US20120123023A1 - (meth)acrylate polymer, a resin composition and a shaped article - Google Patents

(meth)acrylate polymer, a resin composition and a shaped article Download PDF

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US20120123023A1
US20120123023A1 US13/255,726 US201013255726A US2012123023A1 US 20120123023 A1 US20120123023 A1 US 20120123023A1 US 201013255726 A US201013255726 A US 201013255726A US 2012123023 A1 US2012123023 A1 US 2012123023A1
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meth
acrylate polymer
acrylate
mass
monomer mixture
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Tsuneki Wakita
Toshihiro Kasai
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Mitsubishi Rayon Co Ltd
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Mitsubishi Rayon Co Ltd
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Assigned to MITSUBISHI RAYON CO., LTD. reassignment MITSUBISHI RAYON CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KASAI, TOSHIHIRO, WAKITA, TSUNEKI
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

Definitions

  • the present invention relates to a (meth)acrylate polymer, a resin composition comprising the (meth)acrylate polymer, a shaped article obtained with shaping of the resin composition, a process for producing the (meth)acrylate polymer, and a process for producing a powdery (meth)acrylate polymer.
  • the resin composition of the present invention is specifically useful as sealing materials for semiconductors, and adhesives.
  • Resin-shaped articles are produced for various applications such as electric or electronic parts, auto parts and building materials.
  • At least one kind of resin and at least one kind of additive are applied for obtaining of required performance depending on an object.
  • plastic sealing using a epoxy resin composition is adopted mainly.
  • Plastic sealing with the epoxy resin composition is excellent in mass productivity and products can be obtained cheaply.
  • epoxy resins are much applied to insulating layers of laminated sheets for electric insulation or printed wiring boards.
  • the object of the present invention is to provide a (meth)acrylate polymer which is excellent in dispersibility of primary particles in a resin, which gives excellent storage stability of a resin composition obtained, and which gives excellent reduction in elastic modulus and insulating properties of a shaped article obtained.
  • the present invention is a (meth)acrylate polymer having a volume average primary particle size of 0.520 to 3.00 ⁇ m, a peak temperature of tan ⁇ in the range of ⁇ 100 to 0° C., determined with dynamic viscoelasticity measurement, of ⁇ 40° C. or below, a peak height of tan ⁇ in the range of ⁇ 100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more, and an acetone-insoluble component of 99% by mass or more.
  • the present invention is a resin composition comprising the (meth)acrylate polymer and a resin.
  • the present invention is a shaped article obtained with shaping of the resin composition.
  • the present invention is a sealing material for semiconductors comprising the (meth)acrylate polymer and a resin.
  • the present invention is an adhesive comprising the (meth)acrylate polymer and a resin.
  • the present invention is a process for producing the (meth)acrylate polymer comprising polymerization of monomer mixture (b) in the presence of rubbery (meth)acrylate polymer (A), wherein monomer mixture (b) comprises cross-linkable monomer (b1), the content of rubbery (meth)acrylate polymer (A) is 81 to 98% by mass and the content of monomer mixture (b) is 2 to 19% by mass (total of rubbery (meth)acrylate polymer (A) and monomer mixture (b) is 100% by mass), and the (meth)acrylate polymer has the volume average primary particle size of 0.520 to 3.00 ⁇ m and the peak temperature of tan ⁇ in the range of ⁇ 100 to 0° C., determined with dynamic viscoelasticity measurement, of ⁇ 40° C. or below.
  • the present invention is a process for producing a powdery (meth)acrylate polymer comprising polymerization of monomer mixture (b) in the presence of rubbery (meth)acrylate polymer (A) and spray-drying of a latex of the (meth)acrylate polymer, wherein monomer mixture (b) comprises cross-linkable monomer (b1), a composition ratio of rubbery (meth)acrylate polymer (A) and monomer mixture (b) at the point of polymerization of monomer mixture (b) is 81 to 98% by mass of rubbery (meth)acrylate polymer (A) and 2 to 19% by mass of monomer mixture (b) (total of rubbery (meth)acrylate polymer (A) and monomer mixture (b) is 100% by mass), and the (meth)acrylate polymer has the volume average primary particle size of 0.520 to 3.00 ⁇ m and the peak temperature of tan ⁇ in the range of ⁇ 100 to 0° C., determined with dynamic viscoelasticity measurement,
  • the resin composition of the present invention is useful as sealing materials for semiconductors and adhesives.
  • FIG. 1 shows tan ⁇ curves in ⁇ 100 to 0° C. determined with dynamic viscoelasticity measurement of (meth)acrylate polymers obtained with Examples 1 to 3 and Comparative example 1.
  • FIG. 2 shows tan ⁇ curves in ⁇ 100 to 0° C. determined with dynamic viscoelasticity measurement of (meth)acrylate polymers obtained with Examples 2 and 6, and Comparative example 3.
  • the (meth)acrylate polymer of the present invention has the peak temperature of tan ⁇ in ⁇ 100 to 0° C., determined with dynamic viscoelasticity measurement, of ⁇ 40° C. or below.
  • (meth)acrylate shows “acrylate” or “methacrylate” in the present specification.
  • the peak temperature of tan ⁇ is ⁇ 40° C. or below, preferably ⁇ 45° C. or below, and more preferably ⁇ 48° C. or below.
  • the peak temperature of tan ⁇ is preferably ⁇ 90° C. or above, and more preferably ⁇ 80° C. or above.
  • the peak temperature of tan ⁇ can be set appropriately with adjustment of glass transition temperature of rubbery (meth)acrylate polymer (A) in the (meth)acrylate polymer.
  • a glass transition temperature of rubbery (meth)acrylate polymer (A) may be designed to be ⁇ 40° C. or below to make the peak temperature of tan ⁇ ⁇ 40° C. or below, and a glass transition temperature of rubbery (meth)acrylate polymer (A) may be designed to be ⁇ 90° C. or below to make the peak temperature of tan ⁇ ⁇ 90° C. or below.
  • the glass transition temperature of rubbery (meth)acrylate polymer (A), to make the peak temperature of tan ⁇ ⁇ 40° C. or below, is 40° C. or below, preferably ⁇ 45° C. or below, and more preferably ⁇ 48° C. or below.
  • a polymer can not show sufficient rubber elasticity at the temperature lower than the glass transition temperature of the polymer.
  • the glass transition temperature of rubbery (meth)acrylate polymer (A) be lower, namely, as the peak temperature of tan ⁇ of the (meth)acrylate polymer be lower, from the viewpoint that rubber elasticity at a lower temperature can be developed.
  • the (meth)acrylate polymer of the present invention has the peak height of tan ⁇ in the range of ⁇ 100 to 0° C., determined with dynamic viscoelasticity measurement, of 0.300 or more.
  • the peak height of tan ⁇ is 0.300 or more, preferably 0.350 or more, more preferably 0.400 or more, and further more preferably 0.450 or more.
  • the peak height of tan ⁇ is preferably 1.00 or less, more preferably 0.900 or less, and further more preferably 0.800 or less.
  • the peak height of tan ⁇ can be set appropriately with adjustment of the content of rubbery (meth)acrylate polymer (A) in the (meth)acrylate polymer and the content of cross-linkable monomer (a1) in monomer mixture (a) to be used for obtaining of rubbery (meth)acrylate polymer (A).
  • the content of rubbery (meth)acrylate polymer (A) in the (meth)acrylate polymer may be designed to be in the range of 81% by mass or more in 100% by mass of the (meth)acrylate polymer and the content of cross-linkable monomer (a1) in monomer mixture (a) to be used for obtaining of rubbery (meth)acrylate polymer (A) may be designed to be in the range of 2.5% by mass or less in 100% by mass of monomer mixture (a).
  • the content of rubbery (meth)acrylate polymer (A) in the (meth)acrylate polymer, to make the peak height of tan ⁇ 0.300 or more, is 81% by mass or more, preferably 83% by mass or more, and more preferably 86% by mass or more, in 100% by mass of the (meth)acrylate polymer.
  • the content of rubbery (meth)acrylate polymer (A) in the (meth)acrylate polymer can be confirmed with the use of an analyser such as a pulsed NMR.
  • the content of cross-linkable monomer (a1) in monomer mixture (a) to be used for obtaining of rubbery (meth)acrylate polymer (A), to make the peak height of tan ⁇ 0.300 or more, is 2.5% by mass or less, preferably 2.3% by mass or less, and more preferably 2.0% by mass or less.
  • the peak height of tan ⁇ of the (meth)acrylate polymer be higher, from the viewpoint that rubber elasticity can be developed.
  • Dynamic viscoelasticity measurement in the present invention was carried out under conditions of a rate of increasing temperature of 2° C./m and frequency of 10 Hz, with a dual cantilever bending mode with the use of a dynamic mechanical analyser.
  • the peak temperature of tan ⁇ and the peak height of tan ⁇ were determined with a peak in the range of ⁇ 100 to 0° C. of the tan ⁇ curve obtained with the above measurement.
  • Rubbery (meth)acrylate polymer (A) having a glass transition temperature of lower than ⁇ 40° C. can be obtained with polymerization of monomer mixture (a) comprising (meth)acrylate monomer (a2) which gives a homopolymer having a glass transition temperature of ⁇ 40° C. or below and which is a main component.
  • a glass transition temperature of a homopolymer can be confirmed with the use of publicly known methods for measurement such as dynamic viscoelasticity analysis, differential scanning calorimetry, thermogravimetry-differential thermal analysis, and thermomechanical analysis.
  • Examples of (meth)acrylate monomer (a2) include 2-ethylhexyl acrylate, isooctyl acrylate, 2-methoxyethyl acrylate, and ethylcarbitol acrylate.
  • Method (Meth)acrylate monomer (a2) may be used alone or in combination.
  • the content of (meth)acrylate monomer (a2) is preferably 69.999 to 99.999% by mass, more preferably 79.99 to 99.99% by mass, and further more preferably 89.9 to 99.9% by mass, in 100% by mass of monomer mixture (a).
  • the content of the (meth)acrylate monomer (a2) is 99.999% by mass or less, the acetone-insoluble component of the (meth)acrylate polymer shows 99% by mass or more, and as a result, the resin composition obtained has excellent storage stability.
  • Monomer mixture (a) can contain other monomer (a3) except (meth)acrylate monomer (a2) if necessary in the extent that the peak temperature of tan ⁇ of the (meth)acrylate polymer is ⁇ 40° C. or below.
  • Examples of other monomer (a3) include (meth)acrylates, which give homopolymers having glass transition temperatures of higher than 40° C., such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, and i-butyl (meth)acrylate; aromatic vinyl monomers such as styrene, ⁇ -methyl styrene, and alkyl-substituted styrenes; vinyl cyanides such as acrylonitrile and methacrylonitrile; vinyl monomers having glycidyl group such as glycidyl (meth)acrylate and allyl glycidyl ether; vinyl monomers having hydroxyl group such as hydroxy (meth)acrylate; (meth)acryl group-modified silicones; and halogen-containing vinyl monomers.
  • (meth)acrylates which give homopolymers having glass transition temperatures
  • the content of other monomer (a3) is preferably 30% by mass or less, more preferably 20% by mass or less, and further more preferably 10% by mass or less, in 100% by mass of monomer mixture (a).
  • the peak temperature of tan ⁇ of the (meth)acrylate polymer shows ⁇ 40° C. or below, and as a result, the shaped article obtained has excellent reduction in elastic modulus at low temperature.
  • Monomer mixture (a) may contain cross-linkable monomer (a1) if necessary.
  • cross-linkable monomer (a1) examples include ethyleneglycol di(meth)acrylate, propylene glycol di(meth)acrylate, 1,3-butylene glycol di(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, allyl (meth)acrylate, triallyl cyanurate, triallyl isocyanurate, divinylbenzene, and polyfunctional (meth)acryl group-modified silicones.
  • Cross-linkable monomer (a1) may be used alone or in combination.
  • cross-linkable monomer (a1) such as allyl (meth)acrylate, triallyl cyanurate, and triallyl isocyanurate has a function as well as a graftlinking agent.
  • the content of cross-linkable monomer (a1) is preferably 0.0001 to 2.5% by mass, more preferably 0.01 to 2.3% by mass, and further more preferably 0.1 to 2.0% by mass, in 100% by mass of monomer mixture (a).
  • the content of cross-linkable monomer (a1) is 0.001% by mass or more, the acetone-insoluble component of the (meth)acrylate polymer shows 99% by mass or more, and as a result, the resin composition obtained has excellent storage stability.
  • the content of cross-linkable monomer (a1) is 2.5% by mass or less, the peak height of tan ⁇ of the (meth)acrylate polymer shows 0.300 or more, and as a result, the shaped article obtained has excellent reduction in elastic modulus at low temperature.
  • a polymerization method of monomer mixture (a) is not limited especially.
  • Examples of the above polymerization include emulsion polymerization, soap-free polymerization, soap-free emulsified polymerization, dispersion polymerization, swelling polymerization, mini-emulsion polymerization, and micro suspension polymerization.
  • polymerization initiator for polymerization of monomer mixture (a), well-known polymerization initiators can be used.
  • polymerization initiators without containing metal ions from the viewpoint that no remaining of metal ions can be achieved in the case of obtaining of the powdery (meth)acrylate polymer with the use of spray-drying.
  • Examples of the polymerization initiator without containing metal ions include azo compounds such as 2,2′-azobisisobutyronitrile, 4,4′-azobis-(4-cyanovaleric acid), and 2,2′-azobis-[N-(2-carboxyethyl)-2-methyl propione amidine]; persulfuric acid compounds such as ammonium persulfate; organic peroxides such as diisopropyl benzene hydroperoxide, p-menthane hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; and redox initiators using the persulfuric acid compounds or the organic peroxides.
  • azo compounds such as 2,2′-azobisisobutyronitrile, 4,4′-azobis-(4-cyanovaleric acid), and 2,2′-azobis-[N-(2-carboxyethyl)-2-methyl propione amidine]
  • persulfuric acid compounds such as am
  • polymerization initiators may be used alone or in combination.
  • emulsifier for polymerization of monomer mixture (a), well-known emulsifiers can be used.
  • the emulsifier examples include alkali metal salts or ammonium salts of higher fatty acids such as disproportionated rosin acids, oleic acid, and stearic acid; alkali metal salts or ammonium salts of sulfonic acids such as dodecyl benzene sulfonic acid; and nonionic emulsifiers.
  • ammonium salt-type anionic emulsifiers or nonionic emulsifiers from the viewpoint that no remaining of metal ions can be achieved in the case of obtaining of the powdery (meth)acrylate polymer with the use of spray-drying.
