US20100264948A1 - Differential signal probing system - Google Patents
Differential signal probing system Download PDFInfo
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- US20100264948A1 US20100264948A1 US12/816,648 US81664810A US2010264948A1 US 20100264948 A1 US20100264948 A1 US 20100264948A1 US 81664810 A US81664810 A US 81664810A US 2010264948 A1 US2010264948 A1 US 2010264948A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Definitions
- the present invention relates to probe measurement systems for testing integrated circuits and other microelectronic devices and, more particularly, probe measurement systems utilizing differential signaling for testing microelectronic devices.
- Integrated circuits are economically attractive because large numbers of often complex circuits, for example microprocessors, can be inexpensively fabricated on the surface of a wafer or substrate.
- individual dies including one or more circuits, are separated or singulated and encased in a package that provides for electrical connections between the exterior of the package and the circuit on the enclosed die.
- the separation and packaging of a die comprises a significant portion of the cost of manufacturing an integrated circuit device and to monitor and control the IC fabrication process and avoid the cost of packaging defective dies, manufacturers commonly add electrical circuits or test structures to the wafer to enable on-wafer testing or “probing” to verify characteristics of the integrated circuits before the dies are singulated.
- a test structure 20 typically includes a device-under-test (DUT) 22 , a plurality of metallic probe or bond pads 24 that are deposited at the wafer's surface and a plurality of conductive vias 26 that connect the probe pads to the DUT which is typically fabricated beneath the surface of the wafer 28 .
- the DUT typically comprises a simple circuit that includes a copy of one or more of the basic elements of the integrated circuit, such as a single line of conducting material, a chain of vias or a single transistor.
- the circuit elements of the DUT are typically produced with the same process and in the same layers of the fabrication as the corresponding elements of the integrated circuit.
- the marketable ICs are typically evaluated or characterized “on-wafer” by applying a test instrument generated signal to the test structure and measuring the response of the test structure to the signal. Since the circuit elements of the DUT are fabricated with the same process as the corresponding elements of the marketable integrated circuit, the electrical properties of the DUT are expected to be representative of the electrical properties of the corresponding components of the ICs.
- Integrated circuits commonly utilize single ended or ground referenced signaling with a ground plane at the lower surface of the substrate on which the active and passive devices of the circuit are fabricated.
- parasitic interconnections exist between many of the parts of the individual devices and between parts of the devices and the wafer on which the devices are fabricated.
- These interconnections are commonly capacitive and/or inductive in nature and have frequency dependent impedances.
- the terminals of transistors fabricated on semi-conductive substrates or wafers are typically capacitively interconnected, through the substrate, to the ground plane.
- the impedance of this parasitic capacitive interconnection is frequency dependent and at higher frequencies the ground potential and the true nature of ground referenced signals becomes uncertain.
- a differential gain cell 30 is a balanced device comprising two nominally identical circuit halves 30 A, 30 B.
- a DC current source 32 When biased, with a DC current source 32 , and stimulated with a differential mode signal, comprising even and odd mode components of equal amplitude and opposite phase (S i +1 and S i ⁇ 1 ) 34 , 36 , a virtual ground is established at the symmetrical axis 38 of the two circuit halves. At the virtual ground, the potential at the operating frequency does not change with time regardless of the amplitude of the stimulating signal.
- the quality of the virtual ground of a balanced device is independent of the physical ground path and, therefore, balanced or differential circuits can tolerate poor RF grounding better than circuits operated with single ended signals.
- the two waveforms of the differential output signal (S o +1 and S o ⁇ 1 ) 40 , 42 are mutual references providing faster and more certain transition from one binary value to the other for digital devices and enabling operation with a reduced voltage swing for the signal.
- differential devices can operate at lower signal power and higher data rates than single ended devices.
- noise from external sources, such as adjacent conductors tends to couple, electrically and electromagnetically, in the common mode and cancel in the differential mode.
- balanced or differential circuits have good immunity to noise, including noise at even-harmonic frequencies since signals that are of opposite phase at the fundamental frequency are in phase at the even harmonics.
- a test structure comprising a differential gain cell enables on wafer testing and characterization of differential devices included in the marketable ICs fabricated on the wafer.
- the network analyzer comprises a source of an AC signal, commonly, a radio frequency (RF) signal, that is used to stimulate the DUT of a test structure.
- RF radio frequency
- a forward-reverse switch directs the stimulating signals to one or more of the probe pads of the test structure.
- Directional couplers or bridges pick off the forward or reverse waves traveling to or from the test structure which are down-converted by intermediate frequency (IF) sections of the network analyzer where the signals are filtered, amplified and digitized for further processing and display.
- IF intermediate frequency
- the preferred interconnection for communicating signals between the test structure, the source of the stimulating test signal and the sink for the output signals of the test structure is coaxial cable.
- the transition between the coaxial cable and the probe pads of the test structure is preferably provided by movable probes having one or more conductive probe tips 44 that are arranged to be co-locatable with respective probe pads of the test structure.
- the test instrumentation and the test structure can be temporarily interconnected for probing by bringing the probe tips of the probe(s) into contact with the probe pads of the test structure.
- two probes 46 , 48 are utilized when probing a differential or balanced test structure.
- a differential gain cell requires two input probe pads 50 , 52 and two output probe pads 54 , 56 for the even and odd mode components of the differential input and output signals and a bias probe pad 58 through which the transistors of the cell are biased.
- the probe pads of differential test structures are arranged to avoid physical contact and crosstalk between the two probes during simultaneous engagement with the test structure.
- the probe pads of a differential test structure occupy a significant portion of the useable surface of a wafer and, typically, must be fabricated in an area of the wafer in which one or more dies containing marketable ICs could otherwise be fabricated.
- test structures serve no purpose after the dies containing the marketable ICs are singulated and manufacturers of ICs are under continuous cost pressure to maximize the number of marketable ICs that are manufactured on each wafer.
- FIG. 1 is a perspective illustration of a portion of a wafer including a differential test structure having probe pads arranged for engagement by a two probes.
- FIG. 2 is a perspective illustration of a portion of a wafer including a differential test structure engageable by a single probe having a linear array of probe tips.
- FIG. 3 is a schematic diagram of a probe system utilizing a two-port network analyzer for testing a differential test structure.
- FIG. 4 is a schematic diagram of a probe system utilizing a four-port network analyzer for testing a differential test structure.
- FIG. 5 is a schematic diagram of a probe system utilizing a differential test structure as a frequency converter.
- FIG. 6 is a perspective view of a probe for testing a differential test structure.
- FIG. 7 is a section view of the probe of FIG. 6 along line A-A.
- FIG. 8 is a top view of a probe head of a probe for engaging a differential test structure.
- FIG. 9 is an elevation view of the probe head of FIG. 8 .
- FIG. 10 is a bottom view of the probe head of FIG. 8 .
- FIG. 11 is a perspective view of a probe including a linear array of four probe tips and a fifth probe tip.
- FIG. 12 is a bottom view of a probe head of the probe of FIG. 11 .
- FIG. 13 is a perspective view of an embodiment of a differential signal probe comprising cables including having a plurality of conductors.
- FIG. 14 is a top view of a probe head of the probe of FIG. 13 .
- FIG. 15 is a top view and an elevation view of a probe head comprising a dielectric membrane plate.
- FIG. 16 is a top view of an additional embodiment of a probe head.
- FIG. 17 is an elevation view of the probe head of FIG. 16 .
- FIG. 18 is a bottom view of the probe head of FIG. 16 .
- Circuits utilizing differential signaling are becoming increasingly common for a wide range of higher frequency applications.
- the benefits of differential signaling or balanced devices include lower power levels, faster state transition for binary devices, good immunity from noise, minimal susceptibility to electromagnetic coupling at higher frequencies, and greater tolerance of poor grounding conditions which are commonly encountered when integrated circuits are operated at high frequencies.
- the integrity of the process used to manufacture marketable integrated circuits (ICs) is tested by fabricating a plurality of test structures on the wafer using the same process that is used to fabricate the ICs. Characteristics of the marketable ICs are inferred by stimulating the test structure with a test instrument generated signal and capturing the response of the test structure. While test structures are typically simple circuits, the response of similar devices included in the more complex marketable ICs is expected to be similar to the response of the test structure because the devices in the marketable ICs and similar devices in the test structures are fabricated with the same process.
- differential signaling provides a number of advantages, particularly at higher frequencies and in noisier environments, the use of balanced or differential devices in the DUTs of test structures is limited.
- the probe pads of differential test structures are arranged so that two probes can simultaneously engage the probe pads while avoiding physical contact and crosstalk between the probe tips.
- the probe pads are spread over a significant area of the surface of the wafer and, typically, must be fabricated in an area of the wafer that could otherwise accommodate one or more dies containing marketable ICs.
- test structures serve no purpose after the dies containing the marketable ICs are singulated and manufacturers of ICs are under continuous cost pressure to maximize the number of marketable ICs manufactured on each wafer.
- the test structure 120 comprises a DUT 122 that includes a differential gain cell 124 that is responsive to a differential mode input signal.
- the differential mode input signal comprises an even mode component (S i +1 ) and an odd mode component (S i ⁇ 1 ) that has substantially the same amplitude as the even mode component but which is opposite in phase of the even mode component.
- the differential gain cell 124 comprises two substantially identical field effect (JFET) transistors 126 A and 126 B.
- a DUT typically comprises components corresponding to the components utilized in the marketable integrated circuits fabricated on the wafer and other types of transistors, such as bipolar junction (BJT) transistors or MOSFET transistors can be used in the construction of the differential gain cell of a test structure.
- BJT bipolar junction
- MOSFET MOSFET
- the five probe pads 130 , 132 , 134 , 136 and 138 through which the DUT is biased and through which the components of the differential signals are communicated to and from the test structure are arranged in a substantially linear array reducing the breadth of the probe pad arrangement and enabling placement of the test structure between dies 144 in a saw street 146 (indicated by a bracket) that is only slightly wider that the width of a probe pad.
- the source terminals of the transistors of the differential gain cell are interconnected as a transistor bias terminal 148 .
- the bias terminal is interconnected to the bias bond or probe pad 130 located in the center of the linear array of probe pads.
- the gates of the transistors comprise input terminals of the DUT and are connected to respective signal input probe pads 136 , 138 .
- the drains of the transistors of the differential gain cell comprise the output signal terminals of the DUT and are interconnected to the output signal probe pads 132 , 134 .
- the DUT 122 is relatively small and comprises circuit elements that are fabricated beneath the surface of the wafer.
- the probe pads are conductively connected to the terminals of the DUT by vias 26 that extend from the probe pads on the surface of the wafer to the subsurface strata in which the circuit elements of the DUT and the corresponding circuit elements of the integrated circuit have been fabricated.
- the DUT for example the DUT 122
- the DUT 122 of a differential test structure is typically stimulated with a signal generated by a network analyzer.
- a typical two-port network analyzer 202 outputs a single ended (ground referenced) modulated signal, which may include a DC offset, at the port of an RF signal source 204 .
- the single ended input signal is conducted to a balun 206 which converts the single ended signal to a balanced or differential signal comprising differential components having substantially the same amplitude but opposite phase.
- the two components of the differential input signal are transmitted to respective bias tees 208 , 210 which separate the modulated portion of the input signal from the DC portion.
- a bias tee comprises a capacitor 212 in series with an RF port 214 that blocks transmission of the DC component of the input signal from the RF port.
- An inductor 216 in series with a DC port 210 of the bias tee blocks, the modulated signal but permits transmission of the DC portion of the input signal to the DC port.
- the modulated components of differential input signal, S i +1 and S i ⁇ 1 are communicated to respective probe tips 156 , 158 via interconnections to the RF ports of the respective input signal bias tees.
- the probe tips 156 , 158 are arranged on a probe 160 which is movable relative to the test structure so that the probe tips may be co-located with the respective input signal probe pads 136 , 138 connected to the DUT 122 of a test structure.
- the differential output signal components (S o +1 and S o ⁇ 1 ) which are controlled by the input signals at the respective input terminals of the differential gain cell are communicated from the respective probe pads 132 , 134 to respective output signal probe tips 152 , 154 that are interconnected to respective bias tees 220 , 222 .
- the modulated portions of the differential output signal components are transmitted to a balun 224 while DC portions of the differential output signal components are blocked from the network analyzer by the capacitors 214 in series with the RF ports of the bias tees.
- the balun converts the differential signal components to a single ended signal which is transmitted to a signal sink 226 of the network analyzer.
- the signal sink typically comprises one or more intermediate frequency (IF) sections where, typically, the signals are filtered, amplified and digitized for further processing and display.
- IF intermediate frequency
- the transistors of the differential gain cell of the DUT are biased by a DC current that is communicated between the DC ports of the bias tees and bias probe pad 130 by a bias probe tip 150 of the probe.
- An alternative embodiment of the test structure 122 includes additional probe pads 140 , 142 located distal of the respective ends of the linear array of five probe pads and which are interconnected with the bias probe pad 130 .
- Spatially corresponding additional probe tips 162 , 164 interconnected with the centrally located bias probe tip 150 , are included in an alternative embodiment of the probe 160 to engage the additional probe pads of the alternative test structure probe pad arrangement.
- a four port network analyzer 302 can output differential signals directly permitting mixed mode analysis and de-embedding of the DUT at its terminals.
- the differential input signal components including a DC offset, are output at the ports 306 , 308 of the signal source 304 and transmitted to respective bias tees 316 , 318 .
- the capacitor 320 in series with the RF port of a bias tee blocks the transmission of the DC component of the input signal from the RF port.
- the modulated portion of the differential input signal components (S i +1 and S i ⁇ 1 ) are communicated from the RF port of the respective bias tee 316 , 318 to a respective probe tip 156 , 158 of the probe 360 .
- Each of the probe tips is co-locatable with a respective one of the probe pads 136 , 138 that is interconnected to conduct an input signal component to the DUT.
- the differential output signal components (S o +1 and S o ⁇ 1 ) are transmitted from respective probe pads 132 , 134 to respective probe tips 152 , 154 and then to respective bias tees 332 , 334 .
- the capacitors of the bias tees in series with the RF port, block the transmission of DC from the bias tees to the two signal input ports 312 , 310 of the signal sink 302 .
- the outputs at the DC ports of the bias tees are transmitted to the bias probe tip 150 which is arranged for contact with the bias probe pad 130 of the DUT.
- FIG. 4 illustrates another alternative arrangement of probe pads and probe tips where the output signals are sourced from the probe pads at the ends of the linear array of five probe pads and the input signals are transmitted to the probe pads immediately adjacent to the central probe pad of the linear array of five probe pads.
- the differential signal components are conducted to a probe 360 including a plurality of probe tips arranged to be co-locatable with the probe pads of a test structure including a DUT 322 comprising a differential gain cell 325 .
- the components of the differential signals from the first signal generator are conducted by probe tips 152 and 154 to respective probe pads 132 and 134 which are connected to the gates of the transistors of the differential gain cell.
- the transistors of the differential gain cell are biased by the connection of their source terminals to ground 620 through the probe pad 130 and the contacting probe tip 150 .
- a second signal generator 606 outputs a second single ended, modulated signal having a second frequency (f 2 ) to a second balun 608 which converts the single ended signal to a differential signal comprising components of substantially equal amplitude and opposite phase.
- the signal is transmitted to the drains of the transistors of the differential gain cell through high pass filter capacitors 616 which block the transmission of low frequency signals.
- the outputs of the DUT which are controlled by the input signals at the respective gates of the transistors are conducted to the output signal probe pads 136 and 138 and respective contacting probe tips 156 , 158 .
- the respective components of the signals from the second signal generator and the output terminals of the DUT, having respective second and first frequencies, are combined producing respective components of a differential combined output signal.
- the components of the combined output signal comprise an upper frequency (f 1 +f 2 ) combined output signal band and a lower frequency (f 1 ⁇ f 2 ) combined output signal band.
- the differential components of the lower frequency combined output signal band are separated from the upper frequency combined output signal band by the low pass filters 614 and converted to a single ended signal by a balun 612 .
- the lower frequency (f 1 ⁇ f 2 ), single ended signal is conducted to a signal sink 610 for analysis, such as comparison with the results obtained by testing other differential gain cells having known characteristics, and display.
- Utilizing the differential test structure as a frequency converter enables stimulation of the test structure with a high frequency signal but permits analyzing the result with a relatively less expensive, lower frequency capable, signal sink, such as a spectrum analyzer.
- the probe 500 comprises a support block 502 which is suitably constructed for connection to a movable probe supporting member 504 of a probe station.
- the support block 502 includes an aperture 506 for engagement by a snugly fitting alignment pin 508 that projects vertically from the probe supporting member.
- the support block includes a pair of countersunk apertures 510 to accept a pair of fastening screws 512 arranged to engage threaded holes in the probe supporting member and secure the probe to the probe supporting member.
- the probe includes a plurality of input ports 530 , 532 , 534 , 536 , 538 which, in the embodiment depicted, comprise spark-plug type, K connectors.
- This connector enables the external connection of an ordinary coaxial cable to an input port permitting a well shielded high frequency transmission channel to be established between the probe and the test instrument.
- other types of connectors can be used, such as a 2.4 mm. connector, a 1.85 mm. connector or a 1 mm. connector.
- a semi-rigid coaxial cable 514 is connected at its rearward end to each K connector comprising one of the ports of the probe.
- These coaxial cables preferably include an inner conductor 516 , an inner dielectric 518 and an outer conductor 520 and are preferably of phase-stable low-loss type.
- the coaxial cable may likewise include other layers of materials, as desired.
- the dummy connector is then removed and a K-connector is screwed into each of the threaded openings formed in the block above the bore so as to effect electrical connection between the connectors and the coaxial cables.
- a thread locking compound may be applied to the threads of the K-connectors prior to their installation to ensure a secure physical connection.
- the forward ends of the cables remain freely suspended and, in this condition, serve as a movable support for a probe head 540 of the probe.
- the cables Before being connected to the K-connector, the cables are bent along first and second intermediate portions in the manner shown so that a generally upwardly curving 90° bend and a downwardly curving bend, respectively, are formed in the cable.
- the protruding ends of the coaxial cables may be slidably inserted into a tube 526 comprising semi-flexible microwave-absorbing material.
- One material used for forming the tube comprises iron and urethane.
- the semi-flexible tube of microwave absorbing material serves to substantially reduce the levels of microwave energy that travel along the outer conductor of the semi-rigid cable.
- the probe includes a microstrip style probe head 540 that includes a dielectric plate 560 having generally planar upper and lower surfaces that is affixed to the forward ends of the coaxial cables 550 , 552 , 554 , 556 , 558 .
- the underside of each cable is cut away to form a shelf 562 , and the dielectric plate is affixed to the shelf.
- the dielectric plate may be supported by an upwardly facing shelf cut away from the cable or the end of the cable without a shelf.
- a conductive bias layer 564 comprising a thin, generally planar conductive material is affixed to the bottom of the dielectric plate.
- a thin, generally planar, bias layer has a low profile that is less likely to interfere with the ability to effectively probe a DUT by accidentally contacting the device.
- a via 566 electrically couples the bias layer to the center conductor of the coaxial cable 550 connected to the bias input port 530 of the probe.
- the bias layer may be provided with any DC voltage potential suitable for biasing the transistors of the differential gain cell of the DUT.
- the bias layer preferably covers substantially all of the lower surface of the dielectric plate. Alternatively, the bias layer may cover a portion greater than 50%, 60%, 70%, 80%, 90% of the surface of the dielectric plate and/or the region directly under a majority (or more) of the length of a conductive signal trace secured to the opposing side of the plate.
- One or more conductive signal traces are supported by the upper surface of the dielectric plate.
- the conductive traces may be deposited, using any technique, or otherwise secured on the upper surface of the dielectric plate.
- a conductive signal trace is electrically interconnected to the inner conductor of each of the coaxial cables 552 , 554 , 556 , 558 .
- the respective interconnected conductive traces 572 , 574 , 576 , 578 normally conduct the components of the differential signals to and from the DUT.
- each conductive trace, together with the bias layer forms one type of a microstrip transmission structure.
- Other layers above, below, and/or between the bias layer and the conductive trace(s) may be included, if desired.
- Conductive vias 568 passing through the dielectric plate enables transference of the signal path from the conductive traces on the upper surface of the plate to the lower surface of the plate.
- the conductive via substantially reduces the capacitance of the signal path compared to a conductive finger extending over the end of the dielectric plate.
- the conductive via provides a path from one side of the plate to the other that is free from an air gap between the via and the dielectric for at least a majority of the thickness of the plate.
- the lower surface of the dielectric plate includes a plurality of contact bumps or probe tips 580 , 582 , 584 , 586 , 588 that are respectively electrically connected to the bias layer or to the vias extending from respective conductive traces on the upper surface of the dielectric plate.
- the probe tips are arranged in a linear array with the centroids of the lower ends of the probe tips being substantially aligned and arranged generally parallel to forward edge of the probe head.
- the probe tips are spatially arranged proximate the adjacent tip(s) in the linear array so as to be co-locatable with the respective probe pads that conduct the signals for the test structure that is to be probed.
- the probe tips may take any suitable form, such as a bump, a patterned structure, or an elongate conductor.
- the bias layer may laterally encircle one or more of the probe tips or may extend beyond one or more of the probe tips to reduce crosstalk with other probes.
- a conductive shield 902 which is preferably planar in nature, is affixed to the bottom of a lower dielectric plate 904 .
- the conductive shield may be for example, a thin conductive material (or otherwise) that is affixed to the lower plate 904 .
- a shield of thin generally planar conductive material is less likely to accidentally contact the test structure when the probe tips are contact with the probe pads.
- the conductive shield is electrically coupled to an outer conductor 520 of at least one of the coaxial cables 550 , 552 , 554 , 556 , 558 by a via 910 to form a ground plane.
- the outer conductor is typically connected to ground, though the outer conductor may be provided with any suitable voltage potential (either DC or AC).
- the conductive shield 902 preferably covers substantially all of the lower surface of the lower dielectric plate 904 . Alternatively, the conductive shield 902 may cover greater than 50%, 60%, 70%, 80%, 90%, and/or the region directly under a majority (or more) of the length of a conductive signal trace on the opposing side of the probe head.
- the bias voltage for the transistors of the DUT is conducted to the bias probe tip 580 through a middle conductive layer 906 which is conductively connected to the bias probe tip and to the center conductor of the coaxial cable 550 by vias.
- an upper dielectric plate 908 Overlaying the middle conductive layer, an upper dielectric plate 908 includes an upper surface to which are secured the traces 572 , 574 , 576 , 578 that conduct the components of the differential input and output signals.
- the traces are in contact with the center conductors of the respective coaxial cables and are connected to the respective probe tips by vias extending from the upper surface of the upper dielectric plate to the probe tips.
- the probe 600 comprises support block 602 securable to the probe supporting member 504 .
- a plurality of ports 532 , 534 , 536 , 538 are attached to the support block and electrically connected to a plurality of coaxial cables that extend to a probe head 604 .
- the connector of the centrally located port 530 is electrically connected to a coaxial cable 606 which extends to a probe tip 608 supported by an arm 610 attached to the support block 602 .
- the probe head 604 comprises a dielectric plate 612 which supports four probe tips 582 , 584 , 586 , 588 arranged in a linear array and which conduct the components of the differential input and output signals to and from the test structure.
- the bias for the transistors of the test structure is conducted from the port 530 to a probe pad of a test structure by a probe tip 608 which is proximate the third and fourth probe tips of the linear array of probe tips 582 , 584 , 586 , 588 but not in linear alignment with the probe tips included in the linear array through which the components of the differential signals are conducted.
- the ports 702 , 704 of the probe 700 of alternative embodiment are arranged to provide electrical interconnections to a coaxial cable having more than two conductors.
- the conductors may be triaxial cables having three conductors separated by intervening dielectric layers.
- the triaxial cables 706 , 708 are electrically interconnected to the respective ports, at least one of which is insulated from the support block, at their rearward ends.
- the freely suspended forward support ends of the triaxial cables support a probe head 710 comprising a dielectric plate 712 secured to a shelf formed in each of the ends of the two triaxial cables.
- the removal of a portion of the triaxial cable to form the shelf exposes the inner conductor 714 , the inner dielectric layer 716 , the intermediate conductor 718 , the outer dielectric layer 720 and the outer conductor 722 that comprise the cable.
- the conductors of the triaxial cables are interconnected to respective probe tips formed on the lower surface of the dielectric plate.
- the central probe tip 150 can be interconnected to the outer conductors by a bias layer 724 supported on the lower surface of the dielectric plate that is electrically interconnected to the central probe tip 150 and electrically interconnected to the outer conductors by vias 726 , 728 , 730 extending through the dielectric plate.
- the linear array of probe tips includes probe tips 162 and 164 for engaging probe pads 142 and 140 of an alternative embodiment comprising seven probe pads and are also interconnected to the bias layer.
- the components of the differential input and output signals are conducted from the respective inner conductors and respective intermediate conductors to the probe tips 152 , 154 , 156 and 158 by traces 736 , 738 , 740 , 742 on the upper surface of the dielectric plate that are electrically interconnected to the respective conductor exposed at the shelf in the triaxial cable and vias 744 , 746 , 748 , 750 extending between the upper and lower surfaces of the dielectric plate.
- a flexible dielectric membrane plate 802 may be substituted for a more rigid dielectric plate.
- membrane material is described in U.S. Pat. No. 5,914,613.
- membrane based probes are characterized by a flexible (or semi-flexible) plate or substrate with traces supported thereon together with contacting portions or probe tips being supported thereon.
- the linear array of probe tips 850 , 852 , 854 , 856 , 858 are arranged to be co-locatable with the probe pads of the DUT.
- the traces are normally on the opposing side of the membrane and connected to the probe tips with vias.
- the membrane technology may be significantly thinner than ceramic based substrates or plates, such as 40, 30, 20, 10, 5, or 3 microns or less.
- the dielectric constant of the membrane material is 7 or less, sometimes less than 6, 5, or 4 depending on the particular material used. While normally using a membrane substrate with a lower dielectric constant is unsuitable, using a significantly thinner substrate together with a material having a lower dielectric constant raises the theoretical frequency range of effective signal transmission to hundreds of GHz.
- the significantly thinner substrate material permits positioning the lower bias layer significantly closer to the signal traces than the relatively thick ceramic substrate, and therefore tends to more tightly confine the electromagnetic fields.
- a probe measurement system including a probe comprising a linear array of probe tips enables testing of a differential or balanced test structure with a single probe facilitating fabrication of the test structure in a saw street between dies on a wafer.
Abstract
A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal
Description
- This application is a continuation of U.S. patent application Ser. No. 11/710,225 filed Feb. 22, 2007 which claims the benefit of U.S. Provisional Application No. 60/813,119, filed Jun. 12, 2006 and U.S. Provisional Application No. 60/813,477, filed Jul. 17, 2006.
- The present invention relates to probe measurement systems for testing integrated circuits and other microelectronic devices and, more particularly, probe measurement systems utilizing differential signaling for testing microelectronic devices.
- Integrated circuits (ICs) are economically attractive because large numbers of often complex circuits, for example microprocessors, can be inexpensively fabricated on the surface of a wafer or substrate. Following fabrication, individual dies, including one or more circuits, are separated or singulated and encased in a package that provides for electrical connections between the exterior of the package and the circuit on the enclosed die. The separation and packaging of a die comprises a significant portion of the cost of manufacturing an integrated circuit device and to monitor and control the IC fabrication process and avoid the cost of packaging defective dies, manufacturers commonly add electrical circuits or test structures to the wafer to enable on-wafer testing or “probing” to verify characteristics of the integrated circuits before the dies are singulated.
- Referring to
FIG. 1 , atest structure 20 typically includes a device-under-test (DUT) 22, a plurality of metallic probe orbond pads 24 that are deposited at the wafer's surface and a plurality ofconductive vias 26 that connect the probe pads to the DUT which is typically fabricated beneath the surface of thewafer 28. The DUT typically comprises a simple circuit that includes a copy of one or more of the basic elements of the integrated circuit, such as a single line of conducting material, a chain of vias or a single transistor. The circuit elements of the DUT are typically produced with the same process and in the same layers of the fabrication as the corresponding elements of the integrated circuit. The marketable ICs are typically evaluated or characterized “on-wafer” by applying a test instrument generated signal to the test structure and measuring the response of the test structure to the signal. Since the circuit elements of the DUT are fabricated with the same process as the corresponding elements of the marketable integrated circuit, the electrical properties of the DUT are expected to be representative of the electrical properties of the corresponding components of the ICs. - Integrated circuits commonly utilize single ended or ground referenced signaling with a ground plane at the lower surface of the substrate on which the active and passive devices of the circuit are fabricated. As a result of the physical make up of the devices of an integrated circuit, parasitic interconnections exist between many of the parts of the individual devices and between parts of the devices and the wafer on which the devices are fabricated. These interconnections are commonly capacitive and/or inductive in nature and have frequency dependent impedances. For example, the terminals of transistors fabricated on semi-conductive substrates or wafers are typically capacitively interconnected, through the substrate, to the ground plane. The impedance of this parasitic capacitive interconnection is frequency dependent and at higher frequencies the ground potential and the true nature of ground referenced signals becomes uncertain.
- Balanced devices utilizing differential signals are more tolerant to poor radio frequency (RF) grounding than single ended devices making them attractive for high performance ICs. A differential gain cell 30 is a balanced device comprising two nominally
identical circuit halves current source 32, and stimulated with a differential mode signal, comprising even and odd mode components of equal amplitude and opposite phase (Si +1 and Si −1) 34, 36, a virtual ground is established at thesymmetrical axis 38 of the two circuit halves. At the virtual ground, the potential at the operating frequency does not change with time regardless of the amplitude of the stimulating signal. The quality of the virtual ground of a balanced device is independent of the physical ground path and, therefore, balanced or differential circuits can tolerate poor RF grounding better than circuits operated with single ended signals. - In addition, the two waveforms of the differential output signal (So +1 and So −1) 40, 42 are mutual references providing faster and more certain transition from one binary value to the other for digital devices and enabling operation with a reduced voltage swing for the signal. Typically, differential devices can operate at lower signal power and higher data rates than single ended devices. Moreover, noise from external sources, such as adjacent conductors, tends to couple, electrically and electromagnetically, in the common mode and cancel in the differential mode. As a result, balanced or differential circuits have good immunity to noise, including noise at even-harmonic frequencies since signals that are of opposite phase at the fundamental frequency are in phase at the even harmonics. Improved tolerance to poor RF grounding, increased resistance to noise and reduced power consumption make differential devices attractive for ICs that operate at higher frequencies. A test structure comprising a differential gain cell enables on wafer testing and characterization of differential devices included in the marketable ICs fabricated on the wafer.
- At higher frequencies, on-wafer characterization is commonly performed with a network analyzer. The network analyzer comprises a source of an AC signal, commonly, a radio frequency (RF) signal, that is used to stimulate the DUT of a test structure. A forward-reverse switch directs the stimulating signals to one or more of the probe pads of the test structure. Directional couplers or bridges pick off the forward or reverse waves traveling to or from the test structure which are down-converted by intermediate frequency (IF) sections of the network analyzer where the signals are filtered, amplified and digitized for further processing and display. The result is a plurality of s-parameters (scattering parameters), the ratio of a normalized power wave comprising the response of the DUT to the normalized power wave comprising the stimulus supplied by the signal source.
- At higher frequencies, the preferred interconnection for communicating signals between the test structure, the source of the stimulating test signal and the sink for the output signals of the test structure is coaxial cable. The transition between the coaxial cable and the probe pads of the test structure is preferably provided by movable probes having one or more
conductive probe tips 44 that are arranged to be co-locatable with respective probe pads of the test structure. The test instrumentation and the test structure can be temporarily interconnected for probing by bringing the probe tips of the probe(s) into contact with the probe pads of the test structure. Typically, twoprobes input probe pads output probe pads 54, 56 for the even and odd mode components of the differential input and output signals and abias probe pad 58 through which the transistors of the cell are biased. The probe pads of differential test structures are arranged to avoid physical contact and crosstalk between the two probes during simultaneous engagement with the test structure. As a result, the probe pads of a differential test structure occupy a significant portion of the useable surface of a wafer and, typically, must be fabricated in an area of the wafer in which one or more dies containing marketable ICs could otherwise be fabricated. However, test structures serve no purpose after the dies containing the marketable ICs are singulated and manufacturers of ICs are under continuous cost pressure to maximize the number of marketable ICs that are manufactured on each wafer. - What is desired, therefore, is a compact, simplified probe measurement system for communicating differential signals between a test instrument and a test structure.
-
FIG. 1 is a perspective illustration of a portion of a wafer including a differential test structure having probe pads arranged for engagement by a two probes. -
FIG. 2 is a perspective illustration of a portion of a wafer including a differential test structure engageable by a single probe having a linear array of probe tips. -
FIG. 3 is a schematic diagram of a probe system utilizing a two-port network analyzer for testing a differential test structure. -
FIG. 4 is a schematic diagram of a probe system utilizing a four-port network analyzer for testing a differential test structure. -
FIG. 5 is a schematic diagram of a probe system utilizing a differential test structure as a frequency converter. -
FIG. 6 is a perspective view of a probe for testing a differential test structure. -
FIG. 7 is a section view of the probe ofFIG. 6 along line A-A. -
FIG. 8 is a top view of a probe head of a probe for engaging a differential test structure. -
FIG. 9 is an elevation view of the probe head ofFIG. 8 . -
FIG. 10 is a bottom view of the probe head ofFIG. 8 . -
FIG. 11 is a perspective view of a probe including a linear array of four probe tips and a fifth probe tip. -
FIG. 12 is a bottom view of a probe head of the probe ofFIG. 11 . -
FIG. 13 is a perspective view of an embodiment of a differential signal probe comprising cables including having a plurality of conductors. -
FIG. 14 is a top view of a probe head of the probe ofFIG. 13 . -
FIG. 15 is a top view and an elevation view of a probe head comprising a dielectric membrane plate. -
FIG. 16 is a top view of an additional embodiment of a probe head. -
FIG. 17 is an elevation view of the probe head ofFIG. 16 . -
FIG. 18 is a bottom view of the probe head ofFIG. 16 . - Circuits utilizing differential signaling are becoming increasingly common for a wide range of higher frequency applications. The benefits of differential signaling or balanced devices include lower power levels, faster state transition for binary devices, good immunity from noise, minimal susceptibility to electromagnetic coupling at higher frequencies, and greater tolerance of poor grounding conditions which are commonly encountered when integrated circuits are operated at high frequencies. The integrity of the process used to manufacture marketable integrated circuits (ICs) is tested by fabricating a plurality of test structures on the wafer using the same process that is used to fabricate the ICs. Characteristics of the marketable ICs are inferred by stimulating the test structure with a test instrument generated signal and capturing the response of the test structure. While test structures are typically simple circuits, the response of similar devices included in the more complex marketable ICs is expected to be similar to the response of the test structure because the devices in the marketable ICs and similar devices in the test structures are fabricated with the same process.
- While differential signaling provides a number of advantages, particularly at higher frequencies and in noisier environments, the use of balanced or differential devices in the DUTs of test structures is limited. The probe pads of differential test structures are arranged so that two probes can simultaneously engage the probe pads while avoiding physical contact and crosstalk between the probe tips. The probe pads are spread over a significant area of the surface of the wafer and, typically, must be fabricated in an area of the wafer that could otherwise accommodate one or more dies containing marketable ICs. However, test structures serve no purpose after the dies containing the marketable ICs are singulated and manufacturers of ICs are under continuous cost pressure to maximize the number of marketable ICs manufactured on each wafer. The inventors concluded that the number of dies comprising marketable ICs fabricated on a wafer could be increased if the differential test structure could be connected to the test instrumentation with a single probe enabling rearrangement of the probe pads and fabrication of the test structure in a saw street between dies.
- Referring in detail to the drawings where similar parts are identified by like reference numerals, and, more particularly to
FIG. 2 , thetest structure 120 comprises aDUT 122 that includes a differential gain cell 124 that is responsive to a differential mode input signal. The differential mode input signal comprises an even mode component (Si +1) and an odd mode component (Si −1) that has substantially the same amplitude as the even mode component but which is opposite in phase of the even mode component. The differential gain cell 124 comprises two substantially identical field effect (JFET)transistors - The five
probe pads transistor bias terminal 148. The bias terminal is interconnected to the bias bond orprobe pad 130 located in the center of the linear array of probe pads. The gates of the transistors comprise input terminals of the DUT and are connected to respective signalinput probe pads signal probe pads DUT 122 is relatively small and comprises circuit elements that are fabricated beneath the surface of the wafer. The probe pads are conductively connected to the terminals of the DUT by vias 26 that extend from the probe pads on the surface of the wafer to the subsurface strata in which the circuit elements of the DUT and the corresponding circuit elements of the integrated circuit have been fabricated. - Referring to
FIG. 3 , at higher frequencies the DUT, for example theDUT 122, of a differential test structure is typically stimulated with a signal generated by a network analyzer. A typical two-port network analyzer 202 outputs a single ended (ground referenced) modulated signal, which may include a DC offset, at the port of anRF signal source 204. In theprobe measurement system 200, the single ended input signal is conducted to abalun 206 which converts the single ended signal to a balanced or differential signal comprising differential components having substantially the same amplitude but opposite phase. The two components of the differential input signal are transmitted torespective bias tees capacitor 212 in series with anRF port 214 that blocks transmission of the DC component of the input signal from the RF port. Aninductor 216, in series with aDC port 210 of the bias tee blocks, the modulated signal but permits transmission of the DC portion of the input signal to the DC port. The modulated components of differential input signal, Si +1 and Si −1, are communicated torespective probe tips probe tips probe 160 which is movable relative to the test structure so that the probe tips may be co-located with the respective inputsignal probe pads DUT 122 of a test structure. - Similarly, the differential output signal components (So +1 and So −1) which are controlled by the input signals at the respective input terminals of the differential gain cell are communicated from the
respective probe pads signal probe tips respective bias tees balun 224 while DC portions of the differential output signal components are blocked from the network analyzer by thecapacitors 214 in series with the RF ports of the bias tees. The balun converts the differential signal components to a single ended signal which is transmitted to asignal sink 226 of the network analyzer. The signal sink typically comprises one or more intermediate frequency (IF) sections where, typically, the signals are filtered, amplified and digitized for further processing and display. - The transistors of the differential gain cell of the DUT are biased by a DC current that is communicated between the DC ports of the bias tees and
bias probe pad 130 by abias probe tip 150 of the probe. An alternative embodiment of thetest structure 122 includesadditional probe pads bias probe pad 130. Spatially correspondingadditional probe tips bias probe tip 150, are included in an alternative embodiment of theprobe 160 to engage the additional probe pads of the alternative test structure probe pad arrangement. - While many network analyzers output only single ended signals, the accuracy of a probe system utilizing single ended signals to probe a differential test structure is limited because the reference plane for de-embedding the test structure is located at the ports of the baluns nearest the DUT. Referring to
FIG. 4 , a fourport network analyzer 302 can output differential signals directly permitting mixed mode analysis and de-embedding of the DUT at its terminals. In theprobe measurement system 300, the differential input signal components, including a DC offset, are output at theports signal source 304 and transmitted torespective bias tees respective bias tee respective probe tip probe 360. Each of the probe tips is co-locatable with a respective one of theprobe pads respective probe pads respective probe tips respective bias tees signal input ports signal sink 302. The outputs at the DC ports of the bias tees are transmitted to thebias probe tip 150 which is arranged for contact with thebias probe pad 130 of the DUT.FIG. 4 illustrates another alternative arrangement of probe pads and probe tips where the output signals are sourced from the probe pads at the ends of the linear array of five probe pads and the input signals are transmitted to the probe pads immediately adjacent to the central probe pad of the linear array of five probe pads. - A network analyzer is expensive and the cost of a probe measurement system that includes a network analyzer substantially impacts the cost of producing high frequency ICs. The inventors realized that the differential gain cell could be utilized as a passive frequency converter enabling parametric RF testing with a less costly probe measurement system that utilizes a low frequency spectrum analyzer rather than a more costly network analyzer. Referring to
FIG. 5 , in the probe measurement system 600 afirst signal generator 602 transmits a single ended, modulated signal having a frequency (f1) to afirst balun 604. The balun converts the single ended signal to a differential signal comprising even and odd mode components of substantially equal amplitude and opposite phase angle. The differential signal components are conducted to aprobe 360 including a plurality of probe tips arranged to be co-locatable with the probe pads of a test structure including aDUT 322 comprising adifferential gain cell 325. The components of the differential signals from the first signal generator are conducted byprobe tips respective probe pads probe pad 130 and the contactingprobe tip 150. - A
second signal generator 606 outputs a second single ended, modulated signal having a second frequency (f2) to asecond balun 608 which converts the single ended signal to a differential signal comprising components of substantially equal amplitude and opposite phase. The signal is transmitted to the drains of the transistors of the differential gain cell through highpass filter capacitors 616 which block the transmission of low frequency signals. The outputs of the DUT which are controlled by the input signals at the respective gates of the transistors are conducted to the outputsignal probe pads probe tips balun 612. The lower frequency (f1−f2), single ended signal is conducted to asignal sink 610 for analysis, such as comparison with the results obtained by testing other differential gain cells having known characteristics, and display. Utilizing the differential test structure as a frequency converter enables stimulation of the test structure with a high frequency signal but permits analyzing the result with a relatively less expensive, lower frequency capable, signal sink, such as a spectrum analyzer. - Typically, coaxial cable interconnects the network analyzer, other test instrumentation and the probe which provides the transition from the signal paths provided by the coaxial cable to the signal paths comprising the probe pads fabricated on the surface of a wafer. Referring
FIGS. 6 , 7 and 8, theprobe 500 comprises asupport block 502 which is suitably constructed for connection to a movableprobe supporting member 504 of a probe station. For example, thesupport block 502 includes anaperture 506 for engagement by a snuglyfitting alignment pin 508 that projects vertically from the probe supporting member. In addition, the support block includes a pair of countersunkapertures 510 to accept a pair of fastening screws 512 arranged to engage threaded holes in the probe supporting member and secure the probe to the probe supporting member. - The probe includes a plurality of
input ports - In the depicted embodiment, a semi-rigid
coaxial cable 514 is connected at its rearward end to each K connector comprising one of the ports of the probe. These coaxial cables preferably include aninner conductor 516, aninner dielectric 518 and anouter conductor 520 and are preferably of phase-stable low-loss type. The coaxial cable may likewise include other layers of materials, as desired. To prepare the rearward ends of the cables for connection to an appropriate K-connector, the rearward end is stripped to expose the inner conductor, and this inner conductor is temporarily held inside a dummy connector while the adjacent outer conductor is soldered within abore 522 formed in the primary support block. Arecess 524 in the support block below this bore provides access to facilitate the soldering process. The dummy connector is then removed and a K-connector is screwed into each of the threaded openings formed in the block above the bore so as to effect electrical connection between the connectors and the coaxial cables. A thread locking compound may be applied to the threads of the K-connectors prior to their installation to ensure a secure physical connection. - The forward ends of the cables remain freely suspended and, in this condition, serve as a movable support for a
probe head 540 of the probe. Before being connected to the K-connector, the cables are bent along first and second intermediate portions in the manner shown so that a generally upwardly curving 90° bend and a downwardly curving bend, respectively, are formed in the cable. The protruding ends of the coaxial cables may be slidably inserted into atube 526 comprising semi-flexible microwave-absorbing material. One material used for forming the tube comprises iron and urethane. The semi-flexible tube of microwave absorbing material serves to substantially reduce the levels of microwave energy that travel along the outer conductor of the semi-rigid cable. - Referring also to
FIGS. 9 and 10 , the probe includes a microstripstyle probe head 540 that includes adielectric plate 560 having generally planar upper and lower surfaces that is affixed to the forward ends of thecoaxial cables shelf 562, and the dielectric plate is affixed to the shelf. Alternatively, the dielectric plate may be supported by an upwardly facing shelf cut away from the cable or the end of the cable without a shelf. Aconductive bias layer 564 comprising a thin, generally planar conductive material is affixed to the bottom of the dielectric plate. A thin, generally planar, bias layer has a low profile that is less likely to interfere with the ability to effectively probe a DUT by accidentally contacting the device. A via 566, electrically couples the bias layer to the center conductor of thecoaxial cable 550 connected to thebias input port 530 of the probe. The bias layer may be provided with any DC voltage potential suitable for biasing the transistors of the differential gain cell of the DUT. The bias layer preferably covers substantially all of the lower surface of the dielectric plate. Alternatively, the bias layer may cover a portion greater than 50%, 60%, 70%, 80%, 90% of the surface of the dielectric plate and/or the region directly under a majority (or more) of the length of a conductive signal trace secured to the opposing side of the plate. - One or more conductive signal traces are supported by the upper surface of the dielectric plate. The conductive traces may be deposited, using any technique, or otherwise secured on the upper surface of the dielectric plate. A conductive signal trace is electrically interconnected to the inner conductor of each of the
coaxial cables conductive traces -
Conductive vias 568 passing through the dielectric plate enables transference of the signal path from the conductive traces on the upper surface of the plate to the lower surface of the plate. The conductive via substantially reduces the capacitance of the signal path compared to a conductive finger extending over the end of the dielectric plate. The conductive via provides a path from one side of the plate to the other that is free from an air gap between the via and the dielectric for at least a majority of the thickness of the plate. - The lower surface of the dielectric plate includes a plurality of contact bumps or probe
tips - Referring to
FIGS. 16 , 17 and 18, in an additional embodiment of aprobe head 900 for testing a differential test structure, aconductive shield 902, which is preferably planar in nature, is affixed to the bottom of alower dielectric plate 904. The conductive shield, may be for example, a thin conductive material (or otherwise) that is affixed to thelower plate 904. A shield of thin generally planar conductive material is less likely to accidentally contact the test structure when the probe tips are contact with the probe pads. The conductive shield is electrically coupled to anouter conductor 520 of at least one of thecoaxial cables conductive shield 902 preferably covers substantially all of the lower surface of thelower dielectric plate 904. Alternatively, theconductive shield 902 may cover greater than 50%, 60%, 70%, 80%, 90%, and/or the region directly under a majority (or more) of the length of a conductive signal trace on the opposing side of the probe head. The bias voltage for the transistors of the DUT is conducted to thebias probe tip 580 through a middleconductive layer 906 which is conductively connected to the bias probe tip and to the center conductor of thecoaxial cable 550 by vias. Overlaying the middle conductive layer, anupper dielectric plate 908 includes an upper surface to which are secured thetraces - Referring to
FIGS. 11 and 12 , in another embodiment of a probe for a testing a differential test structure, theprobe 600 comprises support block 602 securable to theprobe supporting member 504. A plurality ofports probe head 604. The connector of the centrally locatedport 530 is electrically connected to acoaxial cable 606 which extends to aprobe tip 608 supported by anarm 610 attached to thesupport block 602. Theprobe head 604 comprises adielectric plate 612 which supports fourprobe tips port 530 to a probe pad of a test structure by aprobe tip 608 which is proximate the third and fourth probe tips of the linear array ofprobe tips - Referring to
FIGS. 13 and 14 , theports probe 700 of alternative embodiment are arranged to provide electrical interconnections to a coaxial cable having more than two conductors. For example, the conductors may be triaxial cables having three conductors separated by intervening dielectric layers. Thetriaxial cables probe head 710 comprising adielectric plate 712 secured to a shelf formed in each of the ends of the two triaxial cables. The removal of a portion of the triaxial cable to form the shelf exposes theinner conductor 714, theinner dielectric layer 716, theintermediate conductor 718, theouter dielectric layer 720 and theouter conductor 722 that comprise the cable. The conductors of the triaxial cables are interconnected to respective probe tips formed on the lower surface of the dielectric plate. For example, if the DC bias is conducted to the probe head through the outer conductors of the triaxial cables, thecentral probe tip 150 can be interconnected to the outer conductors by abias layer 724 supported on the lower surface of the dielectric plate that is electrically interconnected to thecentral probe tip 150 and electrically interconnected to the outer conductors byvias probe tips probe pads probe tips traces vias - Referring to
FIG. 15 , in an additional embodiment a flexible dielectric membrane plate 802 may be substituted for a more rigid dielectric plate. An example of membrane material is described in U.S. Pat. No. 5,914,613. In general, membrane based probes are characterized by a flexible (or semi-flexible) plate or substrate with traces supported thereon together with contacting portions or probe tips being supported thereon. The linear array ofprobe tips - When a probe tip of a membrane based probe head comes into contact with a probe pad, as in most probes, it tends to skate across the pad as additional pressure is exerted. This skating is the result of the angled probe and/or co-axial cable flexing while under increasing pressure against the probe pad. A limited amount of skating is useful to “scrub” away oxide layers, or otherwise, that may build up on the probe pad. In many cases the probe pad is typically relatively small and excessive skating from the application of slightly too much pressure results in the probe simply skating off the probe pad. In addition, if excessive pressure is exerted damage to the probe and/or probe pad may result. Accordingly, there is an acceptable range of pressure and skating that should be maintained.
- A probe measurement system including a probe comprising a linear array of probe tips enables testing of a differential or balanced test structure with a single probe facilitating fabrication of the test structure in a saw street between dies on a wafer.
- The detailed description, above, sets forth numerous specific details to provide a thorough understanding of the present invention. However, those skilled in the art will appreciate that the present invention may be practiced without these specific details. In other instances, well known methods, procedures, components, and circuitry have not been described in detail to avoid obscuring the present invention.
- All the references cited herein are incorporated by reference.
- The terms and expressions that have been employed in the foregoing specification are used as terms of description and not of limitation, and there is no intention, in the use of such terms and expressions, of excluding equivalents of the features shown and described or portions thereof, it being recognized that the scope of the invention is defined and limited only by the claims that follow.
Claims (18)
1. A probe for testing a differential test structure having a plurality of probe pads, said probe comprising:
(a) a first probe tip operable to conduct a first mode component of a first differential signal;
(b) a second probe tip proximate said first probe tip and operable to conduct a first mode component of a second differential signal;
(c) a third probe tip proximate said second probe tip;
(d) a fourth probe tip proximate said third probe tip and operable to conduct a second mode component of said second differential signal together with conduction of said first mode component of said first differential signal by said first probe tip; and
(e) a fifth probe tip proximate said fourth probe tip and operable to conduct a second mode component of said first differential signal together with conduction of said first mode component of said second differential signal by said second probe tip; said first, said second, said fourth and said fifth probe tips being arranged in a substantially linear array and, with said third probe tip, co-locatable with respective probe pads of said test structure.
2. The probe of claim 1 wherein a source of said first differential signal comprises said respective probe pads of said test structure co-locatable with said first and said fifth probe tips.
3. The probe of claim 1 wherein a source of said second differential signal comprises said respective probe pads of said test structure co-locatable with said second and said fourth probe tips.
4. The probe of claim 1 wherein said third probe tip is interconnected to a source of a direct current.
5. The probe of claim 1 wherein said third probe tip is aligned substantially linearly with said linear array of said first, said second, said fourth and said fifth probe tips.
6. The probe of claim 5 further comprising:
(a) a sixth probe tip proximate said first probe tip; and
(b) a seventh probe tip proximate said fifth probe tip; said sixth and said seventh probe tips being arrayed substantially linearly with said first, said second, said third, said fourth and said fifth probe tips; interconnected to said third probe tip and co-locatable with respective probe pads of said test structure.
7. The probe of claim 6 wherein said third probe tip is interconnected to a source of a direct current.
8. A probe for testing a differential test structure having a plurality of probe pads, said probe comprising:
(a) a dielectric plate having a substantially planar first surface and a second surface;
(b) a first probe tip projecting from said first surface and operable to conduct a first mode component of a first differential signal;
(c) a second probe tip projecting from said first surface proximate said first probe tip and operable to conduct a first mode component of a second differential signal;
(d) a third probe tip projecting from said first surface proximate said second probe tip;
(e) a fourth probe tip projecting from said first surface proximate said third probe tip and operable to conduct a second mode component of said second differential signal together with conduction of said first mode component of said first differential signal by said first probe tip; and
(f) a fifth probe tip projecting from said first surface proximate said fourth probe tip and operable to conduct a second mode component of said first differential signal together with conduction of said first mode component of said second differential signal by said second probe tip; said first, said second, said fourth and said fifth probe tips being arranged in a substantially linear array and co-locatable with respective probe pads of said test structure.
9. The probe of claim 8 wherein a source of said first differential signal comprises said respective probe pads of said test structure co-locatable with said first and said fifth probe tips.
10. The probe of claim 8 wherein a source of said second differential signal comprises said respective probe pads of said test structure co-locatable with said second and said fourth probe tips.
11. The probe of claim 8 wherein said third probe tip is interconnected to a source of a direct current.
12. The probe of claim 8 wherein said third probe tip is aligned substantially linearly with said linear array of said first, said second, said fourth and said fifth probe tips.
13. The probe of claim 12 further comprising:
(a) a sixth probe tip proximate said first probe tip; and
(b) a seventh probe tip proximate said fifth probe tip; said sixth and said seventh probe tips being arrayed substantially linearly with said first, said second, said third, said fourth and said fifth probe tips; interconnected to said third probe tip and co-locatable with respective probe pads of said test structure.
14. The probe of claim 8 further comprising:
(a) a first conductor overlaying an area of said first surface and electrically interconnected with said third probe tip;
(b) a second conductor extending from said first surface to said second surface of said dielectric plate and electrically interconnected with said first conductor; and
(c) a conductor of direct current electrically interconnected with said second conductor.
15. The probe of claim 14 further comprising:
(a) a sixth probe tip projecting from said first surface proximate said first probe tip; and
(b) a seventh probe tip projecting from said first surface proximate said fifth probe tip, said sixth and said seventh probe tips being electrically interconnected with said first conductor and arrayed substantially linearly with said first, said second, said third, said fourth and said fifth probe tips and respectively co-locatable with probe pads of said test structure.
16. The probe of claim 8 further comprising:
(a) a first conductor overlaying an area of said second surface; and
(b) a second conductor extending from said second surface of said dielectric plate and electrically interconnecting said first conductor with a ground potential.
17. The probe of claim 8 wherein said dielectric plate is rigid.
18. The probe of claim 8 wherein said dielectric plate is flexible.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110208467A1 (en) * | 2010-02-23 | 2011-08-25 | Freescale Semiconductor, Inc. | Calibration standards and methods of their fabrication and use |
US10804874B2 (en) | 2018-06-12 | 2020-10-13 | International Business Machines Corporation | Superconducting combiner or separator of DC-currents and microwave signals |
US11317519B2 (en) | 2018-10-15 | 2022-04-26 | International Business Machines Corporation | Fabrication of superconducting devices that control direct currents and microwave signals |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202005021435U1 (en) | 2004-09-13 | 2008-02-28 | Cascade Microtech, Inc., Beaverton | Double-sided test setups |
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
KR101647302B1 (en) * | 2009-11-26 | 2016-08-10 | 삼성전자주식회사 | Probe card and test apparatus having the same |
CN102193008A (en) * | 2010-03-03 | 2011-09-21 | 鸿富锦精密工业(深圳)有限公司 | Probe |
DE102010033991A1 (en) | 2010-03-11 | 2011-12-01 | Rhode & Schwarz Gmbh & Co. Kg | Measuring tip with integrated transducer |
US9244145B2 (en) * | 2011-06-30 | 2016-01-26 | Amber Precision Instruments, Inc. | System and method for measuring near field information of device under test |
US9250264B2 (en) * | 2011-08-30 | 2016-02-02 | Leeno Industrial Inc. | Coaxial probe |
US20130069680A1 (en) * | 2011-09-16 | 2013-03-21 | Cascade Microtech, Inc. | Risers including a plurality of high aspect ratio electrical conduits and systems and methods of manufacture and use therof |
US9335343B1 (en) * | 2012-03-30 | 2016-05-10 | Altera Corporation | Contactor for reducing ESD in integrated circuit testing |
US10067163B2 (en) * | 2012-12-26 | 2018-09-04 | Mpi Corporation | Probe card capable of transmitting high-frequency signals |
TWI471570B (en) * | 2012-12-26 | 2015-02-01 | Mpi Corp | High frequency probe card |
US9435855B2 (en) | 2013-11-19 | 2016-09-06 | Teradyne, Inc. | Interconnect for transmitting signals between a device and a tester |
US9594114B2 (en) | 2014-06-26 | 2017-03-14 | Teradyne, Inc. | Structure for transmitting signals in an application space between a device under test and test electronics |
US10180458B2 (en) | 2015-05-14 | 2019-01-15 | Rohde & Schwarz Gmbh & Co. Kg | Measuring system and measuring method with power calibration |
US10037925B2 (en) * | 2016-03-04 | 2018-07-31 | Qorvo Us, Inc. | Removable sacrificial connections for semiconductor devices |
US9977052B2 (en) | 2016-10-04 | 2018-05-22 | Teradyne, Inc. | Test fixture |
US10481041B2 (en) * | 2017-05-23 | 2019-11-19 | Fluke Corporation | Measuring optical array polarity, power, and loss using a position sensing detector and photodetector-equipped optical testing device |
US10677815B2 (en) | 2018-06-08 | 2020-06-09 | Teradyne, Inc. | Test system having distributed resources |
US11363746B2 (en) | 2019-09-06 | 2022-06-14 | Teradyne, Inc. | EMI shielding for a signal trace |
WO2022033124A1 (en) * | 2020-08-14 | 2022-02-17 | 中国电子科技集团公司第十三研究所 | Method for determining parameters in on-chip calibrator model |
US11862901B2 (en) | 2020-12-15 | 2024-01-02 | Teradyne, Inc. | Interposer |
CN112748326A (en) * | 2020-12-30 | 2021-05-04 | 上海捷策创电子科技有限公司 | Chip test circuit, device and system |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
Family Cites Families (1071)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US491783A (en) | 1893-02-14 | Bolster-plate | ||
US1337866A (en) | 1917-09-27 | 1920-04-20 | Griffiths Ethel Grace | System for protecting electric cables |
US2142625A (en) | 1932-07-06 | 1939-01-03 | Hollandsche Draad En Kabelfab | High tension cable |
US2376101A (en) | 1942-04-01 | 1945-05-15 | Ferris Instr Corp | Electrical energy transmission |
US2389668A (en) | 1943-03-04 | 1945-11-27 | Barnes Drill Co | Indexing mechanism for machine tables |
GB579665A (en) | 1943-10-28 | 1946-08-12 | Gen Electric | Improvements in and relating to impedance matching transformers |
US2545258A (en) | 1945-03-22 | 1951-03-13 | Marcel L Cailloux | Device for telecontrol of spatial movement |
US2762234A (en) | 1952-09-08 | 1956-09-11 | Dodd Roy Frank | Search-track radar control |
US2901696A (en) | 1953-11-25 | 1959-08-25 | Ingeniors N Magnetic Ab Fa | Arrangement for automatic and continuous measuring of the noise factor of an electric device |
US2921276A (en) | 1955-08-30 | 1960-01-12 | Cutler Hammer Inc | Microwave circuits |
US2947939A (en) | 1956-09-24 | 1960-08-02 | Libbey Owens Ford Glass Co | Testing electrically conductive articles |
US3111699A (en) | 1961-10-09 | 1963-11-26 | Joseph E Comeau | Wire brush for railroad switches |
US3193712A (en) | 1962-03-21 | 1965-07-06 | Clarence A Harris | High voltage cable |
US3230299A (en) | 1962-07-18 | 1966-01-18 | Gen Cable Corp | Electrical cable with chemically bonded rubber layers |
US3176091A (en) | 1962-11-07 | 1965-03-30 | Helmer C Hanson | Controlled multiple switching unit |
US3262593A (en) | 1963-07-10 | 1966-07-26 | Gen Mills Inc | Wall-mounted support structure |
GB1031068A (en) | 1963-09-23 | 1966-05-25 | George Vincent Grispo | Improvements in or relating to motion reduction mechanisms |
US3218584A (en) | 1964-01-02 | 1965-11-16 | Sanders Associates Inc | Strip line connection |
US3429040A (en) | 1965-06-18 | 1969-02-25 | Ibm | Method of joining a component to a substrate |
US3401126A (en) | 1965-06-18 | 1968-09-10 | Ibm | Method of rendering noble metal conductive composition non-wettable by solder |
US3445770A (en) | 1965-12-27 | 1969-05-20 | Philco Ford Corp | Microelectronic test probe with defect marker access |
US3484679A (en) | 1966-10-03 | 1969-12-16 | North American Rockwell | Electrical apparatus for changing the effective capacitance of a cable |
US3573617A (en) | 1967-10-27 | 1971-04-06 | Aai Corp | Method and apparatus for testing packaged integrated circuits |
GB1240866A (en) | 1968-08-22 | 1971-07-28 | Amf Inc | Control device |
US3609539A (en) | 1968-09-28 | 1971-09-28 | Ibm | Self-aligning kelvin probe |
US3541222A (en) | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
JPS497756B1 (en) | 1969-01-24 | 1974-02-22 | ||
NL7003475A (en) | 1969-03-28 | 1970-09-30 | ||
US3648169A (en) | 1969-05-26 | 1972-03-07 | Teledyne Inc | Probe and head assembly |
US3596228A (en) | 1969-05-29 | 1971-07-27 | Ibm | Fluid actuated contactor |
US3611199A (en) | 1969-09-30 | 1971-10-05 | Emerson Electric Co | Digital electromagnetic wave phase shifter comprising switchable reflectively terminated power-dividing means |
US3686624A (en) | 1969-12-15 | 1972-08-22 | Rca Corp | Coax line to strip line end launcher |
US3654585A (en) | 1970-03-11 | 1972-04-04 | Brooks Research And Mfg Inc | Coordinate conversion for the testing of printed circuit boards |
US3622915A (en) | 1970-03-16 | 1971-11-23 | Meca Electronics Inc | Electrical coupler |
US3740900A (en) | 1970-07-01 | 1973-06-26 | Signetics Corp | Vacuum chuck assembly for semiconductor manufacture |
US3700998A (en) | 1970-08-20 | 1972-10-24 | Computer Test Corp | Sample and hold circuit with switching isolation |
US3714572A (en) | 1970-08-21 | 1973-01-30 | Rca Corp | Alignment and test fixture apparatus |
US4009456A (en) | 1970-10-07 | 1977-02-22 | General Microwave Corporation | Variable microwave attenuator |
US3680037A (en) | 1970-11-05 | 1972-07-25 | Tech Wire Prod Inc | Electrical interconnector |
US3662318A (en) | 1970-12-23 | 1972-05-09 | Comp Generale Electricite | Transition device between coaxial and microstrip lines |
US3710251A (en) | 1971-04-07 | 1973-01-09 | Collins Radio Co | Microelectric heat exchanger pedestal |
US3705379A (en) | 1971-05-14 | 1972-12-05 | Amp Inc | Connector for interconnection of symmetrical and asymmetrical transmission lines |
US3766470A (en) | 1971-05-24 | 1973-10-16 | Unit Process Assemblies | Apparatus for testing the integrity of a thru-hole plating in circuit board workpieces or the like by measuring the effective thickness thereof |
US3725829A (en) | 1971-07-14 | 1973-04-03 | Itek Corp | Electrical connector |
GB1387587A (en) | 1971-07-22 | 1975-03-19 | Plessey Co Ltd | Electrical interconnectors and connector assemblies |
US3882597A (en) | 1971-12-17 | 1975-05-13 | Western Electric Co | Method for making a test probe for semiconductor devices |
US3810016A (en) | 1971-12-17 | 1974-05-07 | Western Electric Co | Test probe for semiconductor devices |
US3829076A (en) | 1972-06-08 | 1974-08-13 | H Sofy | Dial index machine |
US3858212A (en) | 1972-08-29 | 1974-12-31 | L Tompkins | Multi-purpose information gathering and distribution system |
US3952156A (en) | 1972-09-07 | 1976-04-20 | Xerox Corporation | Signal processing system |
CA970849A (en) | 1972-09-18 | 1975-07-08 | Malcolm P. Macmartin | Low leakage isolating transformer for electromedical apparatus |
US3806801A (en) | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
US3839672A (en) | 1973-02-05 | 1974-10-01 | Belden Corp | Method and apparatus for measuring the effectiveness of the shield in a coaxial cable |
US3867698A (en) | 1973-03-01 | 1975-02-18 | Western Electric Co | Test probe for integrated circuit chips |
US3803709A (en) | 1973-03-01 | 1974-04-16 | Western Electric Co | Test probe for integrated circuit chips |
US3833852A (en) | 1973-08-16 | 1974-09-03 | Owens Illinois Inc | Inspection head mounting apparatus |
US3930809A (en) | 1973-08-21 | 1976-01-06 | Wentworth Laboratories, Inc. | Assembly fixture for fixed point probe card |
US3849728A (en) | 1973-08-21 | 1974-11-19 | Wentworth Labor Inc | Fixed point probe card and an assembly and repair fixture therefor |
US4001685A (en) | 1974-03-04 | 1977-01-04 | Electroglas, Inc. | Micro-circuit test probe |
US3936743A (en) | 1974-03-05 | 1976-02-03 | Electroglas, Inc. | High speed precision chuck assembly |
US3971610A (en) | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
US3976959A (en) | 1974-07-22 | 1976-08-24 | Gaspari Russell A | Planar balun |
US3970934A (en) | 1974-08-12 | 1976-07-20 | Akin Aksu | Printed circuit board testing means |
CH607045A5 (en) | 1974-12-05 | 1978-11-30 | Ernst Hedinger | Diode test appts. with oscillator |
US4038599A (en) | 1974-12-30 | 1977-07-26 | International Business Machines Corporation | High density wafer contacting and test system |
US4123706A (en) | 1975-03-03 | 1978-10-31 | Electroglas, Inc. | Probe construction |
US4038894A (en) | 1975-07-18 | 1977-08-02 | Springfield Tool And Die, Inc. | Piercing apparatus |
US4003253A (en) * | 1975-09-08 | 1977-01-18 | Fischer & Porter Co. | Multi-range vortex-shedding flowmeter |
SE407115B (en) | 1975-10-06 | 1979-03-12 | Kabi Ab | PROCEDURES AND METAL ELECTRODES FOR THE STUDY OF ENZYMATIC AND OTHER BIOCHEMICAL REACTIONS |
US4035723A (en) | 1975-10-16 | 1977-07-12 | Xynetics, Inc. | Probe arm |
US3992073A (en) | 1975-11-24 | 1976-11-16 | Technical Wire Products, Inc. | Multi-conductor probe |
US4116523A (en) | 1976-01-23 | 1978-09-26 | James M. Foster | High frequency probe |
US4049252A (en) | 1976-02-04 | 1977-09-20 | Bell Theodore F | Index table |
US4008900A (en) | 1976-03-15 | 1977-02-22 | John Freedom | Indexing chuck |
US4063195A (en) | 1976-03-26 | 1977-12-13 | Hughes Aircraft Company | Parametric frequency converter |
US4099120A (en) | 1976-04-19 | 1978-07-04 | Akin Aksu | Probe head for testing printed circuit boards |
US4027935A (en) | 1976-06-21 | 1977-06-07 | International Business Machines Corporation | Contact for an electrical contactor assembly |
US4074201A (en) | 1976-07-26 | 1978-02-14 | Gte Sylvania Incorporated | Signal analyzer with noise estimation and signal to noise readout |
US4115735A (en) | 1976-10-14 | 1978-09-19 | Faultfinders, Inc. | Test fixture employing plural platens for advancing some or all of the probes of the test fixture |
US4093988A (en) | 1976-11-08 | 1978-06-06 | General Electric Company | High speed frequency response measurement |
US4124787A (en) | 1977-03-11 | 1978-11-07 | Atari, Inc. | Joystick controller mechanism operating one or plural switches sequentially or simultaneously |
US4151465A (en) | 1977-05-16 | 1979-04-24 | Lenz Seymour S | Variable flexure test probe for microelectronic circuits |
US4161692A (en) | 1977-07-18 | 1979-07-17 | Cerprobe Corporation | Probe device for integrated circuit wafers |
US4312117A (en) | 1977-09-01 | 1982-01-26 | Raytheon Company | Integrated test and assembly device |
US4184729A (en) | 1977-10-13 | 1980-01-22 | Bunker Ramo Corporation | Flexible connector cable |
US4135131A (en) | 1977-10-14 | 1979-01-16 | The United States Of America As Represented By The Secretary Of The Army | Microwave time delay spectroscopic methods and apparatus for remote interrogation of biological targets |
US4184133A (en) | 1977-11-28 | 1980-01-15 | Rockwell International Corporation | Assembly of microwave integrated circuits having a structurally continuous ground plane |
US4216467A (en) | 1977-12-22 | 1980-08-05 | Westinghouse Electric Corp. | Hand controller |
GB2014315B (en) | 1978-01-30 | 1983-02-02 | Texas Instruments Inc | Determining probe contact |
US4232398A (en) | 1978-02-09 | 1980-11-04 | Motorola, Inc. | Radio receiver alignment indicator |
US4177421A (en) | 1978-02-27 | 1979-12-04 | Xerox Corporation | Capacitive transducer |
US4302146A (en) | 1978-08-23 | 1981-11-24 | Westinghouse Electric Corp. | Probe positioner |
US4225819A (en) | 1978-10-12 | 1980-09-30 | Bell Telephone Laboratories, Incorporated | Circuit board contact contamination probe |
US4306235A (en) | 1978-11-02 | 1981-12-15 | Cbc Corporation | Multiple frequency microwave antenna |
DE2849119A1 (en) | 1978-11-13 | 1980-05-14 | Siemens Ag | METHOD AND CIRCUIT FOR DAMPING MEASUREMENT, ESPECIALLY FOR DETERMINING THE DAMPING AND / OR GROUP DISTANCE DISTORTION OF A MEASURED OBJECT |
US4251772A (en) | 1978-12-26 | 1981-02-17 | Pacific Western Systems Inc. | Probe head for an automatic semiconductive wafer prober |
US4383217A (en) | 1979-01-02 | 1983-05-10 | Shiell Thomas J | Collinear four-point probe head and mount for resistivity measurements |
US4280112A (en) | 1979-02-21 | 1981-07-21 | Eisenhart Robert L | Electrical coupler |
US4287473A (en) | 1979-05-25 | 1981-09-01 | The United States Of America As Represented By The United States Department Of Energy | Nondestructive method for detecting defects in photodetector and solar cell devices |
FI58719C (en) | 1979-06-01 | 1981-04-10 | Instrumentarium Oy | DIAGNOSTISERINGSANORDNING FOER BROESTKANCER |
US4277741A (en) | 1979-06-25 | 1981-07-07 | General Motors Corporation | Microwave acoustic spectrometer |
SU843040A1 (en) | 1979-08-06 | 1981-06-30 | Физико-Технический Институт Низкихтемператур Ah Украинской Ccp | Straightway rejection filter |
US4327180A (en) | 1979-09-14 | 1982-04-27 | Board Of Governors, Wayne State Univ. | Method and apparatus for electromagnetic radiation of biological material |
US4284033A (en) | 1979-10-31 | 1981-08-18 | Rca Corporation | Means to orbit and rotate target wafers supported on planet member |
US4330783A (en) | 1979-11-23 | 1982-05-18 | Toia Michael J | Coaxially fed dipole antenna |
DE2951072C2 (en) | 1979-12-19 | 1985-02-21 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Transition from a coaxial component to a microwave circuit arranged on a substrate |
SE441640B (en) | 1980-01-03 | 1985-10-21 | Stiftelsen Inst Mikrovags | PROCEDURE AND DEVICE FOR HEATING BY MICROVAGS ENERGY |
US4284682A (en) | 1980-04-30 | 1981-08-18 | Nasa | Heat sealable, flame and abrasion resistant coated fabric |
US4340860A (en) | 1980-05-19 | 1982-07-20 | Trigon | Integrated circuit carrier package test probe |
US4357575A (en) | 1980-06-17 | 1982-11-02 | Dit-Mco International Corporation | Apparatus for use in testing printed circuit process boards having means for positioning such boards in proper juxtaposition with electrical contacting assemblies |
US4552033A (en) | 1980-07-08 | 1985-11-12 | Gebr. Marzhauser Wetzlar oHG | Drive system for a microscope stage or the like |
US4346355A (en) | 1980-11-17 | 1982-08-24 | Raytheon Company | Radio frequency energy launcher |
US4376920A (en) | 1981-04-01 | 1983-03-15 | Smith Kenneth L | Shielded radio frequency transmission cable |
US4375631A (en) | 1981-04-09 | 1983-03-01 | Ampex Corporation | Joystick control |
DE3267983D1 (en) | 1981-04-25 | 1986-01-30 | Toshiba Kk | Apparatus for measuring noise factor and available gain |
US4401945A (en) | 1981-04-30 | 1983-08-30 | The Valeron Corporation | Apparatus for detecting the position of a probe relative to a workpiece |
US4425395A (en) | 1981-04-30 | 1984-01-10 | Fujikura Rubber Works, Ltd. | Base fabrics for polyurethane-coated fabrics, polyurethane-coated fabrics and processes for their production |
JPS5943091B2 (en) | 1981-06-03 | 1984-10-19 | 義栄 長谷川 | Fixed probe board |
US4888550A (en) | 1981-09-14 | 1989-12-19 | Texas Instruments Incorporated | Intelligent multiprobe tip |
DE3175044D1 (en) | 1981-10-30 | 1986-09-04 | Ibm Deutschland | Test apparatus for testing runs of a circuit board with at least one test head comprising a plurality of flexible contacts |
US4453142A (en) | 1981-11-02 | 1984-06-05 | Motorola Inc. | Microstrip to waveguide transition |
US4480223A (en) | 1981-11-25 | 1984-10-30 | Seiichiro Aigo | Unitary probe assembly |
US4567436A (en) | 1982-01-21 | 1986-01-28 | Linda Koch | Magnetic thickness gauge with adjustable probe |
DE3202461C1 (en) | 1982-01-27 | 1983-06-09 | Fa. Carl Zeiss, 7920 Heidenheim | Attachment of microscope objectives |
US4468629A (en) | 1982-05-27 | 1984-08-28 | Trw Inc. | NPN Operational amplifier |
US4528504A (en) | 1982-05-27 | 1985-07-09 | Harris Corporation | Pulsed linear integrated circuit tester |
US4502028A (en) | 1982-06-15 | 1985-02-26 | Raytheon Company | Programmable two-port microwave network |
US4527942A (en) | 1982-08-25 | 1985-07-09 | Intest Corporation | Electronic test head positioner for test systems |
US4705447A (en) | 1983-08-11 | 1987-11-10 | Intest Corporation | Electronic test head positioner for test systems |
US4551747A (en) | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation |
SU1392603A1 (en) | 1982-11-19 | 1988-04-30 | Физико-технический институт низких температур АН УССР | Band-rejection filter |
US4487996A (en) | 1982-12-02 | 1984-12-11 | Electric Power Research Institute, Inc. | Shielded electrical cable |
GB2133649A (en) | 1982-12-23 | 1984-07-25 | Philips Electronic Associated | Microwave oscillator |
US4558609A (en) | 1983-01-06 | 1985-12-17 | Wico Corporation | Joystick controller with interchangeable handles |
DE3308690A1 (en) | 1983-03-11 | 1984-09-13 | Deutsche Thomson-Brandt Gmbh, 7730 Villingen-Schwenningen | METHOD FOR TUNING THE VIBRATION CIRCLES OF A MESSAGE RECEIVER |
US4581679A (en) | 1983-05-31 | 1986-04-08 | Trw Inc. | Multi-element circuit construction |
JPS59226167A (en) | 1983-06-04 | 1984-12-19 | Dainippon Screen Mfg Co Ltd | Surface treating device for circuit board |
FR2547945B1 (en) | 1983-06-21 | 1986-05-02 | Raffinage Cie Francaise | NEW STRUCTURE OF ELECTRIC CABLE AND ITS APPLICATIONS |
US4553111A (en) | 1983-08-30 | 1985-11-12 | Burroughs Corporation | Printed circuit board maximizing areas for component utilization |
US4588950A (en) | 1983-11-15 | 1986-05-13 | Data Probe Corporation | Test system for VLSI digital circuit and method of testing |
JPS60136006U (en) | 1984-02-20 | 1985-09-10 | 株式会社 潤工社 | flat cable |
US4646005A (en) | 1984-03-16 | 1987-02-24 | Motorola, Inc. | Signal probe |
US4649339A (en) | 1984-04-25 | 1987-03-10 | Honeywell Inc. | Integrated circuit interface |
US4697143A (en) | 1984-04-30 | 1987-09-29 | Cascade Microtech, Inc. | Wafer probe |
US4653174A (en) | 1984-05-02 | 1987-03-31 | Gte Products Corporation | Method of making packaged IC chip |
JPS60235304A (en) | 1984-05-08 | 1985-11-22 | 株式会社フジクラ | Dc power cable |
US4636722A (en) | 1984-05-21 | 1987-01-13 | Probe-Rite, Inc. | High density probe-head with isolated and shielded transmission lines |
US4515133A (en) | 1984-05-31 | 1985-05-07 | Frank Roman | Fuel economizing device |
US4837507A (en) | 1984-06-08 | 1989-06-06 | American Telephone And Telegraph Company At&T Technologies, Inc. | High frequency in-circuit test fixture |
SU1195402A1 (en) | 1984-06-11 | 1985-11-30 | Предприятие П/Я В-8117 | Detachable coaxial-microstrip junction |
DK291184D0 (en) | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | METHOD AND DEVICE FOR TESTING CIRCUIT PLATES |
US4755747A (en) | 1984-06-15 | 1988-07-05 | Canon Kabushiki Kaisha | Wafer prober and a probe card to be used therewith |
JPS6113583A (en) | 1984-06-27 | 1986-01-21 | 日本電気株式会社 | High frequency connector |
DE3426565A1 (en) | 1984-07-19 | 1986-01-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Contact-free connection for planar leads |
DE3428087A1 (en) | 1984-07-30 | 1986-01-30 | Kraftwerk Union AG, 4330 Mülheim | CONCENTRIC THREE-WIRE CABLE |
US4593243A (en) | 1984-08-29 | 1986-06-03 | Magnavox Government And Industrial Electronics Company | Coplanar and stripline probe card apparatus |
US4706050A (en) | 1984-09-22 | 1987-11-10 | Smiths Industries Public Limited Company | Microstrip devices |
US4652082A (en) | 1984-10-29 | 1987-03-24 | Amp Incorporated | Angled electro optic connector |
NL8403755A (en) | 1984-12-11 | 1986-07-01 | Philips Nv | METHOD FOR MANUFACTURING A MULTI-LAYER PRINTED WIRING WITH SEW-THROUGH TRACKS IN DIFFERENT LAYERS AND MULTI-LAYER PRINTED WIRES MADE BY THE METHOD |
US4713347A (en) | 1985-01-14 | 1987-12-15 | Sensor Diagnostics, Inc. | Measurement of ligand/anti-ligand interactions using bulk conductance |
US5266963A (en) | 1985-01-17 | 1993-11-30 | British Aerospace Public Limited Company | Integrated antenna/mixer for the microwave and millimetric wavebands |
JPS61164338A (en) | 1985-01-17 | 1986-07-25 | Riken Denshi Kk | Multiplex arithmetic type digital-analog converter |
US4651115A (en) | 1985-01-31 | 1987-03-17 | Rca Corporation | Waveguide-to-microstrip transition |
US4780670A (en) | 1985-03-04 | 1988-10-25 | Xerox Corporation | Active probe card for high resolution/low noise wafer level testing |
US4744041A (en) | 1985-03-04 | 1988-05-10 | International Business Machines Corporation | Method for testing DC motors |
US4600907A (en) | 1985-03-07 | 1986-07-15 | Tektronix, Inc. | Coplanar microstrap waveguide interconnector and method of interconnection |
US4691163A (en) | 1985-03-19 | 1987-09-01 | Elscint Ltd. | Dual frequency surface probes |
US4755746A (en) | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
US4626805A (en) | 1985-04-26 | 1986-12-02 | Tektronix, Inc. | Surface mountable microwave IC package |
US4684883A (en) | 1985-05-13 | 1987-08-04 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of manufacturing high-quality semiconductor light-emitting devices |
US4684884A (en) | 1985-07-02 | 1987-08-04 | Gte Communication Systems Corporation | Universal test circuit for integrated circuit packages |
FR2585513B1 (en) | 1985-07-23 | 1987-10-09 | Thomson Csf | COUPLING DEVICE BETWEEN A METAL WAVEGUIDE, A DIELECTRIC WAVEGUIDE AND A SEMICONDUCTOR COMPONENT, AND MIXER USING THE SAME |
EP0213825A3 (en) | 1985-08-22 | 1989-04-26 | Molecular Devices Corporation | Multiple chemically modulated capacitance |
GB2179458B (en) | 1985-08-23 | 1988-11-09 | Ferranti Plc | Microwave noise measuring apparatus |
DE3531893A1 (en) | 1985-09-06 | 1987-03-19 | Siemens Ag | METHOD FOR DETERMINING THE DISTRIBUTION OF DIELECTRICITY CONSTANTS IN AN EXAMINATION BODY, AND MEASURING ARRANGEMENT FOR IMPLEMENTING THE METHOD |
US4746857A (en) | 1985-09-13 | 1988-05-24 | Danippon Screen Mfg. Co. Ltd. | Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer |
US4749942A (en) | 1985-09-26 | 1988-06-07 | Tektronix, Inc. | Wafer probe head |
JPH0326643Y2 (en) | 1985-09-30 | 1991-06-10 | ||
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5829128A (en) | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
US6043563A (en) | 1997-05-06 | 2000-03-28 | Formfactor, Inc. | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US6330164B1 (en) | 1985-10-18 | 2001-12-11 | Formfactor, Inc. | Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
US4696544A (en) | 1985-11-18 | 1987-09-29 | Olympus Corporation | Fiberscopic device for inspection of internal sections of construction, and method for using same |
SU1327023A1 (en) | 1985-12-04 | 1987-07-30 | Горьковский политехнический институт им.А.А.Жданова | Method of measuring spectral density of noise level and noise coefficient of four-terminal network |
US4853627A (en) | 1985-12-23 | 1989-08-01 | Triquint Semiconductor, Inc. | Wafer probes |
EP0230766A1 (en) | 1985-12-23 | 1987-08-05 | Tektronix, Inc. | Wafer probes |
US4727319A (en) | 1985-12-24 | 1988-02-23 | Hughes Aircraft Company | Apparatus for on-wafer testing of electrical circuits |
EP0230348A2 (en) | 1986-01-07 | 1987-07-29 | Hewlett-Packard Company | Test probe |
US4793814A (en) | 1986-07-21 | 1988-12-27 | Rogers Corporation | Electrical circuit board interconnect |
EP0442543B1 (en) | 1986-01-24 | 1997-11-19 | Fuji Photo Film Co., Ltd. | Device for loading sheet films |
US4757255A (en) | 1986-03-03 | 1988-07-12 | National Semiconductor Corporation | Environmental box for automated wafer probing |
CA1283569C (en) | 1986-03-14 | 1991-04-30 | Toshiaki Kakii | Optical connector and splicer |
US5361049A (en) | 1986-04-14 | 1994-11-01 | The United States Of America As Represented By The Secretary Of The Navy | Transition from double-ridge waveguide to suspended substrate |
US4766384A (en) | 1986-06-20 | 1988-08-23 | Schlumberger Technology Corp. | Well logging apparatus for determining dip, azimuth, and invaded zone conductivity |
US5095891A (en) | 1986-07-10 | 1992-03-17 | Siemens Aktiengesellschaft | Connecting cable for use with a pulse generator and a shock wave generator |
DE3625631A1 (en) | 1986-07-29 | 1988-02-04 | Gore W L & Co Gmbh | ELECTROMAGNETIC SHIELDING |
US4739259A (en) | 1986-08-01 | 1988-04-19 | Tektronix, Inc. | Telescoping pin probe |
US4783625A (en) | 1986-08-21 | 1988-11-08 | Tektronix, Inc. | Wideband high impedance card mountable probe |
JP2609232B2 (en) | 1986-09-04 | 1997-05-14 | 日本ヒューレット・パッカード株式会社 | Floating drive circuit |
EP0259183A3 (en) | 1986-09-05 | 1989-06-28 | Lifetrac | Process for controlling the accuracy and precision of sensitivity assays |
EP0259163A3 (en) | 1986-09-05 | 1989-07-12 | Tektronix, Inc. | Semiconductor wafer probe |
US4904933A (en) | 1986-09-08 | 1990-02-27 | Tektronix, Inc. | Integrated circuit probe station |
US4673839A (en) | 1986-09-08 | 1987-06-16 | Tektronix, Inc. | Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
FR2603954B1 (en) | 1986-09-15 | 1988-12-16 | Olaer Ind Sa | PRESSURE TANK WITH LIQUID PRESENCE SENSOR IN A GAS CHAMBER |
US4690472A (en) | 1986-09-26 | 1987-09-01 | E. I. Du Pont De Nemours And Company | High density flex connector system |
DE3637549A1 (en) | 1986-11-04 | 1988-05-11 | Hans Dr Med Rosenberger | Measuring device for testing the dielectric properties of biological tissues |
US4764723A (en) | 1986-11-10 | 1988-08-16 | Cascade Microtech, Inc. | Wafer probe |
FR2606887B1 (en) | 1986-11-18 | 1989-01-13 | Thomson Semiconducteurs | CIRCUIT FOR MEASURING THE DYNAMIC CHARACTERISTICS OF A BOX FOR A FAST INTEGRATED CIRCUIT, AND METHOD FOR MEASURING THESE DYNAMIC CHARACTERISTICS |
US4754239A (en) | 1986-12-19 | 1988-06-28 | The United States Of America As Represented By The Secretary Of The Air Force | Waveguide to stripline transition assembly |
US4772846A (en) | 1986-12-29 | 1988-09-20 | Hughes Aircraft Company | Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy |
US4812754A (en) | 1987-01-07 | 1989-03-14 | Tracy Theodore A | Circuit board interfacing apparatus |
US4727637A (en) | 1987-01-20 | 1988-03-01 | The Boeing Company | Computer aided connector assembly method and apparatus |
US4918383A (en) | 1987-01-20 | 1990-04-17 | Huff Richard E | Membrane probe with automatic contact scrub action |
US4827211A (en) | 1987-01-30 | 1989-05-02 | Cascade Microtech, Inc. | Wafer probe |
US4711563A (en) | 1987-02-11 | 1987-12-08 | Lass Bennett D | Portable collapsible darkroom |
US4864227A (en) | 1987-02-27 | 1989-09-05 | Canon Kabushiki Kaisha | Wafer prober |
US4734641A (en) | 1987-03-09 | 1988-03-29 | Tektronix, Inc. | Method for the thermal characterization of semiconductor packaging systems |
US5180976A (en) | 1987-04-17 | 1993-01-19 | Everett/Charles Contact Products, Inc. | Integrated circuit carrier having built-in circuit verification |
US5082627A (en) | 1987-05-01 | 1992-01-21 | Biotronic Systems Corporation | Three dimensional binding site array for interfering with an electrical field |
US4908570A (en) | 1987-06-01 | 1990-03-13 | Hughes Aircraft Company | Method of measuring FET noise parameters |
US4740764A (en) | 1987-06-03 | 1988-04-26 | Varian Associates, Inc. | Pressure sealed waveguide to coaxial line connection |
US4810981A (en) | 1987-06-04 | 1989-03-07 | General Microwave Corporation | Assembly of microwave components |
US4912399A (en) | 1987-06-09 | 1990-03-27 | Tektronix, Inc. | Multiple lead probe for integrated circuits in wafer form |
US4894612A (en) | 1987-08-13 | 1990-01-16 | Hypres, Incorporated | Soft probe for providing high speed on-wafer connections to a circuit |
US4755874A (en) | 1987-08-31 | 1988-07-05 | Kla Instruments Corporation | Emission microscopy system |
US5198752A (en) | 1987-09-02 | 1993-03-30 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US5084671A (en) | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
JPH0660912B2 (en) | 1987-09-07 | 1994-08-10 | 浜松ホトニクス株式会社 | Voltage detector |
US4791363A (en) | 1987-09-28 | 1988-12-13 | Logan John K | Ceramic microstrip probe blade |
US4929893A (en) | 1987-10-06 | 1990-05-29 | Canon Kabushiki Kaisha | Wafer prober |
US4922912A (en) | 1987-10-21 | 1990-05-08 | Hideto Watanabe | MAP catheter |
US5062149A (en) | 1987-10-23 | 1991-10-29 | General Dynamics Corporation | Millimeter wave device and method of making |
JP2554669Y2 (en) | 1987-11-10 | 1997-11-17 | 博 寺町 | Rotary positioning device |
US4859989A (en) | 1987-12-01 | 1989-08-22 | W. L. Gore & Associates, Inc. | Security system and signal carrying member thereof |
US4851767A (en) | 1988-01-15 | 1989-07-25 | International Business Machines Corporation | Detachable high-speed opto-electronic sampling probe |
US4891584A (en) | 1988-03-21 | 1990-01-02 | Semitest, Inc. | Apparatus for making surface photovoltage measurements of a semiconductor |
US4980637A (en) | 1988-03-01 | 1990-12-25 | Hewlett-Packard Company | Force delivery system for improved precision membrane probe |
JPH01133701U (en) | 1988-03-07 | 1989-09-12 | ||
US4988062A (en) | 1988-03-10 | 1991-01-29 | London Robert A | Apparatus, system and method for organizing and maintaining a plurality of medical catheters and the like |
US4858160A (en) | 1988-03-18 | 1989-08-15 | Cascade Microtech, Inc. | System for setting reference reactance for vector corrected measurements |
US4918373A (en) | 1988-03-18 | 1990-04-17 | Hughes Aircraft Company | R.F. phase noise test set using fiber optic delay line |
US5021186A (en) | 1988-03-25 | 1991-06-04 | Nissan Chemical Industries, Ltd. | Chloroisocyanuric acid composition having storage stability |
US4839587A (en) | 1988-03-29 | 1989-06-13 | Digital Equipment Corporation | Test fixture for tab circuits and devices |
US4835495A (en) | 1988-04-11 | 1989-05-30 | Hughes Aircraft Company | Diode device packaging arrangement |
US4871964A (en) | 1988-04-12 | 1989-10-03 | G. G. B. Industries, Inc. | Integrated circuit probing apparatus |
US5323035A (en) | 1992-10-13 | 1994-06-21 | Glenn Leedy | Interconnection structure for integrated circuits and method for making same |
US5354695A (en) | 1992-04-08 | 1994-10-11 | Leedy Glenn J | Membrane dielectric isolation IC fabrication |
US5020219A (en) | 1988-05-16 | 1991-06-04 | Leedy Glenn J | Method of making a flexible tester surface for testing integrated circuits |
US4983910A (en) | 1988-05-20 | 1991-01-08 | Stanford University | Millimeter-wave active probe |
US5003253A (en) | 1988-05-20 | 1991-03-26 | The Board Of Trustees Of The Leland Stanford Junior University | Millimeter-wave active probe system |
US4987100A (en) | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4831494A (en) | 1988-06-27 | 1989-05-16 | International Business Machines Corporation | Multilayer capacitor |
US5116180A (en) | 1988-07-18 | 1992-05-26 | Spar Aerospace Limited | Human-in-the-loop machine control loop |
US4991290A (en) | 1988-07-21 | 1991-02-12 | Microelectronics And Computer Technology | Flexible electrical interconnect and method of making |
US4926172A (en) | 1988-09-02 | 1990-05-15 | Dickey-John Corporation | Joystick controller |
US4906920A (en) | 1988-10-11 | 1990-03-06 | Hewlett-Packard Company | Self-leveling membrane probe |
US4893914A (en) | 1988-10-12 | 1990-01-16 | The Micromanipulator Company, Inc. | Test station |
US4998062A (en) | 1988-10-25 | 1991-03-05 | Tokyo Electron Limited | Probe device having micro-strip line structure |
CA1278106C (en) | 1988-11-02 | 1990-12-18 | Gordon Glen Rabjohn | Tunable microwave wafer probe |
US4849689A (en) | 1988-11-04 | 1989-07-18 | Cascade Microtech, Inc. | Microwave wafer probe having replaceable probe tip |
US4904935A (en) | 1988-11-14 | 1990-02-27 | Eaton Corporation | Electrical circuit board text fixture having movable platens |
US5142224A (en) | 1988-12-13 | 1992-08-25 | Comsat | Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals |
US4916398A (en) | 1988-12-21 | 1990-04-10 | Spectroscopy Imaging Systems Corp. | Efficient remote transmission line probe tuning for NMR apparatus |
CA2005070C (en) | 1988-12-23 | 1999-04-27 | Henry C. Yuen | Apparatus and method for using encoded video recorder/player timer preprogramming information |
US5129006A (en) | 1989-01-06 | 1992-07-07 | Hill Amel L | Electronic audio signal amplifier and loudspeaker system |
US4916002A (en) | 1989-01-13 | 1990-04-10 | The Board Of Trustees Of The Leland Jr. University | Microcasting of microminiature tips |
US4922128A (en) | 1989-01-13 | 1990-05-01 | Ibm Corporation | Boost clock circuit for driving redundant wordlines and sample wordlines |
DE3902997C1 (en) | 1989-02-02 | 1990-04-19 | Felten & Guilleaume Energietechnik Ag, 5000 Koeln, De | |
US5232789A (en) | 1989-03-09 | 1993-08-03 | Mtu Motoren- Und Turbinen-Union Muenchen Gmbh | Structural component with a protective coating having a nickel or cobalt basis and method for making such a coating |
US5159752A (en) | 1989-03-22 | 1992-11-03 | Texas Instruments Incorporated | Scanning electron microscope based parametric testing method and apparatus |
US5304924A (en) | 1989-03-29 | 1994-04-19 | Canon Kabushiki Kaisha | Edge detector |
US5030907A (en) | 1989-05-19 | 1991-07-09 | Knights Technology, Inc. | CAD driven microprobe integrated circuit tester |
US4980638A (en) | 1989-05-26 | 1990-12-25 | Dermon John A | Microcircuit probe and method for manufacturing same |
US4965514A (en) | 1989-06-05 | 1990-10-23 | Tektronix, Inc. | Apparatus for probing a microwave circuit |
US5045781A (en) | 1989-06-08 | 1991-09-03 | Cascade Microtech, Inc. | High-frequency active probe having replaceable contact needles |
US4970386A (en) | 1989-06-22 | 1990-11-13 | Westinghouse Electric Corp. | Vertical FET high speed optical sensor |
US5134365A (en) | 1989-07-11 | 1992-07-28 | Nihon Denshizairyo Kabushiki Kaisha | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
US4998063A (en) | 1989-07-31 | 1991-03-05 | Abb Power T & D Company, Inc. | Fiber optic coupled magneto-optic sensor having a concave reflective focusing surface |
US5041782A (en) | 1989-09-20 | 1991-08-20 | Design Technique International, Inc. | Microstrip probe |
US5166606A (en) | 1989-11-03 | 1992-11-24 | John H. Blanz Company, Inc. | High efficiency cryogenic test station |
US5160883A (en) | 1989-11-03 | 1992-11-03 | John H. Blanz Company, Inc. | Test station having vibrationally stabilized X, Y and Z movable integrated circuit receiving support |
US5097207A (en) | 1989-11-03 | 1992-03-17 | John H. Blanz Company, Inc. | Temperature stable cryogenic probe station |
US5267088A (en) | 1989-11-10 | 1993-11-30 | Asahi Kogaku Kogyo Kabushiki Kaisha | Code plate mounting device |
US4975638A (en) | 1989-12-18 | 1990-12-04 | Wentworth Laboratories | Test probe assembly for testing integrated circuit devices |
US5145552A (en) | 1989-12-21 | 1992-09-08 | Canon Kabushiki Kaisha | Process for preparing electrical connecting member |
US5089774A (en) | 1989-12-26 | 1992-02-18 | Sharp Kabushiki Kaisha | Apparatus and a method for checking a semiconductor |
US5066357A (en) | 1990-01-11 | 1991-11-19 | Hewlett-Packard Company | Method for making flexible circuit card with laser-contoured vias and machined capacitors |
JPH03209737A (en) | 1990-01-11 | 1991-09-12 | Tokyo Electron Ltd | Probe equipment |
US5298972A (en) | 1990-01-22 | 1994-03-29 | Hewlett-Packard Company | Method and apparatus for measuring polarization sensitivity of optical devices |
US5001423A (en) | 1990-01-24 | 1991-03-19 | International Business Machines Corporation | Dry interface thermal chuck temperature control system for semiconductor wafer testing |
US5069628A (en) | 1990-03-13 | 1991-12-03 | Hughes Aircraft Company | Flexible electrical cable connector with double sided dots |
US5007163A (en) | 1990-04-18 | 1991-04-16 | International Business Machines Corporation | Non-destructure method of performing electrical burn-in testing of semiconductor chips |
US5408189A (en) | 1990-05-25 | 1995-04-18 | Everett Charles Technologies, Inc. | Test fixture alignment system for printed circuit boards |
US5012186A (en) | 1990-06-08 | 1991-04-30 | Cascade Microtech, Inc. | Electrical probe with contact force protection |
US5245292A (en) | 1990-06-12 | 1993-09-14 | Iniziative Marittime 1991, S.R.L. | Method and apparatus for sensing a fluid handling |
US5198753A (en) | 1990-06-29 | 1993-03-30 | Digital Equipment Corporation | Integrated circuit test fixture and method |
US5061823A (en) | 1990-07-13 | 1991-10-29 | W. L. Gore & Associates, Inc. | Crush-resistant coaxial transmission line |
US5187443A (en) | 1990-07-24 | 1993-02-16 | Bereskin Alexander B | Microwave test fixtures for determining the dielectric properties of a material |
US5128612A (en) | 1990-07-31 | 1992-07-07 | Texas Instruments Incorporated | Disposable high performance test head |
US5569591A (en) | 1990-08-03 | 1996-10-29 | University College Of Wales Aberystwyth | Analytical or monitoring apparatus and method |
KR0138754B1 (en) | 1990-08-06 | 1998-06-15 | 이노우에 아키라 | Touch sensor unit of probe for testing electric circuit and electric circuit testing apparatus using the touch sensor unit |
US5059898A (en) | 1990-08-09 | 1991-10-22 | Tektronix, Inc. | Wafer probe with transparent loading member |
US5363050A (en) | 1990-08-31 | 1994-11-08 | Guo Wendy W | Quantitative dielectric imaging system |
US5091732A (en) | 1990-09-07 | 1992-02-25 | The United States Of America As Represented By The Secretary Of The Navy | Lightweight deployable antenna system |
US5521518A (en) | 1990-09-20 | 1996-05-28 | Higgins; H. Dan | Probe card apparatus |
US6037785A (en) | 1990-09-20 | 2000-03-14 | Higgins; H. Dan | Probe card apparatus |
US5589781A (en) | 1990-09-20 | 1996-12-31 | Higgins; H. Dan | Die carrier apparatus |
JP3196206B2 (en) | 1990-09-25 | 2001-08-06 | 東芝ライテック株式会社 | Discharge lamp lighting device |
US5159267A (en) | 1990-09-28 | 1992-10-27 | Sematech, Inc. | Pneumatic energy fluxmeter |
GB9021448D0 (en) | 1990-10-03 | 1990-11-14 | Renishaw Plc | Capacitance sensing probe |
US5126286A (en) | 1990-10-05 | 1992-06-30 | Micron Technology, Inc. | Method of manufacturing edge connected semiconductor die |
JP2544015Y2 (en) | 1990-10-15 | 1997-08-13 | 株式会社アドバンテスト | IC test equipment |
US5148103A (en) | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
US5207585A (en) | 1990-10-31 | 1993-05-04 | International Business Machines Corporation | Thin interface pellicle for dense arrays of electrical interconnects |
US5061192A (en) | 1990-12-17 | 1991-10-29 | International Business Machines Corporation | High density connector |
US5138289A (en) | 1990-12-21 | 1992-08-11 | California Institute Of Technology | Noncontacting waveguide backshort |
EP0493089B1 (en) | 1990-12-25 | 1998-09-16 | Ngk Insulators, Ltd. | Wafer heating apparatus and method for producing the same |
JP3699349B2 (en) | 1990-12-25 | 2005-09-28 | 日本碍子株式会社 | Wafer adsorption heating device |
US5107076A (en) | 1991-01-08 | 1992-04-21 | W. L. Gore & Associates, Inc. | Easy strip composite dielectric coaxial signal cable |
US5136237A (en) | 1991-01-29 | 1992-08-04 | Tektronix, Inc. | Double insulated floating high voltage test probe |
US5097101A (en) | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
US5233306A (en) | 1991-02-13 | 1993-08-03 | The Board Of Regents Of The University Of Wisconsin System | Method and apparatus for measuring the permittivity of materials |
US5172050A (en) | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
US5133119A (en) | 1991-02-28 | 1992-07-28 | Hewlett-Packard Company | Shearing stress interconnection apparatus and method |
US6411377B1 (en) | 1991-04-02 | 2002-06-25 | Hitachi, Ltd. | Optical apparatus for defect and particle size inspection |
US5172051A (en) | 1991-04-24 | 1992-12-15 | Hewlett-Packard Company | Wide bandwidth passive probe |
US5317656A (en) | 1991-05-17 | 1994-05-31 | Texas Instruments Incorporated | Fiber optic network for multi-point emissivity-compensated semiconductor wafer pyrometry |
US5487999A (en) | 1991-06-04 | 1996-01-30 | Micron Technology, Inc. | Method for fabricating a penetration limited contact having a rough textured surface |
US5225037A (en) | 1991-06-04 | 1993-07-06 | Texas Instruments Incorporated | Method for fabrication of probe card for testing of semiconductor devices |
US5686317A (en) | 1991-06-04 | 1997-11-11 | Micron Technology, Inc. | Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die |
US5148131A (en) | 1991-06-11 | 1992-09-15 | Hughes Aircraft Company | Coaxial-to-waveguide transducer with improved matching |
US5101453A (en) | 1991-07-05 | 1992-03-31 | Cascade Microtech, Inc. | Fiber optic wafer probe |
US5233197A (en) | 1991-07-15 | 1993-08-03 | University Of Massachusetts Medical Center | High speed digital imaging microscope |
KR940001809B1 (en) | 1991-07-18 | 1994-03-09 | 금성일렉트론 주식회사 | Tester of semiconductor device |
US5229782A (en) | 1991-07-19 | 1993-07-20 | Conifer Corporation | Stacked dual dipole MMDS feed |
US5321352A (en) | 1991-08-01 | 1994-06-14 | Tokyo Electron Yamanashi Limited | Probe apparatus and method of alignment for the same |
US5177438A (en) | 1991-08-02 | 1993-01-05 | Motorola, Inc. | Low resistance probe for semiconductor |
US5321453A (en) | 1991-08-03 | 1994-06-14 | Tokyo Electron Limited | Probe apparatus for probing an object held above the probe card |
US5404111A (en) | 1991-08-03 | 1995-04-04 | Tokyo Electron Limited | Probe apparatus with a swinging holder for an object of examination |
US5126696A (en) | 1991-08-12 | 1992-06-30 | Trw Inc. | W-Band waveguide variable controlled oscillator |
US5420516A (en) | 1991-09-20 | 1995-05-30 | Audio Precision, Inc. | Method and apparatus for fast response and distortion measurement |
US5159264A (en) | 1991-10-02 | 1992-10-27 | Sematech, Inc. | Pneumatic energy fluxmeter |
US5214243A (en) | 1991-10-11 | 1993-05-25 | Endevco Corporation | High-temperature, low-noise coaxial cable assembly with high strength reinforcement braid |
US5334931A (en) | 1991-11-12 | 1994-08-02 | International Business Machines Corporation | Molded test probe assembly |
US5170930A (en) | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5537372A (en) | 1991-11-15 | 1996-07-16 | International Business Machines Corporation | High density data storage system with topographic contact sensor |
US5846708A (en) | 1991-11-19 | 1998-12-08 | Massachusetts Institiute Of Technology | Optical and electrical methods and apparatus for molecule detection |
IL103674A0 (en) | 1991-11-19 | 1993-04-04 | Houston Advanced Res Center | Method and apparatus for molecule detection |
US5414565A (en) | 1991-11-27 | 1995-05-09 | Sullivan; Mark T. | Tilting kinematic mount |
US5180977A (en) | 1991-12-02 | 1993-01-19 | Hoya Corporation Usa | Membrane probe contact bump compliancy system |
US5202648A (en) | 1991-12-09 | 1993-04-13 | The Boeing Company | Hermetic waveguide-to-microstrip transition module |
US5214374A (en) | 1991-12-12 | 1993-05-25 | Everett/Charles Contact Products, Inc. | Dual level test fixture |
US5274336A (en) | 1992-01-14 | 1993-12-28 | Hewlett-Packard Company | Capacitively-coupled test probe |
US5686960A (en) | 1992-01-14 | 1997-11-11 | Michael Sussman | Image input device having optical deflection elements for capturing multiple sub-images |
US5367165A (en) | 1992-01-17 | 1994-11-22 | Olympus Optical Co., Ltd. | Cantilever chip for scanning probe microscope |
EP0552944B1 (en) | 1992-01-21 | 1997-03-19 | Sharp Kabushiki Kaisha | Waveguide to coaxial adaptor and converter for antenna for satellite broadcasting including such waveguide |
US5389885A (en) | 1992-01-27 | 1995-02-14 | Everett Charles Technologies, Inc. | Expandable diaphragm test modules and connectors |
US5584120A (en) | 1992-02-14 | 1996-12-17 | Research Organization For Circuit Knowledge | Method of manufacturing printed circuits |
US5202558A (en) | 1992-03-04 | 1993-04-13 | Barker Lynn M | Flexible fiber optic probe for high-pressure shock experiments |
US5672816A (en) | 1992-03-13 | 1997-09-30 | Park Scientific Instruments | Large stage system for scanning probe microscopes and other instruments |
US5376790A (en) | 1992-03-13 | 1994-12-27 | Park Scientific Instruments | Scanning probe microscope |
US5254939A (en) | 1992-03-20 | 1993-10-19 | Xandex, Inc. | Probe card system |
US5478748A (en) | 1992-04-01 | 1995-12-26 | Thomas Jefferson University | Protein assay using microwave energy |
DE4211362C2 (en) | 1992-04-04 | 1995-04-20 | Berthold Lab Prof Dr | Device for determining material parameters by microwave measurements |
TW212252B (en) | 1992-05-01 | 1993-09-01 | Martin Marietta Corp | |
USRE37130E1 (en) | 1992-05-08 | 2001-04-10 | David Fiori, Jr. | Signal conditioning apparatus |
US5281364A (en) | 1992-05-22 | 1994-01-25 | Finch Limited | Liquid metal electrical contact compositions |
US5266889A (en) | 1992-05-29 | 1993-11-30 | Cascade Microtech, Inc. | Wafer probe station with integrated environment control enclosure |
US5479109A (en) | 1992-06-03 | 1995-12-26 | Trw Inc. | Testing device for integrated circuits on wafer |
US6380751B2 (en) | 1992-06-11 | 2002-04-30 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
US5345170A (en) | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
JP3228348B2 (en) | 1992-07-03 | 2001-11-12 | キヤノン株式会社 | Polymer liquid crystal compound, liquid crystal composition and liquid crystal element |
JPH0634715A (en) | 1992-07-17 | 1994-02-10 | Mitsubishi Electric Corp | High-frequency band probe head |
US5360312A (en) | 1992-07-29 | 1994-11-01 | Case Corporation | Three function control mechanism |
US5316435A (en) | 1992-07-29 | 1994-05-31 | Case Corporation | Three function control system |
FR2695508B1 (en) | 1992-09-08 | 1994-10-21 | Filotex Sa | Low noise cable. |
US5227730A (en) | 1992-09-14 | 1993-07-13 | Kdc Technology Corp. | Microwave needle dielectric sensors |
US5347204A (en) | 1992-10-06 | 1994-09-13 | Honeywell Inc. | Position dependent rate dampening in any active hand controller |
US6295729B1 (en) | 1992-10-19 | 2001-10-02 | International Business Machines Corporation | Angled flying lead wire bonding process |
US5371654A (en) | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5308250A (en) | 1992-10-30 | 1994-05-03 | Hewlett-Packard Company | Pressure contact for connecting a coaxial shield to a microstrip ground plane |
US5479108A (en) | 1992-11-25 | 1995-12-26 | David Cheng | Method and apparatus for handling wafers |
JPH06151532A (en) | 1992-11-13 | 1994-05-31 | Tokyo Electron Yamanashi Kk | Prober |
US5684669A (en) | 1995-06-07 | 1997-11-04 | Applied Materials, Inc. | Method for dechucking a workpiece from an electrostatic chuck |
US5326412A (en) | 1992-12-22 | 1994-07-05 | Hughes Aircraft Company | Method for electrodepositing corrosion barrier on isolated circuitry |
US5512835A (en) | 1992-12-22 | 1996-04-30 | Hughes Aircraft Company | Electrical probe and method for measuring gaps and other discontinuities in enclosures using electrical inductance for RF shielding assessment |
JP3175367B2 (en) | 1992-12-24 | 2001-06-11 | 東レ株式会社 | Liquid crystalline polyester with improved homogeneity |
US5422574A (en) | 1993-01-14 | 1995-06-06 | Probe Technology Corporation | Large scale protrusion membrane for semiconductor devices under test with very high pin counts |
JPH0792479B2 (en) | 1993-03-18 | 1995-10-09 | 東京エレクトロン株式会社 | Parallelism adjustment method for probe device |
US5539676A (en) | 1993-04-15 | 1996-07-23 | Tokyo Electron Limited | Method of identifying probe position and probing method in prober |
JPH06302656A (en) | 1993-04-19 | 1994-10-28 | Toshiba Corp | Device and method for evaluating semiconductor element characteristic |
US5383787A (en) | 1993-04-27 | 1995-01-24 | Aptix Corporation | Integrated circuit package with direct access to internal signals |
US5395253A (en) | 1993-04-29 | 1995-03-07 | Hughes Aircraft Company | Membrane connector with stretch induced micro scrub |
US6054651A (en) | 1996-06-21 | 2000-04-25 | International Business Machines Corporation | Foamed elastomers for wafer probing applications and interposer connectors |
US6722032B2 (en) | 1995-11-27 | 2004-04-20 | International Business Machines Corporation | Method of forming a structure for electronic devices contact locations |
US5811982A (en) | 1995-11-27 | 1998-09-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US6528984B2 (en) | 1996-09-13 | 2003-03-04 | Ibm Corporation | Integrated compliant probe for wafer level test and burn-in |
US5810607A (en) | 1995-09-13 | 1998-09-22 | International Business Machines Corporation | Interconnector with contact pads having enhanced durability |
US5914614A (en) | 1996-03-12 | 1999-06-22 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US6329827B1 (en) | 1997-10-07 | 2001-12-11 | International Business Machines Corporation | High density cantilevered probe for electronic devices |
US5357211A (en) | 1993-05-03 | 1994-10-18 | Raytheon Company | Pin driver amplifier |
US5539323A (en) | 1993-05-07 | 1996-07-23 | Brooks Automation, Inc. | Sensor for articles such as wafers on end effector |
US5467021A (en) | 1993-05-24 | 1995-11-14 | Atn Microwave, Inc. | Calibration method and apparatus |
US5657394A (en) | 1993-06-04 | 1997-08-12 | Integrated Technology Corporation | Integrated circuit probe card inspection system |
US5373231A (en) | 1993-06-10 | 1994-12-13 | G. G. B. Industries, Inc. | Integrated circuit probing apparatus including a capacitor bypass structure |
US5412330A (en) | 1993-06-16 | 1995-05-02 | Tektronix, Inc. | Optical module for an optically based measurement system |
JPH0714898A (en) | 1993-06-23 | 1995-01-17 | Mitsubishi Electric Corp | Equipment and method for testing and analyzing semiconductor wafer |
US6728113B1 (en) | 1993-06-24 | 2004-04-27 | Polychip, Inc. | Method and apparatus for non-conductively interconnecting integrated circuits |
JP3346838B2 (en) | 1993-06-29 | 2002-11-18 | 有限会社創造庵 | Rotary movement mechanism |
US5412866A (en) | 1993-07-01 | 1995-05-09 | Hughes Aircraft Company | Method of making a cast elastomer/membrane test probe assembly |
US5441690A (en) | 1993-07-06 | 1995-08-15 | International Business Machines Corporation | Process of making pinless connector |
JP3395264B2 (en) | 1993-07-26 | 2003-04-07 | 東京応化工業株式会社 | Rotating cup type coating device |
JP3442822B2 (en) | 1993-07-28 | 2003-09-02 | アジレント・テクノロジー株式会社 | Measurement cable and measurement system |
US5451884A (en) | 1993-08-04 | 1995-09-19 | Transat Corp. | Electronic component temperature test system with flat ring revolving carriage |
US5792668A (en) | 1993-08-06 | 1998-08-11 | Solid State Farms, Inc. | Radio frequency spectral analysis for in-vitro or in-vivo environments |
US5494030A (en) | 1993-08-12 | 1996-02-27 | Trustees Of Dartmouth College | Apparatus and methodology for determining oxygen in biological systems |
US5594358A (en) | 1993-09-02 | 1997-01-14 | Matsushita Electric Industrial Co., Ltd. | Radio frequency probe and probe card including a signal needle and grounding needle coupled to a microstrip transmission line |
US5326428A (en) | 1993-09-03 | 1994-07-05 | Micron Semiconductor, Inc. | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
DE9313420U1 (en) | 1993-09-06 | 1993-10-28 | Ge Elektronik Gmbh Magdeburg | Probe |
US5600258A (en) | 1993-09-15 | 1997-02-04 | Intest Corporation | Method and apparatus for automated docking of a test head to a device handler |
US5500606A (en) | 1993-09-16 | 1996-03-19 | Compaq Computer Corporation | Completely wireless dual-access test fixture |
JP2710544B2 (en) | 1993-09-30 | 1998-02-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Probe structure, method of forming probe structure |
JP3089150B2 (en) | 1993-10-19 | 2000-09-18 | キヤノン株式会社 | Positioning stage device |
US5463324A (en) | 1993-10-26 | 1995-10-31 | Hewlett-Packard Company | Probe with contacts that interdigitate with and wedge between adjacent legs of an IC or the like |
US5467024A (en) | 1993-11-01 | 1995-11-14 | Motorola, Inc. | Integrated circuit test with programmable source for both AC and DC modes of operation |
US5878486A (en) | 1993-11-16 | 1999-03-09 | Formfactor, Inc. | Method of burning-in semiconductor devices |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US7064566B2 (en) | 1993-11-16 | 2006-06-20 | Formfactor, Inc. | Probe card assembly and kit |
US6835898B2 (en) | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
US5806181A (en) | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US5912046A (en) | 1993-11-16 | 1999-06-15 | Form Factor, Inc. | Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component |
US6727580B1 (en) | 1993-11-16 | 2004-04-27 | Formfactor, Inc. | Microelectronic spring contact elements |
US6741085B1 (en) | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US5974662A (en) | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6525555B1 (en) | 1993-11-16 | 2003-02-25 | Formfactor, Inc. | Wafer-level burn-in and test |
US5601740A (en) | 1993-11-16 | 1997-02-11 | Formfactor, Inc. | Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
US5832601A (en) | 1993-11-16 | 1998-11-10 | Form Factor, Inc. | Method of making temporary connections between electronic components |
US6336269B1 (en) | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
US6029344A (en) | 1993-11-16 | 2000-02-29 | Formfactor, Inc. | Composite interconnection element for microelectronic components, and method of making same |
US6836962B2 (en) | 1993-11-16 | 2005-01-04 | Formfactor, Inc. | Method and apparatus for shaping spring elements |
US6023103A (en) | 1994-11-15 | 2000-02-08 | Formfactor, Inc. | Chip-scale carrier for semiconductor devices including mounted spring contacts |
US5772451A (en) | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US5983493A (en) | 1993-11-16 | 1999-11-16 | Formfactor, Inc. | Method of temporarily, then permanently, connecting to a semiconductor device |
US6184053B1 (en) | 1993-11-16 | 2001-02-06 | Formfactor, Inc. | Method of making microelectronic spring contact elements |
US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US6442831B1 (en) | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US6064213A (en) | 1993-11-16 | 2000-05-16 | Formfactor, Inc. | Wafer-level burn-in and test |
US5669316A (en) | 1993-12-10 | 1997-09-23 | Sony Corporation | Turntable for rotating a wafer carrier |
KR100248569B1 (en) | 1993-12-22 | 2000-03-15 | 히가시 데쓰로 | Probe system |
US20020011859A1 (en) | 1993-12-23 | 2002-01-31 | Kenneth R. Smith | Method for forming conductive bumps for the purpose of contrructing a fine pitch test device |
US6064217A (en) | 1993-12-23 | 2000-05-16 | Epi Technologies, Inc. | Fine pitch contact device employing a compliant conductive polymer bump |
US5475316A (en) | 1993-12-27 | 1995-12-12 | Hypervision, Inc. | Transportable image emission microscope |
US5510792A (en) | 1993-12-27 | 1996-04-23 | Tdk Corporation | Anechoic chamber and wave absorber |
US5430813A (en) | 1993-12-30 | 1995-07-04 | The United States Of America As Represented By The Secretary Of The Navy | Mode-matched, combination taper fiber optic probe |
GB9401459D0 (en) | 1994-01-26 | 1994-03-23 | Secr Defence | Method and apparatus for measurement of unsteady gas temperatures |
US5583445A (en) | 1994-02-04 | 1996-12-10 | Hughes Aircraft Company | Opto-electronic membrane probe |
JP3565893B2 (en) | 1994-02-04 | 2004-09-15 | アジレント・テクノロジーズ・インク | Probe device and electric circuit element measuring device |
US5642298A (en) | 1994-02-16 | 1997-06-24 | Ade Corporation | Wafer testing and self-calibration system |
US5611946A (en) | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
US5477011A (en) | 1994-03-03 | 1995-12-19 | W. L. Gore & Associates, Inc. | Low noise signal transmission cable |
US5565881A (en) | 1994-03-11 | 1996-10-15 | Motorola, Inc. | Balun apparatus including impedance transformer having transformation length |
JP3578232B2 (en) | 1994-04-07 | 2004-10-20 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Electrical contact forming method, probe structure and device including the electrical contact |
US5523694A (en) | 1994-04-08 | 1996-06-04 | Cole, Jr.; Edward I. | Integrated circuit failure analysis by low-energy charge-induced voltage alteration |
US5528158A (en) | 1994-04-11 | 1996-06-18 | Xandex, Inc. | Probe card changer system and method |
US5530372A (en) | 1994-04-15 | 1996-06-25 | Schlumberger Technologies, Inc. | Method of probing a net of an IC at an optimal probe-point |
IL109492A (en) | 1994-05-01 | 1999-06-20 | Sirotech Ltd | Method and apparatus for evaluating bacterial populations |
US5715819A (en) | 1994-05-26 | 1998-02-10 | The Carolinas Heart Institute | Microwave tomographic spectroscopy system and method |
US5511010A (en) | 1994-06-10 | 1996-04-23 | Texas Instruments Incorporated | Method and apparatus of eliminating interference in an undersettled electrical signal |
JP2940401B2 (en) | 1994-06-10 | 1999-08-25 | 住友電装株式会社 | Connector inspection device |
US5505150A (en) | 1994-06-14 | 1996-04-09 | L&P Property Management Company | Method and apparatus for facilitating loop take time adjustment in multi-needle quilting machine |
EP0694282B1 (en) | 1994-07-01 | 2004-01-02 | Interstitial, LLC | Breast cancer detection and imaging by electromagnetic millimeter waves |
US5704355A (en) | 1994-07-01 | 1998-01-06 | Bridges; Jack E. | Non-invasive system for breast cancer detection |
US5829437A (en) | 1994-07-01 | 1998-11-03 | Interstitial, Inc. | Microwave method and system to detect and locate cancers in heterogenous tissues |
US5561378A (en) * | 1994-07-05 | 1996-10-01 | Motorola, Inc. | Circuit probe for measuring a differential circuit |
US5584608A (en) | 1994-07-05 | 1996-12-17 | Gillespie; Harvey D. | Anchored cable sling system |
US5506515A (en) | 1994-07-20 | 1996-04-09 | Cascade Microtech, Inc. | High-frequency probe tip assembly |
US5565788A (en) | 1994-07-20 | 1996-10-15 | Cascade Microtech, Inc. | Coaxial wafer probe with tip shielding |
US6337479B1 (en) | 1994-07-28 | 2002-01-08 | Victor B. Kley | Object inspection and/or modification system and method |
GB9417450D0 (en) | 1994-08-25 | 1994-10-19 | Symmetricom Inc | An antenna |
US5488954A (en) | 1994-09-09 | 1996-02-06 | Georgia Tech Research Corp. | Ultrasonic transducer and method for using same |
GB9418183D0 (en) | 1994-09-09 | 1994-10-26 | Chan Tsing Y A | Non-destructive method for determination of polar molecules on rigid and semi-rigid substrates |
EP0779989A4 (en) | 1994-09-09 | 1998-01-07 | Micromodule Systems Inc | Membrane probing of circuits |
AU3890095A (en) | 1994-09-19 | 1996-04-09 | Terry Lee Mauney | Plant growing system |
US5469324A (en) | 1994-10-07 | 1995-11-21 | Storage Technology Corporation | Integrated decoupling capacitive core for a printed circuit board and method of making same |
EP0707214A3 (en) | 1994-10-14 | 1997-04-16 | Hughes Aircraft Co | Multiport membrane probe for full-wafer testing |
WO1996013728A1 (en) | 1994-10-28 | 1996-05-09 | Nitto Denko Corporation | Probe structure |
KR100384265B1 (en) | 1994-10-28 | 2003-08-14 | 클리크 앤드 소파 홀딩스 인코포레이티드 | Programmable high-density electronic device testing |
US5481196A (en) | 1994-11-08 | 1996-01-02 | Nebraska Electronics, Inc. | Process and apparatus for microwave diagnostics and therapy |
US6727579B1 (en) | 1994-11-16 | 2004-04-27 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5471185A (en) | 1994-12-06 | 1995-11-28 | Eaton Corporation | Electrical circuit protection devices comprising conductive liquid compositions |
MY112945A (en) | 1994-12-20 | 2001-10-31 | Ibm | Electronic devices comprising dielectric foamed polymers |
US5583733A (en) | 1994-12-21 | 1996-12-10 | Polaroid Corporation | Electrostatic discharge protection device |
US5731920A (en) | 1994-12-22 | 1998-03-24 | Canon Kabushiki Kaisha | Converting adapter for interchangeable lens assembly |
JPH08179008A (en) | 1994-12-22 | 1996-07-12 | Advantest Corp | Test head cooling device |
US5792562A (en) | 1995-01-12 | 1998-08-11 | Applied Materials, Inc. | Electrostatic chuck with polymeric impregnation and method of making |
US5625299A (en) | 1995-02-03 | 1997-04-29 | Uhling; Thomas F. | Multiple lead analog voltage probe with high signal integrity over a wide band width |
US5550481A (en) | 1995-02-08 | 1996-08-27 | Semco Machine Corporation | Circuit board test fixture apparatus with cam rotably mounted in slidable cam block and method for making |
US5507652A (en) | 1995-02-17 | 1996-04-16 | Hewlett-Packard Company | Wedge connector for integrated circuits |
DE19605214A1 (en) | 1995-02-23 | 1996-08-29 | Bosch Gmbh Robert | Ultrasonic drive element |
GB9503953D0 (en) | 1995-02-28 | 1995-04-19 | Plessey Semiconductors Ltd | An mcm-d probe tip |
US5678210A (en) | 1995-03-17 | 1997-10-14 | Hughes Electronics | Method and apparatus of coupling a transmitter to a waveguide in a remote ground terminal |
US5777485A (en) | 1995-03-20 | 1998-07-07 | Tokyo Electron Limited | Probe method and apparatus with improved probe contact |
WO1996031801A1 (en) | 1995-04-03 | 1996-10-10 | Baker Gary H | A flexible darkness adapting viewer |
US5532608A (en) | 1995-04-06 | 1996-07-02 | International Business Machines Corporation | Ceramic probe card and method for reducing leakage current |
US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
US5610529A (en) | 1995-04-28 | 1997-03-11 | Cascade Microtech, Inc. | Probe station having conductive coating added to thermal chuck insulator |
DE19517330C2 (en) | 1995-05-11 | 2002-06-13 | Helmuth Heigl | handling device |
US5720098A (en) | 1995-05-12 | 1998-02-24 | Probe Technology | Method for making a probe preserving a uniform stress distribution under deflection |
US5621333A (en) | 1995-05-19 | 1997-04-15 | Microconnect, Inc. | Contact device for making connection to an electronic circuit device |
US5998864A (en) | 1995-05-26 | 1999-12-07 | Formfactor, Inc. | Stacking semiconductor devices, particularly memory chips |
US5804982A (en) | 1995-05-26 | 1998-09-08 | International Business Machines Corporation | Miniature probe positioning actuator |
US6150186A (en) | 1995-05-26 | 2000-11-21 | Formfactor, Inc. | Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive |
US6042712A (en) | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
US6090261A (en) | 1995-05-26 | 2000-07-18 | Formfactor, Inc. | Method and apparatus for controlling plating over a face of a substrate |
US6685817B1 (en) | 1995-05-26 | 2004-02-03 | Formfactor, Inc. | Method and apparatus for controlling plating over a face of a substrate |
US5728091A (en) | 1995-06-07 | 1998-03-17 | Cardiogenesis Corporation | Optical fiber for myocardial channel formation |
EP0776530A4 (en) | 1995-06-21 | 1998-06-10 | Motorola Inc | Method and antenna for providing an omnidirectional pattern |
DE19522774A1 (en) | 1995-06-27 | 1997-01-02 | Ifu Gmbh | Appliance for spectroscopic examination of specimens taken from human body |
US5659421A (en) | 1995-07-05 | 1997-08-19 | Neuromedical Systems, Inc. | Slide positioning and holding device |
US6002109A (en) | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
US5676360A (en) | 1995-07-11 | 1997-10-14 | Boucher; John N. | Machine tool rotary table locking apparatus |
US5656942A (en) | 1995-07-21 | 1997-08-12 | Electroglas, Inc. | Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane |
JP3458586B2 (en) | 1995-08-21 | 2003-10-20 | 松下電器産業株式会社 | Microwave mixer circuit and down converter |
US5621400A (en) | 1995-09-07 | 1997-04-15 | Corbi; Ronald W. | Ice detection method and apparatus for an aircraft |
DE19536837B4 (en) | 1995-10-02 | 2006-01-26 | Alstom | Apparatus and method for injecting fuels into compressed gaseous media |
US5841342A (en) | 1995-10-13 | 1998-11-24 | Com Dev Ltd. | Voltage controlled superconducting microwave switch and method of operation thereof |
US5807107A (en) | 1995-10-20 | 1998-09-15 | Barrier Supply | Dental infection control system |
US6006002A (en) | 1995-10-25 | 1999-12-21 | Olympus Optical Co., Ltd. | Rigid sleeve device fitted over a flexible insertion section of an endoscope for inspecting industrial equipment |
US5742174A (en) | 1995-11-03 | 1998-04-21 | Probe Technology | Membrane for holding a probe tip in proper location |
US5892539A (en) | 1995-11-08 | 1999-04-06 | Alpha Innotech Corporation | Portable emission microscope workstation for failure analysis |
US6483328B1 (en) | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
DE19542955C2 (en) | 1995-11-17 | 1999-02-18 | Schwind Gmbh & Co Kg Herbert | endoscope |
US5953477A (en) | 1995-11-20 | 1999-09-14 | Visionex, Inc. | Method and apparatus for improved fiber optic light management |
JP2970505B2 (en) | 1995-11-21 | 1999-11-02 | 日本電気株式会社 | Semiconductor device wiring current observation method, inspection method and apparatus |
JP3838381B2 (en) | 1995-11-22 | 2006-10-25 | 株式会社アドバンテスト | Probe card |
US5785538A (en) | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5910727A (en) | 1995-11-30 | 1999-06-08 | Tokyo Electron Limited | Electrical inspecting apparatus with ventilation system |
US5729150A (en) | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
US5611008A (en) | 1996-01-26 | 1997-03-11 | Hughes Aircraft Company | Substrate system for optoelectronic/microwave circuits |
US5814847A (en) | 1996-02-02 | 1998-09-29 | National Semiconductor Corp. | General purpose assembly programmable multi-chip package substrate |
AU1678697A (en) | 1996-02-06 | 1997-08-28 | Telefonaktiebolaget Lm Ericsson (Publ) | Assembly and method for testing integrated circuit devices |
US5841288A (en) | 1996-02-12 | 1998-11-24 | Microwave Imaging System Technologies, Inc. | Two-dimensional microwave imaging apparatus and methods |
DE19605598C1 (en) | 1996-02-15 | 1996-10-31 | Singulus Technologies Gmbh | Substrate hold and release mechanism for vacuum chamber |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US6327034B1 (en) | 1999-09-20 | 2001-12-04 | Rex Hoover | Apparatus for aligning two objects |
US5628057A (en) | 1996-03-05 | 1997-05-06 | Motorola, Inc. | Multi-port radio frequency signal transformation network |
US5726211A (en) | 1996-03-21 | 1998-03-10 | International Business Machines Corporation | Process for making a foamed elastometric polymer |
US5804607A (en) | 1996-03-21 | 1998-09-08 | International Business Machines Corporation | Process for making a foamed elastomeric polymer |
JP2900877B2 (en) | 1996-03-22 | 1999-06-02 | 日本電気株式会社 | Semiconductor device wiring current observation method, wiring system defect inspection method, and apparatus therefor |
JP3457495B2 (en) | 1996-03-29 | 2003-10-20 | 日本碍子株式会社 | Aluminum nitride sintered body, metal buried product, electronic functional material and electrostatic chuck |
US5869974A (en) | 1996-04-01 | 1999-02-09 | Micron Technology, Inc. | Micromachined probe card having compliant contact members for testing semiconductor wafers |
US5631571A (en) | 1996-04-03 | 1997-05-20 | The United States Of America As Represented By The Secretary Of The Air Force | Infrared receiver wafer level probe testing |
US5700844A (en) | 1996-04-09 | 1997-12-23 | International Business Machines Corporation | Process for making a foamed polymer |
JP3022312B2 (en) | 1996-04-15 | 2000-03-21 | 日本電気株式会社 | Method of manufacturing probe card |
US5808874A (en) | 1996-05-02 | 1998-09-15 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
DE19618717C1 (en) | 1996-05-09 | 1998-01-15 | Multitest Elektronische Syst | Electrical connection device |
US5818084A (en) | 1996-05-15 | 1998-10-06 | Siliconix Incorporated | Pseudo-Schottky diode |
US6046599A (en) | 1996-05-20 | 2000-04-04 | Microconnect, Inc. | Method and device for making connection |
KR100471341B1 (en) | 1996-05-23 | 2005-07-21 | 제네시스 테크놀로지 가부시키가이샤 | Contact Probe and Probe Device with It |
US5748506A (en) | 1996-05-28 | 1998-05-05 | Motorola, Inc. | Calibration technique for a network analyzer |
US6268016B1 (en) | 1996-06-28 | 2001-07-31 | International Business Machines Corporation | Manufacturing computer systems with fine line circuitized substrates |
US5879289A (en) | 1996-07-15 | 1999-03-09 | Universal Technologies International, Inc. | Hand-held portable endoscopic camera |
US5756908A (en) | 1996-07-15 | 1998-05-26 | Framatome Technologies, Inc. | Probe positioner |
US6822443B1 (en) | 2000-09-11 | 2004-11-23 | Albany Instruments, Inc. | Sensors and probes for mapping electromagnetic fields |
US5793213A (en) | 1996-08-01 | 1998-08-11 | Motorola, Inc. | Method and apparatus for calibrating a network analyzer |
JP2962234B2 (en) | 1996-08-07 | 1999-10-12 | 日本電気株式会社 | Parasitic MIM structure location analysis method for semiconductor device and parasitic MIM structure location analysis method for Si semiconductor device |
US5847569A (en) | 1996-08-08 | 1998-12-08 | The Board Of Trustees Of The Leland Stanford Junior University | Electrical contact probe for sampling high frequency electrical signals |
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6050829A (en) | 1996-08-28 | 2000-04-18 | Formfactor, Inc. | Making discrete power connections to a space transformer of a probe card assembly |
US5869326A (en) | 1996-09-09 | 1999-02-09 | Genetronics, Inc. | Electroporation employing user-configured pulsing scheme |
US6307161B1 (en) | 1996-09-10 | 2001-10-23 | Formfactor, Inc. | Partially-overcoated elongate contact structures |
DE19636890C1 (en) | 1996-09-11 | 1998-02-12 | Bosch Gmbh Robert | Transition from a waveguide to a strip line |
EP0925509B1 (en) | 1996-09-13 | 2005-09-07 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
US6181149B1 (en) | 1996-09-26 | 2001-01-30 | Delaware Capital Formation, Inc. | Grid array package test contactor |
US5999268A (en) | 1996-10-18 | 1999-12-07 | Tokyo Electron Limited | Apparatus for aligning a semiconductor wafer with an inspection contactor |
US5666063A (en) | 1996-10-23 | 1997-09-09 | Motorola, Inc. | Method and apparatus for testing an integrated circuit |
US5945836A (en) | 1996-10-29 | 1999-08-31 | Hewlett-Packard Company | Loaded-board, guided-probe test fixture |
US5883522A (en) | 1996-11-07 | 1999-03-16 | National Semiconductor Corporation | Apparatus and method for retaining a semiconductor wafer during testing |
US5896038A (en) | 1996-11-08 | 1999-04-20 | W. L. Gore & Associates, Inc. | Method of wafer level burn-in |
US6104201A (en) | 1996-11-08 | 2000-08-15 | International Business Machines Corporation | Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage |
US5876331A (en) | 1996-11-12 | 1999-03-02 | Johnson & Johnson Medical, Inc. | Endoscope with improved flexible insertion tube |
US6184845B1 (en) | 1996-11-27 | 2001-02-06 | Symmetricom, Inc. | Dielectric-loaded antenna |
JPH10165522A (en) | 1996-12-09 | 1998-06-23 | Tokyo Iken Kk | Physical treatment optical fiber device and optical fiber arm device |
US6603322B1 (en) | 1996-12-12 | 2003-08-05 | Ggb Industries, Inc. | Probe card for high speed testing |
JP3364401B2 (en) | 1996-12-27 | 2003-01-08 | 東京エレクトロン株式会社 | Probe card clamp mechanism and probe device |
US6307672B1 (en) | 1996-12-31 | 2001-10-23 | The United States Of America As Represented By The Department Of Energy | Microscope collision protection apparatus |
US5852232A (en) | 1997-01-02 | 1998-12-22 | Kla-Tencor Corporation | Acoustic sensor as proximity detector |
US5848500A (en) | 1997-01-07 | 1998-12-15 | Eastman Kodak Company | Light-tight enclosure and joint connectors for enclosure framework |
US6826422B1 (en) | 1997-01-13 | 2004-11-30 | Medispectra, Inc. | Spectral volume microprobe arrays |
US6551844B1 (en) | 1997-01-15 | 2003-04-22 | Formfactor, Inc. | Test assembly including a test die for testing a semiconductor product die |
US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
US6429029B1 (en) | 1997-01-15 | 2002-08-06 | Formfactor, Inc. | Concurrent design and subsequent partitioning of product and test die |
US5982166A (en) | 1997-01-27 | 1999-11-09 | Motorola, Inc. | Method for measuring a characteristic of a semiconductor wafer using cylindrical control |
JPH10204102A (en) | 1997-01-27 | 1998-08-04 | Mitsubishi Gas Chem Co Inc | Production of water-soluble tricarboxy polysaccharide |
US5923180A (en) | 1997-02-04 | 1999-07-13 | Hewlett-Packard Company | Compliant wafer prober docking adapter |
US5888075A (en) | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
US6019612A (en) | 1997-02-10 | 2000-02-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus for electrically connecting a device to be tested |
US6798224B1 (en) | 1997-02-11 | 2004-09-28 | Micron Technology, Inc. | Method for testing semiconductor wafers |
US6060891A (en) | 1997-02-11 | 2000-05-09 | Micron Technology, Inc. | Probe card for semiconductor wafers and method and system for testing wafers |
US6520778B1 (en) | 1997-02-18 | 2003-02-18 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US5905421A (en) | 1997-02-18 | 1999-05-18 | Wiltron Company | Apparatus for measuring and/or injecting high frequency signals in integrated systems |
JP2934202B2 (en) | 1997-03-06 | 1999-08-16 | 山一電機株式会社 | Method for forming conductive bumps on wiring board |
US6064218A (en) | 1997-03-11 | 2000-05-16 | Primeyield Systems, Inc. | Peripherally leaded package test contactor |
US6127831A (en) | 1997-04-21 | 2000-10-03 | Motorola, Inc. | Method of testing a semiconductor device by automatically measuring probe tip parameters |
US6091236A (en) | 1997-04-28 | 2000-07-18 | Csi Technology, Inc. | System and method for measuring and analyzing electrical signals on the shaft of a machine |
US5883523A (en) | 1997-04-29 | 1999-03-16 | Credence Systems Corporation | Coherent switching power for an analog circuit tester |
CN1261259A (en) | 1997-05-23 | 2000-07-26 | 卡罗莱纳心脏研究所 | Electromagnetical imaging and therpeutic (Emit) systems |
US5926029A (en) | 1997-05-27 | 1999-07-20 | International Business Machines Corporation | Ultra fine probe contacts |
JPH10335395A (en) | 1997-05-28 | 1998-12-18 | Advantest Corp | Contact position detecting method for probe card |
US6229327B1 (en) | 1997-05-30 | 2001-05-08 | Gregory G. Boll | Broadband impedance matching probe |
US5981268A (en) | 1997-05-30 | 1999-11-09 | Board Of Trustees, Leland Stanford, Jr. University | Hybrid biosensors |
US5966645A (en) | 1997-06-03 | 1999-10-12 | Garmin Corporation | Transmitter with low-level modulation and minimal harmonic emissions |
US6034533A (en) | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
SE507577C2 (en) | 1997-06-11 | 1998-06-22 | Saab Marine Electronics | Horn Antenna |
US6215196B1 (en) | 1997-06-30 | 2001-04-10 | Formfactor, Inc. | Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals |
WO1999000844A2 (en) | 1997-06-30 | 1999-01-07 | Formfactor, Inc. | Sockets for semiconductor devices with spring contact elements |
US6002426A (en) | 1997-07-02 | 1999-12-14 | Cerprobe Corporation | Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits |
US6052653A (en) | 1997-07-11 | 2000-04-18 | Solid State Measurements, Inc. | Spreading resistance profiling system |
US5959461A (en) | 1997-07-14 | 1999-09-28 | Wentworth Laboratories, Inc. | Probe station adapter for backside emission inspection |
WO1999004273A1 (en) | 1997-07-15 | 1999-01-28 | Wentworth Laboratories, Inc. | Probe station with multiple adjustable probe supports |
US6828566B2 (en) | 1997-07-22 | 2004-12-07 | Hitachi Ltd | Method and apparatus for specimen fabrication |
US6215295B1 (en) | 1997-07-25 | 2001-04-10 | Smith, Iii Richard S. | Photonic field probe and calibration means thereof |
US6104206A (en) | 1997-08-05 | 2000-08-15 | Verkuil; Roger L. | Product wafer junction leakage measurement using corona and a kelvin probe |
US5998768A (en) | 1997-08-07 | 1999-12-07 | Massachusetts Institute Of Technology | Active thermal control of surfaces by steering heating beam in response to sensed thermal radiation |
US5970429A (en) | 1997-08-08 | 1999-10-19 | Lucent Technologies, Inc. | Method and apparatus for measuring electrical noise in devices |
US6292760B1 (en) | 1997-08-11 | 2001-09-18 | Texas Instruments Incorporated | Method and apparatus to measure non-coherent signals |
ATE326913T1 (en) | 1997-08-13 | 2006-06-15 | Solarant Medical Inc | NON-INVASIVE DEVICES AND SYSTEMS FOR SHRINKING TISSUES |
US6233613B1 (en) | 1997-08-18 | 2001-05-15 | 3Com Corporation | High impedance probe for monitoring fast ethernet LAN links |
US6573702B2 (en) | 1997-09-12 | 2003-06-03 | New Wave Research | Method and apparatus for cleaning electronic test contacts |
US5993611A (en) | 1997-09-24 | 1999-11-30 | Sarnoff Corporation | Capacitive denaturation of nucleic acid |
JP3616236B2 (en) | 1997-09-26 | 2005-02-02 | 株式会社ルネサステクノロジ | Probe card and wafer test method using the same |
US6059982A (en) | 1997-09-30 | 2000-05-09 | International Business Machines Corporation | Micro probe assembly and method of fabrication |
US6071009A (en) | 1997-10-03 | 2000-06-06 | Micron Technology, Inc. | Semiconductor wirebond machine leadframe thermal map system |
US6278051B1 (en) | 1997-10-09 | 2001-08-21 | Vatell Corporation | Differential thermopile heat flux transducer |
US6013586A (en) | 1997-10-09 | 2000-01-11 | Dimension Polyant Sailcloth, Inc. | Tent material product and method of making tent material product |
US5949383A (en) | 1997-10-20 | 1999-09-07 | Ericsson Inc. | Compact antenna structures including baluns |
JPH11125646A (en) | 1997-10-21 | 1999-05-11 | Mitsubishi Electric Corp | Vertical needle type probe card, and its manufacture and exchange method for defective probe of the same |
US6049216A (en) | 1997-10-27 | 2000-04-11 | Industrial Technology Research Institute | Contact type prober automatic alignment |
JP3112873B2 (en) | 1997-10-31 | 2000-11-27 | 日本電気株式会社 | High frequency probe |
JPH11142433A (en) | 1997-11-10 | 1999-05-28 | Mitsubishi Electric Corp | Probe for vertical needle type probe card and manufacture thereof |
DE19822123C2 (en) | 1997-11-21 | 2003-02-06 | Meinhard Knoll | Method and device for the detection of analytes |
JPH11163066A (en) | 1997-11-29 | 1999-06-18 | Tokyo Electron Ltd | Wafer tester |
US6096567A (en) | 1997-12-01 | 2000-08-01 | Electroglas, Inc. | Method and apparatus for direct probe sensing |
US6118287A (en) | 1997-12-09 | 2000-09-12 | Boll; Gregory George | Probe tip structure |
US6100815A (en) | 1997-12-24 | 2000-08-08 | Electro Scientific Industries, Inc. | Compound switching matrix for probing and interconnecting devices under test to measurement equipment |
US5944093A (en) | 1997-12-30 | 1999-08-31 | Intel Corporation | Pickup chuck with an integral heat pipe |
US6415858B1 (en) | 1997-12-31 | 2002-07-09 | Temptronic Corporation | Temperature control system for a workpiece chuck |
US6287776B1 (en) | 1998-02-02 | 2001-09-11 | Signature Bioscience, Inc. | Method for detecting and classifying nucleic acid hybridization |
US6287874B1 (en) | 1998-02-02 | 2001-09-11 | Signature Bioscience, Inc. | Methods for analyzing protein binding events |
US6338968B1 (en) | 1998-02-02 | 2002-01-15 | Signature Bioscience, Inc. | Method and apparatus for detecting molecular binding events |
US7083985B2 (en) | 1998-02-02 | 2006-08-01 | Hefti John J | Coplanar waveguide biosensor for detecting molecular or cellular events |
US6395480B1 (en) | 1999-02-01 | 2002-05-28 | Signature Bioscience, Inc. | Computer program and database structure for detecting molecular binding events |
JP3862845B2 (en) | 1998-02-05 | 2006-12-27 | セイコーインスツル株式会社 | Near-field optical probe |
US6807734B2 (en) | 1998-02-13 | 2004-10-26 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
US6181144B1 (en) | 1998-02-25 | 2001-01-30 | Micron Technology, Inc. | Semiconductor probe card having resistance measuring circuitry and method fabrication |
US6078183A (en) | 1998-03-03 | 2000-06-20 | Sandia Corporation | Thermally-induced voltage alteration for integrated circuit analysis |
US6054869A (en) | 1998-03-19 | 2000-04-25 | H+W Test Products, Inc. | Bi-level test fixture for testing printed circuit boards |
DE29805631U1 (en) | 1998-03-27 | 1998-06-25 | Ebinger Klaus | Magnetometer |
JPH11281675A (en) | 1998-03-31 | 1999-10-15 | Hewlett Packard Japan Ltd | Signal measuring probe |
JP3553791B2 (en) | 1998-04-03 | 2004-08-11 | 株式会社ルネサステクノロジ | CONNECTION DEVICE AND ITS MANUFACTURING METHOD, INSPECTION DEVICE, AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD |
US6147502A (en) | 1998-04-10 | 2000-11-14 | Bechtel Bwxt Idaho, Llc | Method and apparatus for measuring butterfat and protein content using microwave absorption techniques |
US6720501B1 (en) | 1998-04-14 | 2004-04-13 | Formfactor, Inc. | PC board having clustered blind vias |
US6181416B1 (en) | 1998-04-14 | 2001-01-30 | Optometrix, Inc. | Schlieren method for imaging semiconductor device properties |
US6060888A (en) | 1998-04-24 | 2000-05-09 | Hewlett-Packard Company | Error correction method for reflection measurements of reciprocal devices in vector network analyzers |
US6032714A (en) | 1998-05-01 | 2000-03-07 | Fenton; Jay Thomas | Repeatably positionable nozzle assembly |
US6091255A (en) | 1998-05-08 | 2000-07-18 | Advanced Micro Devices, Inc. | System and method for tasking processing modules based upon temperature |
US6121836A (en) | 1998-05-08 | 2000-09-19 | Lucent Technologies | Differential amplifier |
US6078500A (en) | 1998-05-12 | 2000-06-20 | International Business Machines Inc. | Pluggable chip scale package |
US6257564B1 (en) | 1998-05-15 | 2001-07-10 | Applied Materials, Inc | Vacuum chuck having vacuum-nipples wafer support |
TW440699B (en) | 1998-06-09 | 2001-06-16 | Advantest Corp | Test apparatus for electronic parts |
US6281691B1 (en) | 1998-06-09 | 2001-08-28 | Nec Corporation | Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable |
US6251595B1 (en) | 1998-06-18 | 2001-06-26 | Agilent Technologies, Inc. | Methods and devices for carrying out chemical reactions |
US6307363B1 (en) | 1998-06-22 | 2001-10-23 | Bruce Michael Anderson | Ultrahigh-frequency high-impedance passive voltage probe |
US6194720B1 (en) | 1998-06-24 | 2001-02-27 | Micron Technology, Inc. | Preparation of transmission electron microscope samples |
US6166553A (en) | 1998-06-29 | 2000-12-26 | Xandex, Inc. | Prober-tester electrical interface for semiconductor test |
US7304486B2 (en) | 1998-07-08 | 2007-12-04 | Capres A/S | Nano-drive for high resolution positioning and for positioning of a multi-point probe |
US6664628B2 (en) | 1998-07-13 | 2003-12-16 | Formfactor, Inc. | Electronic component overlapping dice of unsingulated semiconductor wafer |
US6130536A (en) | 1998-07-14 | 2000-10-10 | Crown Cork & Seal Technologies Corporation | Preform test fixture and method of measuring a wall thickness |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6259260B1 (en) | 1998-07-30 | 2001-07-10 | Intest Ip Corporation | Apparatus for coupling a test head and probe card in a wafer testing system |
ATE287543T1 (en) | 1998-08-21 | 2005-02-15 | Koninkl Philips Electronics Nv | TEST DEVICE FOR TESTING A MODULE FOR A DATA CARRIER INTENDED FOR CONTACTLESS COMMUNICATION |
US6744268B2 (en) | 1998-08-27 | 2004-06-01 | The Micromanipulator Company, Inc. | High resolution analytical probe station |
US6529844B1 (en) | 1998-09-02 | 2003-03-04 | Anritsu Company | Vector network measurement system |
US6040739A (en) | 1998-09-02 | 2000-03-21 | Trw Inc. | Waveguide to microstrip backshort with external spring compression |
US6937341B1 (en) | 1998-09-29 | 2005-08-30 | J. A. Woollam Co. Inc. | System and method enabling simultaneous investigation of sample with two beams of electromagnetic radiation |
US6816840B1 (en) | 1998-10-07 | 2004-11-09 | Ncr Corporation | System and method of sending messages to a group of electronic price labels |
US6175228B1 (en) | 1998-10-30 | 2001-01-16 | Agilent Technologies | Electronic probe for measuring high impedance tri-state logic circuits |
JP2000137120A (en) | 1998-11-02 | 2000-05-16 | Sony Corp | Tool for fixing optical fiber |
US6169410B1 (en) | 1998-11-09 | 2001-01-02 | Anritsu Company | Wafer probe with built in RF frequency conversion module |
US6236223B1 (en) | 1998-11-09 | 2001-05-22 | Intermec Ip Corp. | Method and apparatus for wireless radio frequency testing of RFID integrated circuits |
US6441315B1 (en) | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
US6201453B1 (en) | 1998-11-19 | 2001-03-13 | Trw Inc. | H-plane hermetic sealed waveguide probe |
US6332270B2 (en) | 1998-11-23 | 2001-12-25 | International Business Machines Corporation | Method of making high density integral test probe |
US6476913B1 (en) | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
US6420884B1 (en) | 1999-01-29 | 2002-07-16 | Advantest Corp. | Contact structure formed by photolithography process |
US6268015B1 (en) | 1998-12-02 | 2001-07-31 | Formfactor | Method of making and using lithographic contact springs |
US6255126B1 (en) | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
US6491968B1 (en) | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
US6672875B1 (en) | 1998-12-02 | 2004-01-06 | Formfactor, Inc. | Spring interconnect structures |
US6608494B1 (en) | 1998-12-04 | 2003-08-19 | Advanced Micro Devices, Inc. | Single point high resolution time resolved photoemission microscopy system and method |
US6627483B2 (en) | 1998-12-04 | 2003-09-30 | Formfactor, Inc. | Method for mounting an electronic component |
US6456099B1 (en) | 1998-12-31 | 2002-09-24 | Formfactor, Inc. | Special contact points for accessing internal circuitry of an integrated circuit |
US6232787B1 (en) | 1999-01-08 | 2001-05-15 | Schlumberger Technologies, Inc. | Microstructure defect detection |
US6388455B1 (en) | 1999-01-13 | 2002-05-14 | Qc Solutions, Inc. | Method and apparatus for simulating a surface photo-voltage in a substrate |
JP2000206146A (en) | 1999-01-19 | 2000-07-28 | Mitsubishi Electric Corp | Probe needle |
US6583638B2 (en) | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
US6300775B1 (en) | 1999-02-02 | 2001-10-09 | Com Dev Limited | Scattering parameter calibration system and method |
US6147851A (en) | 1999-02-05 | 2000-11-14 | Anderson; Karl F. | Method for guarding electrical regions having potential gradients |
GB9902765D0 (en) | 1999-02-08 | 1999-03-31 | Symmetricom Inc | An antenna |
US6206273B1 (en) | 1999-02-17 | 2001-03-27 | International Business Machines Corporation | Structures and processes to create a desired probetip contact geometry on a wafer test probe |
FR2790097B1 (en) | 1999-02-18 | 2001-04-27 | St Microelectronics Sa | METHOD FOR CALIBRATING AN INTEGRATED RF CIRCUIT PROBE |
US6335625B1 (en) | 1999-02-22 | 2002-01-01 | Paul Bryant | Programmable active microwave ultrafine resonance spectrometer (PAMURS) method and systems |
US6218910B1 (en) | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
US6208225B1 (en) | 1999-02-25 | 2001-03-27 | Formfactor, Inc. | Filter structures for integrated circuit interfaces |
US6459343B1 (en) | 1999-02-25 | 2002-10-01 | Formfactor, Inc. | Integrated circuit interconnect system forming a multi-pole filter |
US6539531B2 (en) | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes |
US6448865B1 (en) | 1999-02-25 | 2002-09-10 | Formfactor, Inc. | Integrated circuit interconnect system |
US6538538B2 (en) | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | High frequency printed circuit board via |
US6452411B1 (en) | 1999-03-01 | 2002-09-17 | Formfactor, Inc. | Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses |
US6499121B1 (en) | 1999-03-01 | 2002-12-24 | Formfactor, Inc. | Distributed interface for parallel testing of multiple devices using a single tester channel |
US6480978B1 (en) | 1999-03-01 | 2002-11-12 | Formfactor, Inc. | Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons |
US20010043073A1 (en) | 1999-03-09 | 2001-11-22 | Thomas T. Montoya | Prober interface plate |
US6710798B1 (en) | 1999-03-09 | 2004-03-23 | Applied Precision Llc | Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card |
US6211837B1 (en) | 1999-03-10 | 2001-04-03 | Raytheon Company | Dual-window high-power conical horn antenna |
FR2790842B1 (en) | 1999-03-12 | 2001-04-20 | St Microelectronics Sa | METHOD FOR MANUFACTURING A TEST CIRCUIT ON A SILICON WAFER |
US6225816B1 (en) | 1999-04-08 | 2001-05-01 | Agilent Technologies, Inc. | Split resistor probe and method |
WO2000061023A1 (en) | 1999-04-08 | 2000-10-19 | Synergetics, Inc. | Directional laser probe |
US6400166B2 (en) | 1999-04-15 | 2002-06-04 | International Business Machines Corporation | Micro probe and method of fabricating same |
US6114865A (en) | 1999-04-21 | 2000-09-05 | Semiconductor Diagnostics, Inc. | Device for electrically contacting a floating semiconductor wafer having an insulating film |
US6456152B1 (en) | 1999-05-17 | 2002-09-24 | Hitachi, Ltd. | Charge pump with improved reliability |
JP2000329664A (en) | 1999-05-18 | 2000-11-30 | Nkk Corp | Observation method of transmission electron microscope and holding jig |
US6448788B1 (en) | 1999-05-26 | 2002-09-10 | Microwave Imaging System Technologies, Inc. | Fixed array microwave imaging apparatus and method |
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US6917525B2 (en) | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
US6409724B1 (en) | 1999-05-28 | 2002-06-25 | Gyrus Medical Limited | Electrosurgical instrument |
US6211663B1 (en) | 1999-05-28 | 2001-04-03 | The Aerospace Corporation | Baseband time-domain waveform measurement method |
US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
US7215131B1 (en) | 1999-06-07 | 2007-05-08 | Formfactor, Inc. | Segmented contactor |
US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
US6320372B1 (en) | 1999-07-09 | 2001-11-20 | Electroglas, Inc. | Apparatus and method for testing a substrate having a plurality of terminals |
JP4104099B2 (en) | 1999-07-09 | 2008-06-18 | 東京エレクトロン株式会社 | Probe card transport mechanism |
US6580283B1 (en) | 1999-07-14 | 2003-06-17 | Aehr Test Systems | Wafer level burn-in and test methods |
US6340895B1 (en) | 1999-07-14 | 2002-01-22 | Aehr Test Systems, Inc. | Wafer-level burn-in and test cartridge |
US7013221B1 (en) | 1999-07-16 | 2006-03-14 | Rosetta Inpharmatics Llc | Iterative probe design and detailed expression profiling with flexible in-situ synthesis arrays |
US6407562B1 (en) | 1999-07-29 | 2002-06-18 | Agilent Technologies, Inc. | Probe tip terminating device providing an easily changeable feed-through termination |
US6780001B2 (en) | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
US6713374B2 (en) | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
US6888362B2 (en) | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
JP2001053517A (en) | 1999-08-06 | 2001-02-23 | Sony Corp | Antenna system and portable radio device |
EP1075042A2 (en) | 1999-08-06 | 2001-02-07 | Sony Corporation | Antenna apparatus and portable radio set |
US6468098B1 (en) | 1999-08-17 | 2002-10-22 | Formfactor, Inc. | Electrical contactor especially wafer level contactor using fluid pressure |
US6275738B1 (en) | 1999-08-19 | 2001-08-14 | Kai Technologies, Inc. | Microwave devices for medical hyperthermia, thermotherapy and diagnosis |
US6809533B1 (en) | 1999-09-10 | 2004-10-26 | University Of Maryland, College Park | Quantitative imaging of dielectric permittivity and tunability |
CN1083975C (en) | 1999-09-10 | 2002-05-01 | 北京航空工艺研究所 | Method and apparatus for arc-light sensing the working of plasma arc welding small hole |
US6545492B1 (en) | 1999-09-20 | 2003-04-08 | Europaisches Laboratorium Fur Molekularbiologie (Embl) | Multiple local probe measuring device and method |
US6483327B1 (en) | 1999-09-30 | 2002-11-19 | Advanced Micro Devices, Inc. | Quadrant avalanche photodiode time-resolved detection |
US7009415B2 (en) | 1999-10-06 | 2006-03-07 | Tokyo Electron Limited | Probing method and probing apparatus |
US6352454B1 (en) | 1999-10-20 | 2002-03-05 | Xerox Corporation | Wear-resistant spring contacts |
JP2001124676A (en) | 1999-10-25 | 2001-05-11 | Hitachi Ltd | Sample support member for electron microscopic observation |
US6245692B1 (en) | 1999-11-23 | 2001-06-12 | Agere Systems Guardian Corp. | Method to selectively heat semiconductor wafers |
US6528993B1 (en) | 1999-11-29 | 2003-03-04 | Korea Advanced Institute Of Science & Technology | Magneto-optical microscope magnetometer |
US6724928B1 (en) | 1999-12-02 | 2004-04-20 | Advanced Micro Devices, Inc. | Real-time photoemission detection system |
US6771806B1 (en) | 1999-12-14 | 2004-08-03 | Kla-Tencor | Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices |
US6633174B1 (en) | 1999-12-14 | 2003-10-14 | Kla-Tencor | Stepper type test structures and methods for inspection of semiconductor integrated circuits |
JP2001174482A (en) | 1999-12-21 | 2001-06-29 | Toshiba Corp | Contact needle for evaluating electric characteristic, probe structure, probe card and manufacturing method of contact needle for evaluating electric characteristic |
US6827584B2 (en) | 1999-12-28 | 2004-12-07 | Formfactor, Inc. | Interconnect for microelectronic structures with enhanced spring characteristics |
US6459739B1 (en) | 1999-12-30 | 2002-10-01 | Tioga Technologies Inc. | Method and apparatus for RF common-mode noise rejection in a DSL receiver |
DE10000324A1 (en) | 2000-01-07 | 2001-07-19 | Roesler Hans Joachim | Analysis apparatus for use in clinical-chemical analysis and laboratory diagnosis methods comprises equipment for simultaneous FIR- and microwave spectroscopy of vaporized liquid sample |
US6339338B1 (en) | 2000-01-18 | 2002-01-15 | Formfactor, Inc. | Apparatus for reducing power supply noise in an integrated circuit |
US6657455B2 (en) | 2000-01-18 | 2003-12-02 | Formfactor, Inc. | Predictive, adaptive power supply for an integrated circuit under test |
ATE262729T1 (en) | 2000-02-02 | 2004-04-15 | Raytheon Co | CONTACT STRUCTURE FOR MICRORELAYS AND RF APPLICATIONS |
US6384614B1 (en) | 2000-02-05 | 2002-05-07 | Fluke Corporation | Single tip Kelvin probe |
US6891263B2 (en) | 2000-02-07 | 2005-05-10 | Ibiden Co., Ltd. | Ceramic substrate for a semiconductor production/inspection device |
EP1261022B1 (en) | 2000-02-25 | 2009-11-04 | Hitachi, Ltd. | Apparatus for detecting defect in device and method of detecting defect |
US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
NZ521229A (en) | 2000-02-25 | 2004-02-27 | Personal Chemistry I Uppsala | Microwave heating apparatus |
JP3389914B2 (en) | 2000-03-03 | 2003-03-24 | 日本電気株式会社 | Sampling method and device for power supply current value of integrated circuit, and storage medium storing control program therefor |
US6927586B2 (en) | 2000-03-06 | 2005-08-09 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6888236B2 (en) | 2000-03-07 | 2005-05-03 | Ibiden Co., Ltd. | Ceramic substrate for manufacture/inspection of semiconductor |
US6488405B1 (en) | 2000-03-08 | 2002-12-03 | Advanced Micro Devices, Inc. | Flip chip defect analysis using liquid crystal |
US6509751B1 (en) | 2000-03-17 | 2003-01-21 | Formfactor, Inc. | Planarizer for a semiconductor contactor |
US6407542B1 (en) | 2000-03-23 | 2002-06-18 | Avaya Technology Corp. | Implementation of a multi-port modal decomposition system |
JP2001266317A (en) | 2000-03-23 | 2001-09-28 | Toshiba Corp | Magnetic recording head measuring device and measuring method applied for this device |
EP1269206A2 (en) | 2000-03-24 | 2003-01-02 | Surgi-Vision | Apparatus, systems and methods for in vivo magnetic resonance imaging |
US6640432B1 (en) | 2000-04-12 | 2003-11-04 | Formfactor, Inc. | Method of fabricating shaped springs |
US6677744B1 (en) | 2000-04-13 | 2004-01-13 | Formfactor, Inc. | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
US6476630B1 (en) | 2000-04-13 | 2002-11-05 | Formfactor, Inc. | Method for testing signal paths between an integrated circuit wafer and a wafer tester |
US20020050828A1 (en) | 2000-04-14 | 2002-05-02 | General Dielectric, Inc. | Multi-feed microwave reflective resonant sensors |
US6396298B1 (en) | 2000-04-14 | 2002-05-28 | The Aerospace Corporation | Active feedback pulsed measurement method |
US20020070745A1 (en) | 2000-04-27 | 2002-06-13 | Johnson James E. | Cooling system for burn-in unit |
JP4684461B2 (en) | 2000-04-28 | 2011-05-18 | パナソニック株式会社 | Method for manufacturing magnetic element |
US6711283B1 (en) | 2000-05-03 | 2004-03-23 | Aperio Technologies, Inc. | Fully automatic rapid microscope slide scanner |
US6396296B1 (en) | 2000-05-15 | 2002-05-28 | Advanced Micro Devices, Inc. | Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station |
US20010044152A1 (en) | 2000-05-18 | 2001-11-22 | Gale Burnett | Dual beam, pulse propagation analyzer, medical profiler interferometer |
WO2002095378A1 (en) | 2000-05-22 | 2002-11-28 | Moore Thomas M | Method for sample separation and lift-out |
US20050068054A1 (en) | 2000-05-23 | 2005-03-31 | Sammy Mok | Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies |
WO2001091166A1 (en) | 2000-05-26 | 2001-11-29 | Ibiden Co., Ltd. | Semiconductor manufacturing and inspecting device |
US6549022B1 (en) | 2000-06-02 | 2003-04-15 | Sandia Corporation | Apparatus and method for analyzing functional failures in integrated circuits |
US6379130B1 (en) | 2000-06-09 | 2002-04-30 | Tecumseh Products Company | Motor cover retention |
US6622103B1 (en) | 2000-06-20 | 2003-09-16 | Formfactor, Inc. | System for calibrating timing of an integrated circuit wafer tester |
US6768110B2 (en) | 2000-06-21 | 2004-07-27 | Gatan, Inc. | Ion beam milling system and method for electron microscopy specimen preparation |
JP2002005960A (en) | 2000-06-21 | 2002-01-09 | Ando Electric Co Ltd | Probe card and its manufacturing method |
JP2002022775A (en) | 2000-07-05 | 2002-01-23 | Ando Electric Co Ltd | Electro-optical probe and magneto-optical probe |
US6603323B1 (en) | 2000-07-10 | 2003-08-05 | Formfactor, Inc. | Closed-grid bus architecture for wafer interconnect structure |
US6731128B2 (en) | 2000-07-13 | 2004-05-04 | International Business Machines Corporation | TFI probe I/O wrap test method |
US6424141B1 (en) | 2000-07-13 | 2002-07-23 | The Micromanipulator Company, Inc. | Wafer probe station |
US6906539B2 (en) | 2000-07-19 | 2005-06-14 | Texas Instruments Incorporated | High density, area array probe card apparatus |
JP2002039091A (en) | 2000-07-21 | 2002-02-06 | Minebea Co Ltd | Blower |
JP4408538B2 (en) | 2000-07-24 | 2010-02-03 | 株式会社日立製作所 | Probe device |
DE10036127B4 (en) | 2000-07-25 | 2007-03-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for supply voltage decoupling for RF amplifier circuits |
IT1318734B1 (en) | 2000-08-04 | 2003-09-10 | Technoprobe S R L | VERTICAL PROBE MEASUREMENT HEAD. |
DE10039928B4 (en) | 2000-08-16 | 2004-07-15 | Infineon Technologies Ag | Device for automated testing, calibration and characterization of test adapters |
DE10040988A1 (en) | 2000-08-22 | 2002-03-21 | Evotec Biosystems Ag | Measurement of chemical and/or biological samples, useful for screening interactions between two bio-molecules, comprises excitement of a marker with electromagnetic radiation of one wavelength or polarization from a pulsed transmitter |
US6970005B2 (en) | 2000-08-24 | 2005-11-29 | Texas Instruments Incorporated | Multiple-chip probe and universal tester contact assemblage |
EP1316059A2 (en) | 2000-08-31 | 2003-06-04 | Siemens Aktiengesellschaft | Fingerprint mouse with line sensor |
GB0021975D0 (en) | 2000-09-07 | 2000-10-25 | Optomed As | Filter optic probes |
US6920407B2 (en) | 2000-09-18 | 2005-07-19 | Agilent Technologies, Inc. | Method and apparatus for calibrating a multiport test system for measurement of a DUT |
US6731804B1 (en) | 2000-09-28 | 2004-05-04 | The United States Of America As Represented By The Secretary Of The Army | Thermal luminescence liquid monitoring system and method |
US6418009B1 (en) | 2000-09-28 | 2002-07-09 | Nortel Networks Limited | Broadband multi-layer capacitor |
US20030072549A1 (en) | 2000-10-26 | 2003-04-17 | The Trustees Of Princeton University | Method and apparatus for dielectric spectroscopy of biological solutions |
DE10151288B4 (en) | 2000-11-02 | 2004-10-07 | Eads Deutschland Gmbh | Structure antenna for aircraft or aircraft |
US6753699B2 (en) | 2000-11-13 | 2004-06-22 | Standard Microsystems Corporation | Integrated circuit and method of controlling output impedance |
US6586946B2 (en) | 2000-11-13 | 2003-07-01 | Signature Bioscience, Inc. | System and method for detecting and identifying molecular events in a test sample using a resonant test structure |
US6582979B2 (en) | 2000-11-15 | 2003-06-24 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless chip carrier with embedded antenna |
WO2002045283A2 (en) | 2000-11-29 | 2002-06-06 | Broadcom Corporation | Integrated direct conversion satellite tuner |
DE10143173A1 (en) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafer probe has contact finger array with impedance matching network suitable for wide band |
US6927079B1 (en) | 2000-12-06 | 2005-08-09 | Lsi Logic Corporation | Method for probing a semiconductor wafer |
US6605951B1 (en) | 2000-12-11 | 2003-08-12 | Lsi Logic Corporation | Interconnector and method of connecting probes to a die for functional analysis |
US6794950B2 (en) | 2000-12-21 | 2004-09-21 | Paratek Microwave, Inc. | Waveguide to microstrip transition |
DE20021685U1 (en) | 2000-12-21 | 2001-03-15 | Rosenberger Hochfrequenztech | High frequency probe tip |
WO2002052285A1 (en) | 2000-12-22 | 2002-07-04 | Tokyo Electron Limited | Probe cartridge assembly and multi-probe assembly |
US6541993B2 (en) | 2000-12-26 | 2003-04-01 | Ericsson, Inc. | Transistor device testing employing virtual device fixturing |
JP3543765B2 (en) | 2000-12-28 | 2004-07-21 | Jsr株式会社 | Probe device for wafer inspection |
US6944380B1 (en) | 2001-01-16 | 2005-09-13 | Japan Science And Technology Agency | Optical fiber for transmitting ultraviolet ray, optical fiber probe, and method of manufacturing the optical fiber probe |
GB2371618B (en) | 2001-01-30 | 2004-11-17 | Teraprobe Ltd | A probe, apparatus and method for examining a sample |
US6707548B2 (en) | 2001-02-08 | 2004-03-16 | Array Bioscience Corporation | Systems and methods for filter based spectrographic analysis |
US7102366B2 (en) | 2001-02-09 | 2006-09-05 | Georgia-Pacific Corporation | Proximity detection circuit and method of detecting capacitance changes |
JP2002243502A (en) | 2001-02-09 | 2002-08-28 | Olympus Optical Co Ltd | Encoder device |
AU2002238100A1 (en) | 2001-02-12 | 2002-08-28 | Signature Bioscience, Inc. | A system and method for characterizing the permittivity of molecular events |
US7006046B2 (en) | 2001-02-15 | 2006-02-28 | Integral Technologies, Inc. | Low cost electronic probe devices manufactured from conductive loaded resin-based materials |
US6946864B2 (en) | 2001-02-19 | 2005-09-20 | Osram Gmbh | Method for measuring product parameters of components formed on a wafer and device for performing the method |
US6628503B2 (en) | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
GB0106245D0 (en) | 2001-03-14 | 2001-05-02 | Renishaw Plc | Calibration of an analogue probe |
JP4721247B2 (en) | 2001-03-16 | 2011-07-13 | 東京エレクトロン株式会社 | PROBE METHOD AND PROBE DEVICE |
US6512482B1 (en) | 2001-03-20 | 2003-01-28 | Xilinx, Inc. | Method and apparatus using a semiconductor die integrated antenna structure |
US6611417B2 (en) | 2001-03-22 | 2003-08-26 | Winbond Electronics Corporation | Wafer chuck system |
US6910268B2 (en) | 2001-03-27 | 2005-06-28 | Formfactor, Inc. | Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via |
JP2002296508A (en) | 2001-03-30 | 2002-10-09 | Nikon Corp | Microscopic system |
US6856150B2 (en) | 2001-04-10 | 2005-02-15 | Formfactor, Inc. | Probe card with coplanar daughter card |
US6627980B2 (en) | 2001-04-12 | 2003-09-30 | Formfactor, Inc. | Stacked semiconductor device assembly with microelectronic spring contacts |
US6811406B2 (en) | 2001-04-12 | 2004-11-02 | Formfactor, Inc. | Microelectronic spring with additional protruding member |
JP2002311052A (en) | 2001-04-13 | 2002-10-23 | Agilent Technologies Japan Ltd | Blade-like connecting needle |
US6627461B2 (en) | 2001-04-18 | 2003-09-30 | Signature Bioscience, Inc. | Method and apparatus for detection of molecular events using temperature control of detection environment |
DE20106745U1 (en) | 2001-04-19 | 2002-08-29 | Bosch Gmbh Robert | Small coupling connector, especially for a planar broadband lamda probe with loss protection for single wire seals |
US6549396B2 (en) | 2001-04-19 | 2003-04-15 | Gennum Corporation | Multiple terminal capacitor structure |
US6943563B2 (en) | 2001-05-02 | 2005-09-13 | Anritsu Company | Probe tone S-parameter measurements |
DE20220754U1 (en) | 2001-05-04 | 2004-04-01 | Cascade Microtech, Inc., Beaverton | Fiber optic wafer probe for measuring the parameters of photodetectors and other optoelectronic devices in situ on a wafer, whereby the probe has a probe body with a tip from which an optical fiber extends towards a test object |
US6882239B2 (en) | 2001-05-08 | 2005-04-19 | Formfactor, Inc. | Electromagnetically coupled interconnect system |
JP2002343879A (en) | 2001-05-15 | 2002-11-29 | Nec Corp | Semiconductor device and method of manufacturing the same |
JP3979793B2 (en) | 2001-05-29 | 2007-09-19 | 日立ソフトウエアエンジニアリング株式会社 | Probe design apparatus and probe design method |
RU2298197C2 (en) | 2001-05-31 | 2007-04-27 | Интелскан Орбилгютэкни Ехф. | Device and method of measuring of at least one physical parameter of material by means of microwaves |
WO2002101816A1 (en) | 2001-06-06 | 2002-12-19 | Ibiden Co., Ltd. | Wafer prober |
US6906506B1 (en) | 2001-06-08 | 2005-06-14 | The Regents Of The University Of Michigan | Method and apparatus for simultaneous measurement of electric field and temperature using an electrooptic semiconductor probe |
US6911826B2 (en) | 2001-06-12 | 2005-06-28 | General Electric Company | Pulsed eddy current sensor probes and inspection methods |
JP4610798B2 (en) | 2001-06-19 | 2011-01-12 | エスアイアイ・ナノテクノロジー株式会社 | Scanning electron microscope with laser defect detection function and its autofocus method |
US6649402B2 (en) | 2001-06-22 | 2003-11-18 | Wisconsin Alumni Research Foundation | Microfabricated microbial growth assay method and apparatus |
WO2003003907A2 (en) | 2001-07-06 | 2003-01-16 | Wisconsin Alumni Research Foundation | Space-time microwave imaging for cancer detection |
US6729019B2 (en) | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
CA2353024C (en) | 2001-07-12 | 2005-12-06 | Ibm Canada Limited-Ibm Canada Limitee | Anti-vibration and anti-tilt microscope stand |
GB0117715D0 (en) | 2001-07-19 | 2001-09-12 | Mrbp Res Ltd | Microwave biochemical analysis |
US6908364B2 (en) | 2001-08-02 | 2005-06-21 | Kulicke & Soffa Industries, Inc. | Method and apparatus for probe tip cleaning and shaping pad |
US6617866B1 (en) | 2001-08-02 | 2003-09-09 | Lsi Logic Corporation | Apparatus and method of protecting a probe card during a sort sequence |
US20030076585A1 (en) | 2001-08-07 | 2003-04-24 | Ledley Robert S. | Optical system for enhancing the image from a microscope's high power objective lens |
IL144806A (en) | 2001-08-08 | 2005-11-20 | Nova Measuring Instr Ltd | Method and apparatus for process control in semiconductor manufacturing |
JP4064921B2 (en) | 2001-08-10 | 2008-03-19 | 株式会社アドバンテスト | Probe module and test apparatus |
US20030032000A1 (en) | 2001-08-13 | 2003-02-13 | Signature Bioscience Inc. | Method for analyzing cellular events |
US20040147034A1 (en) | 2001-08-14 | 2004-07-29 | Gore Jay Prabhakar | Method and apparatus for measuring a substance in a biological sample |
WO2003052435A1 (en) | 2001-08-21 | 2003-06-26 | Cascade Microtech, Inc. | Membrane probing system |
US6862727B2 (en) | 2001-08-24 | 2005-03-01 | Formfactor, Inc. | Process and apparatus for adjusting traces |
US6643597B1 (en) | 2001-08-24 | 2003-11-04 | Agilent Technologies, Inc. | Calibrating a test system using unknown standards |
US6678876B2 (en) | 2001-08-24 | 2004-01-13 | Formfactor, Inc. | Process and apparatus for finding paths through a routing space |
US6481939B1 (en) | 2001-08-24 | 2002-11-19 | Robb S. Gillespie | Tool tip conductivity contact sensor and method |
US6639461B1 (en) | 2001-08-30 | 2003-10-28 | Sierra Monolithics, Inc. | Ultra-wideband power amplifier module apparatus and method for optical and electronic communications |
US6549106B2 (en) | 2001-09-06 | 2003-04-15 | Cascade Microtech, Inc. | Waveguide with adjustable backshort |
WO2003023358A2 (en) | 2001-09-10 | 2003-03-20 | University Of North Carolina At Charlotte | Methods and apparatus for testing electronic circuits |
US6764869B2 (en) | 2001-09-12 | 2004-07-20 | Formfactor, Inc. | Method of assembling and testing an electronics module |
US6714828B2 (en) | 2001-09-17 | 2004-03-30 | Formfactor, Inc. | Method and system for designing a probe card |
EP1430485B1 (en) | 2001-09-24 | 2009-01-14 | JPK Instruments AG | Device and method for scanning probe microscope |
US6636063B2 (en) | 2001-10-02 | 2003-10-21 | Texas Instruments Incorporated | Probe card with contact apparatus and method of manufacture |
US6882546B2 (en) | 2001-10-03 | 2005-04-19 | Formfactor, Inc. | Multiple die interconnect system |
US20030139662A1 (en) | 2001-10-16 | 2003-07-24 | Seidman Abraham Neil | Method and apparatus for detecting, identifying and performing operations on microstructures including, anthrax spores, brain cells, cancer cells, living tissue cells, and macro-objects including stereotactic neurosurgery instruments, weapons and explosives |
KR100442822B1 (en) | 2001-10-23 | 2004-08-02 | 삼성전자주식회사 | Methods for detecting binding of biomolecules using shear stress measurements |
US6759311B2 (en) | 2001-10-31 | 2004-07-06 | Formfactor, Inc. | Fan out of interconnect elements attached to semiconductor wafer |
US7071714B2 (en) | 2001-11-02 | 2006-07-04 | Formfactor, Inc. | Method and system for compensating for thermally induced motion of probe cards |
US6817052B2 (en) | 2001-11-09 | 2004-11-16 | Formfactor, Inc. | Apparatuses and methods for cleaning test probes |
US7020360B2 (en) | 2001-11-13 | 2006-03-28 | Advantest Corporation | Wavelength dispersion probing system |
WO2003047684A2 (en) | 2001-12-04 | 2003-06-12 | University Of Southern California | Method for intracellular modifications within living cells using pulsed electric fields |
US6816031B1 (en) | 2001-12-04 | 2004-11-09 | Formfactor, Inc. | Adjustable delay transmission line |
US6447339B1 (en) | 2001-12-12 | 2002-09-10 | Tektronix, Inc. | Adapter for a multi-channel signal probe |
JP4123408B2 (en) | 2001-12-13 | 2008-07-23 | 東京エレクトロン株式会社 | Probe card changer |
US6794934B2 (en) | 2001-12-14 | 2004-09-21 | Iterra Communications, Llc | High gain wideband driver amplifier |
US6870359B1 (en) | 2001-12-14 | 2005-03-22 | Le Croy Corporation | Self-calibrating electrical test probe |
US6770955B1 (en) | 2001-12-15 | 2004-08-03 | Skyworks Solutions, Inc. | Shielded antenna in a semiconductor package |
US6759859B2 (en) | 2001-12-19 | 2004-07-06 | Chung-Shan Institute Of Science And Technology | Resilient and rugged multi-layered probe |
US6777319B2 (en) | 2001-12-19 | 2004-08-17 | Formfactor, Inc. | Microelectronic spring contact repair |
US20030119057A1 (en) | 2001-12-20 | 2003-06-26 | Board Of Regents | Forming and modifying dielectrically-engineered microparticles |
US6822463B1 (en) | 2001-12-21 | 2004-11-23 | Lecroy Corporation | Active differential test probe with a transmission line input structure |
US6657601B2 (en) | 2001-12-21 | 2003-12-02 | Tdk Rf Solutions | Metrology antenna system utilizing two-port, sleeve dipole and non-radiating balancing network |
US6479308B1 (en) | 2001-12-27 | 2002-11-12 | Formfactor, Inc. | Semiconductor fuse covering |
US6891385B2 (en) | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US7020363B2 (en) | 2001-12-28 | 2006-03-28 | Intel Corporation | Optical probe for wafer testing |
US6741092B2 (en) | 2001-12-28 | 2004-05-25 | Formfactor, Inc. | Method and system for detecting an arc condition |
US7186990B2 (en) | 2002-01-22 | 2007-03-06 | Microbiosystems, Limited Partnership | Method and apparatus for detecting and imaging the presence of biological materials |
US6911834B2 (en) | 2002-01-25 | 2005-06-28 | Texas Instruments Incorporated | Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing |
JP2003222654A (en) | 2002-01-30 | 2003-08-08 | Tokyo Electron Ltd | Probe device |
US6907149B2 (en) | 2002-02-01 | 2005-06-14 | Kaiser Optical Systems, Inc. | Compact optical measurement probe |
US6771086B2 (en) | 2002-02-19 | 2004-08-03 | Lucas/Signatone Corporation | Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control |
KR100608521B1 (en) | 2002-02-22 | 2006-08-03 | 마츠시타 덴끼 산교 가부시키가이샤 | Helical antenna apparatus provided with two helical antenna elements, and radio communication apparatus provided with same helical antenna apparatus |
US6617862B1 (en) | 2002-02-27 | 2003-09-09 | Advanced Micro Devices, Inc. | Laser intrusive technique for locating specific integrated circuit current paths |
US6701265B2 (en) | 2002-03-05 | 2004-03-02 | Tektronix, Inc. | Calibration for vector network analyzer |
US7015707B2 (en) | 2002-03-20 | 2006-03-21 | Gabe Cherian | Micro probe |
US6828767B2 (en) | 2002-03-20 | 2004-12-07 | Santronics, Inc. | Hand-held voltage detection probe |
DE10213692B4 (en) | 2002-03-27 | 2013-05-23 | Weinmann Diagnostics Gmbh & Co. Kg | Method for controlling a device and device for measuring ingredients in the blood |
US6806697B2 (en) | 2002-04-05 | 2004-10-19 | Agilent Technologies, Inc. | Apparatus and method for canceling DC errors and noise generated by ground shield current in a probe |
US6737920B2 (en) | 2002-05-03 | 2004-05-18 | Atheros Communications, Inc. | Variable gain amplifier |
DE10220343B4 (en) | 2002-05-07 | 2007-04-05 | Atg Test Systems Gmbh & Co. Kg Reicholzheim | Apparatus and method for testing printed circuit boards and probes |
US6798225B2 (en) | 2002-05-08 | 2004-09-28 | Formfactor, Inc. | Tester channel to multiple IC terminals |
US6784674B2 (en) | 2002-05-08 | 2004-08-31 | Formfactor, Inc. | Test signal distribution system for IC tester |
US6911835B2 (en) | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
US6909300B2 (en) | 2002-05-09 | 2005-06-21 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips |
US7259043B2 (en) | 2002-05-14 | 2007-08-21 | Texas Instruments Incorporated | Circular test pads on scribe street area |
JP2005526250A (en) | 2002-05-16 | 2005-09-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Method for calibration and de-embedding, device set for de-embedding, and vector network analyzer |
CN1662794A (en) | 2002-05-16 | 2005-08-31 | Vega格里沙贝两合公司 | Planar antenna and antenna system |
US6587327B1 (en) | 2002-05-17 | 2003-07-01 | Daniel Devoe | Integrated broadband ceramic capacitor array |
KR100435765B1 (en) | 2002-05-21 | 2004-06-10 | 현대자동차주식회사 | piercing pad structure for press device |
AU2003233659A1 (en) | 2002-05-23 | 2003-12-12 | Cascade Microtech, Inc. | Probe for testing a device under test |
US20030234659A1 (en) | 2002-06-20 | 2003-12-25 | Promos Technologies | Electrical isolation between pins sharing the same tester channel |
US7343185B2 (en) | 2002-06-21 | 2008-03-11 | Nir Diagnostics Inc. | Measurement of body compounds |
KR100470970B1 (en) | 2002-07-05 | 2005-03-10 | 삼성전자주식회사 | Probe needle fixing apparatus and method for semiconductor device test equipment |
US6856129B2 (en) | 2002-07-09 | 2005-02-15 | Intel Corporation | Current probe device having an integrated amplifier |
US6812691B2 (en) | 2002-07-12 | 2004-11-02 | Formfactor, Inc. | Compensation for test signal degradation due to DUT fault |
JP4335497B2 (en) | 2002-07-12 | 2009-09-30 | エスアイアイ・ナノテクノロジー株式会社 | Ion beam apparatus and ion beam processing method |
US6937045B2 (en) | 2002-07-18 | 2005-08-30 | Aries Electronics, Inc. | Shielded integrated circuit probe |
US6913476B2 (en) | 2002-08-06 | 2005-07-05 | Micron Technology, Inc. | Temporary, conformable contacts for microelectronic components |
US6788093B2 (en) | 2002-08-07 | 2004-09-07 | International Business Machines Corporation | Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies |
JP4357813B2 (en) | 2002-08-23 | 2009-11-04 | 東京エレクトロン株式会社 | Probe apparatus and probe method |
US6924653B2 (en) | 2002-08-26 | 2005-08-02 | Micron Technology, Inc. | Selectively configurable microelectronic probes |
JP3574444B2 (en) | 2002-08-27 | 2004-10-06 | 沖電気工業株式会社 | Method of measuring contact resistance of probe and method of testing semiconductor device |
CN1685240A (en) | 2002-08-27 | 2005-10-19 | Jsr株式会社 | Anisotropic conductive sheet and probe for measuring impedances |
US6902416B2 (en) | 2002-08-29 | 2005-06-07 | 3M Innovative Properties Company | High density probe device |
CN1669182A (en) | 2002-09-10 | 2005-09-14 | 弗拉克托斯股份有限公司 | Coupled multi-band antenna |
JP2004132971A (en) | 2002-09-17 | 2004-04-30 | Iwasaki Correspond Industry Co Ltd | Probe card |
US6784679B2 (en) | 2002-09-30 | 2004-08-31 | Teradyne, Inc. | Differential coaxial contact array for high-density, high-speed signals |
US6881072B2 (en) | 2002-10-01 | 2005-04-19 | International Business Machines Corporation | Membrane probe with anchored elements |
US7038441B2 (en) | 2002-10-02 | 2006-05-02 | Suss Microtec Testsystems Gmbh | Test apparatus with loading device |
US6768328B2 (en) | 2002-10-09 | 2004-07-27 | Agilent Technologies, Inc. | Single point probe structure and method |
US6927598B2 (en) | 2002-10-15 | 2005-08-09 | General Electric Company | Test probe for electrical devices having low or no wedge depression |
JP4659328B2 (en) | 2002-10-21 | 2011-03-30 | 東京エレクトロン株式会社 | Probe device for controlling the temperature of an object to be inspected |
US7026832B2 (en) | 2002-10-28 | 2006-04-11 | Dainippon Screen Mfg. Co., Ltd. | Probe mark reading device and probe mark reading method |
JP2004152916A (en) | 2002-10-29 | 2004-05-27 | Nec Corp | Inspecting device and inspecting method of semiconductor device |
US6864694B2 (en) | 2002-10-31 | 2005-03-08 | Agilent Technologies, Inc. | Voltage probe |
JP2004205487A (en) | 2002-11-01 | 2004-07-22 | Tokyo Electron Ltd | Probe card fixing mechanism |
US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US6853198B2 (en) | 2002-11-14 | 2005-02-08 | Agilent Technologies, Inc. | Method and apparatus for performing multiport through-reflect-line calibration and measurement |
US7019895B2 (en) | 2002-11-15 | 2006-03-28 | Dmetrix, Inc. | Microscope stage providing improved optical performance |
US20040100276A1 (en) | 2002-11-25 | 2004-05-27 | Myron Fanton | Method and apparatus for calibration of a vector network analyzer |
DE60321837D1 (en) | 2002-11-27 | 2008-08-07 | Medical Device Innovations Ltd | Coaxial tissue ablation sample and method of making a balun therefor |
US6727716B1 (en) | 2002-12-16 | 2004-04-27 | Newport Fab, Llc | Probe card and probe needle for high frequency testing |
US7084650B2 (en) | 2002-12-16 | 2006-08-01 | Formfactor, Inc. | Apparatus and method for limiting over travel in a probe card assembly |
TW594899B (en) | 2002-12-18 | 2004-06-21 | Star Techn Inc | Detection card for semiconductor measurement |
JP2004199796A (en) | 2002-12-19 | 2004-07-15 | Shinka Jitsugyo Kk | Method for connecting probe pin for measuring characteristics of thin-film magnetic head and method for measuring characteristics of thin-film magnetic head |
US6741129B1 (en) | 2002-12-19 | 2004-05-25 | Texas Instruments Incorporated | Differential amplifier slew rate boosting scheme |
EP1576356B1 (en) | 2002-12-19 | 2009-10-28 | Oerlikon Trading AG, Trübbach | Apparatus and method for generating electromagnetic field distributions |
US6753679B1 (en) | 2002-12-23 | 2004-06-22 | Nortel Networks Limited | Test point monitor using embedded passive resistance |
JP4133777B2 (en) | 2003-01-06 | 2008-08-13 | 日本電子株式会社 | Nuclear magnetic resonance probe |
KR100702003B1 (en) | 2003-01-18 | 2007-03-30 | 삼성전자주식회사 | Probe card |
US6856126B2 (en) | 2003-01-21 | 2005-02-15 | Agilent Technologies, Inc. | Differential voltage probe |
JP3827159B2 (en) | 2003-01-23 | 2006-09-27 | 株式会社ヨコオ | In-vehicle antenna device |
US6937020B2 (en) | 2003-02-04 | 2005-08-30 | The University Of Kansas | Solid-state nuclear magnetic resonance probe |
US7107170B2 (en) | 2003-02-18 | 2006-09-12 | Agilent Technologies, Inc. | Multiport network analyzer calibration employing reciprocity of a device |
US6970001B2 (en) | 2003-02-20 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Variable impedance test probe |
JP2004265942A (en) | 2003-02-20 | 2004-09-24 | Okutekku:Kk | Method for detecting zero point of probe pin and probe |
US6987483B2 (en) | 2003-02-21 | 2006-01-17 | Kyocera Wireless Corp. | Effectively balanced dipole microstrip antenna |
US6838885B2 (en) | 2003-03-05 | 2005-01-04 | Murata Manufacturing Co., Ltd. | Method of correcting measurement error and electronic component characteristic measurement apparatus |
US6778140B1 (en) | 2003-03-06 | 2004-08-17 | D-Link Corporation | Atch horn antenna of dual frequency |
US6902941B2 (en) | 2003-03-11 | 2005-06-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Probing of device elements |
US6946859B2 (en) | 2003-03-12 | 2005-09-20 | Celerity Research, Inc. | Probe structures using clamped substrates with compliant interconnectors |
US6914427B2 (en) | 2003-03-14 | 2005-07-05 | The Boeing Company | Eddy current probe having sensing elements defined by first and second elongated coils and an associated inspection method |
US6943571B2 (en) | 2003-03-18 | 2005-09-13 | International Business Machines Corporation | Reduction of positional errors in a four point probe resistance measurement |
US6940283B2 (en) | 2003-03-20 | 2005-09-06 | Snap-On Incorporated | Detecting field from different ignition coils using adjustable probe |
US6948391B2 (en) | 2003-03-21 | 2005-09-27 | Nuclear Filter Technology | Probe with integral vent, sampling port and filter element |
US7130756B2 (en) | 2003-03-28 | 2006-10-31 | Suss Microtec Test System Gmbh | Calibration method for carrying out multiport measurements on semiconductor wafers |
GB2399948B (en) | 2003-03-28 | 2006-06-21 | Sarantel Ltd | A dielectrically-loaded antenna |
US7022976B1 (en) | 2003-04-02 | 2006-04-04 | Advanced Micro Devices, Inc. | Dynamically adjustable probe tips |
US6823276B2 (en) | 2003-04-04 | 2004-11-23 | Agilent Technologies, Inc. | System and method for determining measurement errors of a testing device |
US20040201388A1 (en) | 2003-04-08 | 2004-10-14 | Barr Andrew Harvey | Support for an electronic probe and related methods |
US7342402B2 (en) | 2003-04-10 | 2008-03-11 | Formfactor, Inc. | Method of probing a device using captured image of probe structure in which probe tips comprise alignment features |
KR20040089244A (en) | 2003-04-11 | 2004-10-21 | 주식회사 유림하이테크산업 | Needle assembly of probe card |
US7002133B2 (en) | 2003-04-11 | 2006-02-21 | Hewlett-Packard Development Company, L.P. | Detecting one or more photons from their interactions with probe photons in a matter system |
US7023225B2 (en) | 2003-04-16 | 2006-04-04 | Lsi Logic Corporation | Wafer-mounted micro-probing platform |
TWI220163B (en) | 2003-04-24 | 2004-08-11 | Ind Tech Res Inst | Manufacturing method of high-conductivity nanometer thin-film probe card |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US6882160B2 (en) | 2003-06-12 | 2005-04-19 | Anritsu Company | Methods and computer program products for full N-port vector network analyzer calibrations |
US6900652B2 (en) | 2003-06-13 | 2005-05-31 | Solid State Measurements, Inc. | Flexible membrane probe and method of use thereof |
KR100523139B1 (en) | 2003-06-23 | 2005-10-20 | 주식회사 하이닉스반도체 | Semiconductor device for reducing the number of probing pad used during wafer testing and method for testing the same |
US6956388B2 (en) | 2003-06-24 | 2005-10-18 | Agilent Technologies, Inc. | Multiple two axis floating probe assembly using split probe block |
US6870381B2 (en) | 2003-06-27 | 2005-03-22 | Formfactor, Inc. | Insulative covering of probe tips |
US6911814B2 (en) | 2003-07-01 | 2005-06-28 | Formfactor, Inc. | Apparatus and method for electromechanical testing and validation of probe cards |
US7015708B2 (en) | 2003-07-11 | 2006-03-21 | Gore Enterprise Holdings, Inc. | Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts |
US20050229053A1 (en) | 2003-07-25 | 2005-10-13 | Logicvision, Inc., 101 Metro Drive, 3Rd Floor, San Jose, Ca, 95110 | Circuit and method for low frequency testing of high frequency signal waveforms |
US20050026276A1 (en) | 2003-07-29 | 2005-02-03 | Northrop Grumman Corporation | Remote detection and analysis of chemical and biological aerosols |
JP4159043B2 (en) | 2003-07-29 | 2008-10-01 | ソニー・エリクソン・モバイルコミュニケーションズ株式会社 | Television broadcasting system |
US7068049B2 (en) | 2003-08-05 | 2006-06-27 | Agilent Technologies, Inc. | Method and apparatus for measuring a device under test using an improved through-reflect-line measurement calibration |
US7015703B2 (en) | 2003-08-12 | 2006-03-21 | Scientific Systems Research Limited | Radio frequency Langmuir probe |
US6859054B1 (en) | 2003-08-13 | 2005-02-22 | Advantest Corp. | Probe contact system using flexible printed circuit board |
US7025628B2 (en) | 2003-08-13 | 2006-04-11 | Agilent Technologies, Inc. | Electronic probe extender |
US6912468B2 (en) | 2003-08-14 | 2005-06-28 | Westerngeco, L.L.C. | Method and apparatus for contemporaneous utilization of a higher order probe in pre-stack and post-stack seismic domains |
US6924655B2 (en) | 2003-09-03 | 2005-08-02 | Micron Technology, Inc. | Probe card for use with microelectronic components, and methods for making same |
US7088189B2 (en) | 2003-09-09 | 2006-08-08 | Synergy Microwave Corporation | Integrated low noise microwave wideband push-push VCO |
JP3812559B2 (en) | 2003-09-18 | 2006-08-23 | Tdk株式会社 | Eddy current probe |
US7286013B2 (en) | 2003-09-18 | 2007-10-23 | Avago Technologies Wireless Ip (Singapore) Pte Ltd | Coupled-inductance differential amplifier |
US7227140B2 (en) | 2003-09-23 | 2007-06-05 | Zyvex Instruments, Llc | Method, system and device for microscopic examination employing fib-prepared sample grasping element |
US6946860B2 (en) | 2003-10-08 | 2005-09-20 | Chipmos Technologies (Bermuda) Ltd. | Modularized probe head |
US7009452B2 (en) | 2003-10-16 | 2006-03-07 | Solarflare Communications, Inc. | Method and apparatus for increasing the linearity and bandwidth of an amplifier |
US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
US7981362B2 (en) | 2003-11-04 | 2011-07-19 | Meso Scale Technologies, Llc | Modular assay plates, reader systems and methods for test measurements |
US7020506B2 (en) | 2003-11-06 | 2006-03-28 | Orsense Ltd. | Method and system for non-invasive determination of blood-related parameters |
US6897668B1 (en) | 2003-11-28 | 2005-05-24 | Premtek International Inc. | Double-faced detecting devices for an electronic substrate |
US7034553B2 (en) | 2003-12-05 | 2006-04-25 | Prodont, Inc. | Direct resistance measurement corrosion probe |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
CN1922756A (en) | 2003-12-24 | 2007-02-28 | 莫莱克斯公司 | Transmission line having a transforming impedance |
DE202004021093U1 (en) | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Differential probe for e.g. integrated circuit, has elongate probing units interconnected to respective active circuits that are interconnected to substrate by respective pair of flexible interconnects |
US6933725B2 (en) | 2004-01-16 | 2005-08-23 | Bruker Biospin Corporation | NMR probe circuit for generating close frequency resonances |
JP4206930B2 (en) | 2004-01-21 | 2009-01-14 | 株式会社デンソー | Digital filter test apparatus and digital filter test method |
US7254425B2 (en) | 2004-01-23 | 2007-08-07 | Abbott Laboratories | Method for detecting artifacts in data |
US6933713B2 (en) | 2004-01-26 | 2005-08-23 | Agilent Technologies, Inc. | High bandwidth oscilloscope probe with replaceable cable |
US6940264B2 (en) | 2004-01-29 | 2005-09-06 | The United States Of America As Represented By The Secretary Of The Navy | Near field probe |
TWI232938B (en) | 2004-02-11 | 2005-05-21 | Star Techn Inc | Probe card |
US7319335B2 (en) | 2004-02-12 | 2008-01-15 | Applied Materials, Inc. | Configurable prober for TFT LCD array testing |
TWI228597B (en) | 2004-02-25 | 2005-03-01 | Nat Applied Res Laboratories | Device monitor for RF and DC measurements |
JP4130639B2 (en) | 2004-03-16 | 2008-08-06 | 三洋化成工業株式会社 | Method for producing resin dispersion and resin particles |
US7009188B2 (en) | 2004-05-04 | 2006-03-07 | Micron Technology, Inc. | Lift-out probe having an extension tip, methods of making and using, and analytical instruments employing same |
US7015709B2 (en) | 2004-05-12 | 2006-03-21 | Delphi Technologies, Inc. | Ultra-broadband differential voltage probes |
US7019541B2 (en) | 2004-05-14 | 2006-03-28 | Crown Products, Inc. | Electric conductivity water probe |
US7023231B2 (en) | 2004-05-14 | 2006-04-04 | Solid State Measurements, Inc. | Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof |
JP2005331298A (en) | 2004-05-18 | 2005-12-02 | Mitsubishi Electric Corp | Method for measuring characteristics of high-frequency circuit, pattern for calibration, and fixture for calibration |
US7091729B2 (en) | 2004-07-09 | 2006-08-15 | Micro Probe | Cantilever probe with dual plane fixture and probe apparatus therewith |
US7015690B2 (en) | 2004-05-27 | 2006-03-21 | General Electric Company | Omnidirectional eddy current probe and inspection system |
US7148716B2 (en) | 2004-06-10 | 2006-12-12 | Texas Instruments Incorporated | System and method for the probing of a wafer |
TWI252925B (en) | 2004-07-05 | 2006-04-11 | Yulim Hitech Inc | Probe card for testing a semiconductor device |
US7188037B2 (en) | 2004-08-20 | 2007-03-06 | Microcraft | Method and apparatus for testing circuit boards |
US20060052075A1 (en) | 2004-09-07 | 2006-03-09 | Rajeshwar Galivanche | Testing integrated circuits using high bandwidth wireless technology |
US7315715B2 (en) * | 2004-09-08 | 2008-01-01 | Ricoh Co. Ltd. | Apparatus, method, and program for image forming |
US7001785B1 (en) | 2004-12-06 | 2006-02-21 | Veeco Instruments, Inc. | Capacitance probe for thin dielectric film characterization |
US7030328B1 (en) | 2004-12-22 | 2006-04-18 | Agilent Technologies, Inc. | Liquid metal switch employing micro-electromechanical system (MEMS) structures for actuation |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
JP2006237378A (en) | 2005-02-25 | 2006-09-07 | Elpida Memory Inc | Wafer prober and method of testing wafer |
US7005879B1 (en) | 2005-03-01 | 2006-02-28 | International Business Machines Corporation | Device for probe card power bus noise reduction |
JP4340248B2 (en) | 2005-03-17 | 2009-10-07 | 富士通マイクロエレクトロニクス株式会社 | Method for manufacturing a semiconductor imaging device |
JP2006258667A (en) | 2005-03-17 | 2006-09-28 | Nec Electronics Corp | Rf impedance measuring device of package substrate |
US7279920B2 (en) | 2005-04-06 | 2007-10-09 | Texas Instruments Incoporated | Expeditious and low cost testing of RFID ICs |
JP4611788B2 (en) | 2005-04-12 | 2011-01-12 | サンテック株式会社 | Optical deflection probe and optical deflection probe apparatus |
US7096133B1 (en) | 2005-05-17 | 2006-08-22 | National Semiconductor Corporation | Method of establishing benchmark for figure of merit indicative of amplifier flicker noise |
US7733287B2 (en) | 2005-07-29 | 2010-06-08 | Sony Corporation | Systems and methods for high frequency parallel transmissions |
US7327153B2 (en) | 2005-11-02 | 2008-02-05 | Texas Instruments Incorporated | Analog built-in self-test module |
DE102005053146A1 (en) | 2005-11-04 | 2007-05-10 | Suss Microtec Test Systems Gmbh | Test prod for e.g. electrical characteristics measurement, during electrical circuitry testing, has support unit with U-shaped section, where all or part of contact units of support unit overlap on sides facing high frequency wave guides |
US20070145989A1 (en) | 2005-12-27 | 2007-06-28 | Hua Zhu | Probe card with improved transient power delivery |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
-
2007
- 2007-02-22 US US11/710,225 patent/US7764072B2/en not_active Expired - Fee Related
- 2007-05-03 WO PCT/US2007/010800 patent/WO2007145727A2/en active Application Filing
-
2010
- 2010-06-16 US US12/816,648 patent/US20100264948A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110208467A1 (en) * | 2010-02-23 | 2011-08-25 | Freescale Semiconductor, Inc. | Calibration standards and methods of their fabrication and use |
US8290736B2 (en) * | 2010-02-23 | 2012-10-16 | Freescale Semiconductor, Inc. | Calibration standards and methods of their fabrication and use |
US10804874B2 (en) | 2018-06-12 | 2020-10-13 | International Business Machines Corporation | Superconducting combiner or separator of DC-currents and microwave signals |
US11317519B2 (en) | 2018-10-15 | 2022-04-26 | International Business Machines Corporation | Fabrication of superconducting devices that control direct currents and microwave signals |
Also Published As
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WO2007145727A2 (en) | 2007-12-21 |
US7764072B2 (en) | 2010-07-27 |
WO2007145727A3 (en) | 2009-04-16 |
US20070285085A1 (en) | 2007-12-13 |
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