US20120264355A1 - Polishing method by blasting and nozzle structure for a blasting apparatus for use in the polishing method - Google Patents

Polishing method by blasting and nozzle structure for a blasting apparatus for use in the polishing method Download PDF

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Publication number
US20120264355A1
US20120264355A1 US13/428,565 US201213428565A US2012264355A1 US 20120264355 A1 US20120264355 A1 US 20120264355A1 US 201213428565 A US201213428565 A US 201213428565A US 2012264355 A1 US2012264355 A1 US 2012264355A1
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Prior art keywords
abrasive
workpiece
accelerated flow
nozzle
introduction path
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US13/428,565
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English (en)
Inventor
Keiji Mase
Masato Hinata
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Fuji Manufacturing Co Ltd
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Fuji Manufacturing Co Ltd
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Assigned to FUJI MANUFACTURING CO., LTD. reassignment FUJI MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HINATA, MASATO, MASE, KEIJI
Publication of US20120264355A1 publication Critical patent/US20120264355A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
    • B24C7/0046—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a gaseous carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00—Devices or accessories for generating abrasive blasts
    • B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
    • B24C5/04—Nozzles therefor

Definitions

  • the present invention relates to a polishing method by blasting and a nozzle structure for a blasting apparatus for realizing the polishing method. More specifically, the present invention relates to a workpiece polishing method which is performed by imparting kinetic energy to abrasive using a compressed gas flow and to a structure of a nozzle portion of a blasting apparatus for realizing the polishing method using the blasting apparatus.
  • polishing methods for improving the flatness, i.e., so-called “surface roughness” of a surface of a workpiece and processing the surface into a smooth surface such as a mirror surface include, for example, polishing using polishing paper or polishing cloth, polishing using a buff, lapping, polishing by contact with rotating abrasive grains, superfinishing in which polishing is performed on a workpiece by contact with abrasive grains given ultrasonic vibration, and the like.
  • blasting in which abrasive is ejected to a surface of a workpiece together with a compressed fluid, e.g., compressed air, to perform cutting is generally not used as polishing processing for improving the flatness of a surface of a workpiece, though blasting is a process relating to a processing technique also using abrasive.
  • a compressed fluid e.g., compressed air
  • abrasive ejected together with a compressed gas or the like is collided with a surface of a workpiece by blasting, and the surface of the workpiece is processed using the collision energy. Accordingly, the abrasive exerts cutting force on the surface of the workpiece W in the vertical (depth) direction. As a result, as shown in FIG. 18 , cutting proceeds while morphological characteristics of irregularities originally existing on the surface of the workpiece are being inherited. Thus, surface planarization is difficult to achieve despite a large amount of cutting.
  • the applicant has proposed a technique for inhibiting a satin finished surface from being produced by ejecting or projecting abrasive having a structure in which abrasive grains are dispersed in a base material which is an elastic body (in this specification, abrasive having such structure is referred to as “elastic abrasive”) onto a surface of a workpiece at a predetermined angle of incidence to cause the collision energy to be absorbed by the plastic deformation of the elastic body, and for enabling blasting to be used for the improvement of flatness by causing the elastic abrasive to slide along the surface to be processed (Japanese Unexamined Patent Application, Publication No. 2006-159402).
  • the applicant has also proposed a technique for improving flatness by generating an ejection flow of abrasive along a surface of a workpiece even in the case where existing abrasive (abrasive grains) is used and where the abrasive is ejected together with a compressed fluid to the surface of the workpiece to be processed under the following conditions:
  • polishing using polishing cloth or polishing paper, lapping, polishing using a grinding wheel and the like must include multiple polishing steps in which the particle diameter of abrasive is gradually decreased because abrasive having a small particle diameter exerts only a weak polishing force. Thus, work becomes complicated.
  • the amount of polishing depends on processing pressure. However, if processing pressure is set low to avoid the excessive occurrence of processing strains, processing speed decreases, and productivity becomes low.
  • processing strains occur in a surface layer of a workpiece undergoing polishing with processing pressure applied thereto.
  • the processing strains occurring in polishing processing may need to be removed in order to secure a perfect crystal layer near the surface of the wafer. Accordingly, a step of heat-treating the wafer which has undergone polishing, removing the surface layer using an agent such as an acid or an alkali, or the like needs to be performed after the polishing processing. Moreover, in the case where the surface layer is removed using an agent such as an acid or an alkali, work therefor is very complicated for reasons such as the necessity of appropriately treating liquid waste of the agent such as an acid or an alkali used at that time.
  • the aforementioned elastic abrasive is used to cause the plastic deformation of the elastic abrasive to absorb the collision energy.
  • the use of abrasive having a special structure is required.
  • abrasive can be made to slide along a surface of a workpiece even in the case where general abrasive (abrasive grains) is used rather than using special abrasive.