  • ammonium salt-type anionic emulsifiers it is preferable using lauryl ammonium sulfate or di-(2-ethylhexyl)sulfosuccinic acid ammonium from the viewpoint of excellent stability of emulsion polymerization.
  • nonionic emulsifiers it is preferable using polyoxyethylene (85) monotetradecyl ether or polyoxyethylene distyrene phenyl ether from the viewpoint of excellent stability of emulsion polymerization.
  • a chain transfer agent can be used if necessary.
  • Rubbery (meth)acrylate polymer (A) may have a monolayer structure or a multilayer structure with 2 steps.
  • At least two kinds of rubbery (meth)acrylate polymer (A) may be composited.
  • the (meth)acrylate polymer of the present invention has the acetone-insoluble component of 99% by mass or more.
  • the acetone-insoluble component is 99% by mass or more, preferably 99.5% by mass or more, and more preferably 99.8% by mass or more.
  • the resin composition obtained has excellent storage stability.
  • the (meth)acrylate polymer of the present invention has the acetone-insoluble component of 99% by mass or more, so that the (meth)acrylate polymer of the present invention does not include a (meth)acrylate type thermoplastic elastomer having the acetone-insoluble component of less than 99% by mass.
  • the acetone-insoluble component can be set appropriately with adjusting of the content of cross-linkable monomer (a1) in monomer mixture (a) and the content of cross-linkable monomer (b1) in monomer mixture (b).
  • the acetone-insoluble component in the present invention was measured as follows.
  • the powdery (meth)acrylate polymer is weighed with approximately 1 g and added in an eggplant-shaped flask, and then 50 mL of acetone is added.
  • the inside of the flask After cooling of the inside of the flask, the inside of the flask is moved in a cell for centrifugation, and centrifugation is carried out with 14,000 rpm, at 4° C. for 30 minutes.
  • the cell After 50 mL of acetone is added in the cell, the cell is dipped in a supersonic water bath (40 mm ⁇ 240 mm ⁇ 150 mm) in which 1,000 g of deionized water was served, and then sonication is carried out at 100 W for more than 30 minutes.
  • a supersonic water bath 40 mm ⁇ 240 mm ⁇ 150 mm
  • the solid component After preliminary drying of a solid component obtained at 68° C. for 3 hours, the solid component is dried with 1,333 Pa, at 50° C. for 12 hours, and then the solid is weighed as the acetone-insoluble component.
  • the acetone-insoluble component is calculated with Formula 1 based on mass of the powdery (meth)acrylate polymer used and mass of the acetone-insoluble component.
  • Acetone-insoluble component [%] ⁇ [mass of acetone-insoluble component]/[mass of powdery (meth)acrylate polymer used] ⁇ 100 (Formula 1)
  • the content of cross-linkable monomer (a1), in monomer mixture (a), to make the acetone-insoluble component 99% by mass or more is 0.001% by mass or more, preferably 0.01% by mass or more, and more preferably 0.1% by mass or more, in 100% by mass of monomer mixture (a).
  • the content of cross-linkable monomer (b1), in monomer mixture (b), to make the acetone-insoluble component 99% by mass or more is 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 2% by mass or more, in 100% by mass of monomer mixture (b).
  • cross-linkable monomer (b1) contained in monomer mixture (b) examples include ethyleneglycol di(methi)acrylate, propylene glycol di(meth)acrylate, 1,3-butylene glycol di(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, divinylbenzene, polyfunctional (meth)acryl group-modified silicones, and allyl (meth)acrylate.
  • Cross-linkable monomer (b1) may be used alone or in combination.
  • cross-linkable monomer (b1) it is preferable using allyl(meth)acrylate, ethyleneglycol di(methi)acrylate or divinylbenzene, and allyl(meth)acrylate is more preferable, from the viewpoint of polymerization stability of monomer mixture (b).
  • the content of cross-linkable monomer (b1) is preferably 0.1 to 30% by mass, more preferably 0.5 to 20% by mass, and further more preferably 2 to 8% by mass, in 100% by mass of monomer mixture (b).
  • the content of cross-linkable monomer (b1) is 0.1% by mass or more, the acetone-insoluble component shows 99% by mass or more, and as a result, the resin composition obtained has excellent storage stability.
  • the shaped article obtained has excellent reduction in elastic modulus at low temperature.
  • Monomer mixture (b) contains vinyl monomer (b2) except cross-linkable monomer (b1).
  • vinyl monomer (b2) examples include alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, and i-butyl (meth)acrylate; aromatic vinyl monomers such as styrene, ⁇ -methyl styrene, and alkyl-substituted styrenes; vinyl cyanides such as acrylonitrile and methacrylonitrile; vinyl monomers having glycidyl group such as glycidyl (meth)acrylate and allyl glycidyl ether; vinyl monomers having hydroxy group such as hydroxy (meth)acrylate; (meth)acryl group-modified silicones; and halogen-containing vinyl monomers.
  • alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n
  • These monomers may be used alone or in combination.
  • vinyl monomer (b2) it is preferable using alkyl (meth)acrylates, aromatic vinyl monomers, vinyl cyanides, or vinyl monomers having glycidyl group, more preferable using an alkyl (meth)acrylate such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, or i-butyl (meth)acrylate; or a vinyl monomer having glycidyl group such as glycidyl (meth)acrylate or allyl glycidyl ether, and further more preferable using methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, or glycidyl (meth)acrylate from the viewpoint of excellent polymerization stability, excellent affinity with an epoxy resin, and excellent heat resistance of the shaped article obtained.
  • the content of vinyl monomer (b2) is preferably 70 to 99.9% by mass, more preferably 80 to 99.5% by mass, and further more preferably 92 to 98% by mass, in 100% by mass of monomer mixture (b).
  • the shaped article obtained has excellent reduction in elastic modulus at low temperature.
  • the content of vinyl monomer (b2) is 99.9% by mass or less, the acetone-insoluble component shows 99% by mass or more, and as a result, the resin composition obtained has excellent storage stability.
  • the polymer of monomer mixture (b) in the present invention may have a monolayer structure or a multilayer structure with 2 steps.
  • a polymerization method of monomer mixture (b) is not limited especially.
  • Examples of the above polymerization include emulsion polymerization, soap-free polymerization, dispersion polymerization, swelling polymerization, mini-emulsion polymerization, and micro suspension polymerization.
  • Spherical polymer particles are preferable from the viewpoint that rise of viscosity of the resin composition obtained is restrained and the resin composition has excellent flowability in the case of blending of a powdery polymer.
  • polymerization initiator for polymerization of monomer mixture (b), there can be used the same compounds as polymerization initiators to be used for polymerization of monomer mixture (a).
  • an emulsifier may be used if necessary.
  • emulsifier to be used for polymerization of monomer mixture (b) there can be used the same compounds as emulsifiers to be used for polymerization of monomer mixture (a).
  • a chain transfer agent can be used if necessary.
  • the contents of rubbery (meth)acrylate polymer (A) and monomer mixture (b) in the case of polymerization of the monomer mixture (b) are 81 to 98% by mass of rubbery (meth)acrylate polymer (A) and 2 to 19% by mass of monomer mixture (b), preferably 83 to 96% by mass of rubbery (meth)acrylate polymer (A) and 4 to 17% by mass of monomer mixture (b), and further more preferably 86 to 93% by mass of rubbery (meth)acrylate polymer (A) and 7 to 14% by mass of monomer mixture (b), in 100% by mass of rubbery (meth)acrylate polymer (A) and monomer mixture (b) in total.
  • the resin composition obtained has excellent storage stability.
  • the resin composition obtained has excellent storage stability.
  • the peak height of tan ⁇ of the (meth)acrylate polymer shows 0.300 or more, and as a result, the shaped article obtained has excellent reduction in elastic modulus at low temperature.
  • the (meth)acrylate polymer of the present invention has the volume average primary particle size of 0.520 to 3.00 ⁇ m.
  • the volume average primary particle size of the (meth)acrylate polymer is 0.520 to 3.00 ⁇ m, preferably 0.530 to 2.00 ⁇ m, and more preferably 0.550 to 1.50 ⁇ m.
  • the volume average primary particle size of the (meth)acrylate polymer is 0.520 ⁇ m or more, the primary particles of the (meth)acrylate polymer in the resin is excellent in dispersibility.
  • the volume average primary particle size of the (meth)acrylate polymer is 3.00 ⁇ m or less, the shaped article obtained does not lost original characteristics of the resin.
  • Examples of methods for adjusting the volume average primary particle size include a method to adjust amounts of an emulsifier and a method to adjust the ratio of a monomer to a dispersion medium.
  • soap-free emulsion polymerization which is a method of performing of emulsion polymerization after obtaining of seed particles with soap-free polymerization, from the viewpoint of easiness of controlling of the volume average primary particle size.
  • the volume average primary particle size of the (meth)acrylate polymer of the present invention was determined by measurement of a laser diffraction scattering method with the use of a laser diffraction/particle size distribution analyser.
  • the latex of the (meth)acrylate polymer obtained may contain antioxidants and additives if necessary.
  • antioxidants examples include phenolic antioxidants such as IRGANOX 1076 DWJ, IRGANOX 245 DWJ and IRGASTAB MBS 11 (products made in Ciba Japan Co., Ltd.) and composite type antioxidants such as ADEKASTAB LX-803 (made in ADEKA Corporation).
  • Examples of the method for producing the powdery polymer include a spray-drying method, freeze-drying method, and coagulation method.
  • a spray-drying method is preferable from the viewpoint of excellent dispersibility of the (meth)acrylate polymer in the resin.
  • the spray-drying method is a method of drying of microdroplets, which is obtained with spraying of a latex, with exposing of a hot wind.
  • Examples of a type to generate microdroplets include a rotation disk type, pressure nozzle type, two-fluid pressure nozzle type, and two-fluid nozzle type.
  • a capacity of the dryer there can be used any scale from a small scale used in a laboratory to an extensive scale used industrially.
  • a location of an inlet-portion which is a feed section of heated gas for drying, and a location of an outlet portion which is an exhaust port of heated gas for drying and the powder may be the same as portions of spray dryers which are usually used.
  • the temperature (inlet temperature) of the hot wind to be introduced in a dryer namely the maximum temperature of the hot wind which can contact with a graft copolymer is preferably 100 to 200° C., and more preferably 120 to 180° C., from the viewpoint of excellent dispersibility of primary particles of the (meth)acrylate polymer in the resin.
  • the latex of the (meth)acrylate polymer used for spray-drying may be one kind or a mixture of plural latices.
  • spray-drying can be carried out for the latex, in which additives such as silica was added, for improving of powder characteristics such as blocking in spray-drying and bulk specific gravity.
  • the volume average particle size of the powdery (meth)acrylate polymer obtained with spray-drying is preferably 5 to 300 ⁇ m, more preferably 10 to 220 ⁇ m, and further more preferably 20 to 200 ⁇ m.
  • volume average particle size of the powdery (meth)acrylate polymer is 5 ⁇ m or more, powder rarely flies, so that the volume average particle size of the powdery (meth)acrylate polymer is excellent in powder handling characteristics.
  • the volume average particle size of the powder of the (meth)acrylate polymer is 300 ⁇ m or less, the primary particles of the (meth)acrylate polymer in the resin is excellent in dispersibility.
  • a moisture content in the powdery (meth)acrylate polymer is preferably 1.5% by mass or less, and more preferably 1.0% by mass or less, in 100% by mass of the powdery (meth)acrylate polymer.
  • the content of each of metal ions in the powdery (meth)acrylate polymer is preferably less than 10 ppm.
  • the shaped article obtained has excellent insulating properties.
  • the content of sulfate ion in the powdery (meth)acrylate polymer is preferably less than 500 ppm, and more preferably less than 300 ppm.
  • the shaped article obtained has excellent insulating properties.
  • the content of ionic impurities such as metal ions or sulfate ion in the powdery (meth)acrylate polymer is based on the content of ions extracted with hot water extraction.
  • the (meth)acrylate polymer of the present invention is useful as an additive for the resin with stress relaxation properties, and is specifically useful as an additive for an epoxy resin with stress relaxation properties, from the viewpoint of getting reduction in elastic modulus of the shaped article obtained with blending.
  • the resin composition of the present invention comprises the (meth)acrylate polymer of the present invention and the resin.
  • thermoplastic resin a variety of curable resins or thermoplastic resins are applied.
  • curable resins are preferable and epoxy resins are more preferable, from the viewpoint of an effect as a resin type additive of the (meth)acrylate polymer.
  • the curable resin examples include an epoxy resin, a phenol resin, an unsaturated polyester resin, a melamine resin, and an urea resin.
  • These resins may be used alone or in combination.
  • epoxy resin well-known epoxy resins can be used, and a molecular structure or molecular weight of the epoxy resin is not restricted specifically.
  • epoxy resin examples include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, bisphenol E type epoxy resins, naphthalen type epoxy resins, biphenyl type epoxy resins, dicyclopentadiene type epoxy resins, phenol novolac type epoxy resins, cycloaliphatic epoxy resins, and glycidyl amine type epoxy resins.
  • examples of the epoxy resin include prepolymers of the above epoxy resins; copolymers of the epoxy resin and other polymers such as polyether modified epoxy resins and silicone modified epoxy resins; and resins of which a part of epoxy resins are substituted for reactive diluents.
  • epoxy resins may be used alone or in combination.
  • Examples of the reactive diluent include mono glycidyl compounds such as resorcin glycidyl ether, t-butyl phenyl glycidyl ether, 2-ethylhexy glycidyl ether, allyl glycidyl ether, phenyl glycidyl ether, 3-glycidoxy propyl trimethoxy silane, 3-glycidoxy propyl methyl dimethoxy silane, 1-(3-glycidoxy propyl)-1,1,3,3,3-pentamethylsiloxane, and N-glycidyl-N,N-bis-[3-(trimethoxysilyl)propyl]amine; monocycloaliphatic epoxy compounds such as 2-(3,4-epoxy cyclohexyl)ethyl trimethoxysilane.
  • mono glycidyl compounds such as resorcin glycidyl ether
  • reactive diluents may be used alone or in combination.
  • Examples of a curing agent of the epoxy resin include acid anhydrides, amine compounds, and phenolic compounds.
  • acid anhydrides are preferable from the viewpoint of excellent heat resistance or chemical resistance of a cured resin.
  • Curing ability of the epoxy resin or properties of the cured epoxy resin can be adjusted with the use of the curing agent.
