US20090314476A1 - Heat radiating component - Google Patents

Heat radiating component Download PDF

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Publication number
US20090314476A1
US20090314476A1 US12/461,824 US46182409A US2009314476A1 US 20090314476 A1 US20090314476 A1 US 20090314476A1 US 46182409 A US46182409 A US 46182409A US 2009314476 A1 US2009314476 A1 US 2009314476A1
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US
United States
Prior art keywords
heat radiating
heat
radiating fins
fins
radiating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/461,824
Other languages
English (en)
Inventor
Hideyuki Fujikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJIKAWA, HIDEYUKI
Publication of US20090314476A1 publication Critical patent/US20090314476A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the embodiments discussed herein are related to a heat radiating component that includes plural heat radiating fins which are arranged with spaces therebetween, and radiates heat from the heat radiating fins to air flowing through the spaces.
  • a heat radiating component carrying out heat radiation for a such large LSI also is required to deliver increasingly high performance of heat radiation.
  • a heat radiating structure in which a number of heat radiating fins arranged with spaces therebetween are provided, air is flown into the spaces in the heat radiating fins to conduct heat from the heat radiating fins to the air so that the air with a raised temperature is exhausted outside the apparatus.
  • Japanese Laid-open Patent Publications No. H08-88301 and No. H11-103183 describe structures in which shapes and arrangements of the heat radiating fins are devised to obtain higher heat radiating performance.
  • a major problem with a heat radiating component provided with a number of heat radiating fins arranged with spaces therebetween as described above is the following. While an electronic apparatus mounted with such heat radiating component has been used for a long time, the heat radiating fins are attached with dust in air inflow ends thereof so that the air flow is impaired and the heat radiating performance is deteriorated. As a result, for example, a heat generating component serving as an object for heat radiation such as a large LSI is less cooled and thus has a high temperature, thereby causing the heat radiating component to malfunction or deteriorate. In the end, the heat radiating component may be damaged and the electronic apparatus may stop in operation.
  • a heat radiating component includes plural heat radiating fins which are arranged with spaces therebetween so that the heat radiating component radiates heat from the plural heat radiating fins to air flowing through the spaces between the plural heat radiating fins.
  • the heat radiating fins have such notch shapes that portions that are at least one of alternately and cyclically different in an arrangement direction of the plural heat radiating fins are notched.
  • the heat radiating component of the invention includes the notch shape described above in the air inflow side of the beat radiating fins, an aperture of air inflow in the air inflow side edges is substantially widened and dust attaching is reduced while the heat radiating performance is maintained.
  • FIG. 1 illustrates a perspective view of a heat radiating component as a first embodiment according to the invention
  • FIG. 2 illustrates a top view of the heat radiating component illustrated in FIG. 1 ;
  • FIG. 3 illustrates a front view of the heat radiating component illustrated in FIG. 1 ;
  • FIG. 4 illustrates a side view of the heat radiating component illustrated in FIG. 1 ;
  • FIG. 5 illustrates an enlarged view of a portion indicated by the circle R 1 illustrated in FIG. 1 ;
  • FIG. 6 illustrates an enlarged view of a portion indicated by the circle R 2 illustrated in FIG. 3 ;
  • FIG. 7 illustrates a perspective view of a heat radiating component as a second embodiment according to the invention.
  • FIG. 8 illustrates a side view of the heat radiating component illustrated in FIG. 7 ;
  • FIG. 9 illustrates an enlarged view of a portion indicated by the circle R 3 illustrated in FIG. 8 ;
  • FIG. 10 illustrates an outline perspective view of a heat absorbing plate included in the heat radiating component illustrated in FIG. 7 ;
  • FIG. 11 is a schematic diagram illustrating a shape of a heat pipe included in the heat radiating component illustrated in FIG. 7 .
  • FIG. 1 illustrates a perspective view of a heat radiating component 10 as a first embodiment according to the invention.
  • FIG. 2 illustrates a top view of the heat radiating component 10 illustrated in FIG. 1 .
  • FIG. 3 illustrates a front view of the heat radiating component illustrated 10 in FIG. 1 .
  • FIG. 4 illustrates a side view of the heat radiating component 10 illustrated in FIG. 1 .
  • FIG. 5 illustrates an enlarged view of a portion indicated by the circle R 1 illustrated in FIG. 1 .
  • FIG. 6 illustrates an enlarged view of a portion indicated by the circle R 2 illustrated in FIG. 3 .
  • This heat radiating component 10 includes a heat absorbing plate 11 , multiple heat radiating fins 12 arranged with spaces therebetween.
  • the heat absorbing plate 11 is made of metal having a high heat conduction efficiency such as copper.
  • the heat absorbing plate 11 plays a role that a bottom surface of the heat absorbing plate 11 is attached to a heat generating component (not illustrated) to absorb heat from the heat generating component, and a role that the heat absorbing plate 11 holds the multiple heat radiating fins 12 in a crimped state to conduct to the heat to the multiple heat radiating fins 12 .
  • the multiple heat radiating fins 12 are also formed by a material having a high thermal conduction efficient such as aluminum or copper.
  • Heat conducted from the heat generating component to the heat absorbing plate 11 is further conducted to the heat radiating fins and then to air flowing through the spaces in the multiple heat radiating fins 12 .
