to 2.0.
  • a curing reaction preferably proceeds to be able to obtain a silicone cured material, and when the compounding amount is 4.0 or less, unreacted (residual) SiH groups in the cured material are contained less and there is no fear of change with time of physical properties of the cured material.
  • thermosetting silicone resin compositions in many cases, a platinum-based catalyst that is not photoactive is added in advance (Patent Literature 3, for example).
  • the present invention is characterized by using a photoactive catalyst as a catalyst.
  • the (C) component is not restricted to particular one as long as it is a catalyst having a photoactive property, particularly a photoactive platinum group metal catalyst or nickel-based catalyst can be cited.
  • the platinum group metal catalysts include a platinum-based catalyst, a palladium-based catalyst and a rhodium-based catalyst. Among these, the platinum-based catalyst is preferred.
  • platinum-based catalysts ⁇ -diketonate platinum complex catalysts such as trimethyl(acetylacetonate)platinum complexes, trimethyl(3,5-heptanedionate)platinum complexes, trimethyl(methylacetoacetate)platinum complexes, bis(2,4-pentanedionato)platinum complexes, bis(2,4-hexanedionato)platinum complexes, bis(2,4-heptanedionato)platinum complexes, bis(3,5-heptanedionato)platinum complexes, bis(1-phenyl-1,3-butanedionato)platinum complexes and bis(1,3-diphenyl-1,3-propanedionato)platinum complexes can be exemplified.
  • (methylcyclopentadienyl)trimethyl platinum can be used.
  • nickel-based catalysts include bis(2,4-pentanedionato)nickel complexes. These catalysts may be used singularly or in a combination of two or more kinds thereof.
  • bis(2,4-pentanedionato)platinum complexes whose trivial name is bis(acetylacetonato) platinum(II), is preferably used in the curing method of the present invention.
  • a compounding amount of the (C) component may be an effective amount for curing, and, usually, is used, with respect to a total amount of the (A) component and (B) component, in terms of mass as platinum group metal, for example, in the range of 0.1 to 1000 ppm, particularly preferably 0.5 to 500 ppm.
  • the resin composition does not flow during heat-curing and can be cured with an initial shape maintained. Further, from the composition, an adhesive silicone composition sheet that is in a plastic solid state or semi-solid state in an uncured state at room temperature and can be readily handled can be formed. Further, the adhesive silicone composition sheet can be readily adhered to a surface of a semiconductor device (including an optical semiconductor device such as an. LED device), and, by curing only a necessary portion with a UV-light source and a mask, a resin cured layer can be readily formed only on a necessary portion.
  • a semiconductor device including an optical semiconductor device such as an. LED device
  • UV-curable adhesive silicone composition of the present invention in addition to the above-described (A) to (C) components, as required, various kinds of additives that are heretofore-known can be compounded.
  • the composition preferably contains, in addition to the above-described (A) to (C) components, (D) a phosphor for converting a wavelength.
  • the UV-curable adhesive silicone composition of the present invention even in the case where (D) the phosphor is contained like this, can obtain a resin cured layer where the phosphor is uniformly dispersed and a state of dispersion is stable with time.
  • the phosphor of the (D) component may be any of heretofore known phosphors and a compounding amount thereof is usually set in the range of 0.1 to 100 parts by mass with respect to 100 parts by mass of a total amount of the (A) to (C).
  • the phosphor of the (D) component that has, as a range of a particle size in the particle size distribution measurement according to a laser light diffraction method using a Cirrus laser measurement apparatus, etc., a particle size of, usually, 10 nm or more, preferably 10 nm to 10 ⁇ m, more preferably about 10 nm to 1 ⁇ m is used.
  • a phosphor may be, for example, a material that absorbs a light from a semiconductor light-emitting diode that has a nitride-based semiconductor as a light-emitting layer and converts to a light having a different wavelength.
