US20120061245A1 - Method and device for the electrolytic treatment of high-resistance layers - Google Patents

Method and device for the electrolytic treatment of high-resistance layers Download PDF

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Publication number
US20120061245A1
US20120061245A1 US13/321,631 US201013321631A US2012061245A1 US 20120061245 A1 US20120061245 A1 US 20120061245A1 US 201013321631 A US201013321631 A US 201013321631A US 2012061245 A1 US2012061245 A1 US 2012061245A1
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United States
Prior art keywords
contact
transport
track
zone
plant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/321,631
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English (en)
Inventor
Egon Huebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rena GmbH
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Rena GmbH
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Filing date
Publication date
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Assigned to RENA GMBH reassignment RENA GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUEBEL, EGON
Publication of US20120061245A1 publication Critical patent/US20120061245A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Definitions

  • the invention relates to the electrolytic treatment, in particular electroplating and etching, of electrically conductive layers on preferably planar material. It is particularly suitable for electroplating substrates such as printed circuit boards and conductive foils as portions in continuously operating plant or strips of metal or metallized synthetic films in plant for passing material from one roll to the next.
  • the intention is to apply as high a current density as possible to deposit or etch a metal layer of uniform thickness over the entire extent of the surface of the material even if the base layer is very thin and hence has high resistance. Tried-and-tested solutions for this already exist.
  • the preferably rotating electrical contact-making means of the material is also to be suitable for material having differing sizes transversely to the direction of transport and having thin base layers, for uniform electrolytic treatment. In this case, by comparison with the prior art a high level of complexity in the plant is to be avoided.
  • Continuously operating plant and plant that produces material passed from one roll to the next is suitable preferably for the manufacture of mass-produced products, because it has little flexibility in respect of the sequence of processes.
  • These products were called end products above.
  • These are usually small and miniature printed circuit boards or conductive foils for, for example, BGAs (ball grid arrays), RFIDs (radio frequency identification units), MP3 players, memory sticks or indeed for relatively large printed circuit boards for, for example, mobile telephones, PCs and the like.
  • the invention makes use of the increasing miniaturisation of these electronic end products to optimize the layout of the material, and on the other it supports the precision conductor technology required for miniaturisation, as a result of the planar electroplating of the thin base layers necessary therefor. After they have been finished in the continuously operating plant, and where appropriate further plant, the end products are separated from the material for their respective use.
  • the material to be treated is in this case for example a large-scale printed circuit board or conductive foil.
  • these large-scale printed circuit boards or conductive foils are also called panels. They have a useful and a non-useful zone.
  • the end products are located in the area to be used.
  • the edge zones, including the contact track or tracks located thereon, are typically not usable for the end products.
  • a large or very large number of, usually, the same end products are arranged in the area to be used. There are always a plurality of ways of arranging the many end products on the printed circuit board or panel. The present invention makes use of this fact.
  • the invention is described in particular by way of the example of electroplating, in particular that of printed circuit boards for metalizing the entire surface and providing uninterrupted contact and for constructing the conductor pattern, which is structured using resist, for example.
  • the invention is also suitable without restrictions for electrolytic etching and other electrolytic processes.
  • the material is supplied with the electrical or electrolytic current required for electroplating, preferably by means of a contact track in the centre.
  • the effect on the distribution of layer thickness transversely as seen in the direction of transport is at least as advantageous as—or better than—in the prior art with optimally uniform supply from the two edges.
  • the two oblique planes which are formed according to the invention face in the opposite direction, however.
  • the maximum layer thickness is once again achieved in the contact zone, that is to say in the centre of the material.
  • the differences in layer thickness in the oblique planes transversely as seen in the direction of transport are, according to the invention, only approximately a quarter of the difference achieved when the electroplating current is supplied from only one edge, regardless of the contact resistances effective at the particular moment.
  • FIG. 1 a shows, in cross section, a continuously operating plant or a strip plant, according to the prior art.
  • FIG. 1 b shows, on a much larger scale, the profile of the layer thickness to be achieved with the arrangement according to FIG. 1 a.
  • FIG. 2 a shows, in cross section, a continuously operating plant or a strip plant, according to the present invention.
  • FIG. 2 b shows the profile of the layer thickness to be achieved according to the invention, transversely as seen in the direction of transport, again on a much larger scale.
  • FIG. 3 shows, in plan view, a material having a large number of end products arranged thereon.