  • Air, which has absorbed heat and is in a high temperature, is exhausted outside an electronic apparatus and the like in which the heat generating component and the heat radiating component 10 are housed.
  • each one of the heat radiating fins 12 has the notch shape in which the ends are notched to form projections 12 a and depressions 12 b repeatedly, and in the example discussed here, the projections 12 a and 12 b between adjacent heat radiating fins of the plural heat radiating fins do not overlap each other, and as illustrated in FIG. 6 , the projections 12 a are formed in alternately different positions such that gaps f and gaps g between the projections 12 a and the projections 12 b are formed.
  • the opening gaps f and g between the projections are formed as illustrated in FIG. 6 .
  • the projections are formed alternately such that the projections partially overlaps each other, the widening of substantial apertures as a whole of the air inflow ends and the air outflow ends of the heat radiating fins is ensured. Therefore, these gaps f and g are not necessarily formed.
  • the heat radiating fins have the notch shapes in the three sides excluding the side crimped by the heat absorbing plate 11 .
  • the adjacent fins are notched in alternately different portions.
  • the notch shapes may be formed in cyclically different portions, i.e., the notch shapes are repeatedly formed in same positions every three or four of the heat radiating fins.
  • FIG. 7 illustrates a perspective view of a heat radiating component 20 as a second embodiment according to the invention.
  • FIG. 8 illustrates a side view of the heat radiating component illustrated in FIG. 7 .
  • FIG. 9 illustrates an enlarged view of a portion indicated by the circle R 3 illustrated in FIG. 8 .
  • FIG. 10 illustrates an outline perspective view of a heat absorbing plate 21 included in the heat radiating component 20 illustrated in FIG. 7 .
  • FIG. 11 is a schematic diagram illustrating a heat pipe 25 included in the heat radiating component 20 illustrated in FIG. 7 .
  • the heat radiating component 20 serving as the second embodiment is provided with a heat absorbing plate 21 in a bottom end thereof.
  • This heat absorbing plate 21 includes, as illustrated in FIG. 10 , a heat absorbing section 211 to absorb heat from a heat generating component (not illustrated), and four of arm sections 212 to fix the heat radiating component 20 illustrated in FIG. 7 .
  • the heat absorbing section 211 is formed from copper in order to ensure a good heat absorbing performance.
  • the arm sections 212 made of aluminum are crimped at its four corners.
  • the heat absorbing section 211 is formed with two grooves 211 a, in which the heat pipe 25 described later (see FIG. 11 ) is arranged.
  • the four arm sections 212 are provided with mounting openings 212 a penetrating vertically through the arm section 212 . As illustrated in FIG. 7 , screw parts 22 go through the mounting openings 212 a .
  • the heat radiating component 20 is fixed to a casing or the like of an electronic apparatus in a state where a top face of the heat generating component is pressed onto a bottom face of the heat absorbing section 211 .
  • spring members 23 are provided to make it possible to stably mount the heat radiating component 20 to the casing or the like in a state where the bottom face of the heat radiating component 20 is attached to the heat generating component.
  • the heat radiating component 20 illustrated in FIG. 7 and FIG. 8 are arranged with a number of heat radiating fins 24 crimped to the heat absorbing section 211 .
  • a top face covered by a fan 26 , and both side faces of these heat radiating fins 24 have notch shapes as illustrated in FIG. 9 .
  • the notch shapes themselves are equivalent to the notch shapes of the heat radiating fins 21 included in the heat radiating component 10 serving as the first embodiment. Thus, a redundant explanation will be avoided.
  • the heat radiating component 20 is provided with the heat pipe 25 having a shape as illustrated in FIG. 11 .
  • One end side of the heat pipe 25 is to be engaged in the groove 21 formed in the heat absorbing section 211 of the heat absorbing plate 21 , and extends from there, then curves to turn and extends in the arrangement direction of the heat radiating fins 24 to penetrate the heat radiating fins 24 .
  • the heat radiating component 20 illustrated in FIG. 7 and FIG. 8 is provided with the fan 26 in a position where the heat radiating component 20 covers a top end of the heat radiating fins 24 .
  • the fan 26 blows air toward from the top ends of the heat radiating fins 24 to the heat radiating fins 24 .
  • Air blown into the spaces of the heat radiating fins 24 from the top ends of the heat radiating fins 24 by the fan 26 absorbs heat from the heat radiating fins 24 while going through the spaces of the heat radiating fins 24 , and further, blows to the heat absorbing plate 21 to directly absorb heat also from the heat absorbing plate 21 and then exhausted from the both side ends of the heat radiating fins 24 .
  • the top ends of the heat radiating fins 24 also have notch shapes similar to those formed in the side ends of the heat radiating fins 24 . Thus, dust attaching to the air inflow ends serving as the top ends of the heat radiating fins 24 is reduced.
  • the fan 26 of the second embodiment is explained as a fan which blows air toward the heat radiating fins 24 .
  • this fan 26 may be a fan which blows air in a direction of suctioning air from the heat radiating fins 24 .
  • the both side ends of the heat radiating fins 24 become air inflow ends.
  • the heat radiating fins 24 have the notch shapes also in both side ends. Thus, also in this case, dust attaching to the both side ends serving as the air inflow ends is reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US12/461,824 2007-02-27 2009-08-25 Heat radiating component Abandoned US20090314476A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/053613 WO2008105067A1 (ja) 2007-02-27 2007-02-27 放熱部品

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/053613 Continuation WO2008105067A1 (ja) 2007-02-27 2007-02-27 放熱部品

Publications (1)

Publication Number Publication Date
US20090314476A1 true US20090314476A1 (en) 2009-12-24

Family

ID=39720913

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/461,824 Abandoned US20090314476A1 (en) 2007-02-27 2009-08-25 Heat radiating component

Country Status (3)

Country Link
US (1) US20090314476A1 (ja)
JP (1) JP4998548B2 (ja)
WO (1) WO2008105067A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2937974A1 (en) * 2012-12-21 2015-10-28 Weg Equipamentos Elétricos S.A. - Motores Heat exchange system for casings of rotary electric machines
US10836113B2 (en) 2015-01-22 2020-11-17 Mitsubishi Engineering-Plastics Corporation Laser welding member, and molded article

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6340729B2 (ja) * 2014-09-01 2018-06-13 パナソニックＩｐマネジメント株式会社 照明器具
JP6821242B2 (ja) * 2016-07-12 2021-01-27 日本車輌製造株式会社 エンジン発電機

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
US5701951A (en) * 1994-12-20 1997-12-30 Jean; Amigo Heat dissipation device for an integrated circuit
US6166904A (en) * 1992-08-06 2000-12-26 Pfu Limited Heat generating element cooling device
JP2001102786A (ja) * 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk 電子部品の放熱器およびその製造方法
US20020189789A1 (en) * 2001-06-18 2002-12-19 Global Win Technology Co., Ltd CPU cooling arrangement
US20050217825A1 (en) * 2004-04-01 2005-10-06 Lian-Huang Chern Heat dissipating sheet and heat dissipating module made of the heat dissipating sheet
US20060289150A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipation device
US7289322B2 (en) * 2005-10-24 2007-10-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536787Y2 (ja) * 1989-06-29 1993-09-17
JP3015783U (ja) * 1995-03-14 1995-09-12 陳富英 洪 超薄型コンピュータ中央処理装置の放熱用基板
JPH10126078A (ja) * 1996-10-22 1998-05-15 Nippon Tekuraito:Kk 放熱板及び放熱装置
JP2002305273A (ja) * 2001-04-05 2002-10-18 Pfu Ltd ヒートシンク装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6166904A (en) * 1992-08-06 2000-12-26 Pfu Limited Heat generating element cooling device
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
US5701951A (en) * 1994-12-20 1997-12-30 Jean; Amigo Heat dissipation device for an integrated circuit
JP2001102786A (ja) * 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk 電子部品の放熱器およびその製造方法
US20020189789A1 (en) * 2001-06-18 2002-12-19 Global Win Technology Co., Ltd CPU cooling arrangement
US20050217825A1 (en) * 2004-04-01 2005-10-06 Lian-Huang Chern Heat dissipating sheet and heat dissipating module made of the heat dissipating sheet
US20060289150A1 (en) * 2005-06-24 2006-12-28 Foxconn Technology Co., Ltd. Heat dissipation device
US7289322B2 (en) * 2005-10-24 2007-10-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2937974A1 (en) * 2012-12-21 2015-10-28 Weg Equipamentos Elétricos S.A. - Motores Heat exchange system for casings of rotary electric machines
EP2937974A4 (en) * 2012-12-21 2016-08-10 Weg Equipamentos Elétricos S A Motores HEAT EXCHANGE SYSTEM FOR HOUSINGS OF ROTATING ELECTRICAL MACHINES
US10836113B2 (en) 2015-01-22 2020-11-17 Mitsubishi Engineering-Plastics Corporation Laser welding member, and molded article

Also Published As

Publication number Publication date
JPWO2008105067A1 (ja) 2010-06-03
JP4998548B2 (ja) 2012-08-15
WO2008105067A1 (ja) 2008-09-04

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AS Assignment

Owner name: FUJITSU LIMITED, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FUJIKAWA, HIDEYUKI;REEL/FRAME:023166/0288

Effective date: 20090629

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION