US20110209863A1 - Climate Control in a Radio Network Node - Google Patents

Climate Control in a Radio Network Node Download PDF

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Publication number
US20110209863A1
US20110209863A1 US13/127,170 US200813127170A US2011209863A1 US 20110209863 A1 US20110209863 A1 US 20110209863A1 US 200813127170 A US200813127170 A US 200813127170A US 2011209863 A1 US2011209863 A1 US 2011209863A1
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US
United States
Prior art keywords
closed space
arrangement
heat exchanger
electronic equipment
fixed member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/127,170
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English (en)
Inventor
Fredrik Jonsson
Klas Hedberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Assigned to TELEFONAKTEIBOLAGET LM ERICSSON (PUBL) reassignment TELEFONAKTEIBOLAGET LM ERICSSON (PUBL) ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEDBERG, KLAS, JONSSON, FREDRIK
Publication of US20110209863A1 publication Critical patent/US20110209863A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/207—Thermal management, e.g. cabinet temperature control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/14—Relay systems
    • H04B7/15—Active relay systems
    • H04B7/155—Ground-based stations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/206—Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger

Definitions

  • the present invention relates to an arrangement and a method in a radio network node for cooling electronic equipment within the radio network node.
  • a radio communication system of today comprises an access network and a number of communication devices.
  • the access network is built up of several nodes, in particular, radio base stations.
  • the primary task of a radio base station is to send and receive information to/from the communication devices within reach of the radio base station. In many cases, the base station is run 24 hours a day. Therefore, it is of particular interest and importance to ensure that the base station is operable predictably and reliably.
  • the radio base station further comprises a cabinet, which comprises an enclosure for housing circuitry, or electronic equipment, for performing different tasks of the radio base station.
  • the circuitry may comprise a power control unit, a radio unit and a filtering unit for performing corresponding tasks.
  • fans are used to circulate air through or over the heat generating equipment and through or over one side of a heat exchanger (i.e. an internal side within the enclosure). Moreover, further fans are used to force ambient air through or over the other side of the heat exchanger (i.e. an external side within the cabinet).
  • the heat exchanger comprises a refrigerant that absorbs heat from the air, heated by the electronic equipment, at the internal side within the enclosure. As a result, a transition from liquid phase to gas phase of the refrigerant occurs.
  • the portion of the heat exchanger that is located at the internal side within the enclosure is called evaporator.
  • the gas is, by evaporation, forced to the external side of the heat exchanger, where it dissipates heat to ambient air.
  • a transition from gas phase to liquid phase of the refrigerant occurs in the external side of the heat exchanger.
  • the portion of the heat exchanger that is located on the external side is called condenser.
  • gravity forces the liquid to flow towards the evaporator.
  • the device further comprises a controller for controlling the entire operation of the cooling device and a sensor for detecting an air temperature in the housing and transmitting a signal of the detected air temperature to the controller.
  • the normal control mode is to regulate the speed of each air regulating device as a function of the air temperature inside the housing.
  • an air temperature sensor normally measures the temperature in a point, and the air temperature can be uneven. Further, the air temperature sensor can also be influenced by radiation and local heat sources, e.g. a heater, which is an increasing problem with future very compact climate systems.
  • the object is achieved by an arrangement for controlling the cooling of electronic equipment in a radio network node.
  • the arrangement comprises a closed space for housing the electronic equipment and a heat exchanger for transporting heat from the closed space.
  • a first flow regulating device is arranged for circulating a cooling fluid within the closed space and a second flow regulating device is arranged for circulating a cooling fluid outside the closed space.
  • the arrangement further comprises at least one sensor for measuring temperature in the arrangement and a controller for controlling at least one of the first and second flow regulating devices based on at least one temperature measurement, wherein the at least one sensor is located on a fixed member within the arrangement.
  • the object is achieved by a method in a radio network node arrangement for cooling electronic equipment within the arrangement.
  • the arrangement comprises a closed space for housing the electronic equipment and a heat exchanger for transporting heat from the closed space.
  • the arrangement further comprises a first flow regulating device for circulating a cooling fluid within the closed space and a second flow regulating device for circulating a cooling fluid outside the closed space.
  • At least one sensor measures at least one temperature on a fixed member within the arrangement.
  • a controller receives the at least one measured temperature and controls at least one of the first and second flow regulating devices based on that temperature(s).