  • the material 1 is transported perpendicularly out of the plane of the drawing.
  • upper and lower transport and contact means 2 which are driven in rotation.
  • annular or disc-shaped electrical contacts 3 are arranged on the elongate contact means 2 there are, at both ends, annular or disc-shaped electrical contacts 3 . These contacts 3 roll on the upper and lower sides of the material 1 , on the base layers 4 thereof.
  • the material 1 is transported and at the same time makes electrical contact.
  • the electrical contact is made at the two edge zones 5 of the material.
  • On the upper side and lower side there are soluble or insoluble anodes 6 .
  • the base layer 4 that is to say the surface of the material 1 , forms a respective electrolytic cell, located in the electrolyte 7 .
  • at least one electroplating current source 8 taking the form of a direct current source or a unipolar or bipolar pulsed current source, serves to supply the electrolytic cells with current.
  • the electrical current is transmitted by way of rotary contacts 9 or sliding contacts 9 to the rotating transport and contact means 2 and from there to the contacts 3 .
  • the width of the material 1 transversely to the direction of transport must be dimensioned such that the contacts 3 can each roll on a sufficiently wide contact track at the edges of the material 1 . For this reason, only material 1 of a very particular width can be handled in an existing plant according to the prior art.
  • FIG. 1 b shows the profile of the layer thickness on the material 1 transversely to the direction of transport, as results from an arrangement according to FIG. 1 a .
  • the minimum layer thickness of the electroplated layer 10 occurs in the zone at the centre of the material 1 .
  • the effective cell voltage between the cathodic surface of the material 1 and the anode 6 is smallest in this zone, because of the voltage drop in the base layer 4 . Accordingly, the local current density and hence the thickness of the deposited layer are also smallest here. In this arrangement, there are consequently the following dependent relationships:
  • the difference in the amount deposited between the edge zone 5 and the centre of the material increases when the base layer to be electroplated is of higher resistance, when the width of the material transversely to the direction of transport is larger and when a higher current density is used for the electroplating.
  • deposition bone formation 11 is added to the profile of the oblique planes at the already higher edges of the material 1 , and this effect is particularly intensive there because of the electrical edge effect in the zone of greatest local current density. This increases the difference in the overall depositions on the material in a highly disadvantageous way.
  • the distributions of layer thickness have to be very uniform, and according to the prior art this can only be achieved using low current densities.
  • FIG. 2 a shows, in cross section, a continuously operating plant or a strip plant according to the invention, for electroplating board-shaped or strip-shaped material 1 .
  • this plant there are along the transport path numerous transport and contact means 2 which transport the material 1 and make electrical contact.
  • Rolls are illustrated serving as the transport means 2 . It is also possible for rotating rolls having small wheels, or non-rotating sliding contacts, to be used.
  • the electrical contacts 3 which take the form of rings, small wheels, discs, brushes or segmented contact wheels, are in this basic arrangement of the invention located transversely as seen in the direction of transport, preferably in the centre of the contact means 2 and the transport path.
  • This arrangement requires only one corresponding contact track 15 on the material, preferably also running in the centre of the material 1 inside the useful area 17 , as shown in FIG. 3 .
  • the electroplating current is supplied to the material by way of the contact track 15 on the material, this track being kept free separately or not separately within the layout and running within the entire useful zone thereof. In the case of a contact track 15 which is not kept free and separate this extends over the end products 14 arranged in the layout of the material 1 .
  • An asymmetrical contact track in the layout of the material or printed circuit board or the strip to be electroplated, and corresponding contacts 3 along the transport path of the continuously operating plant may also be provided.
  • the width of the contact track 15 may be narrow in the layout of the material 1 , for example 10 mm with a width of the contact wheel 3 of for example 5 mm.
  • the contacts always roll within the useful zone 12 of the material. They cannot fall off the material and so lose electrical contact. This means that electrical contact cannot be broken, which among other things means that faults cannot result in the case of demetallisation of the contacts because of a thick metallized layer that was not planned for.
  • the distribution of layer thickness which can be achieved according to the invention transversely to the direction of transport is shown in FIG. 2 b .
  • the troughs of the oblique planes are in the zones away from contact, that is to say at the two edges 13 of the material 1 .
  • These thinner edge zones 13 are adjoined, in the zone of the lowest current density and hence in the trough of the oblique plane, by the respective deposition bone formation 11 .
  • the bone formation occurs in the zone of lowest current density. Because of this, by comparison with the supply on both sides according to the prior art, in which the deposition bone formation is in the zone of highest current density, here it is significantly smaller. In total, therefore, the overall differences in layer thickness are smaller than with the supply on both sides according to the prior art. Added to this are the further advantages described, of making electrical contact with the material in its centre zone.