  • Examples of the acid anhydride include phthalic anhydride, methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyl tetrahydrophthalic anhydride, methyl himick acid anhydride, methylcyclohexene dicarboxylic acid anhydride, trimellitic anhydride, pyromellitic acid anhydride, benzophenone tetracarboxylic acid anhydride, ethylene glycol bis (anhydrotrimellitates), glycerol tris (anhydrotrimellitates), dodecenyl succinic anhydride, polyazelaic polyanhydride, and poly (ethyl octadecanedioic acid) anhydride.
  • methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride are preferable in an application that weather resistance, light resistance, or heat resistance is required.
  • Examples of the amine compound include 2,5(2,6)-bis(aminomethyl)bicycle[2,2,1]heptane, isophorone diamine, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, diethylamino propylamine, bis-(4-amino-3-methyl dicyclohexyl)methane, diamino dicyclohexylmethane, bis(aminomethyl)cyclohexane, meta phenylenediamine, diaminodiphenyl methane, diaminodiphenyl sulphone, diaminodiethyl diphenylmethane, and diethyltoluene diamine.
  • amine compounds may be used alone or in combination.
  • phenolic compound examples include phenolic novolac resins, creosol novolac resins, bisphenol A, bisphenol F, bisphenol AD, and diallyl derivatives of the bisphenols.
  • phenolic compounds may be used alone or in combination.
  • the amount of the curing agent of the epoxy resin is not restricted specifically, but it is necessary to consider a stoichiometric quantity of epoxy group.
  • an accelerator or a latent curing agent may be used if necessary.
  • accelerator well-known accelerators can be used.
  • the accelerator include imidazole compounds such as 2-methyl imidazole and 2-ethyl-4-methyl imidazoles; adducts of imidazole compounds and the epoxy resin; organophosphorous compounds such as triphenylphosphine; borates such as tetraphenyl phosphine tetraphenylborate; and Diazabicyclo undecene.
  • These accelerators may be used alone or in combination.
  • the latent curing agent is a solid at room temperature, and it liquefies in heat curing of the epoxy resin to act as the curing agent.
  • latent curing agent examples include dicyandiamide, carbohydrazide, oxalic dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, imino diacetic acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, suberic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, dodecane dihydrazide, hexadecane dihydrazide, maleic acid dihydrazide, fumaric acid dihydrazide, diglycolic acid dihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 4,4′-bis benzene dihydrazide, 1,4-naphtho
  • the content of the (meth)acrylate polymer in the resin composition of the present invention is preferably 0.1 to 50 parts by mass and more preferably 0.5 to 30 parts by mass, in 100% by mass of the resin.
  • the resin composition of the present invention may contain additives if necessary.
  • the additive examples include releasing agents such as silicone oil, natural wax, and synthetic wax; powder such as crystalline silica, fused silica, calcium silicate, and alumina; fibers such as glass fiber and carbon fiber; flame retardants such as antimony trioxide; halogen-trapping agents such as hydrotalcite and rare earth oxides; colorants such as carbon black and blood red; and silane coupling agents.
  • releasing agents such as silicone oil, natural wax, and synthetic wax
  • powder such as crystalline silica, fused silica, calcium silicate, and alumina
  • fibers such as glass fiber and carbon fiber
  • flame retardants such as antimony trioxide
  • halogen-trapping agents such as hydrotalcite and rare earth oxides
  • colorants such as carbon black and blood red
  • silane coupling agents examples include releasing agents such as silicone oil, natural wax, and synthetic wax; powder such as crystalline silica, fused silica, calcium silicate, and alumina; fibers such as glass fiber and carbon fiber; flame retardants
  • An example of methods for preparing the resin composition of the present invention include pulverization or tablet-making after cooling a mixture which was obtained with mixing of the resin composition under a solution state, or under melted state with the use of a mixing roll or kneader.
  • water as a dispersing medium of a latex of the (meth)acrylate polymer is substituted with a solvent. Then, the solvent is substituted with a fluidal epoxy resin.
  • the (meth)acrylate polymer is blended with the epoxy resin.
  • composition of the (meth)acrylate polymer and the epoxy resin by blending the epoxy resin with the powdery (meth)acrylate polymer after powdering a latex of the (meth)acrylate polymer, from the viewpoint that the process is simple, and the (meth)acrylate polymer of the present invention has sufficiently excellent dispersibility as primary particles in the resin.
  • the shaped article of the present invention is obtained with shaping of the resin composition of the present invention.
  • Examples of the molding process include a transfer molding, sheet molding-compound molding, and bulk molding-compound molding.
  • the resin composition and shaped article of the present invention can be used for various applications such as electronic materials, and is specifically suitable for applications, such as sealing materials for semiconductors and adhesives, in which getting reduction in elastic modulus is required.
  • part and % represent “part by mass” and “% by mass” respectively in embodiments.
  • a latex of a (meth)acrylate polymer obtained was diluted in deionized water, and a median diameter with the volume average was measured with the use of a laser diffraction scattering type particle size distribution measuring apparatus (“LA-910” made in Horiba, Ltd.).
  • Concentration of a latex sample was adjusted appropriately so that it was set in the suitable range with the use of a scattering light strength monitor attached with a device.
  • a powdery (meth)acrylate polymer obtained was diluted in deionized water, and a median diameter with the volume average was measured with the use of a laser diffraction scattering type particle size distribution measuring apparatus (“LA-910” made in Horiba, Ltd.).
  • Concentration of a latex sample was adjusted appropriately so that it was set in the suitable range with the use of a scattering light strength monitor attached with a device.
  • a test piece of 3 mm (thickness) ⁇ 10 mm (width) ⁇ 50 mm (length) from a powdery (meth)acrylate polymer obtained was prepared with the use of a heat pressing machine.
  • Tan ⁇ curve of the above test piece is obtained with the use of a dynamic mechanical spectrometer (“EXSTAR DMS6100” made in Seiko Instruments Inc.) under conditions of rate of temperature increase of 2° C./m and frequency of 10 Hz, with both side-holding bending mode, and the peak-top temperature and the peak-top height were determined with a peak in the range of ⁇ 100 to 0° C. of the tan ⁇ curve.
  • EXSTAR DMS6100 made in Seiko Instruments Inc.
  • the vessel was shaken and the powdery (meth)acrylate polymer was dispersed uniformly in water, then, the powdery (meth)acrylate polymer dispersion was obtained.
  • the powdery (meth)acrylate polymer dispersion was set in a gear oven for 20 hours at 95° C.
  • the dispersion in the vessel was filtered with a membrane filter with Mixes Cellulose Ester Membranes of 0.2 ⁇ m, and a filtrate was added into a sampling bottle with 100 mL to be used for the sample for measurement.
  • ICP emission spectrophotometer (“IRIS Intrepid II XSP”, made in Thermo Fisher Scientific K. K.)
  • Calibration an absolute calibration method with 4 points of 0 ppm, 0.1 ppm, 1 ppm, and 10 ppm Measurement wavelength: 589.5 nm (Na + ), 766.4 nm (K + ), and 184.0 nm and 317.9 nm (Ca 2+ )
  • the vessel was shaken and the powdery (meth)acrylate polymer was dispersed uniformly in water, then, the powdery (meth)acrylate polymer dispersion was obtained.
  • the powdery (meth)acrylate polymer dispersion was set in a gear oven for 20 hours at 95° C.
  • the dispersion in the vessel was filtered with a membrane filter with Mixes Cellulose Ester Membranes of 0.2 ⁇ m, and a filtrate was added into a sampling bottle with 100 mL to be used for the sample for measurement.
