US20110308262A1 - Refrigerant circulation apparatus - Google Patents

Refrigerant circulation apparatus Download PDF

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Publication number
US20110308262A1
US20110308262A1 US13/162,912 US201113162912A US2011308262A1 US 20110308262 A1 US20110308262 A1 US 20110308262A1 US 201113162912 A US201113162912 A US 201113162912A US 2011308262 A1 US2011308262 A1 US 2011308262A1
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United States
Prior art keywords
temperature
refrigerant
condenser
condenser side
evaporator
Prior art date
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Abandoned
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US13/162,912
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English (en)
Inventor
Yasuhiko Inadomi
Yasuhiro Kashirajima
Junichi Ito
Yasushi Nishida
Teruo Mikami
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Hitachi Ltd
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Hitachi Plant Technologies Ltd
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Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Assigned to HITACHI PLANT TECHNOLOGIES, LTD. reassignment HITACHI PLANT TECHNOLOGIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Inadomi, Yasuhiko, ITO, JUNICHI, KASHIRAJIMA, YASUHIRO, MIKAMI, TERUO, NISHIDA, YASUSHI
Publication of US20110308262A1 publication Critical patent/US20110308262A1/en
Assigned to HITACHI, LTD. reassignment HITACHI, LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI PLANT TECHNOLOGIES, LTD.
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans

Definitions

  • the present invention relates to a refrigerant circulation apparatus, and particularly to a refrigerant circulation apparatus for controlling a cooling capacity at the time of failure of a cooling unit blower in an air-conditioning system.
  • a large number of electronic devices such as a computer and a server are placed in a concentrated state.
  • Electronic devices are generally placed by a rack mount method, that is, a method of stacking racks (casings), which house the electronic devices with the electronic devices separated according to functional units, on cabinets in layer, and a large number of cabinets are disposed in line on the floor of a server room.
  • rack mount method that is, a method of stacking racks (casings), which house the electronic devices with the electronic devices separated according to functional units, on cabinets in layer, and a large number of cabinets are disposed in line on the floor of a server room.
  • a server room is controlled to be under a constant temperature environment by a year-round cooling type package air-conditioner or the like.
  • the air-conditioner fails, the inside of the room is brought into a high-temperature state by the generated heat of the devices, and the room is brought into a state where high-temperature spots locally occur.
  • the allowable temperature of electronic devices is generally about a room temperature.
  • Japanese Patent Application Laid-Open No. 2009-047419 discloses a refrigerant circulation apparatus which is equipped with the countermeasures against the occasion of failure of an air-conditioner.
  • the refrigerant circulation apparatus of Japanese Patent Application Laid-Open No. 2009-047419 is provided with an indoor unit, an outdoor unit, a compressor, an expansion valve and refrigerant piping which connects these components, and, for example, when the compressor fails, after confirming that the indoor unit blower is operable, if the maximum temperature calculated based on the measured value of the temperature sensor placed indoor exceeds the upper limit temperature which is set based on the allowable temperature of the electronic devices, operation of the blower is continued.
  • the present invention is made in view of the above circumstances, and has an object to provide, in a refrigerant circulation apparatus for an air-conditioning system which naturally circulates a refrigerant, a refrigerant circulation apparatus which can increase a cooling capacity and compensate the capacity even when at least one of a plurality of blowers which blow air to an evaporator fails, air flow quantity decreases, and the cooling capacity reduces.
  • a refrigerant circulation apparatus including: an evaporator configured to evaporate a refrigerant; a blowing device configured to blow air to the evaporator; a condenser configured to condense the refrigerant evaporated by the evaporator; a refrigerant liquid pipe and a refrigerant gas pipe which connect the evaporator and the condenser; a blower failure detecting device configured to detect failure of the blowing device; a heat medium flow rate control valve configured to control a flow rate of a heat medium supplied to the condenser, the heat medium for cooling the refrigerant; a condenser refrigerant liquid temperature sensor configured to detect a temperature of the refrigerant which is supplied to the evaporator from the condenser; and a condenser side refrigerant temperature control device configured to lower a setting temperature of a condenser side externally inputted temperature and control the heat medium flow
  • the refrigerant circulation apparatus increases the cooling capacity by lowering the condensing temperature.
  • the refrigerant circulation apparatus that is, the refrigerant circulation apparatus which naturally circulates a refrigerant, is configured by connecting the condenser which is placed at a place higher than the evaporator with gas piping and liquid piping.