  • general abrasive abrasive grains
  • special abrasive abrasive grains
  • the horizontal component of force acting on a surface of a workpiece in the collision of abrasive is set sufficiently larger than the vertical component of the force to prevent collided abrasive grains from producing a satin finished surface on the surface of the workpiece. Unless the angle of incidence ⁇ is set to zero, the vertical component cannot be removed.
  • flatness improvement has been mainly described as one example of the “polishing” of a workpiece.
  • flatness improvement in other polishing works such as the work of reducing the smoothness of (roughening) an original surface and the work of removing a coating provided on a surface, enabling polishing to be performed by relatively simple work similar to that in blasting in a state in which vertical cutting force is inhibited has the following advantages: damage to the workpiece can be reduced; the amount of cutting can be inhibited from increasing more than necessary; and the like.
  • an object of the invention of the present application is to provide a polishing method in which the improvement of flatness of a surface of a workpiece, other adjustments of surface roughness, cutting and removal of a surface portion such as the removal of a surface coating, and other various kinds of polishing can be performed by inhibiting vertical cutting force acting on the surface of the workpiece from occurring and causing horizontal cutting force to be exerted even in the case where general abrasive (abrasive grains) is used rather than using abrasive having a special structure such as elastic abrasive, and to provide a nozzle structure for a blasting apparatus for use in the polishing method.
  • a polishing method by blasting of the present invention comprises the steps of introducing a fluid jet P 1 which is a compressed gas containing no abrasive, into an accelerated flow generation nozzle 10 arranged to be pointed at a surface of a workpiece W and ejecting the compressed gas to generate an accelerated flow S along the surface of the workpiece W by the ejection, and
  • the abrasive 30 may be mixed with a carrier fluid P 2 which is a compressed gas at a pressure lower than the pressure of the ejection fluid P 1 introduced into the accelerated flow generation nozzle 10 , e.g., a pressure which is two-thirds or less of the pressure of the ejection fluid P 1 , to be introduced into the abrasive introduction path 20 .
  • a carrier fluid P 2 which is a compressed gas at a pressure lower than the pressure of the ejection fluid P 1 introduced into the accelerated flow generation nozzle 10 , e.g., a pressure which is two-thirds or less of the pressure of the ejection fluid P 1 , to be introduced into the abrasive introduction path 20 .
  • a nozzle structure for a blasting apparatus (blast nozzle 1 ) of the present invention comprises an accelerated flow generation nozzle 10 for ejecting a compressed gas containing no abrasive supplied as an ejection fluid P 1 from a compressed gas supply source (not shown) toward the surface of the workpiece W to generate an accelerated flow S along the surface of the workpiece W, and
  • the arrangement of the accelerated flow generation nozzle 10 and the abrasive introduction path 20 in the above-described nozzle structure can be realized by arranging an end portion of the accelerated flow generation nozzle 10 on the ejection orifice 11 side in the abrasive introduction path 20 (see FIGS. 1 to 3 ).
  • a configuration may be employed in which the ejection orifice 11 of the accelerated flow generation nozzle 10 is formed into the form of a slit and in which an opening 21 of the abrasive introduction path 20 is arranged parallel to the ejection orifice 11 (see FIGS. 4A and 4B ).
  • the opening 21 of the abrasive introduction path 20 may be arranged on each of opposite sides of the ejection orifice 11 of the accelerated flow generation nozzle 10 (see FIGS. 5A and 5B ).
  • the gap ⁇ 1 between the ejection orifice 11 of the accelerated flow generation nozzle 10 and the surface of the workpiece W is set to, for example, 0.5 to 3.0 mm, and that the gap ( ⁇ 1 + ⁇ 2 ) between the opening 21 of the abrasive introduction path 20 and the surface of the workpiece W is made wider than the gap M between the ejection orifice 11 of the accelerated flow generation nozzle 10 and the surface of the workpiece W by, for example, approximately 1.0 to 3.0 mm (see FIG. 3 ).
  • the polishing method of the present invention has the following significant effects.
  • the ejection of the ejection fluid P 1 to the surface of the workpiece W and the introduction of the abrasive 30 are performed through separately provided routes, i.e., the accelerated flow generation nozzle 10 and the abrasive introduction path 20 , respectively.
  • the abrasive 30 is merged with the accelerated flow S. This enables the abrasive 30 to slide along the surface of the workpiece W together with the accelerated flow S without colliding against the surface of the workpiece in the vertical direction.
  • the carrying of the abrasive 30 is performed using a mixture fluid of the abrasive 30 and the carrier fluid P 2 at a pressure lower than the pressure of the ejection fluid P 1 , preferably the carrier fluid P 2 at a pressure which is two-thirds or less of the pressure of the ejection fluid P 1 .
  • This makes it possible to smoothly introduce the abrasive 30 while greatly inhibiting the abrasive 30 from exerting vertical cutting force on the surface of the workpiece W.
  • the carrier fluid P 2 discharged from the opening 21 of the abrasive introduction path 20 toward the accelerated flow S acts to press the accelerated flow S toward the surface of the workpiece W. Accordingly, the accelerated flow S can be prevented from being separated from the surface of the workpiece W, and the followability of the accelerated flow S to the surface of the workpiece W can be improved.
  • the ejection fluid P 1 ejected from the accelerated flow generation nozzle 10 becomes the accelerated flow S, which is a flow favorably running along the surface of the workpiece W when passing through the gap ⁇ 1 , and is introduced into the gap ( ⁇ 1 + ⁇ 2 ) between the abrasive introduction path 20 and the surface of the workpiece W which is formed wider than the gap ⁇ 1 .
  • the accelerated flow S is not interrupted by the existence of the abrasive introduction path 20 , and the accelerated flow S and the abrasive 30 can be favorably merged at this position.
  • a nozzle structure for a blasting apparatus comprising the accelerated flow generation nozzle 10 for ejecting a compressed gas supplied as an ejection fluid P 1 from the compressed gas supply source (not shown) toward the surface of the workpiece W to generate the accelerated flow S along the surface of the workpiece W, and the abrasive introduction path 20 opening toward the surface of the workpiece W at an area where the accelerated flow S is generated and having the abrasive 30 from the abrasive supply source (not shown) supplied thereto.
  • the abrasive introduction path 20 is made to communicate with the abrasive supply source (not shown) for supplying the abrasive 30 as a mixture fluid with the carrier fluid P 2 which is a compressed gas
  • the carrying and merging of the abrasive 30 can be smoothly performed. Also, as described previously, since the carrier fluid presses the accelerated flow S toward the surface of the workpiece, the accelerated flow S can be favorably prevented from being separated from the surface.
  • the abrasive 30 can be made to slide along the surface of the workpiece W around the entire circumference of the ejection orifice 11 of the accelerated flow generation nozzle 10 .
  • the processing area can be widened.
  • polishing processing can be performed simultaneously over a wide area corresponding to the length of the slit.
  • polishing processing can be performed simultaneously in two opposite directions along the width of the opening of the nozzle 10 from the accelerated flow generation nozzle 10 as a center.
  • FIG. 1 is a schematic cross-sectional view showing a configuration example of a nozzle structure (blast nozzle) for use in a polishing method of the present invention
  • FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1 ;
  • FIG. 3 is an enlarged cross-sectional view of a tip portion of the blast nozzle
  • FIGS. 4A and 4B are explanatory diagrams showing a modified example of the tip portion of the blast nozzle.
  • FIG. 4A is a side cross-sectional view
  • FIG. 4B is a cross-sectional view taken along line B-B of FIG. 4A ;
  • FIGS. 5A and 5B are explanatory diagrams showing a modified example of the tip portion of the blast nozzle.
  • FIG. 5A is a side cross-sectional view
  • FIG. 5B is a cross-sectional view taken along line B-B of FIG. 5A ;
  • FIG. 6 is an explanatory diagram schematically showing the process of cutting a surface of a workpiece by the method of the present invention
  • FIG. 7 is a diagram for explaining RMS (root mean square roughness).
  • FIGS. 8A and 8B are electron micrographs of a surface of an unprocessed test piece (soda glass: minor surface).
  • FIG. 8A is a planar image
  • FIG. 8B is a stereoscopic image;
  • FIGS. 9A and 9B are electron micrographs of a surface of soda glass processed by the method (Example 1) of the present invention.
  • FIG. 9A is a planar image
  • FIG. 9B is a stereoscopic image;
  • FIGS. 10A and 10B are electron micrographs of a surface of soda glass processed by known blasting (Comparative Example 1).
  • FIG. 10A is a planar image
  • FIG. 10B is a stereoscopic image;
  • FIGS. 11A and 11B are electron micrographs of a surface of soda glass processed by the method (Example 2) of the present invention.
  • FIG. 11A is a planar image
  • FIG. 11B is a stereoscopic image;
  • FIGS. 12A and 12B are electron micrographs of a surface of an unprocessed test piece (aluminum alloy: a product with hairline pattern).
  • FIG. 12A is a planar image
  • FIG. 12B is a stereoscopic image;
  • FIGS. 13A and 13B are electron micrographs of a surface of aluminum alloy processed by the method (Example 3) of the present invention.
  • FIG. 13A is a planar image
  • FIG. 13B is a stereoscopic image;
  • FIGS. 14A and 14B are electron micrographs of a surface of aluminum alloy processed by known blasting (Comparative Example 2: ejection pressure is 0.2 MPa).