  • An advantage of the present invention is that the temperature used in accordance with the present invention for controlling the at least one of the first and second flow regulating devices is a stable temperature safe from influences such as radiation and/or local heat sources, e.g. heaters.
  • a reliable and stable value is provided to the controller used for controlling the flow regulating devices. This results in an efficient, reliable and improved cooling of electronic equipment within a radio network node in accordance with the object of the present invention.
  • FIG. 1 illustrates a schematic block diagram of parts within the arrangement within a network node according to the invention
  • FIG. 2 is a flow chart showing the methods according to the invention.
  • FIG. 1 shows an arrangement 100 in a radio network node 400 for cooling electronic equipment 102 within the arrangement 100 .
  • the arrangement comprises a closed space 104 , defined by wall members 104 of the closed space for housing the electronic equipment 102 .
  • the arrangement 100 further comprises a heat exchanger 106 for transporting heat from the closed space 104 to outside 112 of the closed space.
  • the heat exchanger 106 may comprise of one or several heat exchangers in series or in parallel.
  • a first flow regulating device 202 is arranged for circulating a cooling fluid 204 within the closed space 104 .
  • the heat exchanger 106 takes up heat from the cooling fluid 204 within the closed space and dissipates it outside 112 the closed space.
  • a second flow regulating device 206 is arranged for circulating an outer cooling fluid 208 outside 112 the closed space.
  • the flow regulating devices 202 , 206 may be for example fans.
  • the fluid regulating devices 202 , 206 are regulated by a controller 210 connected to the first and second flow regulating devices respectively.
  • the controller 210 is preferably located within the closed space in the vicinity of the first flow regulating device 202 .
  • the arrangement 100 further comprises at least one sensor 301 , 302 , 303 , 304 , 305 , 306 for measuring temperature within the closed space 104 or outside 112 the closed space.
  • the heat exchanger 106 includes a boiling and condensing refrigerant i.e. a refrigerant fluid, referred to as arrow 109 .
  • the heat exchanger 106 has a first portion 107 located within the closed space 104 .
  • This first portion 107 of the heat exchanger 106 is an evaporator.
  • the refrigerant fluid 109 evaporates and takes up heat energy from the cooling fluid 204 that has been warmed up by the electronic equipment 102 inside the closed space 104 .
  • the heat exchanger 106 also has a second portion 108 located outside 112 the closed space 104 .
  • the second portion 108 of the heat exchanger is a condenser.
  • the refrigerant fluid 109 is condensed and heat is dissipated to the outer cooling fluid 208 outside 112 of the closed space.
  • the refrigerant flow 109 between the first portion 107 and the second portion 108 is generated either by gravitation from the density difference between liquid and gas phases of the refrigerant, as in a thermosiphon or by gravitation and capillary forces, as in a heat pipe.
  • the first and second fluid regulating devices 202 , 206 are used to force the cooling fluids in directions indicated by arrows 204 , 208 on both or either sides of the heat exchanger 106 to improve the cooling capacity.
  • the cooling of the electronic equipment 102 within the arrangement is controlled by controlling at least one of the first and second flow regulating devices 202 , 206 based on at least one temperature measurement wherein the at least one sensor 301 , 302 , 303 , 304 , 305 , 306 is located on a fixed member 102 , 104 , 106 , 112 , 308 within the arrangement 100 .
  • the sensors 301 , 302 , 303 , 304 , 305 , 306 shown in FIG. 1 are shown for illustrative purpose and it is to be understood that still further sensors may be positioned on further fixed members within the arrangement 100 .
  • the fixed member may be represented by
  • the measuring piece 308 protrudes from the electronic equipment 102 into the cooling fluid 204 in the closed space 104 .
  • An advantage with this embodiment is that the change in temperature of the measuring piece involves a certain inertia or delay, which means that measuring piece 308 will have a similar temperature to that in the electronic equipment 102 during a cold start up.
  • the measuring piece 308 protrudes from an outside 112 wall member into the outer cooling fluid 208 outside the closed space.
  • an external sensor in combination with any of the other suggested sensors gives the possibility to chose the most efficient and appropriate cooling mode. For example, at lower ambient temperatures it is very efficient to start the second flow regulating device 206 and take the temperature inside the closed space 104 down, whereas at higher ambient temperatures in a situation when the interior is already close to the ambient it will be less noisy to speed up the first flow regulating device 202 .
  • this controlling arrangement makes it possible to optimize the cooling depending on heat dissipation and ambient conditions.
  • the fixed member is represented by a heat sensitive part of the electronic equipment or a heat sink of the electronic equipment.
  • a sensor 303 , 305 may be positioned for example on or near a temperature sensitive part of the electronic equipment 102 or in a heat sink on the electronic equipment.
  • the equipment temperature is often the limiting factor for the life length or reliability of the arrangement.
