US20110073282A1 - Method for cooling microwave plasma and system for the selective destruction of chemical molecules using said method - Google Patents

Method for cooling microwave plasma and system for the selective destruction of chemical molecules using said method Download PDF

Info

Publication number
US20110073282A1
US20110073282A1 US12/994,695 US99469509A US2011073282A1 US 20110073282 A1 US20110073282 A1 US 20110073282A1 US 99469509 A US99469509 A US 99469509A US 2011073282 A1 US2011073282 A1 US 2011073282A1
Authority
US
United States
Prior art keywords
fluid
dielectric tube
tube
dielectric
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/994,695
Other languages
English (en)
Inventor
Daniel Guelles
Christian Larquet
Jean-Christophc Rostaing
Michel Moisan
Pascal Moine
Bruno Depert
Valère Laurent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Assigned to L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE reassignment L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAURENT, VALERE, MOINE, PASCAL, LARQUET, CHRISTIAN, DEPERT, BRUNO, GUERIN, DANIEL, MOISAN, MICHEL, ROSTAING, JEAN-CHRISTOPHE
Publication of US20110073282A1 publication Critical patent/US20110073282A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H1/461—Microwave discharges
    • H05H1/4622—Microwave discharges using waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H1/461—Microwave discharges
    • H05H1/463—Microwave discharges using antennas or applicators