  • FIG. 14A is a planar image
  • FIG. 14B is a stereoscopic image;
  • FIGS. 15A and 15B are electron micrographs of a surface of aluminum alloy processed by known blasting (Comparative Example 3: ejection pressure is 0.4 MPa).
  • FIG. 15A is a planar image
  • FIG. 15B is a stereoscopic image;
  • FIGS. 16A and 16B are electron micrographs of a surface of aluminum alloy processed by the method (Example 4) of the present invention.
  • FIG. 16A is a planar image
  • FIG. 16B is a stereoscopic image;
  • FIGS. 17A and 17B are electron micrographs of a surface of aluminum alloy processed by the method (Example 5) of the present invention.
  • FIG. 17A is a planar image
  • FIG. 17B is a stereoscopic image;
  • FIG. 18 is an explanatory diagram schematically showing a situation in which cutting is being performed by known blasting.
  • reference numeral 1 denotes a blast nozzle for use in a polishing method of the present invention.
  • the blast nozzle 1 is intended to be attached to a known blasting apparatus (not shown) comprising a compressed gas supply source and an abrasive supply source, thereby making the polishing method of the present invention feasible.
  • the blast nozzle 1 comprises an accelerated flow generation nozzle 10 and an abrasive introduction path 20 .
  • the accelerated flow generation nozzle 10 is made to communicate with a compressed gas supply source provided in an unillustrated blasting apparatus and ejects a compressed gas which is introduced as an ejection fluid P 1 from the compressed gas supply source, to a surface of a workpiece W to generate an accelerated flow S flowing along the surface of the workpiece W.
  • the abrasive introduction path 20 introduces abrasive 30 from an unillustrated abrasive supply source (e.g., an abrasive tank), and merges the abrasive 30 with the accelerated flow S.
  • an unillustrated abrasive supply source e.g., an abrasive tank
  • An opening 21 of the abrasive introduction path 20 is arranged to face the surface of the workpiece W at the position of generation of the aforementioned accelerated flow S.
  • the abrasive introduced into the abrasive introduction path 20 can be merged with the accelerated flow S and made to slide along the surface of the workpiece W.
  • the accelerated flow generation nozzle 10 is formed as a cylindrical nozzle, and the abrasive introduction path 20 is formed into an approximately cylindrical shape having an inner diameter larger than the outer diameter of the accelerated flow generation nozzle 10 . Further, part of the accelerated flow generation nozzle 10 on the tip side is arranged concentrically in the abrasive introduction path 20 . Thus, the opening 21 of the abrasive introduction path 20 is formed around an ejection orifice 11 to surround the entire circumference of the ejection orifice 11 along the outer periphery thereof (see FIG. 2 ).
  • the shapes and arrangement of the accelerated flow generation nozzle 10 and the abrasive introduction path 20 are not restricted to the embodiment shown in FIGS. 1 to 3 .
  • the abrasive introduction path 20 formed into a cylindrical shape in the illustrated example may be formed into the form of a rectangular tube or the like.
  • a configuration may be employed in which the ejection orifice 11 of the accelerated flow generation nozzle 10 is formed into the form of a slit, and in which the opening 21 of the abrasive introduction path 20 is provided parallel to the ejection orifice 11 of the accelerated flow generation nozzle 10 formed into the form of a slit.
  • the opening 21 of the abrasive introduction path 20 may be arranged on each side of the ejection orifice 11 of the accelerated flow generation nozzle 10 (see FIG. 5B ).
  • various design modifications can be made as long as the opening 21 is pointed at the accelerated flow S generated by the accelerated flow generation nozzle 10 , thereby abrasive can be merged with the accelerated flow S by providing the opening 21 of the abrasive introduction path 20 .
  • the arrangement of the accelerated flow generation nozzle 10 and the abrasive introduction path 20 is determined such that the aforementioned ejection orifice 11 of the accelerated flow generation nozzle 10 is arranged to protrude from the opening 21 of the abrasive introduction path 20 in an ejection direction by a small protruding length ( ⁇ 2 in FIG. 3 ).
  • the protruding length ⁇ 2 at a tip portion of the accelerated flow generation nozzle 10 is preferably 1.0 to 3.0 mm.
  • the protruding length ⁇ 2 is set to 1.0 mm so that the gap between the opening 21 of the abrasive introduction path 20 and the surface of the workpiece W becomes larger than the gap ⁇ 1 between the ejection orifice 11 of the accelerated flow generation nozzle 10 and the surface of the workpiece W when the ejection orifice 11 of the accelerated flow generation nozzle 10 is arranged to be pointed at the surface of the workpiece.
  • the introduction of the abrasive 30 into the aforementioned abrasive introduction path 20 may be performed by, for example, allowing abrasive to fall under gravity from an abrasive tank (not shown) arranged at a higher position than the abrasive introduction path 20 .
  • the internal space of the aforementioned abrasive introduction path 20 is made to communicate with an abrasive tank (not shown) pressurized by a carrier fluid P 2 which is a compressed gas, as in the case of an abrasive tank of a direct-pressure blasting apparatus.
  • a carrier fluid P 2 which is a compressed gas
  • an abrasive nozzle 24 is attached to a tip of an abrasive hose 25 communicating with the unillustrated abrasive tank to control the amount of abrasive carried. Further, a tip of the abrasive nozzle 24 is inserted into a connecting pipe 23 communicating with the internal space of the abrasive introduction path 20 so that the abrasive 30 can be introduced into the abrasive introduction path 20 together with the carrier fluid P 2 .
  • the compressed gas supply source of the unillustrated blasting apparatus is made to communicate with the accelerated flow generation nozzle 10 of the blast nozzle 1 configured as described above.
  • a compressed gas at 0.1 to 0.7 MPa is introduced as the aforementioned ejection fluid P 1 into the accelerated flow generation nozzle 10 .
  • the abrasive supply source of the unillustrated blasting apparatus is made to communicate with the abrasive introduction path 20 so that the abrasive 30 can be introduced into the abrasive introduction path 20 .
  • the pressure of the carrier fluid P 2 is set to a pressure lower than the pressure of the ejection fluid P 1 , preferably two-thirds or less of the pressure of the ejection fluid P 1 .
  • the kinds of an ejection fluid introduced into the accelerated flow generation nozzle 10 and a carrier fluid for use in carrying the abrasive 30 are not particularly restricted as long as the ejection fluid and the carrier fluid are compressed gases.
  • compressed air which is generally used in blasting was used.
  • compressed gases can be used in accordance with processing conditions.
  • abrasive to be used is of a particle diameter or a material which creates a risk of dust fire
  • compressed inert gas is used.
  • the blast nozzle 1 is made to communicate with each of the compressed gas supply source and the abrasive supply source of the blasting apparatus, and the ejection fluid is ejected from the ejection orifice 11 of the accelerated flow generation nozzle 10 as shown in FIG. 3 .
  • the gap ⁇ 1 between the tip of the accelerated flow generation nozzle 10 and the surface of the workpiece W is adjusted to a relatively narrow gap, preferably a gap of approximately 0.5 to 3.0 mm (in this embodiment, the gap ⁇ 1 is 1.0 mm) so that when the ejection fluid ejected from the ejection orifice 11 collides against the surface of the workpiece W and passes through the gap 61 between the nozzle tip and the surface of the workpiece W, the ejection fluid ejected from the ejection orifice 11 can change the direction thereof to generate the accelerated flow S along the surface of the workpiece W.
  • the tip portion of the accelerated flow generation nozzle 10 is preferably formed to have a diameter ⁇ (see FIG. 3 ) approximately 1.4 to 2 times the diameter of the ejection orifice 11 .
  • the diameter of the ejection orifice 11 was set to 3 mm
  • the diameter ⁇ of the tip portion of the accelerated flow generation nozzle 10 was set to 5 mm.
  • the ejection fluid P 1 starts to be introduced into the accelerated flow generation nozzle 10 and the abrasive 30 is introduced into the abrasive introduction path 20 solely or as a mixture fluid with the carrier fluid P 2 , the ejection fluid P 1 ejected from the ejection orifice 11 of the accelerated flow generation nozzle 10 is introduced into the gap ⁇ 1 between the accelerated flow generation nozzle 10 and the surface of the workpiece W to change the direction thereof, and is diffused in all directions around the accelerated flow generation nozzle 10 , thus becoming the accelerated flow S flowing along the surface of the workpiece W.
  • the abrasive 30 from the abrasive introduction path 20 is merged with the accelerated flow S.
  • the abrasive 30 joins the accelerated flow S to slide along the surface of the workpiece.
  • the ejection fluid P 1 at a relatively high pressure, i.e., 0.1 to 0.7 MPa (in the embodiment, 0.3 MPa) introduced into the accelerated flow generation nozzle 10 passes through the relatively narrow gap ⁇ 1 of 0.5 to 3 mm (in the embodiment, 1.0 mm) formed between the tip of the accelerated flow generation nozzle 10 and the workpiece W, thus generating the accelerated flow S at a relatively high speed along the surface of the workpiece.
  • the accelerated flow S functions like an air curtain covering the surface of the workpiece W.
  • the introduction of the abrasive into the abrasive introduction path 20 is performed using the carrier fluid P 2 which is a compressed gas, it becomes possible to prevent the abrasive 30 from colliding against the surface of the workpiece W in the vertical direction and therefore prevent the abrasive 30 from exerting cutting force on the surface of the workpiece W in the vertical direction.
  • the pressure of the carrier fluid P 2 is set to a pressure lower than the pressure of the ejection fluid P 1 , preferably two-thirds or less of the pressure of the ejection fluid P 1 , it is possible to greatly inhibit the abrasive 30 from exerting cutting force on the surface of the workpiece W in the vertical direction.
  • the carrier fluid P 2 which is a compressed gas
  • a carrier gas is ejected from the opening 21 of the abrasive introduction path 20 such that the accelerated flow S is pressed against the surface of the workpiece W. Accordingly, the accelerated flow S can be prevented from being separated from the surface of the workpiece W, and can be moved along the surface of the workpiece W over a longer distance.
  • the above-described function of cutting does not scrape off a surface of a workpiece in a depth direction more than necessary. Moreover, since soft polishing is performed only with the energy of a compressed gas, a deep scratch formed by polishing can be prevented from being newly made in an polishing step.
  • the polishing method of the present invention unlike lapping, polishing, and the like, nothing but abrasive touches a workpiece. Accordingly, excess stresses are less prone to occur in the workpiece during and after polishing. Thus, the polishing method of the present invention has the effect of preventing the occurrence of strains and the like. Also, in comparison to conventional general blasting methods, since abrasive is inhibited from colliding against the surface of the workpiece in the vertical direction, stresses and strains are less prone to occur similarly.
  • a blast nozzle used in the examples which will be described below has a structure similar to that described with reference to FIG. 1 .
  • the diameter of the ejection orifice 11 of the accelerated flow generation nozzle 10 was 3 mm
  • the diameter ( ⁇ ) of the nozzle tip portion was 5 mm
  • the diameter of the opening 21 of the abrasive introduction path 20 was 20 mm
  • the protruding length ⁇ 2 at the tip portion of the accelerated flow generation nozzle 10 was 1.0 mm.
  • the gap ⁇ 1 between the tip of the accelerated flow generation nozzle and a surface of a workpiece W was 1.0 mm.
  • a plate body having a width of 90 mm and a length of 90 mm was used as a test piece, and half (45 mm ⁇ 90 mm) of the plate body was observed.
  • Example 1 To confirm differences in the behavior of abrasive at surfaces of test pieces between the polishing method of the present invention (Example 1) and conventional general blasting (Comparative Example 1) in which the abrasive is ejected together with a compressed gas, by performing each of the two processing methods on a surface (minor surface) of a test piece without irregularities and observing changes in the surfaces of the test pieces after processing.
  • Test piece soda glass (minor surface)
  • Abrasive High purity alumina abrasive “FUJIRANDOM WA #220” (average particle diameter: 53 to 45 ⁇ m) manufactured by FUJI MANUFACTURING CO., LTD.
  • Processing time 13 minutes (processing time for the observe area of 45 mm ⁇ 90 mm; the same applies hereinafter)
  • Test Piece Soda glass (Minor surface)
  • Abrasive High purity alumina abrasive “FUJIRANDOM WA #600” (Average particle diameter: 20.0 ⁇ 1.5 ⁇ m) manufactured by FUJI MANUFACTURING CO., LTD.
  • FIGS. 8A and 8B show the state of a surface of an unprocessed test piece (workpiece used in Example 1).
  • FIGS. 9A and 9B show the state of the surface of the test piece of Example 1 after processing.
  • FIGS. 10A and 10B show the state of the surface of the test piece of Comparative Example 1 after processing.
  • each of Ra (arithmetical mean roughness), Ry (maximum peak), Rz (ten-point mean roughness), and tp (load length rate) is compliant with JIS (Japanese Industrial Standard) (JISB 0601-1994) (the same applies hereinafter).
  • JIS Japanese Industrial Standard
  • RMS is “root mean square roughness.”. This value is found as the root of the mean of the squares of deviations of a measured profile from a mean line based on a roughness profile (see FIG. 7 : the same applies hereinafter).
  • Example 1 though abrasive with a large particle diameter, i.e., abrasive having high surface roughening effect was used compared to that of Comparative Example 1, the increase in each parameter of roughness was small (difference in height of the formed irregularities was small) compared to that of Comparative Example 1 on the surface of the test piece after the processing of Example 1. This proves that the processing of Example 1 can greatly inhibit cutting force from exerting on the surface of the test piece in the direction perpendicular thereto.
  • cutting principles of the above-described method (Example 1) of the present invention can prevent damage to a surface of a workpiece caused by the collision of abrasive (abrasive grains) such as in known blasting, and enables the work of thinly scraping off a surface portion of the workpiece, which has been difficult in conventional blasting.