  • nitride-based phosphors mainly activated by a lanthanoid element such as Eu, Ce, M 2 Si 5 N 8 : Eu (M is at least one kind selected from Sr, Ca, Ba, Mg and Zn.) can be cited. Further, in addition to M 2 Si 5 N 8 : Eu, MSi 7 N 10 : Eu, M 1.8 Si 5 O 0.2 N 8 : Eu, and M 0.9 Si 7 O 0.1 N 10 : Eu (M is at least one kind selected from Sr, Ca, Ba, Mg and Zn.) can be cited.
  • Ce include MSi 2 O 2 N 2 : Eu (M is at least one kind selected from Sr, Ca, Ba, Mg and Zn.) can be cited.
  • alkali earth halogen apatite phosphors mainly activated by a lanthanoid element such as Eu and/or a transition metal element such as Mn, M 5 (PO 4 ) 3 X: R (M is at least one kind selected from Sr, Ca, Ba, Mg and Zn. X is at least one kind selected from F, Cl, Br and I. R is at least one kind of Eu, Mn, and Eu and Mn.) can be cited.
  • M 2 B 5 O 9 X R (M is at least one kind selected from Sr, Ca, Ba, Mg and Zn. X is at least one kind selected from F, Cl, Br and I. R is least one kind of Eu, Mn, and Eu and Mn.) can be cited.
  • SrAl 2 O 4 R, Sr 4 Al 14 O 25 : R, CaAl 2 O 4 : R, BaMg 2 Al 16 O 27 : R, BaMg 2 Al 16 O 12 : R, and BaMgAl 10 O 17 : R (R is at least any one kind of Eu, Mn, and Eu and Mn.) can be cited.
  • La 2 O 2 S: Eu, Y 2 O 2 S: Eu, and Gd 2 O 2 S: Eu can be cited.
  • rare earth aluminate phosphors mainly activated by a lanthanoid element such as Ce YAG series phosphors represented by a compositional formula such as Y 3 Al 5 O 12 : Ce, (Y 0.8 Gd 0.2 ) 3 Al 5 O 12 : Ce, Y 3 (Al 0.8 Ga 0.2 ) 5 O 12 : Ce and (Y,Gd) 3 (Al, Ga) 5 O 12 can be cited.
  • Tb 3 Al 5 O 12 : Ce and Lu 3 Al 5 O 12 : Ce, in which Y is partially or entirely substituted with Tb or Lu, etc. can be cited.
  • ZnS Eu
  • Zn 2 GeO 4 Mn
  • MGa 2 S 4 Eu
  • M is at least one kind selected from Sr, Ca, Ba, Mg and Zn.
  • X is at least one kind selected from F, Cl, Br and I.
  • the above phosphors may contain, as required, in place of Eu, or in addition to Eu, one or more kind selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni and Ti.
  • the Ca—Al—Si—O—N series oxynitride glass phosphor includes, as a matrix, an oxynitride glass that contains, by mole %, 20 to 50% by mole of CaCO 3 in terms of CaO, 0 to 30% by mole of Al 2 O 3 , 25 to 60% by mole of SiO, 5 to 50% by mole of AlN, and 0.1 to 20% by mole of rare earth oxide or transition metal oxide, the sum total of 5 components being 100% by mole.
  • a content of nitrogen is preferable to be 15% by weight or less, and, in addition to a rare earth oxide ion, another rare earth element ion that becomes a sensitizer is preferably contained as a co-activator as a rare earth oxide in the content in the range of 0.1 to 10% by mole in a phosphorescent glass.
  • the inorganic fillers include: reinforcing inorganic fillers such as fumed silica and fumed titanium dioxide; and nonreinforcing inorganic fillers such as calcium carbonate, calcium silicate, titanium dioxide, ferric oxide, carbon black, and zinc oxide. These inorganic fillers can be appropriately compounded in total in the range of 600 parts by mass or less (0 to 600 parts by weight) with respect to a sum total of 100 parts by mass of the (A) component and (B) component.
  • reinforcing inorganic fillers such as fumed silica and fumed titanium dioxide
  • nonreinforcing inorganic fillers such as calcium carbonate, calcium silicate, titanium dioxide, ferric oxide, carbon black, and zinc oxide.
  • an adhesive auxiliary may be added, as required.
  • the adhesive auxiliary linear or cyclic organosiloxane oligomer having 4 to 50, preferably about 4 to 20 silicon atoms, which contains in one molecule at least two kinds, preferably two kinds or three kinds of functional groups selected from a hydrogen atom bonded to a silicon atom (SiH group), an alkenyl group bonded to a silicon atom (Si—CH ⁇ CH 2 group, for example), an alkoxysilyl group (trimethoxysilyl group, for example), and an epoxy group (glycidoxypropyl group, 3,4-epoxycyclohexylethyl group, for example), and an organooxysilyl-modified isocyanurate compound represented by the following formula (2) and/or a hydrolytic condensate thereof (organosiloxane-modified isocyanurate compound) can be cited.
  • R 19 represents an organic group represented by the following formula (3)
  • R 20 represents a hydrogen atom or a mono-valent hydrocarbon group having 1 to 6 carbon atoms, s represents an integer of 1 to 6, in particular, 1 to 4.) or a mono-valent hydrocarbon group containing an aliphatic unsaturated bond, and at least one of R 19 is an organic group of the formula (3).
  • alkenyl groups having 2 to 8, particularly 2 to 6 carbon atoms such as a vinyl group, an allyl group, an isopropenyl group, a butenyl group, an isobutenyl group, a pentenyl group and a hexenyl group and cycloalkenyl groups having 6 to 8 carbon atoms such as a cyclohexenyl group can be cited.
  • monovalent hydrocarbon groups of R 20 in the formula (3) monovalent hydrocarbon groups having 1 to 8, particularly 1 to 6 carbon atoms such as alkyl groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a hexyl group and a cyclohexyl group; alkenyl groups and cycloalkenyl groups exemplified of the R 19 ; and aryl groups such as a phenyl group can be cited, and alkyl groups are preferably cited.
  • g and h each represent a positive integer in the range of 0 to 50, and g+h satisfies 2 to 50, preferably 4 to 20.
  • organosilicon compounds as compounds that can impart particularly excellent adhesiveness to the resulted cured material, organosilicon compounds having, in one molecule, an alkoxy group bonded to a silicon atom, and an alkenyl group or a hydrogen atom bonded to a silicon atom (SiH group) can be cited.
  • a compounding amount of the adhesive auxiliary is, with respect to 100 parts by mass of the (A) component, usually 10 parts by mass or less (that is, 0 to 10 parts by mass), preferably 0.1 to 8 parts by mass, more preferably 0.2 to 5 parts by mass.
  • the compounding amount is 10 parts by mass or less, there is no fear of adversely affecting on the hardness of the cured material or of enhancing the surface tackiness.
  • a liquid silicone component can be added to an extent that can maintain the UV-curable adhesive silicone composition of the present invention in a plastic solid state or a semi-solid state at room temperature and does not allow to be liquid.
  • a silicone component having the viscosity at 25° C. of 1 to 100,000 mPa ⁇ s is preferred. Examples thereof include vinylsiloxane, hydrogensiloxane, alkoxysiloxane, hydroxysiloxane and mixtures thereof.
  • An addition amount of the liquid silicone component is usually 50% by mass or less with respect to the UV-curable adhesive silicone composition under the condition that the UV-curable adhesive silicone composition maintains a plastic solid state or a semi-solid state at room temperature.
  • a UV-curable adhesive silicone composition sheet of the present invention is obtained by forming the UV-curable adhesive silicone composition of the invention into sheet-form.
  • a film coater and a heat press machine As a method for processing the composition of the present invention into sheet-form, for example, a film coater and a heat press machine can be cited.
  • the composition is processed into sheet-form by using these methods, for example, the composition is sandwiched between a base film for pressurizing and a peeling film and compression molded by using a heat press machine at a temperature usually from 60 to 120° C., preferably from 70 to 100° C., under the pressure of 0.5 to 10 t/cm 2 , preferably 1 to 7 ton/cm 2 , and for about 1 to about 30 min, preferably 2 to 10 min.