  • the gas of the refrigerant which is vaporized by the evaporator is fed to the condenser via the gas piping, and the liquid of the refrigerant which is liquefied by the condenser is fed to the evaporator through the liquid piping, whereby the refrigerant is naturally circulated, and the cooling action can be obtained in the evaporator.
  • Such a refrigerant natural circulation type air-conditioning system is applied to local cooling for a server, and thereby, the running cost of the air conditioner can be reduced,
  • the refrigerant circulation apparatus preferably further includes a condenser side control temperature calculating device configured to calculate a necessary condenser side control temperature based on a number of failed blowers and a cooling performance table which is set in advance when the failure signal is outputted from the blower failure detecting device, wherein: the blowing device includes a plurality of blowers; and the condenser side refrigerant temperature control device lowers the setting temperature of the condenser side externally inputted temperature to the calculated necessary condenser side control temperature and controls the heat medium flow rate control valve so that the measured value measured by the condenser refrigerant temperature sensor becomes equal to the lowered setting temperature.
  • the refrigerant circulation apparatus can calculate a necessary condensing temperature from the number of failed blowers and the cooling performance table, reduce the condensing temperature to that condensing temperature, and thereby, increase the cooling capacity.
  • the refrigerant circulation apparatus preferably further includes an evaporator internal pressure sensor configured to measure an internal pressure in the evaporator, wherein: when the failure signal is outputted from the blower failure detecting device, the condenser side control temperature calculating device calculates a necessary condenser side control temperature based on the number of failed blowers, the measured value of the evaporator internal pressure sensor and the cooling performance table which is set in advance; and the condenser side refrigerant temperature control device lowers the setting temperature of the condenser side externally inputted temperature to the calculated necessary condenser side control temperature and controls the heat medium flow rate control valve so that the measured value measured by the condenser refrigerant liquid temperature sensor becomes equal to the lowered setting temperature.
  • the refrigerant circulation apparatus can calculate the necessary condensing temperature based on the number of failed blowers, the measured value of the evaporator internal pressure sensor and the cooling performance table, and lower the condensing temperature to that condensing temperature, and thereby, increase the cooling capacity.
  • the condensing temperature can be more accurately set to the condensing temperature for achieving necessary cooling capacity. Thereby, loss of the heat quantity is prevented.
  • the refrigerant circulation apparatus preferably further includes an indoor dew-point temperature sensor configured to detect an indoor dew-point temperature, wherein: when the failure signal is outputted from the blower failure detecting device, the condenser side control temperature calculating device calculates a necessary condenser side control temperature based on the number of failed blowers and the cooling performance table which is set in advance; and the condenser side refrigerant temperature control device updates the setting temperature of the condenser side externally inputted temperature to the calculated necessary condenser side control temperature when the calculated necessary condenser side control temperature is not less than an indoor dew-point temperature, or the condenser side refrigerant temperature control device lowers the setting temperature to the indoor dew-point temperature and controls the heat medium flow rate control valve so that measured value measured by the condenser refrigerant liquid temperature sensor becomes equal to the lowered setting temperature when the calculated necessary condenser side control temperature is not more than the indoor dew-point temperature.
  • the present invention adds measure for prevent dew formation in a room.
  • the cooling capacity is increased by lowering the condensing temperature, and therefore, the cooling unit capacity can be compensated. Further, in addition to this, dew formation in the evaporator can be prevented.
  • FIG. 1 is a block diagram showing a configuration of a refrigerant circulation apparatus of a first embodiment
  • FIG. 2 is a block diagram showing a configuration of a refrigerant circulation apparatus of a second embodiment
  • FIG. 3 is a block diagram showing a configuration of a refrigerant circulation apparatus of a third embodiment
  • FIG. 4 is a block diagram showing a configuration of a refrigerant circulation apparatus of a fourth embodiment
  • FIG. 5 is a block diagram showing a configuration of a refrigerant circulation apparatus of a fifth embodiment
  • FIG. 6 is a block diagram showing a configuration of a refrigerant circulation apparatus of a sixth embodiment.
  • FIG. 7 is a block diagram showing a configuration of a refrigerant circulation apparatus of a seventh embodiment.
  • FIG. 1 is a block diagram showing a configuration of a refrigerant circulation apparatus of a first embodiment.
