WO2008105067A1 - 放熱部品 - Google Patents

放熱部品 Download PDF

Info

Publication number
WO2008105067A1
WO2008105067A1 PCT/JP2007/053613 JP2007053613W WO2008105067A1 WO 2008105067 A1 WO2008105067 A1 WO 2008105067A1 JP 2007053613 W JP2007053613 W JP 2007053613W WO 2008105067 A1 WO2008105067 A1 WO 2008105067A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat radiation
fins
radiation component
cutouts
gaps
Prior art date
Application number
PCT/JP2007/053613
Other languages
English (en)
French (fr)
Inventor
Hideyuki Fujikawa
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2009501070A priority Critical patent/JP4998548B2/ja
Priority to PCT/JP2007/053613 priority patent/WO2008105067A1/ja
Publication of WO2008105067A1 publication Critical patent/WO2008105067A1/ja
Priority to US12/461,824 priority patent/US20090314476A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　本発明は、隙間を空けて配列された複数枚の放熱フィンを備え、放熱フィンから、その放熱フィンの隙間を流れる空気に放熱する放熱部品に関し、放熱性能を維持しつつ塵埃の付着の低減化を図ることを目的とし、放熱フィンの、空気流入側端縁が、放熱フィンの配列方向に交互に又は循環的に異なる部分が切り欠かれた切欠形状を有し、好ましくは、空気流出側端縁も、上記の切欠形状を有し、その切欠形状は、その切欠形状を有する端縁を放熱フィンの配列方向に見たときに、隣接する放熱フィンの突出した部分どうしの間に隙間が形成されていることが好ましい。
PCT/JP2007/053613 2007-02-27 2007-02-27 放熱部品 WO2008105067A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009501070A JP4998548B2 (ja) 2007-02-27 2007-02-27 放熱部品
PCT/JP2007/053613 WO2008105067A1 (ja) 2007-02-27 2007-02-27 放熱部品
US12/461,824 US20090314476A1 (en) 2007-02-27 2009-08-25 Heat radiating component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/053613 WO2008105067A1 (ja) 2007-02-27 2007-02-27 放熱部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/461,824 Continuation US20090314476A1 (en) 2007-02-27 2009-08-25 Heat radiating component

Publications (1)

Publication Number Publication Date
WO2008105067A1 true WO2008105067A1 (ja) 2008-09-04

Family

ID=39720913

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/053613 WO2008105067A1 (ja) 2007-02-27 2007-02-27 放熱部品

Country Status (3)

Country Link
US (1) US20090314476A1 (ja)
JP (1) JP4998548B2 (ja)
WO (1) WO2008105067A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051650A (ja) * 2014-09-01 2016-04-11 パナソニックＩｐマネジメント株式会社 照明器具
JP2018009465A (ja) * 2016-07-12 2018-01-18 日本車輌製造株式会社 エンジン発電機

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9843236B2 (en) * 2012-12-21 2017-12-12 WEG Equipamentos Eletricos S.A.-Motores Heat exchange system for casings of rotary electric machines
CN107206703A (zh) 2015-01-22 2017-09-26 三菱工程塑料株式会社 激光熔接用构件和成形品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3015783U (ja) * 1995-03-14 1995-09-12 陳富英 洪 超薄型コンピュータ中央処理装置の放熱用基板
JPH10126078A (ja) * 1996-10-22 1998-05-15 Nippon Tekuraito:Kk 放熱板及び放熱装置
JP2001102786A (ja) * 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk 電子部品の放熱器およびその製造方法
JP2002305273A (ja) * 2001-04-05 2002-10-18 Pfu Ltd ヒートシンク装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536787Y2 (ja) * 1989-06-29 1993-09-17
US5760333A (en) * 1992-08-06 1998-06-02 Pfu Limited Heat-generating element cooling device
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
US5701951A (en) * 1994-12-20 1997-12-30 Jean; Amigo Heat dissipation device for an integrated circuit
TW509348U (en) * 2001-06-18 2002-11-01 Global Win Technology Co Ltd Heat dissipation apparatus
US20050217825A1 (en) * 2004-04-01 2005-10-06 Lian-Huang Chern Heat dissipating sheet and heat dissipating module made of the heat dissipating sheet
US7565925B2 (en) * 2005-06-24 2009-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7289322B2 (en) * 2005-10-24 2007-10-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3015783U (ja) * 1995-03-14 1995-09-12 陳富英 洪 超薄型コンピュータ中央処理装置の放熱用基板
JPH10126078A (ja) * 1996-10-22 1998-05-15 Nippon Tekuraito:Kk 放熱板及び放熱装置
JP2001102786A (ja) * 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk 電子部品の放熱器およびその製造方法
JP2002305273A (ja) * 2001-04-05 2002-10-18 Pfu Ltd ヒートシンク装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051650A (ja) * 2014-09-01 2016-04-11 パナソニックＩｐマネジメント株式会社 照明器具
JP2018009465A (ja) * 2016-07-12 2018-01-18 日本車輌製造株式会社 エンジン発電機

Also Published As

Publication number Publication date
JP4998548B2 (ja) 2012-08-15
US20090314476A1 (en) 2009-12-24
JPWO2008105067A1 (ja) 2010-06-03

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