  • the method according to the invention is highly suited for example to the requirements currently made of such electroplating plant in printed circuit board technology. These requirements include copper base layers down to a minimum of 1.5 ⁇ m thick for printed circuit boards that are 610 mm wide and to which an electroplated layer up to 25 ⁇ m thick is to be applied. In this case, only differences in layer thickness of at most 1 ⁇ m are acceptable in the zone of the useful area. These requirements can be met according to the invention.
  • Base layers deposited by sputtering are particularly thin in the edge zone of the material, or metallisation is completely absent.
  • etched-back full-surface printed circuit boards In these, base layers which are for example 12 ⁇ m or 17 ⁇ m thick are etched back to around 3 ⁇ m. Then the actual treatment of the printed circuit boards takes place.
  • the edge zones are etched more intensively than the centre zone. In both these cases, the fact of supplying the electrolytic current in the centre of the material, according to the invention, or in a plurality of tracks of the centre zone proves very advantageous, because that is where the nominal layer thickness for the base layer always prevails and so a reliable supply of current is possible.
  • a plurality of contact wheels arranged transversely as seen in the direction of transport are preferably arranged symmetrically in relation to the transport path.
  • the edge of the material is not required for making contact when supply is in the centre, by means of one or more contact tracks 15 .
  • the layout of the material and the position of the contacts on the contact means must be adjusted to one another. If there are a plurality of tracks arranged transversely as seen in the direction of transport, there is no longer complete freedom in the selection of parameters, as is provided by a single supply in the centre.
  • this extension according to the invention is very advantageous, particularly since there is no economic alternative of comparable simplicity for the electroplating of very thin and hence high-resistance base layers on a large material using high current density, that is to say economic electroplating with a very good distribution of layer thickness.
  • each contact means 2 it is possible for there to be two contacts 3 on one contact means 2 .
  • two sliding or rotary contacts 9 are required if there are associated with each contact track one or more individual rectifiers, which advantageously ensure that there is a current flow of exactly the same size on all sides, transversely as seen in the direction of transport.
  • each contact means 2 it is also possible to equip each contact means 2 with only one contact 3 and one rotary contact 9 . In this case, these contacts 3 are arranged alternately to right and left on the contact means 2 , as seen in the direction of transport of the material 1 . With this lower-cost solution, the contacts 3 then have to transmit twice the current, however, regardless of whether both sides are supplied by one rectifier or by individual rectifiers.
  • the size of the current to each contact also increases.
  • it is important that the electrolytic handling current of a common rectifier is distributed uniformly over all the respectively involved contacts to avoid damage to the surface of the material and/or the contacts. This is particularly important when the contact track(s) in the useful zone run over the end products.
  • the current-regulated rectifier limits the treatment current to the pre-set current. This reliably prevents the contact from being overloaded.
  • FIG. 3 shows, in plan view and by way of example, a material 1 whereof the layout is constructed for electroplating a large number of end products 14 in a continuously operating plant or strip plant according to the invention.
  • the external dimensions of the material are for example 610 mm ⁇ 610 mm.
  • the useful zone 17 which is edged with a dashed double line and on which the end products and the at least one contact track 15 are located, is smaller by the amount of the narrow edge zones 13 .
  • the transport direction arrow 16 indicates the direction of transport of the material through the electroplating plant.
  • the material may also include through holes for electroplating and blind holes that are provided with an electrically conductive layer.
  • the useful zone for the end products 14 is smaller, for example 580 mm ⁇ 580 mm.
  • the edges 13 are not usable for end products 14 .
  • In the centre of the material 1 or approximately in the centre, runs the contact track 15 , which is kept free and separate.
  • This track is typically not usable for end products 14 , or only to a limited extent. In particular in the case of small end products 14 , however, it is also possible to cover the entire useful area in the layout with end products and not to leave any contact track on the material as a separate area. Electrical contact is made, in the zone of the centre of the material 1 , with the end products 14 there.
  • the invention is also suitable for electroplating structures which are formed by a structured resist on the material.
  • the contact track like the other areas to be electroplated, has to be kept free of resist.
  • the format of the material according to the invention is not restricted to a rectangular shape. It is possible for example for it to have polygonal or round contours. In particular cases, this may result in a saving of base material.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
US13/321,631 2009-05-22 2010-05-18 Method and device for the electrolytic treatment of high-resistance layers Abandoned US20120061245A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009023763.1 2009-05-22
DE102009023763A DE102009023763A1 (de) 2009-05-22 2009-05-22 Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
PCT/DE2010/000596 WO2010133223A1 (de) 2009-05-22 2010-05-18 Verfahren und vorrichtung zum elektrolytischen behandeln von hochohmigen schichten