Definitions

  • the invention relates to a method for cooling a plasma treatment system for treating an especially gaseous fluid or fluid mixture, the system comprising means for coupling a microwave power source to an especially gaseous fluid mixture flowing in a dielectric tube past coupling means that transfer a part of the microwave energy to the fluid mixture in order to create therein a plasma that causes at least some of the chemical bonds of the fluid molecules to break, said dielectric tube being cooled by a flow of a coolant in thermal contact with the external wall of the tube to be cooled.
  • the invention also relates to a system for selectively destroying chemical molecules that uses this cooling method.
  • substances in the gaseous state are used in numerous steps for producing and interconnecting semiconductor elements—in ion implantation, etching and in physical or chemical deposition (PVD or CVD).
  • Some of these substances may be what are called “greenhouse gases”, that is to say they contribute to global warming when present in the atmosphere, such as especially certain fluorine derivatives—in particular perfluorocarbon (PFC) or hydrofluorocarbon (HFC) gases—or they may be certain fluids and especially certain atmospheric pollution gases that present an immediate danger to life or health and that are more particularly toxic, corrosive, inflammable, pyrophoric and/or explosive.
  • gases and a number of gaseous precursors, or precursors delivered in vapor form when they are initially solids or liquids are used.
  • the gas obtained comprises a small quantity of fluorinated gases as such, for example CF 4 or C 2 F 6 , which must be removed as best as possible from the gas to be purified.
  • Effluent gases such as, in particular, PFC or HFC effluents from etchers are systematically diluted with nitrogen in the rough vacuum pumps, because of their hazardousness.
  • the gas mixture fed into a system for treating or destroying effluents of the above type therefore mainly consists of nitrogen.
  • the discharge tube is cooled by a heat-transfer fluid that flows, from one end of the tube to the other, in a space between said tube and an outer, coaxial second tube that confines the liquid.
  • the excellent thermal conductivity of the ceramic may lead the temperature of the external surface in contact with the boundary layer of the dielectric coolant to exceed the temperature at which the physicochemical properties of the latter are stable.
  • the onset of a solid-state polymerization may be observed on the wall of the tube, the deposit formed generally absorbing microwaves leading to a chain-reaction effect (because the absorption generally increases with temperature, the hotter the tube gets the more it is heated) and creating very highly overheated regions which tend to spread gradually.
  • These very high thermal stresses, in a very small thickness of material, are likely to cause the tube to crack or break.
  • the dielectric heat-transfer fluid may also undergo a volume transformation, becoming cloudy and malodorous due to the formation of decomposition products that are thought to be harmful. Without making any presumptions regarding the degradation of the functional properties of the fluid (i.e. dielectric and heat-transfer properties), the harmfulness of the waste product is unacceptable in an industrial plant.
  • the use of silicone fluids like polydimethylsiloxane (PDMS) was stopped due to the presumed harmfulness of its thermal decomposition products.
  • the invention aims to alleviate the various aforementioned drawbacks by providing a system for cooling the tube, especially a dielectric tube, in which the atmospheric-pressure plasma is generated, which is different from the systems of the prior art.
  • the coolant in thermal contact with the dielectric tube flows cocurrently to the fluid or fluid mixture in the dielectric tube and, on the other hand, the coolant comprises at least one oil chosen from among linear alpha-olefins having a carbon chain of at least ten carbon atoms and/or perfluorocarbon liquids having a dielectric constant ⁇ lower than 2.5, a loss tangent tan ⁇ of between 10 ⁇ 2 and 10 ⁇ 4 and a specific heat Cp ⁇ 0.6 g.cal/g.° C.
  • At least one linear alpha-olefin is used, preferably a C 14 linear alpha-olefin or 1-tetradecene and/or a perfluorocarbon (PFC) fluid having a dielectric constant ⁇ 2 and/or a loss tangent tan ⁇ 10 ⁇ 3 and/or a specific heat Cp ⁇ 0.3 g.cal/g.° C.
  • PFC perfluorocarbon
  • the fluid mixture is injected into the tube at atmospheric pressure or at a pressure near atmospheric pressure.
  • the fluid mixture and/or a complementary inert gas are/is injected in the form of a vortex.
  • the fluid to be treated and the coolant flow from top to bottom.
  • the invention also relates to a plasma treatment system comprising:
  • FIG. 1 a schematic overview of the system according to the invention
  • FIG. 2 a a vertical section view of a vortex-creating fluid injection head suitable for the system of FIG. 1 ;
  • FIG. 2 b a section view along the line A-A in FIG. 1 ;
  • FIG. 2 c a horizontal section view along the line B-B in FIG. 2 a ;
  • FIG. 3 is an embodiment of a vortex-creating injection head.
  • the plasma treating system A for treating gases comprises a surfaguide field applicator 1 as described in EP-A-874537, a heat exchanger B, wet scrubbing means C and then dry scrubbing means D (C and D can be placed in the reverse order if desired).
  • the system A is fed via the valve Vd with a gas used for striking the plasma and/or via the valve Vf with the gas to be treated.
  • the gas to be treated is emitted from one of the reactors CVD 1 , CVD 2 , CVD 3 , . . . CVDn, via the valves V 1 , V 2 , V 3 , . . . Vn, respectively (these gases may be gasses emitted from reactors used in the fabrication of semiconductors or flat-screen displays or optical fibers of solar cells, etc.).
  • the system A also comprises a dielectric tube 16 surrounded by a cooling system comprising a heat-transfer 19 that absorbs the microwaves fluid sufficiently weakly for power to remain available to sustain the plasma and that flows in the space 18 defined by the silica outer tube 17 and the dielectric tube 16 .
  • the inlet for the fluid 19 is located in the bottom part 13 of the system A and the outlet 20 for the fluid 19 , after having cooled the tube 16 , is located in the top part 24 .
  • the dielectric tube 16 passes through the reduced central part 3 of the field applicator 1 (the height of the short side of the rectangular-section hollow waveguide decreases relative to the standard waveguide height), the silica tube 17 surrounding the space 18 in which the coolant flows.
  • Electrically conducting jackets 7 , 8 which act as electromagnetic shields, are placed around the top and bottom parts of the aforementioned tubes, respectively.
  • the bottom part of the jacket 7 and the dielectric tube are separated by an optimized radial distance so as to maximize the coupling between the waveguide and the tube, without the presence of the jacket interfering with the microwaves.
  • the top part of the jacket 8 and the tube next to the bottom part of the applicator 1 are separated by the same optimized radial distance.
  • the jackets 7 , 8 are adjacent the top part 24 and the bottom part 13 , respectively.
  • the field applicator 1 formed from a hollow rectangular waveguide comprises a central part 3 having a reduced cross section relative to the standard cross section used at the input/output 2 , 4 located on either side of this central part 3 .
  • the microwave power when the system is in operation, is transmitted from the lateral part 2 toward the central part 3 , in which central part the microwaves are concentrated and then launched along the tube 16 , from both sides of this central part 3 of the field applicator, so as to create a plasma in the tube by providing it with energy over the entire propagation length of the wave along the tube.
  • This plasma is struck using the electrode 23 which is secured to the support 10 located above the top part 9 of the system A.
  • the electrode 23 is kept substantially aligned with the axis of the dielectric tube 16 , said electrode being is connected to a high-voltage source or an ignition coil.
  • the system for striking the plasma is connected to a valve Vn and comprises essentially two branches: one connected to an argon (Ar) source via a mass flow controller and a valve V Ar , the other connected to a nitrogen source via a mass flow controller and a valve V N2 .
  • the heat exchanger B allows the hot gases emitted from the plasma of the system A to be cooled and then passed, at about 150° C. at most, to the wet scrubber C and the dry scrubber D (or vice-versa).
  • FIG. 2 shows a system for injecting gasses (whether gasses for striking the plasma or for treatment) in the form of a vortex.
  • the gas and/or fluid injection ducts arrive tangentially at the vertical duct 54 , which prolongs the dielectric tube 16 , so as to create a swirling effect in the gasses and/or fluids injected.
  • FIG. 2 a is a vertical section view of the top part 9 , 24 of the plasma system A.
  • Four gas-injection ducts ( 57 , 51 ), ( 58 , 62 ), ( 59 , 53 ) and ( 60 , 64 ), all shown in FIG. 2 b (which is a section view along the line A-A in FIG. 1 ) allow this vortex to be created in the duct 54 .
  • the holder 10 for the electrode 23 is secured to the top part 9 ( 24 ).
  • the four injection ducts when viewed in the horizontal plane, are preferably at 90° to each other and, when viewed in the vertical plane, may be oriented either horizontally or downwardly.
  • the ducts ( 70 , 72 ) and ( 71 , 73 ) are also connected tangentially to the central duct 54 and are at 180° to each other. They allow an additional gas (for example nitrogen) to be injected when the gas flow injected by the four injectors located in the plane A-A is insufficient to sustain a vortex. Such a vortex reduces heat exchange with the wall of the dielectric tube, prevents direct contact between the plasma and the same dielectric tube and thus prevents a too high a temperature, which could damage the tube, from being reached.
  • an additional gas for example nitrogen
  • FIG. 3 shows a schematic view of an embodiment of an injection head 9 for injecting gas to be treated in the plasma, with which injection head an effective vortex is achieved.
  • This injection head 9 comprises an inlet ( 11 ) for introducing the gasses to be treated, which then flow via the channel 80 that is coaxial with the inlet 11 toward the peripheral channel, the successive portions 81 , 82 , 83 and 84 of which have been shown in cross section—this continuous channel winds around the solid central part (a structure similar to a spiral staircase around a central column 85 ).
  • This solid central part 85 is preferably made of a conductor which has a conical bottom part 86 serving as electrode for striking the plasma created in the dielectric tube 16 .
  • the solid parts 87 , 88 , 89 , 90 and 91 that protrude relative to the axis 85 are solid parts that spiral around the axis 85 defining the gas channel.
  • the top part 92 above the central part 85 is housed in a removable piece 93 that holds the central part stationary, an O-ring 94 being used as a vacuum seal.
  • the channel 81 , 82 , . . . , through which the gas flows so as to create a vortex in the tube 16 will have an axis inclined at an angle to the horizontal of between approximately 25° and 35°, more preferably about 30°.
  • FC 70 oil is used instead of a C 14 oil, the product d ⁇ Cp drops from 0.5 to 0.38 implying that the flow rate may be reduced by 30% for the same performance.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Fluid Mechanics (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Treating Waste Gases (AREA)
US12/994,695 2008-05-28 2009-04-30 Method for cooling microwave plasma and system for the selective destruction of chemical molecules using said method Abandoned US20110073282A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08305206.8 2008-05-28
EP08305206A EP2131633A1 (fr) 2008-05-28 2008-05-28 Procédé de refroidissement d'un plasma micro-onde et système de destruction sélective de molécules chimiques utilisant ce procédé
PCT/EP2009/055264 WO2009144110A1 (fr) 2008-05-28 2009-04-30 Procede de refroidissement d'un plasma micro-onde et systeme de destruction selective de molecules chimiques utilisant ce procede