  • Examples of the base films for pressurizing include a PET film, a fluorine-based resin film, a polyethylene film, and a polypropylene film, and examples of the peeling films include a fluorine-based resin-coated PET film, a silicone resin-coated PET film and a fluorine-based resin film can be cited.
  • a UV-curable adhesive silicone composition sheet formed from such the UV-curable adhesive silicone composition is in a plastic solid state or in a semi-solid state in an uncured state at room temperature and easy to handle. Further, the UV-curable adhesive silicone composition sheet can be readily adhered on a surface of a semiconductor device such as an LED chip. Further, by curing only a necessary portion with a UV-light source and a mask and by dissolving and developing an unnecessary uncured portion with a solvent, the sheet can form a cured layer only on a necessary portion is formed. Further, when the UV-curable adhesive silicone composition of the present invention contains a phosphor a cured material (resin-cured layer) in which the phosphor is uniformly dispersed and the dispersion state thereof is stable with time can be obtained.
  • UV light sources used in the present invention include UV-LED lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, low-pressure mercury lamps, metal halide lamps, carbon ark lamps, and xenon lamps.
  • a wavelength of light being irradiated is 200 nm to 400 nm, preferably 250 to 400 nm, and any one of a single-wavelength light, a bright line spectrum light and a continuous spectrum light can be used.
  • An exposure dose is, as an integral of light, 100 mJ/cm 2 to 100,000 mJ/cm 2 , preferably 100 mJ/cm 2 to 10,000 mJ/cm 2 , more preferably 100 mJ/cm 2 to 5,000 mJ/cm 2 .
  • the silicone resin composition can be gelated by irradiating a light for a very short time.
  • the gelation in the present invention means a state where a curing reaction of the resin composition partially proceed and the resin composition become insoluble to a solvent.
  • the UV-curable adhesive silicone composition sheet of the present invention is characterized in that, when a light having a specified wavelength is irradiated, the silicone resin composition is gelated.
  • a light having a specified wavelength is irradiated for 0.5 to 10 sec, in particular, for 1 to 5 sec, for example, on the silicone resin composition, thereafter, within 10 to 600 sec, particularly within 60 to 300 sec, the silicone resin composition can be gelated.
  • the gelated sheet can be completely cured.
  • the resin composition can be cured without flowing during heating, that is, with an initial shape maintained.
  • the resin composition is heat-cured at 25 to 200° C., preferably 100 to 180° C., for 3 min to 72 hr, preferably for 1 to 6 hr.
  • the heat-curing condition can be appropriately selected by considering a balance of the working condition and the productivity and the heat resistance of a light-emitting device and a chassis.
  • a method for manufacturing an optical semiconductor apparatus including a step of disposing the UV-curable adhesive silicone composition sheet on a surface of an optical semiconductor device (an LED device, for example), a step of irradiating light, and a step of, after that, heat-curing.
  • an optical semiconductor device an LED device, for example
  • a step of irradiating light a step of, after that, heat-curing.
  • a light-emitting apparatus having a coated LED device where a surface of above-described LED device is covered with a resin-cured layer.
  • the adhesive silicone composition sheet is used at a thickness of 1 to 500 ⁇ m, preferably of 10 to 300 ⁇ m. However, the thickness is appropriately adjusted depending on the content and emission efficiency of the phosphor, etc.
  • a size of the sheet may well be adjusted to a size of an LED device to be covered. After disposing the sheet on a surface of the LED device, light is irradiated to gel, after that, by heating, the sheet is completely cured.
  • the conditions of UV irradiation and heat-curing are as described above, and, usually, after a first curing, a second curing is conducted.
  • the adhesive silicone composition sheet of the present invention according to lithography that uses a UV light source and a mask, by curing only a necessary portion and by dissolving and developing an unnecessary uncured portion with a solvent, a resin-cured layer can be readily formed only on a necessary portion.
  • the cured material obtained from the UV-curable adhesive silicone composition and the UV-curable adhesive silicone composition sheet are excellent in the heat resistance and light transmittance. Further, the present invention can provide a cured material having the light transmittance of 90% to 100%, in particular, 95% to 100% of a light having a wavelength of 450 nm at 23° C. in a layer state of a thickness of 1 mm. Accordingly, the cured material can be preferably used as a sealing material, etc. of optical semiconductor devices such as light-emitting diodes (LEDs), organic electroluminescent devices (organic ELs), laser diodes, and LED arrays.
  • LEDs light-emitting diodes
  • organic ELs organic electroluminescent devices
  • laser diodes and LED arrays.
  • An aspect of sealing an optical semiconductor device with the cured material of the UV-curable adhesive silicone composition of the present invention is not particularly limited.
  • a method where the above silicone resin composition is filled so that an optical semiconductor device disposed in a chassis having an opening is covered, and UV-rays are irradiated to heat to cure can be used.
  • a method where optical semiconductor devices are mounted on a matrixed substrate and a printing method, a transfer molding method, an injection molding method, or a compression molding method is used to produce can be used as well.
  • the silicone resin composition of the present invention is in a plastic solid state or a semi-solid state at room temperature. However, when the silicone resin composition is preheated at a temperature of about 40 to 120° C., preferably 80 to 100° C., the resin composition is softened and melted and becomes a property that allows to injection mold.
  • the composition is preferable to be in a liquid state when it is cast. Further, when an optical semiconductor apparatus is produced by transfer molding, the composition may be pelletized and used in molding.
  • the transfer molding or injection molding it is preferable to mold at a temperature of 150 to 180° C. and under pressure of 20 to 50 kgf/cm 2 for 1 to 5 min.
  • after-cure secondary curing or post cure
  • the compression bonding can be usually applied at a temperature from room temperature to 300° C. or less, under pressure of 10 MPa or less (usually 0.01 to 10 MPa), preferably 5 MPa or less (0.1 to 5 MPa, for example), particularly preferably 0.5 to 5 MPa.
  • the curing is performed usually at a temperature from 50 to 200° C., particularly, from 70 to 180° C., and for 1 to 30 min, particularly for 2 to 10 min.
  • the post cure can be conducted at a temperature from 50 to 200° C., particularly 70 to 180° C. for 0.1 to 10 hr, particularly for 1 to 4 hr.
  • the weight average molecular weight referred in the present invention indicates a weight average molecular weight based on a polystyrene standard material according to gel permeation chromatography (GPC) measured under the following condition.
  • GPC gel permeation chromatography
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [-SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] 0.01 [Me 2 ViSiO 1/2 ] 0.06 .
  • the weight average molecular weight of the resin was 65,000, and the melting point thereof was 58° C.
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] 0.01 [Me 2 HSiO 1/2 ] 0.06 .
  • the weight average molecular weight of the resin was 56,000, and the melting point thereof was 56° C.
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] 0.01 [Me 2 ViSiO 1/2 ] 0.09 .
  • the weight average molecular weight of the resin was 62,000, and the melting point thereof was 61° C.
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O-(Me 2 SiO) 33 —SiMe 2 O 2/2 ] 0.01 [Me 2 HSiO 1/2 ] 0.09 .
  • the weight average molecular weight of the resin was 55,000, and the melting point thereof was 54° C.
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe 2 O-(Me 2 SiO) 7 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O-(Me 2 SiO) 7 —SiMe 2 O 2/2 ] 0.01 [Me 2 ViSiO 1/2 ] 0.06 .
  • the weight average molecular weight of the resin was 45,000, and the melting point thereof was 56° C.
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe 2 O-(Me 2 SiO) 7 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O-(Me 2 SiO) 7 —SiMe 2 O 2/2 ] 0.01 [Me 2 HSiO 1/2 ] 0.06 .
  • the weight average molecular weight of the resin was 42,000, and the melting point thereof was 54° C.
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe 2 O-(Me 2 SiO) 98 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O-(Me 2 SiO) 98 —SiMe 2 O 2/2 ] 0.01 [Me 2 ViSiO 1/2 ] 0.06 .
  • the weight average molecular weight of the resin was 62,000, and the melting point thereof was 60° C.
  • a constituent ratio of siloxane units which constitute the resin and a structure represented by [—SiMe 2 O-(Me 2 SiO) 98 —SiMe 2 O 2/2 ] is denoted by a formula: [PhSiO 3/2 ] 0.27 [—SiMe 2 O(Me 2 SiO) 98 —SiMe 2 O 2/2 ] 0.01 [Me 2 HSiO 1/2 ] 0.06 .
  • the weight average molecular weight of the resin was 60,000, and the melting point thereof was 58° C.
  • composition was coated on a PTFE film 50 ⁇ m thick (base film for pressurizing) by a film coater at a blade of 100 ⁇ m and dried at 100° C. for 2 min to prepare a solid film 50 ⁇ m thick.
  • the solid film was further sandwiched between a PTFE film 25 ⁇ m thick (peeling film) and formed into sheet-form having a thickness of 50 ⁇ m by nipping with a roll.
  • the resulted composition sheet was cut together with the peeling film into small chips.
  • the peeling film was removed.
  • UV 365 nm was irradiated using a UV-LED irradiator (type name: ZUV-C20H, manufactured by OMRON Corporation) (integrated amount of light: 2000 mJ/cm 2 ).
  • an uncured portion was developed with IPA, this was further heated at 150° C.
  • a phosphor-containing resin cured layer 2 was formed on the LED chip 1 .
  • a light-emitting semiconductor (LED) apparatus having a flip-chip structure such as illustrated in FIG. 1 was prepared on a ceramic circuit board 3 .
  • reference numerals 4 and 5 respectively illustrate a wire contact portion and a gold wire. By making every 3 LEDs emit, the chromaticity was measured by using an LED Optical Characteristic Monitor (type name: LE-3400, manufactured by Otsuka Electronics Co., Ltd.).
  • the composition was compression molded by using a compression molding machine, by using a UV-LED irradiator (type name: ZUV-C20H, manufactured by OMRON Corporation), UV 365 nm (integrated amount of light: 2000 mJ/cm 2 ) was irradiated to gelate, this was further cured at 150° C. for 4 hr.
  • the resulted cured material was measured of the tensile strength (0.2 mm thick), the hardness (measured by using a type D spring tester) and the breaking elongation (0.2 mm thick) in accordance with JIS K 6251 and JIS K 6253.
  • the tackiness of a surface of a cured material cured similarly as the evaluation of the mechanical characteristics was confirmed by touching with a finger. Further, the cured material was embedded in commercially available silver powder (average particle size: 5 ⁇ m) and, after taking out, by blowing air, whether the silver powder stuck on the surface like dust can be removed or not was tested.
  • the resin composition immediately after preparation was charged in a recess having a diameter of 6 mm and a depth at a center of 2 mm, which was formed on an alumina substrate, and, by irradiating UV-rays and heat-curing in a manner similar to that in the evaluation of the mechanical characteristics, a disc-like molded product having a thickness of 2 mm and a diameter of 6 mm was molded. From each of an upper superficial layer (thickness: 2 mm) and a lower superficial layer (thickness: 2 mm) of the molded product, a part was cut out and heated at 800° C. to ash, the content (% by mass) of the phosphor in the resulted ash was measured, and the contents in the upper portion and lower portion were compared.
  • the composition was molded in a manner similar to the above, and similarly, the contents of phosphor in the upper portion and lower portion were compared. In this manner, the dispersion stability of the phosphor was measured.
  • the UV-curable adhesive silicone compositions according to Examples 1 to 5 could be cured without allowing the composition to flow during heat-curing but with an initial shape maintained. Further, according to the compositions of Example 1 and Example 2, a resin-cured layer in which the phosphor is uniformly dispersed and the dispersion state thereof is stable with time could be obtained. Still further, when a sheet formed from the composition was used, only on a necessary portion, a resin-cured layer can be formed according to lithography.
  • the present invention is not limited to the embodiments.
  • the embodiments are only illustrative examples. All of what has a constitution essentially the same as that of a technical idea described in the range of Claims of the invention and exerts the same effect is included in the technical range of the invention.

