Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/02—Fibres or whiskers
  • C08K7/04—Fibres or whiskers inorganic
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
  • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08L77/04—Polyamides derived from alpha-amino carboxylic acids
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
  • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2205/00—Polymer mixtures characterised by other features
  • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Definitions

• the present invention relates to filled polyamide molding materials, in particular polyamide molding materials with medium filler content, which are producible from a polyamide blend and for example by compounding with chopped or endless fibers on twin-screw extruders, and showing a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part such as antenna housings of stationary or mobile communication devices.
• thermoplastic polyamide molding materials according to the present invention are suitable for manufacturing molded parts and other semi-finished or finished parts, which are producible for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.
• the present invention relates to the use of filled polyamide molding materials for manufacturing antenna housings for stationary or mobile communications devices. These molded parts have a significantly reduced variation of the electrical properties, i.e. the transmission or reception performance varies slightly with variable ambient humidity.
• Filled polyamide blends play an increasing role in the field of technical construction materials, because they have good mechanical properties.
• Fields of application are, for example, internal and external parts in the automotive sector and in the field of other means of transport, housing material for appliances and equipment for telecommunications, consumer electronics, household appliances, mechanical engineering, heating systems and mounting parts for installations.
• polymers are to be understood as polyamides in the present application, which have basic building blocks that are held together by amide bonds (—NH—CO—) and which are producible by polycondensation or polymerization of monomers, such as dicarboxylic acids, dicarboxylic acid halides, diamines, aminocarboxylic acids and/or lactames. They may be homopolymers or copolyamides.
• the average molecular weight of the polyamides should be more than 5,000, preferably more than 10,000.
• EP 0 441 423 B1 describes polyamide resin compositions with good mechanical properties and relatively low values of water absorption containing necessarily polyamide 46, and an aliphatic polyamide with a ratio of CH 2 /NHCO groups of 6 to 11 in the polyamide backbone and an amorphous polyamide with a Tg of more than 100° C. and optionally fillers.
• the values for water absorption indicated in EP 0 441 423 B1 do not yet show the equilibrium value, since it was only stored 24 h, however the lowest value is about 2.6%.
• EP 0 728 812 A1 describes thermoplastic molding materials from partly aromatic and amorphous copolyamides which optionally contain fibrous and other particulate fillers and rubber-elastic polymers. These molding materials shall have improved mechanical properties and shall be suitable for long-term usage at high temperatures, and shall also have good solution and oil resistance.
• EP 0 728 812 A1 does not use aliphatic polyamides as basic polyamide A), but partly aromatic copolyamides which necessarily comprise terephthalic acid, isophthalic acid, hexamethylene diamine and a cycloaliphatic diamine. Concerning water absorption of the molding materials, no information is given.
• EP 0 400 428 A1 describes thermoplastic molding materials from partly aromatic copolyamides, optionally aliphatic polyamides with adipic acid as monomer and optionally caprolactam.
• the thermoplastic molding materials according to EP 0 400 428 A1 shall have a good overall spectrum of mechanical properties, in particular high toughness levels.
• EP 0 400 428 A1 does not use aliphatic polyamides as basic polyamide A), but partly aromatic copolyamides which necessarily comprise 6T units and caprolactam and/or 66 units. Concerning water absorption of the molding materials, no information is given.
• polyamide molding materials with a polyamide matrix of a blend of polyamide 613 and/or polyamide 614 and/or polyamide 615 and/or polyamide 616 and/or polyamide 617 and/or polyamide 618 (A) and a copolyamide 6I/6T or polyamide 6I (B), respectively, and at least one fibrous or particulate filler (C), selected from the group consisting of glass fibers, carbon fibers, metal fibers, aramid fibers, whiskers, talc, mica, silicates, quartz, titanium dioxide, wollastonite, kaolin, silicic acids, magnesium carbonate, magnesium hydroxide, chalk, grounded or precipitated calcium carbonate, lime, feldspar, barium sulfate, permanent magnetic or magnetizable metals or alloys, glass balls, hollow glass balls, hollow spheroidal silicate fillers, natural layered silicates, synthetic layered silicates and mixtures thereof.
• C fibrous or particulate filler
• the molded parts made from polyamide molding materials according to the present invention have very good dimensional stability and decreased variation in the electrical properties compared to molding materials based on polyamide 6 or polyamide 66.
• the present invention relates to filled polyamide molding materials with low water absorption and good mechanical properties based on polyamide 613, polyamide 614, polyamide 615, polyamide 616, polyamide 617, polyamide 618, of a blend, consisting essentially of the following components:
• D usual additives
• the present invention relates to a method for manufacturing polyamide molding materials on normal compounding machines at cylinder temperatures of 260° C. to 320° C. wherein the polymeric portion is melted first and then fillers are dosed.
• the molding materials according to the present invention can be used to manufacture molded parts, preferably injection molded parts, more preferably for manufacturing antenna housings of stationary and mobile communication devices. These molded parts have inter alia good dimensional stability, small change in permittivity ( ⁇ r ) and loss angle (tan ⁇ ), and good hydrolytic stability due to low water absorption.
• Whiskers Needle-like single crystals of metals, oxides, borides, carbides, nitrides, polytitanate, carbon etc. mostly with polygonal cross-section are regarded to be whiskers, e.g. potassium titanate whiskers, aluminum oxide whiskers, silicon carbide whiskers. Whiskers generally have a diameter of 0.1 to 10 ⁇ m and a length in the range of mm to cm. Additionally, they have a high tensile strength. Whiskers can be produced by deposition from the gas phase on solids (VS mechanism), or from a three-phase system (VLS-mechanism).
• VS mechanism gas phase on solids
• VLS-mechanism three-phase system
• the glass fibers have a diameter of 5 to 20 ⁇ m, preferably of 5 to 15 ⁇ m and more preferably of 5 to 10 ⁇ m.
• the glass fibers preferably have circular, oval, elliptical or rectangular cross section.
• glass fibers especially oval, elliptical or rectangular with non-circular cross section (“flat glass fibers”) may be used in molding materials according to the present invention.
• These molding materials have advantages concerning strength and toughness, especially in the transverse direction, in the molded parts manufactured from the molding materials.
• the glass fibers are consisting of E glass.
• the glass fibers may be added as endless fibers or as chopped glass fibers, wherein the fibers may be equipped with a suitable sizing system and an adhesive agent or an adhesive agent system, e.g. based on silane.
• carbon black and/or carbon nanotubes may be used as antistatics in the molding materials according to the present invention.
• Using carbon black may also improve the black coloring of the molding material.
• Kaolins, serpentine, talc, mica, vermiculite, illite, smectite, montmorillonite, hectorite, double hydroxides or mixtures thereof may be used as layered silicates in the molding materials according to the present invention.
• the layered silicates may be surface treated or untreated.
• Antioxidants, antiozonants, light stabilizers, UV stabilizers, UV absorbers or UV blockers may be used in the molding materials according to the present invention as stabilizers and anti-aging agents, respectively.
• the aliphatic polyamide A) has a relative viscosity between 1.4 and 2.5, preferably 1.5 and 2.1 (0.5 wt.-% solution in m-cresol, 20° C.).
• Polyamide 614 or polyamide 618 or their mixture is preferably used as aliphatic polyamide A), more preferably polyamide 614 is used.
• the preparation of the polyamide molding materials according to the present invention can be effected on customary compounding machines, such as, for example, single-screw or twin-screw extruders or screw kneaders.
• the polymeric fraction is first melted and the filler can be introduced at a subsequent point of the extruder, for example, by means of a side feeder. If more than one filler is used, it may be added at the same point or at various points of the extruder.
• the compounding is preferably effected at set barrel temperatures of 260° C. to 320° C. However, the polymer portion and the fillers may also be dosed into the feeder together.
• the polyamide molding materials according to the present invention may also be manufactured by the known methods for producing long-fiber reinforced rod-like granules, particularly by using a pulltrusion method, wherein the endless fiber strand (roving) is completely soaked with the polymer melt, and subsequently cooled and cut.
• the long-fiber reinforced rod-like granules obtained thereby can be processed to molded parts using the normal processing procedures; especially good properties of the molded part can be obtained using gentle processing methods.
• the glass fibers which are used as roving in an alternative according to the present invention have a diameter of 10 to 20 ⁇ m, preferably of 12 to 18 ⁇ m, wherein the cross-section of the glass fibers is circular, oval, elliptical or angular.
• E glass fibers are especially used as chopped glass fibers, or as endless fibers (roving).
• all other glass fiber types such as A, C, D, M, S, R glass fibers or any mixtures thereof or mixtures with E glass fibers may be used.
• the polymer strand made from molding materials according to the present invention may be processed to granules by all known granuling methods, such as strand granuling, wherein the strand is cooled in a water bath and subsequently cut.
• strand granuling a granuling method
• underwater granuling and underwater hot cut off should be used to improve the quality of the granules, wherein the polymer melt is directly pressed through a nozzle hole and granuled by a rotating knife in a water stream.
• the molding materials according to the present invention can be processed at cylinder temperatures of 260° C. to 320° C., wherein form temperatures of 60° C. to 130° C. have to be chosen depending on the filler content of the molding materials.
• Another alternative for producing molding materials according to the present invention is mixing of granules with e.g. different matrices and/or fillers to form a dryblend, which will then be processed further.
• a compound may be produced in granular form and these granules may then be mixed to form a dryblend, optionally adding additional quantities of granular component (A) and/or (B). The such produced dryblend will then be processed.
• the homogenized granular mixture (dryblend) is processed in a processing machine, for example a screw injection molding machine, to reinforce molded parts and/or hollow bodies, wherein further quantities of granules of component (A) and/or (B) may be added.
• a processing machine for example a screw injection molding machine
• the molded parts made from the molding materials according to the present invention are used for producing interior and exterior parts, preferably with large requirements for dimensional accuracy, preferably in an environment with varying humidity, for example, in the fields of electrics, furniture, sports, engineering, sanitation and hygiene, medicine, energy and propulsion technology, automobiles and other means of transportation or housing materials for equipment and devices for telecommunication, in particular antenna housings for mobile or stationary communication devices, consumer electronics, household appliances, machinery, heating, or fastening parts for installations or for containers and ventilation parts of all kinds.
• a preferred use of the molding materials according to the present invention is the production of antenna housings for mobile or stationary communication devices. Due to the significantly reduced water absorption, the molded part and/or the housing has a significantly reduced variation of electrical properties. As described above, the electrical properties comprise, for example, permeability of electromagnetic radiation, permittivity ( ⁇ r ), or loss angle (tan ⁇ ). The water absorption results in a weakened signal due to increasing the permittivity.
• the molding materials of the compositions in Table 2 and 3 are prepared on a twin-screw extruder from the firm Werner & Pfleiderer type ZSK25.
• the granules PA 614 and PA 6I/6T are metered into the feed zone.
• the glass fiber as well as the carbon fiber is dosed into the polymer melt via a side feeder 3 barrel units before the die.
• the barrel temperature has been set as an ascending temperature profile up to 310° C. At 150 to 200 rpm, 10 kg throughput has been used. Alter cooling of the strands in a water bath the granular properties were measured after granulation and drying at 120° C. for 24 h.
• test specimens have been produced on an Arburg injection molding machine, wherein the cylinder temperatures were set with ascending profile of 280° C. to 310° C. and the molding temperature was chosen as 100° C.
• specimens are used in the dry state, they are stored at least 48 h at room temperature in a dry environment after injection molding, i.e. stored over silica gel.
• Conditioned specimens are stored according to ISO 1110 for 14 days at 72° C. and 62% relative humidity.
• GRIVORY G21 (PA 6I/6T; 2/1) is 2 wt.-% (at 23° C. and 50% relative humidity) and 7 wt.-% (at 23° C. and 100% relative humidity), respectively.
• the molding material according to the example 4 of the present invention shows greatly reduced water absorption in comparison to the molding material of comparison example 8.
• the molding materials according to the present invention show a smaller decrease of tensile modulus of elasticity by conditioning.

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• 2007
  • 2007-02-07 ES ES07002642T patent/ES2324734T3/es active Active
  • 2007-02-07 DE DE502007000618T patent/DE502007000618D1/de active Active
  • 2007-02-07 EP EP07002642A patent/EP1961787B1/de not_active Not-in-force
  • 2007-02-07 AT AT07002642T patent/ATE428751T1/de active
• 2008
  • 2008-02-03 CN CN2008100061264A patent/CN101240110B/zh not_active Expired - Fee Related
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  • 2008-02-07 US US12/027,581 patent/US20080194751A1/en not_active Abandoned
  • 2008-02-11 KR KR1020080012367A patent/KR101135387B1/ko active IP Right Grant
• 2010
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