  • the equipment temperature depends on both the cooling fluid 204 temperature inside the closed space 104 , the heat transfer to the cooling fluid 204 inside the closed space and the heat dissipation of the electronic equipment 102 . By measuring the temperature of the electronic equipment 102 all these factors are taken into account. Also, in case of a sudden increase in heat generation within the system, for example in a starting up mode, a fast response from the cooling system can be achieved.
  • the fixed member 102 , 104 , 106 , 112 , 308 is represented by a first portion 107 of the heat exchanger 106 located in the closed space 104 .
  • a sensor 302 may be positioned somewhere on the piping of the first portion 107 , the evaporator, of the heat exchanger 106 within the closed space 104 .
  • the temperature of the evaporator piping on the internal parts of the heat exchanger depends on the temperature of the cooling fluid 204 inside the closed space, the fluid 208 outside 112 the closed space and how the fluid regulating devices are regulated.
  • the most significant influence of this temperature and the capacity of the heat exchanger 106 is the amount of fluid flow 208 over the second portion 108 of the heat exchanger 106 , possibly generated by a the second fluid regulating device 206 outside the closed space.
  • the evaporator piping temperature gives an even value temperature as heat is distributed in the material of the piping.
  • the fixed member 102 , 104 , 106 , 112 , 308 is represented by a second portion 108 of the heat exchanger 106 located outside 112 the closed space.
  • a sensor 301 can be positioned somewhere on the condenser piping outside 112 the closed space.
  • the temperature of the condenser piping on the external parts of the heat exchanger depends on the fluid flow 208 outside the arrangement, the heat transfer in the heat exchanger 106 and how the fluid regulating devices 202 , 206 are regulated. Normally, the fluid flow 208 outside the arrangement 100 is the ambient air.
  • the fixed member 102 , 104 , 106 , 112 , 308 is represented by a refrigerant fluid 109 circulating in the heat exchanger 106 .
  • a sensor 304 may be positioned somewhere on the inside or on the outside of the piping of the first portion 107 of the heat exchanger 106 .
  • the refrigerant 109 temperature is slightly lower than the mean temperature of the cooling fluid 204 that has passed through or over the first portion 107 and slightly higher than the mean temperature of the cooling fluid 208 surrounding or that has passed through or over the second portion 108 of the heat exchanger 106 .
  • the refrigerant 109 temperature is a stable temperature safe from influences such as radiation and/or local heat sources (heaters). It also gives a mean value of the cooling fluid 204 temperature over the first portion 107 of the heat exchanger 106 .
  • the senor is a temperature sensor.
  • the senor is a pressure sensor for indirectly measuring the temperature.
  • a pressure sensor may be used for measuring the temperature of the refrigerant fluid.
  • the temperature of the refrigerant fluid can be established. Since there is always a saturated condition in the refrigerant circuit 109 , the relation between temperature and pressure for a chosen refrigerant can be established through reference data for each refrigerant.
  • the dotted line having reference number 112 illustrates wall members outside 112 the closed space.
  • the second portion 108 of the heat exchanger 106 and the second flow regulation device 206 are located outside 112 the closed space and are in contact with the ambient air.
  • the arrangement 100 comprises a closed space 104 for housing the electronic equipment 102 , a heat exchanger 106 for transporting heat from the closed space and a first flow regulating device 202 for circulating a cooling fluid 204 within the closed space 104 and a second flow regulating device 206 for circulating an outer cooling fluid 208 outside 112 the closed space.
  • At least one temperature is measured on a fixed member 102 , 104 , 106 , 112 , 308 in the arrangement 100 wherein a reliable and stable value is provided to the controller 210 used for controlling the flow regulating devices 202 , 204 .
  • a reliable and stable value is provided to the controller 210 used for controlling the flow regulating devices 202 , 204 .
  • fixed member is used.
  • the expression fixed member shall be interpreted to mean any member of a radio network node arrangement, inside the closed space or outside the closed space that has a solid, semi-solid or liquid phase, such as any part of the electronic equipment, any part of the heat exchanger, the flow generating devices, any part of the construction elements of the arrangement, for example wall members, racks for holding equipment as well as batteries and battery compartments within the arrangement.
  • the fixed member may be a piece of material without any practical or mechanical function but located within the arrangement to act as a measuring piece, protruding slightly from its fixing point and made of preferably a metallic, polymeric or composite material.
  • the heat exchanger may be an air-to-air heat exchanger, for example a plate heat exchanger, or a boiling and condensing heat exchanger comprising a refrigerant fluid.
  • the radio network node may be a Radio Base Station (RBS) or any other kind of node in a radio communication system, which node comprises heat generating electronic equipment.
  • RBS Radio Base Station
  • nodes are transmission nodes, Remote Subscriber Switches (RSS) and nodes with similar functionality.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/127,170 2008-11-03 2008-11-03 Climate Control in a Radio Network Node Abandoned US20110209863A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2008/051250 WO2010050864A1 (en) 2008-11-03 2008-11-03 Climate control in a radio network node

Publications (1)

Publication Number Publication Date
US20110209863A1 true US20110209863A1 (en) 2011-09-01

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ID=40873257

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/127,170 Abandoned US20110209863A1 (en) 2008-11-03 2008-11-03 Climate Control in a Radio Network Node

Country Status (10)

Country Link
US (1) US20110209863A1 (ko)
EP (1) EP2351474B1 (ko)
JP (1) JP5453444B2 (ko)
KR (1) KR101490545B1 (ko)
CN (1) CN102204423B (ko)
AU (1) AU2008363682B2 (ko)
BR (1) BRPI0823250A2 (ko)
CL (1) CL2009002022A1 (ko)
ES (1) ES2415167T3 (ko)
WO (1) WO2010050864A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10005355B2 (en) 2014-01-28 2018-06-26 General Electric Company Integrated mounting and cooling apparatus, electronic device, and vehicle
US10073512B2 (en) 2014-11-19 2018-09-11 General Electric Company System and method for full range control of dual active bridge

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6069880B2 (ja) * 2012-04-24 2017-02-01 富士通株式会社 ラック装置、ラックシステム及び筐体構造

Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414050A (en) * 1967-04-11 1968-12-03 Navy Usa Heat pipe control apparatus
US3602429A (en) * 1968-11-04 1971-08-31 Isotopes Inc Valved heat pipe
US4437510A (en) * 1982-03-29 1984-03-20 The United States Of America As Represented By The Secretary Of The Navy Heat pipe control apparatus
US4475358A (en) * 1981-09-12 1984-10-09 Firma Ing. Rolf Seifert Electronic Air conditioner
US4600050A (en) * 1985-04-26 1986-07-15 Noren Don W Heat exchanger
US5121291A (en) * 1991-02-13 1992-06-09 Mentor Systems, Inc. Ventilation system in a portable computer
US5216577A (en) * 1991-10-25 1993-06-01 Comtronics Enclosures Corporation Stable thermal enclosure for outdoor electronics
JPH0888493A (ja) * 1994-09-20 1996-04-02 Hitachi Ltd 電子装置
US5523563A (en) * 1994-08-12 1996-06-04 E. I. Du Pont De Nemours And Company Apparatus for controlling the temperature of a near-infrared analyzer
JPH08284830A (ja) * 1995-04-14 1996-10-29 Kawamoto Seisakusho:Kk ポンプ運転用制御盤およびこれを用いたポンプ装置
US5738166A (en) * 1996-01-31 1998-04-14 Chou; Ching-Long Heat exchanger
US5765743A (en) * 1996-06-13 1998-06-16 Fujitsu Limited Outdoor installation type cabinet
US5806583A (en) * 1995-04-14 1998-09-15 Nippondenso Co. Ltd. Easily manufactured cooling apparatus using boiling and condensing refrigerant and method of manufacturing the same
US5881805A (en) * 1997-02-21 1999-03-16 Zexel Corporation Laminated heat exchanger