  • a condenser 3 is a device for cooling and condensing a refrigerant which is vaporized in two evaporators 1 and 1 .
  • the number of evaporators 1 is not limited to two.
  • the condenser 3 is provided at a place higher than the evaporator 1 , for example, on the roof of a building.
  • the condenser 3 is internally provided with a coil in which a heat medium (for example, cold water) which cools the refrigerant so that the vaporized refrigerant performs heat exchange and the refrigerant is liquefied.
  • the heat medium which cools the aforesaid refrigerant in the condenser 3 is supplied from a heat medium creating device 21 (for example, a refrigerator) by using a heat medium conveying device 22 .
  • the evaporators 1 and 1 and the condenser 3 are connected through a refrigerant liquid pipe 4 and a refrigerant gas pipe 5 .
  • An upper end of the refrigerant gas pipe 5 is connected to one end of the coil in the condenser 3
  • a lower end of the refrigerant gas pipe 5 is connected to one end of a coil of each evaporator 1 .
  • an upper end of the refrigerant liquid pipe 4 is connected to the other end of the coil in the condenser 3
  • a lower end of the refrigerant liquid pipe 4 is connected to the other end of the coil of the evaporator 1 .
  • a gas of the refrigerant which is vaporized by each of the evaporators 1 and 1 is naturally fed to the condenser 3 through the refrigerant gas pipe 5 , and after the gas is liquefied by the condenser 3 , the liquefied refrigerant is naturally flows down to each evaporator 1 through the refrigerant liquid pipe 4 . Thereby, natural circulation of the refrigerant is performed.
  • chlorofluorocarbons or HFC (hydrochlorofluorocarbon) as alternative chlorofluorocarbons or the like can be used. Further, if used at a pressure lower than atmospheric pressure, water can be used.
  • a cooling unit which includes the evaporators 1 and blowers 2 (in FIG. 1 , two blowers 2 are shown, as an example) which blow air to the evaporators 1 , is provided at a rear surface of a server rack 24 , and exhaust heat from the electronic devices housed in the server rack 24 is performed by blowing air to the evaporators 1 by the blowers 2 . Thereby, air warmed by the electronic devices is cooled and is released into the inside of the server room,
  • the blowers 2 are provided with a blower failure detecting device 6 which detects failure of the blowers 2 .
  • the refrigerant circulation apparatus is provided with a condenser side refrigerant temperature control device 7 for controlling the temperature of the refrigerant which is supplied to the condenser 3 .
  • the condenser side refrigerant temperature control device 7 controls an opening degree of a heat medium flow rate control valve 23 provided at heat medium piping 25 so that a measured value of a condenser refrigerant liquid temperature sensor 8 provided at the refrigerant liquid pipe 4 at an outlet port of the condenser 3 becomes equal to a setting temperature of the condenser side externally inputted temperature.
  • the condenser side refrigerant temperature control device 7 lowers the setting temperature of the condenser side externally inputted temperature, and controls the opening degree of the heat medium flow rate control valve 23 so that the measured value of the condenser refrigerant liquid temperature sensor 8 becomes equal to the setting temperature.
  • the condensing temperature is reduced and the cooling capacity can be increased, whereby the capacity of the cooling unit can be compensated.
  • FIG. 2 is a block diagram showing a configuration of a refrigerant circulation apparatus of a second embodiment.
  • the same or similar members as those in the refrigerant circulation apparatus shown in FIG. 1 will be described by being assigned with the same reference numerals.
  • the refrigerant circulation apparatus of FIG. 2 is further provided with a condenser side control temperature calculating device 9 which calculates a control temperature of the condenser 3 , when comparing the refrigerant circulation apparatus shown in FIG. 1 .
  • the evaporation temperature needs to be lowered to discharge the heat quantity corresponding to the reduction in an air quantity.
  • the evaporation temperature varies with the condensing temperature. In this case, the condensing temperature is lowered.
  • the condenser side control temperature calculating device 9 calculates a necessary condenser side control temperature (calculated value) from a number of failed blowers 2 and the cooling performance table which is set in advance. Subsequently, the condenser side refrigerant temperature control device 7 reduces the setting temperature of the condenser side externally inputted temperature to the calculated value, and controls the opening degree of the heat medium flow rate control valve 23 so that the measured value of the condenser refrigerant liquid temperature sensor 8 becomes equal to the setting temperature.
  • the condensing temperature is lowered and the cooling capacity can be increased, whereby the cooling unit capacity can be compensated.