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US20120061245A1 true US20120061245A1 (en) 2012-03-15

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US13/321,631 Abandoned US20120061245A1 (en) 2009-05-22 2010-05-18 Method and device for the electrolytic treatment of high-resistance layers

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US (1) US20120061245A1 (de)
EP (1) EP2432922A1 (de)
JP (1) JP2012527526A (de)
KR (1) KR20120028936A (de)
CN (1) CN102439203A (de)
DE (1) DE102009023763A1 (de)
WO (1) WO2010133223A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105040076A (zh) * 2015-08-03 2015-11-11 东莞以利沙五金制品有限公司 水平镀银制造装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800001A (en) * 1986-02-07 1989-01-24 Robert Bosch Gmbh Method and apparatus for continuously galvanizing flat workpieces, and especially printed circuit boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3645319C3 (de) 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
ATE125001T1 (de) * 1991-04-12 1995-07-15 Siemens Ag Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten.
DE4212567A1 (de) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten
DE4301742C2 (de) 1993-01-23 1999-07-08 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren plattenförmiger Gegenstände, insbesondere von elektronischen Leiterplatten
DE19633797B4 (de) * 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
CN1181229C (zh) * 1998-08-19 2004-12-22 阿托特德国有限公司 电化学处理设备和将电流传输到印刷电路板材料的方法
TW501277B (en) * 2000-03-29 2002-09-01 Sanyo Electric Co Plating device
DE10019713C2 (de) * 2000-04-20 2003-11-13 Atotech Deutschland Gmbh Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen
DE10141056C2 (de) 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
DE10228400B4 (de) * 2002-06-25 2005-08-18 Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
DE102004025827B3 (de) 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE102004030726A1 (de) 2004-06-25 2006-01-19 Hans Höllmüller Maschinenbau GmbH & Co. Verfahren und Vorrichtung zur elektrolytischen Behandlung von dünnen Schichten
DE102005030546A1 (de) 2005-06-22 2007-01-04 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von flachen und flächigen Gegenständen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4800001A (en) * 1986-02-07 1989-01-24 Robert Bosch Gmbh Method and apparatus for continuously galvanizing flat workpieces, and especially printed circuit boards

Also Published As

Publication number Publication date
DE102009023763A1 (de) 2010-11-25
CN102439203A (zh) 2012-05-02
EP2432922A1 (de) 2012-03-28
WO2010133223A1 (de) 2010-11-25
KR20120028936A (ko) 2012-03-23
JP2012527526A (ja) 2012-11-08

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