  • Test Piece Soda Glass (after the Processing of Comparative Example 1)
  • Abrasive High purity alumina abrasive “FUJIRANDOM WA #1000” (Average particle diameter: 11.5 ⁇ 1.0 ⁇ m) manufactured By FUJI MANUFACTURING CO., LTD.
  • FIGS. 11A and 11B show the state of the surface of the test piece after the processing of Example 2 (with regard to the state of the surface before processing, see FIGS. 10A and 10B ).
  • each of the values of parameters Ra, Ry, Rz, and RMS indicating surface roughness indicates that in the surface of the test piece after the processing of the present invention, the surface roughness was improved, i.e., the difference in height of irregularities decreased.
  • polishing according to the method of the present invention exerts horizontal cutting force by the sliding of abrasive along the surface of the test piece, and is performed by cutting peaks of irregularities in a horizontal direction.
  • polishing method of the present invention can also be applied to the improvement (smoothing) of flatness of the surface of the workpiece, which was difficult in conventional general blasting.
  • Test piece Aluminum alloy product (A5052P; Alloy No. JIS H4000 (Al—Mg Alloy), P: Plate; Plate material) with hairline pattern
  • Abrasive High purity alumina abrasive “FUJIRANDOM WA #1000” (Average particle diameter: 11.5 ⁇ 1.0 ⁇ m) manufactured by FUJI MANUFACTURING CO., LTD.
  • Test piece Aluminum alloy product (A5052P) with hairline pattern
  • Abrasive High purity alumina abrasive “FUJIRANDOM WA #1000” (Average particle diameter: 11.5 ⁇ 1.0 ⁇ m) manufactured by FUJI MANUFACTURING CO., LTD.
  • Test piece Aluminum alloy product (A5052P) with hairline pattern
  • Abrasive High purity alumina abrasive “FUJIRANDOM WA #1000” (Average particle diameter: 11.5 ⁇ 1.0 ⁇ m) manufactured by FUJI MANUFACTURING CO., LTD.
  • FIGS. 12A and 12B show the state of a surface of an unprocessed test piece (workpiece of Example 3).
  • FIGS. 13A and 13B show the state of a surface of the test piece after the processing of the method (Example 3) of the present invention.
  • FIGS. 14A and 14B show the test piece processed by conventional general blasting (Comparative Example 2) in which ejection pressure was 0.2 MPa.
  • FIGS. 15A and 15B show the test piece processed by conventional general blasting (Comparative Example 3) in which ejection pressure was 0.4 MPa.
  • Example 3 Data on Surface Roughness of Glass Test Pieces (Example 3, Comparative Examples 2 and 3) Parameter Unprocessed*
  • Example 3 Comp. Ex. 2 Comp. Ex. 3 Ra ( ⁇ m) 0.247 0.133 0.279 0.412 Ry ( ⁇ m) 2.540 2.380 4.040 6.310 Rz ( ⁇ m) 2.042 1.818 2.868 5.238 tp (50%) 78.2 63.8 80.6 36.8 RMS ( ⁇ m) 0.305 0.170 0.345 0.518 *The “unprocessed” test piece was the one used in Example 3.
  • hairline pattern recessed grooves and protrusions extending across the width of the test piece: see FIGS. 12A and 12B ) which clearly showed on the surface of the unprocessed test piece completely disappeared ( FIGS. 13A and 13B ) after the processing (Example 3) of the present invention was performed.
  • the polishing method of the present invention can be favorably applied to work such as the improvement of flatness, the removal of tool marks made by various machine parts and the like, and the removal of a coating formed on a surface without causing surface roughening, which cannot be performed by conventional general blasting methods.
  • the value 0.133 ⁇ m of Ra of surface roughness after the processing of Example 3 indicates surface roughness comparable with that obtained when processing is performed by conventional general blasting using fine abrasive of a grit number (approximately #3000) approximately three times as large as that of Example 3.
  • test pieces each made of an aluminum alloy plate (A5052P) with hairline pattern, were processed by the method of the present invention under processing conditions shown in Table 4 below, respectively.
  • Example 3 Abrasive (aforementioned “Fujirandom”) Supply Pressure Average Particle Accelerated Abrasive Processing Example Material Grit No. diameter ( ⁇ m) Flow Supply Time (Min.)
  • Example 3 WA #1000 11.5 ⁇ 1.0 0.3 MPa 0.1 MPa 13
  • Example 4 (Alumina) #3000 4.0 ⁇ 0.5 0.3 MPa 0.2 MPa 10
  • Example 5 #220 53 ⁇ 45 0.3 MPa 0.1 MPa 13
  • FIGS. 16A and 16B show the state of a surface of the test piece after the processing of Example 4.
  • FIGS. 17A and 17B show the state of a surface of the test piece after the processing of Example 5.
  • FIGS. 12A and 12B For the state of a surface of an unprocessed test piece (workpiece of Example 3), see FIGS. 12A and 12B .