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US20150331319A1 (en) * 2012-04-06 2015-11-19 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working photosensitive siloxane composition
US20170194539A1 (en) * 2014-06-25 2017-07-06 Dow Corning Corporation Layered Polymer Structures And Methods
US10870760B2 (en) 2016-11-21 2020-12-22 Shin-Etsu Chemical Co., Ltd. Epoxy group-containing organopolysiloxane, ultraviolet curable silicone composition, and method of forming a cured film
US20210324252A1 (en) * 2018-09-10 2021-10-21 Dow Silicones Corporation Method for producing optical silicone assembly, and optical silicone assembly produced thereby
US11279827B2 (en) 2016-09-26 2022-03-22 Dow Toray Co., Ltd. Curing reactive silicone gel and use thereof
US11396616B2 (en) 2017-04-06 2022-07-26 Dow Toray Co., Ltd. Liquid curable silicone adhesive composition, cured product thereof, and use thereof

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DE102015110429A1 (de) * 2015-06-29 2017-01-12 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung
KR20200032145A (ko) * 2017-08-04 2020-03-25 와커 헤미 아게 귀금속 촉매의 안정화
CN109306259A (zh) * 2018-09-07 2019-02-05 东莞市贝特利新材料有限公司 一种光固化有机硅胶粘剂及其在贴合触摸屏中的应用
JP6897695B2 (ja) * 2019-01-28 2021-07-07 信越化学工業株式会社 紫外線硬化型シリコーン接着剤組成物および積層体の製造方法
WO2021200643A1 (fr) * 2020-03-30 2021-10-07 ダウ・東レ株式会社 Composition de silicone thermofusible durcissable, produit durci à base de celle-ci, et stratifié contenant une composition de silicone thermofusible durcissable ou un produit durci à base de celle-ci
GB202108979D0 (en) 2021-06-23 2021-08-04 Johnson Matthey Plc Hydrosilylation catalysts

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US7858198B2 (en) * 2007-04-10 2010-12-28 Shin-Etsu Chemical Co., Ltd. Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet
US20100256300A1 (en) * 2009-04-06 2010-10-07 Wacker Chemie Ag PT-Catalyzed, Addition-Crosslinking Silicone Compositions Self-Adhesive At Room Temperature

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US20150331319A1 (en) * 2012-04-06 2015-11-19 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working photosensitive siloxane composition
US9684240B2 (en) * 2012-04-06 2017-06-20 AZ Electronic Materials (Luxembourg) S.à.r.l. Negative-working photosensitive siloxane composition
US20150315427A1 (en) * 2012-12-21 2015-11-05 Dow Corning Corporation Hot-melt type curable silicone composition for compression molding or laminating
US9536799B2 (en) * 2012-12-21 2017-01-03 Dow Corning Corporation Hot-melt type curable silicone composition for compression molding or laminating
US20170194539A1 (en) * 2014-06-25 2017-07-06 Dow Corning Corporation Layered Polymer Structures And Methods
US11279827B2 (en) 2016-09-26 2022-03-22 Dow Toray Co., Ltd. Curing reactive silicone gel and use thereof
US10870760B2 (en) 2016-11-21 2020-12-22 Shin-Etsu Chemical Co., Ltd. Epoxy group-containing organopolysiloxane, ultraviolet curable silicone composition, and method of forming a cured film
US11396616B2 (en) 2017-04-06 2022-07-26 Dow Toray Co., Ltd. Liquid curable silicone adhesive composition, cured product thereof, and use thereof
US20210324252A1 (en) * 2018-09-10 2021-10-21 Dow Silicones Corporation Method for producing optical silicone assembly, and optical silicone assembly produced thereby

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KR101986849B1 (ko) 2019-06-07
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KR20130084997A (ko) 2013-07-26
US9268227B2 (en) 2016-02-23
EP2617791A1 (fr) 2013-07-24
EP2617791B1 (fr) 2018-11-21
JP2013147546A (ja) 2013-08-01
US20150261088A1 (en) 2015-09-17
CN103214852A (zh) 2013-07-24
CN103214852B (zh) 2016-12-28
TWI553079B (zh) 2016-10-11

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