  • ion chromatograph “IC-20 model” made in Dionex Corporation
  • Isolation column IonPac AS12A
  • Calibration curve an absolute calibration method with a point of 4 ppm
  • a powdery (meth)acrylate polymer obtained was weighed with approximately 1 g and added in an eggplant-shaped flask, and then 50 mL of acetone was added.
  • the inside of the flask was moved in a cell for centrifugation, and centrifugation was carried out with 14,000 rpm, at 4° C. for 30 minutes.
  • the acetone-insoluble component was calculated with Formula 4 based on mass of the powdery (meth)acrylate polymer used and mass of the acetone-insoluble component.
  • Acetone-insoluble component [%] ⁇ [mass of acetone-insoluble component]/[mass of powdery (meth)acrylate polymer used] ⁇ 100 (Formula 4)
  • Dispersion level of the vinyl polymer powder in the epoxy resin composition was measured with the use of fineness gages according to KS K-5600, and dispersibility was evaluated with the use of the following index.
  • A 4.5 ⁇ m or less
  • B more than 4.5 ⁇ m
  • C more than 10.0 ⁇ m
  • the above viscosity was defined as the viscosity before keeping for 48 hours.
  • the resin composition obtained was adjusted to 25° C. after keeping for 48 hours in a thermostatic chamber of 40° C. and viscosity was measured with the use of a BH type viscometer like the measurement of the viscosity before keeping for 48 hours.
  • the above viscosity was defined as the viscosity after keeping for 48 hours.
  • the above viscosity was defined as the viscosity before keeping for 48 hours.
  • the resin composition obtained was adjusted to 25° C. after keeping for 48 hours in a thermostatic chamber of 8.0° C. and viscosity was measured with the use of a BH type viscometer like the measurement of the viscosity before keeping for 48 hours.
  • the above viscosity was defined as the viscosity after keeping for 48 hours.
  • a shaped article obtained was cut to 3 mm ⁇ 10 mm ⁇ 60 mm to make a test piece.
  • Elastic modulus in bending of the test piece was measured according to JIS K 7171 with the use of a tensile and compression machine (“Strograph T”, made in Toyo Seiki Seisaku-sho Ltd.).
  • the measurement was carried out at 23° C.
  • the following indication is the one about the shaped article obtained from a resin composition containing 20 parts of a graft copolymer.
  • B more than 2,300 MPa
  • C more than 2,400 MPa
  • a shaped article obtained was cut to 3 mm ⁇ 10 mm ⁇ 60 mm to make a test piece.
  • Elastic modulus in bending of the test piece was measured according to JIS K 7171 with the use of a tensile and compression machine (“Strograph T”, made in Toyo Seiki Seisaku-sho Ltd.).
  • the measurement was carried out at ⁇ 40° C.
  • the following indication is the one about the shaped article obtained from a resin composition containing 20 parts of a graft copolymer.
  • B more than 2,300 MPa
  • C more than 2,400 MPa
  • a shaped article obtained was cut to 3 mm ⁇ 30 mm ⁇ 30 mm to make a test piece.
  • dielectric constant in frequency 1 GHz was measured for the above test piece with the uses of a measuring apparatus of dielectric constant (“4291B RF impedance/material analyzer”, made in Agilent technologies Inc.), a dielectric constant probe (“16,453A”, made in Agilent technologies Inc.) and a micrometer (made in Mitutoyo Corporation).
  • Dielectric constant was evaluated with the following index.
  • a shaped article obtained was cut to 3 mm ⁇ 30 mm ⁇ 30 mm to make a test piece.
  • dielectric loss tangent in frequency 1 GHz was measured for the above test piece with the uses of a measuring apparatus of dielectric constant (“4291B RF impedance/material analyzer”, made in Agilent technologies Inc.), a dielectric constant probe (“16,453A”, made in Agilent technologies Inc.) and a micrometer (made in Mitutoyo Corporation).
  • Dielectric loss tangent was evaluated with the following index.
  • Di-(2-ethylhexyl)sulfosuccinic acid ammonium “Rikasurf M-300” (trade name, made in New Japan Chemical Co., Ltd.) was used directly.
  • Di-(2-ethylhexyl)sulfopotassium succinate “Pelex OT-P” (trade name, made in Kao Corporation) was used directly.
  • Polyoxyethylene distyrene phenyl ether “Emulgen A-90” (trade name, made in Kao Corporation) was used directly.
  • Ammonium persulfate Ammonium persulfate made in Wako Pure Chemical Industries, Ltd. was used directly.
  • Potassium persulfate Potassium persulfate made in Wako Pure Chemical Industries, Ltd. was used directly.
  • n-Butyl acrylate n-Butyl acrylate made in Mitsubishi Chemical Corporation was used directly.
  • 2-Ethylhexyl acrylate 2-Ethylhexyl acrylate made in Mitsubishi Chemical Corporation was used directly.
  • Isooctyl acrylate Isooctyl acrylate made in Osaka Organic Chemical Industry Ltd. was used directly.
  • a mixture of 4.88 parts of n-butyl acrylate, 0.12 parts of allyl methacrylate, and 92.41 parts of deionized water are prepared in a separable flask equipped with an agitator, a reflux condenser, a thermal control unit, a titration pump and a nitrogen introduction pipe, and the mixture was raised to 90° C. under agitation with 120 rpm in nitrogen atmosphere.
  • the above emulsified mixture obtained was titrated for 60 minutes in a latex of the rubbery (meth)acrylate polymer (A), and polymerization of monomer mixture (b) was carried out for 60 minutes.
  • the latex of (meth)acrylate polymer (1) obtained was powdered with the use of a spray-dryer (“L-8”, made in Ohkawara Kakohki Co., Ltd.) with spray-drying treatment (atomizing method: a rotation disk method, disk rotation numbers: 25,000 rpm, inlet temperature: 140° C., outlet temperature: 65° C.).
  • Powdery (meth)acrylate polymer (2) was obtained in the same manner as in Example 1 except that the above two polymerization conditions were adopted.
  • Powdery (meth)acrylate polymer (3) was obtained in the same manner as in Example 1 except that the above two polymerization conditions were adopted.
  • Powdery (meth)acrylate polymer (4) was obtained in the same manner as in Example 1 except that 0.001 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium was further added to a mixture which was a liquid for the first step polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (5) was obtained in the same manner as in Example 2 except that 92.41 parts of deionized water was changed to 46.20 parts of deionized water in the composition for the first step polymerization of monomer mixture (a) and except that 44.17 parts of deionized water was changed to 87.88 parts of deionized water in the composition for the second step polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (6) was obtained in the same manner as in Example 2 except that 2-ethylhexyl acrylate was changed to isooctyl acrylate in the composition for the second step polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (7) was obtained in the same manner as in Example 1 except that the amount of 2-ethylhexyl acrylate was change from 78.62 parts to 79.20 parts and the amount of allyl methacrylate was change from 1.38 parts to 0.80 parts in the composition for the second step polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (8) was obtained in the same manner as in Example 1 except that the amount of 2-ethylhexyl acrylate was change from 78.62 parts to 78.05 parts and the amount of allyl methacrylate was change from 1.38 parts to 1.95 parts in the composition for the second step polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (9) was obtained in the same manner as in Example 2 except that the emulsified mixture for polymerization of monomer mixture (b) was changed to a mixture of 9.70 parts of methyl methacrylate, 0.20 parts of n-butyl acrylate, 0.10 parts of allyl methacrylate, 0.05 parts of 2,2′-azobis-[N-(2-carboxyethyl)-2-methyl propione amidine], 0.07 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium, 0.13 parts of polyoxyethylene distyrene phenyl ether, and 5.00 parts of deionized water.