  • FIGS. 13A and 13B For the state of a surface of the test piece after processing of Example 3, see FIGS. 13A and 13B .
  • Example 5 Data on Surface Roughness of Aluminum Test Pieces (Examples 3 to 5) Parameter Unprocessed* Example 3
  • Example 4 Example 5 Ra ( ⁇ m) 0.247 0.133 0.182 0.410 Ry ( ⁇ m) 2.540 2.380 3.580 7.940 Rz ( ⁇ m) 2.042 1.818 1.886 5.234 tp (50%) 78.2 63.8 43.2 90.7 RMS ( ⁇ m) 0.305 0.170 0.235 0.528 *The “unprocessed” test piece was the one used in Example 3.
  • Example 3 the pressure of the carrier fluid P 2 for use in carrying abrasive was set to 0.1 MPa.
  • the pressure of the carrier fluid P 2 for use in carrying abrasive was doubled to 0.2 MPa, i.e., increased to two-thirds of the pressure of the ejection fluid P 1 . It was confirmed that despite such a pressure increase, cutting in the vertical direction performed on a surface of a workpiece was inhibited.
  • polishing method using a nozzle having the nozzle structure for a blasting apparatus of the present invention can be utilized in various fields in which the foregoing methods have been performed.
  • the polishing method of the present invention is performed by exerting horizontal cutting force while making abrasive slide along a surface of a workpiece to inhibit vertical cutting force acting on the surface of the workpiece from occurring. Accordingly, damage to the workpiece can be reduced as much as possible, and polishing in which a surface portion is thinly scraped off can be performed by reducing the amount of cutting in the depth direction.
  • the polishing method of the present invention is expected to be used particularly in the following fields.
  • the method of the present invention can be utilized to improve the surface roughness of a workpiece as pretreatment before lapping.
  • the method of the present invention causes less damage to the workpiece as described previously, the method of the present invention is suitable for use in pretreatment before, for example, polishing of a wafer (silicon, quartz, sapphire, or the like).
  • the method of the present invention has the effect of greatly improving surface roughness, it is expected that the labor of lapping to be performed later can be greatly reduced.
  • the sliding of abrasive along a surface of a workpiece enables cutting near the surface without increasing the amount of cutting in the depth direction. Accordingly, in an operation such as the removal of a thin film formed on a surface of a silicon wafer, the thin film can be removed without cutting a base material deeper than necessary.
  • a surface of a workpiece can be very thinly scraped off using abrasive sliding along the surface of the workpiece. Accordingly, for example, by performing the surface treatment of the present invention on a surface of a base material before the formation of a laminated film by sputtering, various kinds of deposition, and the like, the work of removing an oxidation coating and the like existing on the surface and exposing an active surface is thought to be capable of being performed without greatly reducing the flatness of the base material.
  • the bonding strength between the base material and the laminated film can be improved by performing the polishing method of the present invention as pretreatment before the laminated film is formed by sputtering and various kinds of deposition.
  • hairline pattern formed on a test piece can be removed by the method of the present invention as described previously, the method of the present invention can also be favorably utilized in the removal of scratches produced on surfaces of dies, molds, and various machining parts, tool marks produced as traces of contact with bits, and the like.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
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US20130210320A1 (en) * 2012-02-15 2013-08-15 General Electric Company Titanium aluminide article with improved surface finish
US9156131B2 (en) * 2010-08-18 2015-10-13 Fuji Manufacturing Co., Ltd. Method of treating surface of mold
CN113211323A (zh) * 2021-03-05 2021-08-06 贺州学院 一种基于柔性磨粒流的刀具抛光装置及工艺方法
CN113843717A (zh) * 2021-11-09 2021-12-28 西安热工研究院有限公司 热喷涂硬质涂层快速抛光装置及方法

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US9156131B2 (en) * 2010-08-18 2015-10-13 Fuji Manufacturing Co., Ltd. Method of treating surface of mold
US20130084190A1 (en) * 2011-09-30 2013-04-04 General Electric Company Titanium aluminide articles with improved surface finish and methods for their manufacture
US20130210320A1 (en) * 2012-02-15 2013-08-15 General Electric Company Titanium aluminide article with improved surface finish
US9011205B2 (en) * 2012-02-15 2015-04-21 General Electric Company Titanium aluminide article with improved surface finish
CN113211323A (zh) * 2021-03-05 2021-08-06 贺州学院 一种基于柔性磨粒流的刀具抛光装置及工艺方法
CN113843717A (zh) * 2021-11-09 2021-12-28 西安热工研究院有限公司 热喷涂硬质涂层快速抛光装置及方法

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KR101940571B1 (ko) 2019-04-10
JP5746901B2 (ja) 2015-07-08

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