  • Calculation of the condenser side control temperature is performed by setting the relational expression of the air quantity and the cooling capacity, the relational expression of the cooling capacity and the evaporation temperature, the design conditions, the relational expression of the evaporation temperature and the condensing temperature, and the relational expression of the condensing temperature and the condenser refrigerant liquid temperature, in the cooling performance table in advance.
  • FIG. 3 is a block diagram showing a configuration of a refrigerant circulation apparatus of a third embodiment, and the same or similar members as those of the refrigerant circulation apparatus shown in FIG. 1 will be described by being assigned with the same reference numerals.
  • a refrigerant circulation apparatus of FIG. 3 is further provided with an evaporator internal pressure sensor 11 which detects a pressure inside the evaporator 1 when comparing the refrigerant circulation apparatus shown in FIG. 2 .
  • the evaporation temperature needs to be lowered to discharge the heat quantity corresponding to reduction in an air quantity.
  • the evaporation temperature varies with the condensing temperature. In this case, the condensing temperature is lowered.
  • the condenser side control temperature calculating device 9 calculates the evaporation temperature from the measured value of the evaporator internal pressure sensor 11 set in advance, calculates a degree of temperature by which the evaporation temperature should be lowered, and calculates by a degree of temperature (calculation value) by which the condensing temperature should be lowered from the relational expression of the evaporation temperature and the condensing temperature.
  • the condensing side refrigerant temperature control device 7 calculates the condenser side externally inputted temperature from the relational expression of the condensing temperature and the condenser refrigerant liquid temperature, lowers the setting temperature of the condenser side externally inputted temperature to the calculated value, and controls the opening degree of the heat medium flow rate control valve 23 so that the measured value of the condenser refrigerant liquid temperature sensor 8 becomes equal to the setting temperature.
  • the cooling capacity can be increased while the condensing temperature is more accurately set to the condensing temperature for achieving a necessary cooling capacity, and therefore, the cooling unit capacity can be compensated.
  • Calculation of the condenser side control temperature is performed in the condenser side control temperature calculating device 9 by setting the relational expression of the air quantity and the cooling capacity, the relational expression of the cooling capacity and the evaporation temperature, the design conditions, the relational expression of the evaporation temperature and the condensing temperature, and the relational expression of the condensing temperature and the condenser refrigerant liquid temperature in the cooling performance table in advance.
  • FIG. 4 is a block diagram showing a configuration of a refrigerant circulation apparatus of a fourth embodiment, and the same or similar members as those of the refrigerant circulation apparatus shown in FIG. 1 will be described by being assigned with the same reference numerals.
  • the refrigerant circulation apparatus of FIG. 4 is further provided with an indoor dew-point temperature sensor 10 which detects an indoor dew-point temperature when comparing the refrigerant circulation apparatus shown in FIG. 2 .
  • the evaporation temperature needs to be lowered to discharge the heat quantity corresponding to reduction in an air quantity.
  • the evaporation temperature varies with the condensing temperature. In this case, the condensing temperature is lowered.
  • the condenser side control temperature calculating device 9 calculates the necessary condenser side control temperature (calculated value) from the cooling performance table which is set in advance.
  • the condenser side refrigerant temperature control device 7 resets (update) the setting temperature of the condenser side externally inputted temperature to the calculated value when the calculated value is not less than the measured value of the indoor dew-point temperature sensor 10 .
  • the condenser side refrigerant temperature control device 7 lowers the setting temperature to the measured value of the indoor dew-point temperature sensor 10 when the calculated value is not more than the measured value of the indoor dew-point temperature sensor 10 , and controls the opening degree of the heat medium flow rate control valve 23 so that the measured value of the condenser refrigerant liquid temperature sensor 8 becomes equal to the setting temperature.
  • the cooling unit capacity is increased by increasing the cooling capacity by lowering the condensing temperature, and dew formation in the evaporator 1 can be prevented.
  • the calculation of the condenser side control temperature is performed by setting the relational expression of the air quantity and the cooling capacity, the relational expression of the cooling capacity and the evaporation temperature, the design conditions, the relational expression of the evaporation temperature and the condensing temperature, and the relational expression of the condensing temperature and the condenser refrigerant liquid temperature in the cooling performance table, in advance.
  • FIG. 5 is a block diagram showing a configuration of a refrigerant circulation apparatus of a fifth embodiment, and the same or similar members as those of the refrigerant circulation apparatus shown in FIG. 1 will be described by being assigned with the same reference numerals.
  • the refrigerant circulation apparatus of FIG. 5 is an apparatus which controls the frequency of the heat medium conveying device 22 by a heat medium conveying device controlling device 26 instead of controlling the opening degree of the heat medium flow rate control valve 23 in the refrigerant circulation apparatus shown in FIG. 1 .
  • the same thing applies to the refrigerant circulation apparatuses shown in FIGS. 2 to 4 .
  • FIG. 6 is a block diagram showing a configuration of a refrigerant circulation apparatus of a sixth embodiment, and the same or similar members as those of the refrigerant circulation apparatus shown in FIG. 1 will be described by being assigned with the same reference numerals.
  • the refrigerant circulation apparatus of FIG. 6 is an apparatus which controls the frequency of a water spray type air-cooled condenser 27 by a water spray type air-cooled condenser blower control device 29 instead of controlling the opening degree of the heat medium flow rate control valve 23 when the condenser 3 is a water spray type air-cooled condenser 27 in the refrigerant circulation apparatus shown in FIG. 1 .
  • FIG. 7 is a block diagram showing a configuration of a refrigerant circulation apparatus of a seventh embodiment, and the same or similar members as those of the refrigerant circulation apparatus shown in FIG. 1 will be described by being assigned with the same reference numerals.
  • the refrigerant circulation apparatus of FIG. 7 is an apparatus which controls the frequency of a water spraying circulation pump 30 by a water spraying circulation pump control device 31 instead of controlling the frequency of the water spray type air-cooled condenser blower control device 29 in the refrigerant circulation apparatus shown in FIG. 6 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Air Conditioning Control Device (AREA)
US13/162,912 2010-06-18 2011-06-17 Refrigerant circulation apparatus Abandoned US20110308262A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010139401A JP5351097B2 (ja) 2010-06-18 2010-06-18 冷媒循環装置
JP2010-139401 2010-06-18

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US (1) US20110308262A1 (zh)
JP (1) JP5351097B2 (zh)
CN (1) CN102287972B (zh)
GB (1) GB2481317B (zh)
NL (1) NL2006949C2 (zh)
SG (1) SG177095A1 (zh)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150305209A1 (en) * 2012-12-03 2015-10-22 Nec Corporation Cooling system for electronic device storing apparatus and cooling system for electronic device storing building
US20170280590A1 (en) * 2014-08-27 2017-09-28 Nec Corporation Phase-change cooling device and phase-change cooling method
US20180038660A1 (en) * 2016-08-02 2018-02-08 Munters Corporation Active/passive cooling system
US10375901B2 (en) 2014-12-09 2019-08-13 Mtd Products Inc Blower/vacuum
US20210368647A1 (en) * 2016-08-02 2021-11-25 Munters Corporation Active/passive cooling system
WO2022101024A1 (en) * 2020-11-12 2022-05-19 Nokia Technologies Oy Apparatus and systems for cooling
US11340003B2 (en) 2018-08-14 2022-05-24 Hoffman Enclosures, Inc. Thermal monitoring for cooling systems
US20230137596A1 (en) * 2021-11-02 2023-05-04 Oracle International Corporation Unified control of cooling in computers
US20230209774A1 (en) * 2021-12-23 2023-06-29 Baidu Usa Llc Apparatus and system for two-phase server cooling
US11711908B1 (en) * 2022-03-18 2023-07-25 Baidu Usa Llc System and method for servicing and controlling a leak segregation and detection system of an electronics rack

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2013219731B2 (en) 2012-02-14 2015-05-14 Nec Corporation Cooling apparatus and cooling system
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CN112902314B (zh) * 2021-02-01 2023-07-14 青岛海信日立空调系统有限公司 一种空调器和空调器改善凝露吹水的控制方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267450A (en) * 1992-07-20 1993-12-07 Matsushita Electric Ind. Co., Ltd. Air conditioning apparatus
US20080245083A1 (en) * 2006-08-15 2008-10-09 American Power Conversion Corporation Method and apparatus for cooling
US20090201645A1 (en) * 2008-02-13 2009-08-13 Hitachi Plant Technologies, Ltd. Cooling system for electronic equipment
JP2010071590A (ja) * 2008-09-19 2010-04-02 Sanyo Electric Co Ltd 冷凍装置
US20100094434A1 (en) * 2007-02-14 2010-04-15 Carrier Corporation Optimization of air cooled chiller system operation
US20110220324A1 (en) * 2008-06-30 2011-09-15 Volker Lindenstruth Building for a computer centre with devices for efficient cooling

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810066B2 (ja) * 1987-10-31 1996-01-31 株式会社竹中工務店 ビル空調システム
JP2001248920A (ja) * 2000-03-06 2001-09-14 Mitsubishi Electric Corp 冷凍回路の制御装置
JP4749369B2 (ja) * 2007-03-30 2011-08-17 三菱電機株式会社 冷凍サイクル装置の故障診断装置及びそれを搭載した冷凍サイクル装置
US8151583B2 (en) * 2007-08-01 2012-04-10 Trane International Inc. Expansion valve control system and method for air conditioning apparatus
JP2009216295A (ja) * 2008-03-10 2009-09-24 Hitachi Plant Technologies Ltd 電子機器の冷却システム及びその運転方法
JP4850224B2 (ja) * 2008-10-28 2012-01-11 株式会社Ｎｔｔファシリティーズ 空気調和システム及びその運転方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267450A (en) * 1992-07-20 1993-12-07 Matsushita Electric Ind. Co., Ltd. Air conditioning apparatus
US20080245083A1 (en) * 2006-08-15 2008-10-09 American Power Conversion Corporation Method and apparatus for cooling
US20100094434A1 (en) * 2007-02-14 2010-04-15 Carrier Corporation Optimization of air cooled chiller system operation
US20090201645A1 (en) * 2008-02-13 2009-08-13 Hitachi Plant Technologies, Ltd. Cooling system for electronic equipment
US20110220324A1 (en) * 2008-06-30 2011-09-15 Volker Lindenstruth Building for a computer centre with devices for efficient cooling
JP2010071590A (ja) * 2008-09-19 2010-04-02 Sanyo Electric Co Ltd 冷凍装置

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2927778A4 (en) * 2012-12-03 2016-08-03 Nec Corp COOLING SYSTEM FOR ELECTRONIC EQUIPMENT STORAGE DEVICE AND COOLING SYSTEM FOR ELECTRONIC EQUIPMENT STORAGE FACILITY
US9693485B2 (en) * 2012-12-03 2017-06-27 Nec Corporation Cooling system for electronic device storing apparatus and cooling system for electronic device storing building
AU2013356152B2 (en) * 2012-12-03 2017-07-27 Nec Corporation Cooling system for electronic device storing apparatus and cooling system for electronic device storing building
US20150305209A1 (en) * 2012-12-03 2015-10-22 Nec Corporation Cooling system for electronic device storing apparatus and cooling system for electronic device storing building
US20170280590A1 (en) * 2014-08-27 2017-09-28 Nec Corporation Phase-change cooling device and phase-change cooling method
US10375901B2 (en) 2014-12-09 2019-08-13 Mtd Products Inc Blower/vacuum
US11255611B2 (en) * 2016-08-02 2022-02-22 Munters Corporation Active/passive cooling system
US20210368647A1 (en) * 2016-08-02 2021-11-25 Munters Corporation Active/passive cooling system
US20180038660A1 (en) * 2016-08-02 2018-02-08 Munters Corporation Active/passive cooling system
US11839062B2 (en) * 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
US11340003B2 (en) 2018-08-14 2022-05-24 Hoffman Enclosures, Inc. Thermal monitoring for cooling systems
WO2022101024A1 (en) * 2020-11-12 2022-05-19 Nokia Technologies Oy Apparatus and systems for cooling
EP4001819A1 (en) * 2020-11-12 2022-05-25 Nokia Technologies Oy Apparatus and systems for cooling
US20230137596A1 (en) * 2021-11-02 2023-05-04 Oracle International Corporation Unified control of cooling in computers
US11729940B2 (en) * 2021-11-02 2023-08-15 Oracle International Corporation Unified control of cooling in computers
US20230209774A1 (en) * 2021-12-23 2023-06-29 Baidu Usa Llc Apparatus and system for two-phase server cooling
US11711908B1 (en) * 2022-03-18 2023-07-25 Baidu Usa Llc System and method for servicing and controlling a leak segregation and detection system of an electronics rack

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GB201110161D0 (en) 2011-07-27
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GB2481317B (en) 2012-08-08

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