  • Powdery (meth)acrylate polymer (10) was obtained in the same manner as in Example 2 except that the emulsified mixture for polymerization of monomer mixture (b) was changed to a mixture of 9.31 parts of methyl methacrylate, 0.19 parts of n-butyl acrylate, 0.50 parts of allyl methacrylate, 0.05 parts of 2,2′-azobis-[N-(2-carboxyethyl)-2-methyl propione amidine], 0.07 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium, 0.13 parts of polyoxyethylene distyrene phenyl ether, and 5.00 parts of deionized water.
  • the amount of ammonium persulfate was changed from 0.02 parts to 0.10 parts in the composition for the first step polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (11) was obtained in the same manner as in Example 2 except the above conditions.
  • composition for graft polymerization 0.07 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium was changed to 0.13 parts of di-(2-ethylhexyl)sulfosuccinic acid potassium, and 2,2′-azobis-[N-(2-carboxyethyl]-2-methyl propione amidine] and polyoxyethylene distyrene phenyl ether was not added.
  • Powdery (meth)acrylate polymer (12) was obtained in the same manner as in Example 2 except the above conditions.
  • Powdery (meth)acrylate polymer (1′) was obtained in the same manner as in Example 1 except that the emulsified mixture in the composition for the second step polymerization of monomer mixture (a) was changed to a mixture of 73.71 parts of 2-ethylhexyl acrylate, 1.29 parts of allyl methacrylate, 0.09 parts of 2,2′-azobis-[N-(2-carboxyethyl)-2-methyl propione amidine], 0.18 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium, 0.70 parts of polyoxyethylene distyrene phenyl ether and 37.50 parts of deionized water, and except that the emulsified mixture for polymerization of monomer mixture (b) was changed to a mixture of 19.11 parts of methyl methacrylate, 0.39 parts of n-butyl acrylate, 0.50 parts of allyl methacrylate, 0.03 parts of 2,2′-azo
  • Powdery (meth)acrylate polymer (2′) was obtained in the same manner as in Example 2 except that 0.0025 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium was further added to a mixture which was a liquid for the first step polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (3′) was obtained in the same manner as in Example 2 except that 2-ethylhexyl acrylate was changed to n-butyl acrylate in the composition for polymerization of monomer mixture (a).
  • Powdery (meth)acrylate polymer (4′) was obtained in the same manner as in Example 1 except that the emulsified mixture for polymerization of monomer mixture (b) was changed to a mixture of 14.70 parts of methyl methacrylate, 0.30 parts of n-butyl acrylate, 0.03 parts of 2,2′-azobis-[N-(2-carboxyethyl)-2-methyl propione amidine], 0.10 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium, 0.20 parts of polyoxyethylene distyrene phenyl ether, and 7.50 parts of deionized water.
  • Powdery (meth)acrylate polymer (5′) was obtained in the same manner as in Example 2 except that the emulsified mixture for polymerization of monomer mixture (b) was changed to a mixture of 9.80 parts of methyl methacrylate, 0.20 parts of n-butyl acrylate, 0.05 parts of 2,2′-azobis-[N-(2-carboxyethyl)-2-methyl propione amidine], 0.07 parts of di-(2-ethylhexyl)sulfosuccinic acid ammonium, 0.13 parts of polyoxyethylene distyrene phenyl ether, and 5.00 parts of deionized water.
  • volume average primary particle sizes, volume average secondary particle sizes, peak temperatures of tan ⁇ , peak heights of tan ⁇ , acetone-insoluble components, ionic contents (Na + , K + , Ca 2+ , and SO 4 2 ⁇ ) of (meth)acrylate polymers (1) to (12) obtained with Examples (1) to (12) and (meth)acrylate polymers (1′) to (5′) obtained with Comparative examples (1) to (5) are shown in Table 1 to 6.
  • Example 3 Example 1 (Meth)acrylate polymer (1) (2) (3) (1′) Rubbery (meth)acrylate Monomer mixture (a) n-BA 4.88 n-BA 4.88 n-BA 4.88 n-BA 4.88 polymer (A) 1st stage [part] AMA 0.12 AMA 0.12 AMA 0.12 Monomer mixture (a) 2-EHA 78.62 2-EHA 83.54 2-EHA 88.45 2-EHA 73.71 2nd stage [part] AMA 1.38 AMA 1.46 AMA 1.55 AMA 1.29 Monomer mixture (b) [part] MMA 14.33 MMA 9.55 MMA 4.77 MMA 19.11 n-BA 0.29 n-BA 0.20 n-BA 0.10 n-BA 0.39 AMA 0.38 AMA 0.25 AMA 0.13 AMA 0.50 Content of (a1) in (a) [%] 1.8 1.8 1.8 1.8 1.8 1.8 Ratio of (A) to (b) at the Content of (A) [%]
  • Example 5 (Meth)acrylate polymer (1) (4) (2) (5) (2′) Rubbery (meth)acrylate Monomer mixture (a) n-BA 4.88 n-BA 4.88 n-BA 4.88 n-BA 4.88 n-BA 4.88 polymer (A) 1st stage [part] AMA 0.12 AMA 0.12 AMA 0.12 AMA 0.12 Monomer mixture (a) 2-EHA 78.62 2-EHA 78.62 2-EHA 83.54 2-EHA 83.54 2-EHA 83.54 2-EHA 83.54 2nd stage [part] AMA 1.38 AMA 1.38 AMA 1.46 AMA 1.46 Monomer mixture (b) [part] MMA 14.33 MMA 14.33 MMA 9.55 MMA 9.55 MMA 9.55 MMA 9.55 n-BA 0.29 n-BA 0.29 n-BA 0.20 n-BA 0.20 AMA 0.38 AMA 0.38 AMA 0.38 AMA 0.25 AMA 0.25 Content
  • Example 7 Example 8 (Meth)acrylate polymer (1) (7) (8) Rubbery (meth)acrylate Monomer mixture (a) n-BA 4.88 n-BA 4.88 n-BA 4.88 polymer (A) 1st stage [part] AMA 0.12 AMA 0.12 AMA 0.12 Monomer mixture (a) 2-EHA 78.62 2-EHA 79.2 2-EHA 78.05 2nd stage [part] AMA 1.38 AMA 0.8 AMA 1.95 Monomer mixture (b) [part] MMA 14.33 MMA 14.33 MMA 14.33 n-BA 0.29 n-BA 0.29 n-BA 0.29 AMA 0.38 AMA 0.38 AMA 0.38 AMA 0.38 Content of (a1) in (a) [%] 1.8 1.1 2.4 Ratio of (A) to (b) at the Content of (A) [%] 85 85 point of polymerization Content of (b) [%] 15 15 15 of (b) Content of (b1) in (b) [%] 2.5 2.5 2.5 2.5 Volume average primary particle
  • Example 12 (Meth)acrylate polymer (2) (11) (12) Rubbery (meth)acrylate Monomer mixture (a) n-BA 4.88 n-BA 4.88 n-BA 4.88 polymer (A) 1st stage [part] AMA 0.12 AMA 0.12 AMA 0.12 Monomer mixture (a) 2-EHA 83.54 2-EHA 83.54 2-EHA 83.54 2nd stage [part] AMA 1.46 AMA 1.46 AMA 1.46 Monomer mixture (b) [part] MMA 9.55 MMA 9.55 MMA 9.55 n-BA 0.20 n-BA 0.20 n-BA 0.20 AMA 0.25 AMA 0.25 AMA 0.25 Content of (a1) in (a) [%] 1.8 1.8 1.8 Ratio of (A) to (b) at the Content of (A) [%] 90 90 90 point of polymerization Content of (b) [%] 10 10 of (b) Content of (b1) in (b) [%] 2.5 2.5 2.5 2.5 Volume average primary particle
  • N-BA n-butyl acrylate
  • 2-EHA 2-ethylhexyl acrylate
  • i-OA isooctyl acrylate
  • AMA allyl methacrylate
  • MMA methyl methacrylate
  • Epoxy resins (trade name “JER828”, made in Japan epoxy resin Co., Ltd.) and (meth)acrylate polymers with amounts in Table 7 to 13 were blended.
  • the mixtures obtained were passed through a three-roll mill (“M-80E”, made in EXAKT Technologies, Inc., distances between rolls: each of 5 ⁇ m, rotation numbers: 200 rpm) with 3 times.
  • M-80E made in EXAKT Technologies, Inc., distances between rolls: each of 5 ⁇ m, rotation numbers: 200 rpm
  • an acid anhydride-based curing agent (trade name “Rika Cid MH-700”, made in New Japan Chemical Co., Ltd.) as the curing agent and 2-ethyl-4-methyl imidazole (made in Shikoku Chemicals Corporation) as the accelerator with amounts in Table 7 to 13 were added.
  • a polyethylene terephthalate film was laminated on each one side of the reinforcement glass plates of 300 mm in length, 300 mm in width and 5 mm in thickness.
  • a mold was prepared with sandwitching of a spacer with polytetrafluoroethylene of thickness of 3 mm between the above glass plates.
  • Example 15 example 6 Epoxy resin [part] 100 100 100 100 (Meth)acrylate Kind (1) (2) (3) (1′) polymer Amount [part] 20 20 20 20 Dispersibility A A B A ⁇ 4.5 ⁇ 4.5 9.0 ⁇ 4.5 Initial viscosity [mPa ⁇ s] 33,760 32,550 33,920 32,800 Storage 40° C. A A B A stability 3 4 18 5 80° C. B B B B 37 36 48 40 Epoxy resin [part] 100 100 100 100 100 (Meth)acrylate Kind (1) (2) (3) (1′) polymer Amount [part] 20 20 20 20 20 20 Curing agent [part] 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 85 Accel
  • Example 16 Example 14
  • Example 17 example 7 Epoxy resin [part] 100 100 100 100 100 (Meth)acrylate Kind (1) (4) (2) (5) (2′) polymer Amount [part] 20 20 20 20 20 Dispersibility
  • a B A A C ⁇ 4.5 9.0 ⁇ 4.5 ⁇ 4.5 10.5
  • Example 18 example 8 Epoxy resin [part] 100 100 100 (Meth)acrylate kind (2) (6) (3′) polymer Amount 20 20 20 [part] Dispersibility A A A ⁇ 4.5 ⁇ 4.5 ⁇ 4.5 Initial viscosity [mPa ⁇ s] 32,550 31,580 33,250 Storage 40° C. A A A stability 4 4 3 80° C. B B B 36 31 30 Epoxy resin [part] 100 100 100 (Meth)acrylate Kind (2) (6) (3′) polymer Amount 20 20 20 [part] Curing agent [part] 85 85 85 85 85 85 Accelerator [part] 1 1 1 Elastic 23° C. A A B modulus in 2,280 2,290 2,350 bending ⁇ 40° C.
  • a B C [Mpa] 2,290 2,310 2,640 Dielectric constant [—] A A A 2.71 2.75 2.74 Dielectric loss tangent [—] A A A 0.011 0.011 0.012 Peak temperature of tan ⁇ of A A A shaped article [° C.] 156 155 156
  • Example 20 Epoxy resin [part] 100 100 100 (Meth)acrylate kind (1) (7) (8) polymer Amount 20 20 [part] Dispersibility A B A ⁇ 4.5 9.0 ⁇ 4.5 Initial viscosity [mPa ⁇ s] 33,760 28,640 29,400 Storage 40° C. A A A stability 3 1 2 80° C. B B B 37 40 28 Epoxy resin [part] 100 100 100 (Meth)acrylate Kind (1) (7) (8) polymer Amount 20 20 20 [part] Curing agent [part] 85 85 85 85 85 85 85 85 85 85 85 85 85 Accelerator [part] 1 1 1 Elastic 23° C. B B B modulus in 2,340 2,310 2,360 bending ⁇ 40° C.
  • Example 21 Example 22 example 10 Epoxy resin [part] 100 100 100 100 100 100 100 (Meth)acrylate Kind (1) (4′) (2) (9) (10) (5′) polymer Amount [part] 20 20 20 20 20 20 Dispersibility A A A B A A ⁇ 4.5 ⁇ 4.5 ⁇ 4.5 7.5 ⁇ 4.5 ⁇ 4.5 Initial viscosity [mPa ⁇ s] 33,760 31,200 32,550 30,960 32,160 31,560 Storage 40° C. A C A B A C stability 3 354 4 12 4 432 80° C.
  • Example 14 Example 23
  • Example 24 Epoxy resin [part] 100 100 100 (Meth)acrylate Kind (2) (11) (12) polymer Amount 20 20 20 [part] Dispersibility A A A ⁇ 4.5 ⁇ 4.5 ⁇ 4.5 Initial viscosity [mPa ⁇ s] 32,550 33,640 32,320 Storage 40° C. A A A stability 4 5 5 80° C. B B B 36 39 41 Epoxy resin [part] 100 100 100 (Meth)acrylate Kind (2) (11) (12) polymer Amount 20 20 [part] Curing agent [part] 85 85 85 85 85 85 85 85 85 85 85 Accelerator [part] 1 1 1 Elastic 23° C. A A A modulus in 2,280 2,270 2,260 bending ⁇ 40° C.
  • the (meth)acrylate polymer of the present invention gives excellent reduction in elastic modulus of the shaped article which is obtained with blending of the (meth)acrylate polymer of the present invention, so that the (meth)acrylate polymer of the present invention is useful as an additive for a resin having stress relaxation properties, specifically as an additive for an epoxy resin having stress relaxation properties.
  • the resin composition and the shaped article which are obtained with blending of the (meth)acrylate polymer of the present invention can be used for various applications such as electronic materials, and can be used specifically for applications, such as semiconductors and adhesives, which require reduction in elastic moduli.

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US11884813B2 (en) 2017-09-06 2024-01-30 Mitsubishi Chemical Corporation Macromonomer copolymer, epoxy resin composition, adhesive, molding material, and cured product

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KR101725892B1 (ko) * 2014-08-18 2017-04-26 주식회사 엘지화학 세척성이 우수한 아크릴계 에멀젼 점착제 및 이의 제조방법
CN111655742B (zh) * 2018-01-29 2023-08-29 株式会社可乐丽 丙烯酸类聚合物凝固物
CN113710721A (zh) * 2019-04-19 2021-11-26 三菱化学株式会社 环氧树脂组合物、固化性树脂组合物、固化物、粘接剂

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