Publications (1)

Publication Number Publication Date
US20110073282A1 true US20110073282A1 (en) 2011-03-31

Family

ID=39811616

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/994,695 Abandoned US20110073282A1 (en) 2008-05-28 2009-04-30 Method for cooling microwave plasma and system for the selective destruction of chemical molecules using said method

Country Status (6)

Country Link
US (1) US20110073282A1 (fr)
EP (2) EP2131633A1 (fr)
JP (1) JP2011522691A (fr)
KR (1) KR20110021816A (fr)
TW (1) TW200952568A (fr)
WO (1) WO2009144110A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190252156A1 (en) * 2016-10-12 2019-08-15 Meyer Burger (Germany) GmH Plasma Treatment Device with Two Microwave Plasma Sources Coupled to One Another, and Method for Operating a Plasma Treatment Device of this Kind
US11964549B2 (en) 2018-07-04 2024-04-23 Bp P.L.C. Multiple cooling circuit systems and methods for using them

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101720987B1 (ko) 2015-04-28 2017-04-10 주식회사 글로벌스탠다드테크놀로지 난분해성 유해가스의 처리장치 및 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828703A (en) * 1983-12-28 1989-05-09 Union Carbide Corporation Method for replacing PCB-containing coolants in electrical induction apparatus with substantially PCB-free dielectric coolants
US5159527A (en) * 1991-12-05 1992-10-27 Minnesota Mining And Manufacturing Company Dielectric liquids
EP0874537A1 (fr) * 1997-04-25 1998-10-28 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Dispositif d'excitation d'un gaz par plasma d'onde de surface et installation de traitement de gaz incorporant un tel dispositif
US6541917B1 (en) * 1998-12-22 2003-04-01 L'air Liquide Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Section of pipe for a gas treatment device and device incorporating such a section of pipe
US20040149224A1 (en) * 2002-08-30 2004-08-05 Albert Wang Gas tube end cap for a microwave plasma generator
WO2006008421A2 (fr) * 2004-07-13 2006-01-26 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Traitement d'effluents gazeux par plasma a pression atmospherique

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE434676B (sv) * 1981-10-22 1984-08-06 Skf Steel Eng Ab Sett och anordning for uppvermning av for industriella endamal avsedd processluft
CA1261735A (fr) * 1984-04-20 1989-09-26 William J. Klaila Methode et dispositif de separation de fractions d'hydrocarbures, pour faciliter l'extraction et le raffinage des hydrocarbures liquides, pour isoler les reservoirs de stockage, et pour le decrassage des citernes de stockage et des pipelines
JPH0693397B2 (ja) * 1987-12-29 1994-11-16 日本高周波株式会社 熱プラズマ発生装置
JPH03214600A (ja) * 1990-01-17 1991-09-19 Nippon Koshuha Kk マイクロ波熱プラズマ反応装置
JPH0562793A (ja) * 1991-08-30 1993-03-12 Hitachi Ltd プラズマヒータ
JP3390788B2 (ja) * 1993-09-13 2003-03-31 独立行政法人産業技術総合研究所 高周波誘導熱プラズマ発生方法および有機ハロゲン化合物の分解方法
FR2751565B1 (fr) * 1996-07-26 1998-09-04 Air Liquide Procede et installation de traitement de gaz perfluores et hydrofluorocarbones en vue de leur destruction
DE69733660T2 (de) * 1996-11-04 2006-05-18 Materials Modification, Inc. Mikrowellenplasma chemischen synthese von ultrafeinen pulvern
JP2000119671A (ja) * 1998-10-20 2000-04-25 Matsushita Refrig Co Ltd 冷凍システム
JP4035916B2 (ja) * 1999-03-30 2008-01-23 松下電工株式会社 プラズマ処理装置及びプラズマ処理方法
JP2001025658A (ja) * 1999-07-15 2001-01-30 Mitsubishi Heavy Ind Ltd プラズマ着火方法及び有機ハロゲン化合物の分解方法
JP4075237B2 (ja) * 1999-08-17 2008-04-16 松下電工株式会社 プラズマ処理システム及びプラズマ処理方法
JP2004313998A (ja) * 2003-04-18 2004-11-11 Ebara Corp ハロゲン化物の分解装置
JP3621946B1 (ja) * 2004-02-27 2005-02-23 三菱重工業株式会社 有機ハロゲン化合物放電分解装置およびその方法
JP2006102717A (ja) * 2004-10-08 2006-04-20 Taiyo Nippon Sanso Corp 有害成分含有ガスの処理方法および処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828703A (en) * 1983-12-28 1989-05-09 Union Carbide Corporation Method for replacing PCB-containing coolants in electrical induction apparatus with substantially PCB-free dielectric coolants
US5159527A (en) * 1991-12-05 1992-10-27 Minnesota Mining And Manufacturing Company Dielectric liquids
EP0874537A1 (fr) * 1997-04-25 1998-10-28 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Dispositif d'excitation d'un gaz par plasma d'onde de surface et installation de traitement de gaz incorporant un tel dispositif
US6541917B1 (en) * 1998-12-22 2003-04-01 L'air Liquide Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Section of pipe for a gas treatment device and device incorporating such a section of pipe
US20040149224A1 (en) * 2002-08-30 2004-08-05 Albert Wang Gas tube end cap for a microwave plasma generator
WO2006008421A2 (fr) * 2004-07-13 2006-01-26 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Traitement d'effluents gazeux par plasma a pression atmospherique
US20080234530A1 (en) * 2004-07-13 2008-09-25 Yassine Kabouzi Atmospheric Pressure Plasma Treatment of Gaseous Effluents