US6026891A (en) * 1996-06-12 2000-02-22 Denso Corporation Cooling device boiling and condensing refrigerant
US6039111A (en) * 1997-02-14 2000-03-21 Denso Corporation Cooling device boiling and condensing refrigerant
US6104003A (en) * 1998-10-09 2000-08-15 Ericsson, Inc. Electronics cabinet cooling system
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6131647A (en) * 1997-09-04 2000-10-17 Denso Corporation Cooling system for cooling hot object in container
US20010042614A1 (en) * 2000-05-19 2001-11-22 Yoshiyuki Okamoto Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
US20020134544A1 (en) * 2000-09-07 2002-09-26 Thermotek, Inc. Passive cooling system and method
US6538883B1 (en) * 2001-09-19 2003-03-25 Turin Networks Method and apparatus for thermally insulated and earth cooled electronic components within an electronic system
US6574082B2 (en) * 2001-10-09 2003-06-03 Ericsson Inc. Methods and systems for operating temperature controls for electronic equipment
US6598668B1 (en) * 2000-04-12 2003-07-29 Marconi Communications, Inc. Exhaust system for electronic equipment enclosure
US6612365B1 (en) * 1999-09-17 2003-09-02 Matsushita Electric Industrial Co., Ltd. Heating-element accommodating-box cooling apparatus and method of controlling the same
JP2003347782A (ja) * 2002-05-27 2003-12-05 Denso Corp 冷却装置
US6742583B2 (en) * 1999-08-20 2004-06-01 Nokia Corporation Cooling system for a cabinet
US20040148948A1 (en) * 2002-03-28 2004-08-05 Susumu Kameyama Cooling device
US7061763B2 (en) * 2002-01-29 2006-06-13 Telefonaktiebolaget Lm Ericsson (Publ) Cabinet cooling
US20080245521A1 (en) * 2007-03-12 2008-10-09 Rejean Lavergne Cooling system for an enclosure
US7505269B1 (en) * 2007-10-11 2009-03-17 Valere Power Inc. Thermal energy storage transfer system
US7631687B2 (en) * 2006-01-24 2009-12-15 Delta Electronics, Inc. Heat exchanger
US7954332B2 (en) * 2007-01-19 2011-06-07 Alkhorayef Petroleum Company Temperature control systems and methods
US8733430B2 (en) * 2007-03-06 2014-05-27 Toyota Jidosha Kabushiki Kaisha Cooling apparatus and cooling method for electrical equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3750209B2 (ja) * 1996-03-29 2006-03-01 株式会社デンソー 沸騰冷却装置
JP4463920B2 (ja) * 1999-08-26 2010-05-19 三菱電機株式会社 通信中継基地局の冷却制御方式
JP4318567B2 (ja) * 2004-03-03 2009-08-26 三菱電機株式会社 冷却システム
JP2006172269A (ja) * 2004-12-17 2006-06-29 Toshiba Corp 情報処理装置
JP4609260B2 (ja) * 2005-09-21 2011-01-12 パナソニック株式会社 熱交換型冷却装置
JP4434199B2 (ja) 2006-12-14 2010-03-17 トヨタ自動車株式会社 電気機器の冷却装置、冷却方法および冷却方法をコンピュータに実現させるプログラムならびにそのプログラムを記録した記録媒体

Patent Citations (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414050A (en) * 1967-04-11 1968-12-03 Navy Usa Heat pipe control apparatus
US3602429A (en) * 1968-11-04 1971-08-31 Isotopes Inc Valved heat pipe
US4475358A (en) * 1981-09-12 1984-10-09 Firma Ing. Rolf Seifert Electronic Air conditioner
US4437510A (en) * 1982-03-29 1984-03-20 The United States Of America As Represented By The Secretary Of The Navy Heat pipe control apparatus
US4600050A (en) * 1985-04-26 1986-07-15 Noren Don W Heat exchanger
US5121291A (en) * 1991-02-13 1992-06-09 Mentor Systems, Inc. Ventilation system in a portable computer
US5216577A (en) * 1991-10-25 1993-06-01 Comtronics Enclosures Corporation Stable thermal enclosure for outdoor electronics
US5523563A (en) * 1994-08-12 1996-06-04 E. I. Du Pont De Nemours And Company Apparatus for controlling the temperature of a near-infrared analyzer
JPH0888493A (ja) * 1994-09-20 1996-04-02 Hitachi Ltd 電子装置
JPH08284830A (ja) * 1995-04-14 1996-10-29 Kawamoto Seisakusho:Kk ポンプ運転用制御盤およびこれを用いたポンプ装置
US5806583A (en) * 1995-04-14 1998-09-15 Nippondenso Co. Ltd. Easily manufactured cooling apparatus using boiling and condensing refrigerant and method of manufacturing the same
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US5738166A (en) * 1996-01-31 1998-04-14 Chou; Ching-Long Heat exchanger
US6026891A (en) * 1996-06-12 2000-02-22 Denso Corporation Cooling device boiling and condensing refrigerant
US5765743A (en) * 1996-06-13 1998-06-16 Fujitsu Limited Outdoor installation type cabinet
US6039111A (en) * 1997-02-14 2000-03-21 Denso Corporation Cooling device boiling and condensing refrigerant
US5881805A (en) * 1997-02-21 1999-03-16 Zexel Corporation Laminated heat exchanger
US6131647A (en) * 1997-09-04 2000-10-17 Denso Corporation Cooling system for cooling hot object in container
US6104003A (en) * 1998-10-09 2000-08-15 Ericsson, Inc. Electronics cabinet cooling system
US6742583B2 (en) * 1999-08-20 2004-06-01 Nokia Corporation Cooling system for a cabinet
US6612365B1 (en) * 1999-09-17 2003-09-02 Matsushita Electric Industrial Co., Ltd. Heating-element accommodating-box cooling apparatus and method of controlling the same
US6598668B1 (en) * 2000-04-12 2003-07-29 Marconi Communications, Inc. Exhaust system for electronic equipment enclosure
US20010042614A1 (en) * 2000-05-19 2001-11-22 Yoshiyuki Okamoto Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
US20020134544A1 (en) * 2000-09-07 2002-09-26 Thermotek, Inc. Passive cooling system and method
US6538883B1 (en) * 2001-09-19 2003-03-25 Turin Networks Method and apparatus for thermally insulated and earth cooled electronic components within an electronic system
US6574082B2 (en) * 2001-10-09 2003-06-03 Ericsson Inc. Methods and systems for operating temperature controls for electronic equipment
US7061763B2 (en) * 2002-01-29 2006-06-13 Telefonaktiebolaget Lm Ericsson (Publ) Cabinet cooling
US20040148948A1 (en) * 2002-03-28 2004-08-05 Susumu Kameyama Cooling device
JP2003347782A (ja) * 2002-05-27 2003-12-05 Denso Corp 冷却装置
US7631687B2 (en) * 2006-01-24 2009-12-15 Delta Electronics, Inc. Heat exchanger
US7954332B2 (en) * 2007-01-19 2011-06-07 Alkhorayef Petroleum Company Temperature control systems and methods
US8733430B2 (en) * 2007-03-06 2014-05-27 Toyota Jidosha Kabushiki Kaisha Cooling apparatus and cooling method for electrical equipment
US20080245521A1 (en) * 2007-03-12 2008-10-09 Rejean Lavergne Cooling system for an enclosure
US7505269B1 (en) * 2007-10-11 2009-03-17 Valere Power Inc. Thermal energy storage transfer system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10005355B2 (en) 2014-01-28 2018-06-26 General Electric Company Integrated mounting and cooling apparatus, electronic device, and vehicle
US10073512B2 (en) 2014-11-19 2018-09-11 General Electric Company System and method for full range control of dual active bridge

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KR101490545B1 (ko) 2015-02-05
JP5453444B2 (ja) 2014-03-26
AU2008363682A1 (en) 2010-05-06
WO2010050864A1 (en) 2010-05-06
JP2012507852A (ja) 2012-03-29
CN102204423B (zh) 2014-06-18
ES2415167T3 (es) 2013-07-24
CL2009002022A1 (es) 2010-11-12
BRPI0823250A2 (pt) 2015-06-23
EP2351474A1 (en) 2011-08-03
CN102204423A (zh) 2011-09-28
KR20110091660A (ko) 2011-08-12
AU2008363682B2 (en) 2014-08-07
EP2351474B1 (en) 2013-04-17

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