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Moisan, EP0874537, 04-1996, English abstract. *
Munoz, 28th ICPIG, July 2007, p847. *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190252156A1 (en) * 2016-10-12 2019-08-15 Meyer Burger (Germany) GmH Plasma Treatment Device with Two Microwave Plasma Sources Coupled to One Another, and Method for Operating a Plasma Treatment Device of this Kind
US10685813B2 (en) * 2016-10-12 2020-06-16 Meyer Burger (Germany) Gmbh Plasma treatment device with two microwave plasma sources coupled to one another, and method for operating a plasma treatment device of this kind
US11964549B2 (en) 2018-07-04 2024-04-23 Bp P.L.C. Multiple cooling circuit systems and methods for using them

Also Published As

Publication number Publication date
JP2011522691A (ja) 2011-08-04
TW200952568A (en) 2009-12-16
EP2286641A1 (fr) 2011-02-23
EP2131633A1 (fr) 2009-12-09
KR20110021816A (ko) 2011-03-04
WO2009144110A1 (fr) 2009-12-03

Similar Documents

Publication Publication Date Title
US5720927A (en) Apparatus for decomposition of chemical compounds
CN1301342C (zh) 在大气压下产生的浓等离子体对处理气体排放物的应用
US8518162B2 (en) Method of treating a gas stream
US10757797B2 (en) Method and apparatus for gas abatement
CN1685180A (zh) 气体加热方法和气体加热设备
CN1917932A (zh) 包含氟化合物的气流的处理方法和装置
KR100951631B1 (ko) 폐가스 분해용 플라즈마 반응기와 이를 이용한 가스스크러버
US20110073282A1 (en) Method for cooling microwave plasma and system for the selective destruction of chemical molecules using said method
US20070284242A1 (en) Method For Treating Gases By High Frequency Discharges
KR101026457B1 (ko) 저압 및 대기압 플라즈마를 이용한 폐가스 제거 시스템
US5663476A (en) Apparatus and method for decomposition of chemical compounds by increasing residence time of a chemical compound in a reaction chamber
WO2009010792A2 (fr) Réacteur à plasma
US20080234530A1 (en) Atmospheric Pressure Plasma Treatment of Gaseous Effluents
WO2010103631A1 (fr) Appareil de production de trichlorosilane
KR100972829B1 (ko) 폐가스 처리장치
CN1980859A (zh) 制备含有分子氟的气体或气体混合物的方法
JP2000189745A (ja) ガスを励起するためのパイプセクション並びに装置、及びガスの純化のための方法
KR102037136B1 (ko) 폐 불화가스 처리 장치 및 이에 적합한 급속 냉각 장치
CN101065182A (zh) 气态流出物的常压等离子体处理
US11504669B2 (en) Method for exhaust gas abatement under reduced pressure and apparatus therefor
US5811631A (en) Apparatus and method for decomposition of chemical compounds using a self-supporting member
KR100481398B1 (ko) 과불화 탄화물 가스의 처리 방법 및 이를 위한 장치
JP2009291784A (ja) マイクロ波プラズマの誘起（ｉｎｉｔｉａｔｉｎｇ）方法及びこの方法を使用して化学分子を選択的に分解するためのシステム
KR102599407B1 (ko) 고효율 에너지 저감형 스크러버 장치 및 그 동작 방법
EP1915769B1 (fr) Procédé de traitment d'un flux gazeux

Legal Events

Date Code Title Description
AS Assignment

Owner name: L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'E

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GUERIN, DANIEL;LARQUET, CHRISTIAN;ROSTAING, JEAN-CHRISTOPHE;AND OTHERS;SIGNING DATES FROM 20110204 TO 20110211;REEL/FRAME:025841/0043

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION