Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J133/04—Homopolymers or copolymers of esters
  • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
  • C09J133/08—Homopolymers or copolymers of acrylic acid esters
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
  • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
  • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
  • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
  • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/04—Interconnection of layers
  • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J133/24—Homopolymers or copolymers of amides or imides
  • C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/20—Filters
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
  • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
  • H01J11/20—Constructional details
  • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
  • H01J11/44—Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0073—Shielding materials
  • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
  • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
  • B32B2307/212—Electromagnetic interference shielding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/40—Properties of the layers or laminate having particular optical properties
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/40—Properties of the layers or laminate having particular optical properties
  • B32B2307/412—Transparent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
  • B32B2307/51—Elastic
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2405/00—Adhesive articles, e.g. adhesive tapes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
  • B32B2457/204—Plasma displays
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/12—Esters of monohydric alcohols or phenols
  • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
  • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
  • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
  • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
  • H01J2211/20—Constructional details
  • H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
  • H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
  • H01J2211/446—Electromagnetic shielding means; Antistatic means
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
  • Y10T428/2852—Adhesive compositions
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
  • Y10T428/2852—Adhesive compositions
  • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
  • Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
  • Y10T428/2852—Adhesive compositions
  • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
  • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]

Definitions

• the present invention relates to a pressure sensitive adhesive for sticking an electromagnetic wave-shielding film and an optically functional film, and a display panel filter element containing the same.
• the pressure sensitive adhesive according to the present invention can be used for the manufacture of a display panel filter element constituting, for example, a plasma display panel or the like.
• an electromagnetic wave emitted from an electromagnetic device affects not only other electromagnetic devices, but also the human body.
• an electromagnetic wave having a frequency of 30 MHz to 130 MHz is emitted from a plasma display, and may affect computers and computer peripherals positioned therearound. Accordingly, the emitted electromagnetic wave should be prevented from leaking toward the outside.
• An electromagnetic wave may be shielded, for example, by a method of covering an emitting source with a case formed from a highly conductive material, or a method of applying a conductive net on the emitting source.
• an apparatus such as a plasma display, which must be observed, requires transmittability, and the above methods cannot be adopted.
• an electromagnetic wave-shielding sheet composed of a transparent substrate film and a metal foil mesh carried thereon via an adhesive layer is used as a means having not only transmittability but also a property of shielding an electromagnetic wave.
• the metal foil mesh is formed by mounting a metal foil on the transparent substrate film via the adhesive layer, and forming pores by etching the metal foil.
• the electromagnetic wave-shielding film which is a laminate of the transparent substrate film, the adhesive layer, and the metal foil mesh, can provide a required shielding property by appropriately adjusting a thickness of the metal foil or a size of the mesh pores, even if the strength of an emitted electromagnetic wave is high as in a plasma display. Further, it also has a sufficient transparency to assure a visibility of the display screen (see, for example Patent Document No. 1).
• the electromagnetic wave-shielding film is stuck together with various optically functional films, such as a near infrared light-absorbing film, an ultraviolet light-absorbing film, or an antireflective film by a pressure sensitive adhesive applied onto the metal foil mesh on the surface of the electromagnetic wave-shielding film.
• various optically functional films such as a near infrared light-absorbing film, an ultraviolet light-absorbing film, or an antireflective film by a pressure sensitive adhesive applied onto the metal foil mesh on the surface of the electromagnetic wave-shielding film.
• an autoclaving treatment is generally carried out under a pressure of about 0.3 to 1.5 MPa at about 40 to 80° C.
• the inside of the pores of the metal foil mesh having a fine concave-convex surface structure is entirely filled with the pressure sensitive adhesive under pressure, to entirely exclude bubbles; this property will be hereinafter sometimes referred to as the “filling-in property”.
• the pressure sensitive adhesive used in the above sticking must have a sufficient adhesive strength between the metal foil mesh on the surface of the electromagnetic wave-shielding film and the optically functional film, and a sufficient adhesive strength between the optically functional film and the adhesive layer (for the metal foil) exposed in the pores of the metal foil mesh so that a separation of the electromagnetic wave-shielding film from the optically functional film is prevented.
• pressure sensitive adhesives conventionally used to stick together the electromagnetic wave-shielding film and various optically functional films have defects in that the adhesive strength is insufficient, it does not entirely fill the inside of the pores of the metal foil mesh under pressure, or bubbles are generated during a heat treatment.
• the inventors of the present invention found that, in the particular application of a pressure sensitive adhesive for sticking together an electromagnetic wave-shielding film and an optically functional film, a high adhesive strength can be obtained by adjusting viscoelastic parameters of the pressure sensitive adhesive within a particular scope.
• the object of the present invention is to provide a pressure sensitive adhesive which exhibits a sufficient adhesive strength, can be entirely filled into the inside of the pores of the metal foil mesh under pressure, and does not generate bubbles during a heat treatment, in the sticking together of an electromagnetic wave-shielding film and various optically functional films.
• a pressure sensitive adhesive for sticking together an electromagnetic wave-shielding film and an optically functional film, wherein a storage elastic modulus at 70° C. is 7.00 ⁇ 10 4 Pa or more.
• a storage elastic modulus at 23° C. is 1.00 ⁇ 10 5 Pa or more.
• a peak temperature of loss tangent (tan ⁇ ) is ⁇ 15° C. or more.
• the pressure sensitive adhesive of the present invention comprises an acrylic copolymer containing (meth)acrylic alkyl ester monomers, and optionally further containing nitrogen-containing vinyl monomers, as comonomers.
• the acrylic copolymer does not contain an acid comonomer.
• the present invention also relates to a display panel filter element comprising
• the pressure sensitive adhesive of the present invention can be entirely filled into the inside of the pores of the metal foil mesh under heating and pressed, and has a durability under an elevated temperature and a high humidity condition, by adjusting the storage elastic modulus at an autoclaving treatment of 70° C. within a particular scope.
• the pressure sensitive adhesive of the present invention also has a higher storage elastic modulus at a normal temperature of 23° C. in comparison with conventional pressure sensitive adhesives, and therefore, exhibits good adhesive properties to the surface of the metal foil mesh on the electromagnetic wave-shielding film.
• the pressure sensitive adhesive of the present invention has an excellent corrosion resistance, and therefore, the metal foil mesh is not corroded when applied on the electromagnetic wave-shielding film.
• a pressure sensitive adhesive has viscoelasticity, and thus shows a viscous behavior and an elastic behavior.
• viscoelastic parameters quantitatively representing viscoelasticity the storage elastic modulus (G′), loss elastic modulus (G′′), and loss tangent (tan ⁇ ) are widely used.
• the storage elastic modulus is defined as a ratio of elastic stresses at the same phase of strain, and is associated with a capability of the material to elastically store an energy.
• the loss elastic modulus is a ratio at a different phase of strain, and corresponds to a capability of the material to dissipate a stress as heat.
• the ratio (G′′/G′) of the above elastic moduli is defined as a loss tangent (tan ⁇ ), and represents a ratio of a viscous component to an elastic component in the material.
• the storage elastic modulus at 70° C. of the pressure sensitive adhesive of the present invention is 7.00 ⁇ 10 4 Pa or more, preferably 8.00 ⁇ 10 4 Pa or more, more preferably 9.00 ⁇ 10 4 Pa or more.
• the temperature of 70° C. is a typical temperature at which an electromagnetic wave-shielding film and an optically functional film are stuck together in an autoclave. If the storage elastic modulus (G′) at 70° C. is less than 7.00 ⁇ 10 4 Pa, durability in the particular application according to the present invention may be deteriorated under an elevated temperature and a high humidity. An upper limit of the storage elastic modulus (G′) at 70° C. does not exist.
• the pressure at the autoclaving treatment must be increased so that the pressure sensitive adhesive is applied over the metal foil mesh on the surface of the electromagnetic wave-shielding film, and the inside of the pores of the metal foil mesh having a fine concave-convex surface structure is entirely filled with the pressure sensitive adhesive.
• the upper limit of the storage elastic modulus at 70° C. may be preferably 1.00 ⁇ 10 6 Pa.
• the storage elastic modulus (G′) at 23° C. of the pressure sensitive adhesive of the present invention is preferably 1.00 ⁇ 10 5 Pa or more, more preferably 1.50 ⁇ 10 5 Pa or more, most preferably 2.00 ⁇ 10 5 Pa or more. If the storage elastic modulus (G′) at 23° C. is less than 1.00 ⁇ 10 5 Pa, the adhesive strength between the electromagnetic wave-shielding film and the optically functional film may be insufficient in the particular application according to the present invention. There is not a particular upper limit of the storage elastic modulus (G′) at 23° C. In the particular application according to the present invention, however, if the storage elastic modulus at 23° C. (G′) becomes too high, the sticking abilities are reduced. In this regard, the upper limit of the storage elastic modulus at 23° C. may be preferably 1.00 ⁇ 10 6 Pa.
• the peak temperature of loss tangent (tan ⁇ ) of the pressure sensitive adhesive of the present invention is preferably ⁇ 15° C. or more, more preferably ⁇ 12° C. or more. If the peak temperature is less than ⁇ 15° C., it might be difficult to obtain a desired adhesive strength. There is not a particular upper limit of the peak temperature of loss tangent (tan ⁇ ). However, if the peak temperature of loss tangent becomes too high, sticking abilities are reduced. In this regard, the upper limit of the peak temperature of loss tangent may be preferably 30° C.
• the adhesive strength of the pressure sensitive adhesive of the present invention is preferably 20 to 50 N/25 mm, more preferably 22 to 45 N/25 mm, under the conditions shown in Examples as mentioned below.
• a preferable example of the pressure sensitive adhesive of the present invention is an acrylic copolymer containing (meth)acrylic alkyl ester monomers as a comonomer, particularly an acrylic copolymer containing (meth)acrylic alkyl ester monomers and nitrogen-containing vinyl monomers as a comonomer.
• a ratio of the nitrogen-containing vinyl monomers to all the comonomers contained the acrylic copolymer is preferably 0.1-30.0% by mass, more preferably 3-30% by mass, most preferably 4-25% by mass.
• a mixture of monomers constituting the acrylic copolymer is referred to as a monomer mixture. If an amount of the nitrogen-containing vinyl monomers used is less than 0.1% by mass, the adhesive strength may become extremely low. If an amount of the nitrogen-containing vinyl monomers used is more than 30% by mass, the filling-in property may be deteriorated.
• the (meth)acrylic alkyl ester monomer is, for example, an alkyl acrylate or alkyl methacrylate containing an alkyl ester moiety having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms.
• One or more of the (meth)acrylic alkyl ester monomer as above may be used at an amount of preferably 70-97% by mass, more preferably 75-95% by mass, in the monomer mixture. If the amount of the (meth)acrylic alkyl ester monomer is less than 70% by mass, the filling-in property may be deteriorated. If an amount of the (meth)acrylic alkyl ester monomer is more than 97% by mass, the adhesive strength may become extremely low.
• the monomer mixture which is a mixture of constitutional components of the acrylic copolymer, further contains monomers containing one or more cross-linking functional groups in a molecule.
• the cross-linking functional group may be, for example, a hydroxyl group, an amide group, an amino group, a carboxyl group, or a carbon-carbon unsaturated bond.
• a hydroxy group, an amide group, an amino group or a carboxyl group is reacted with a cross-linking agent to form a cross-linked structure, whereas an addition reaction of carbon-carbon unsaturated bonds forms a cross-linked structure.
• a hydroxyalkyl(meth)acrylate such as 2-hydroxyethyl(meth)acrylate, 2-hydroxypropyl(meth)acrylate, 3-hydroxypropyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, 3-hydroxybutyl(meth)acrylate, 4-hydroxybutyl(meth)acrylate; an acrylamide, such as acrylamide, methacrylamide, N-methyl acrylamide, N-methylmethacrylamide, N-methylolacrylamide, N-methylolmethacrylamide ⁇ ⁇ a monoalkylaminoalkyl(meth)acrylate, such as monomethylaminoethyl(meth)acrylate, monoethylaminoethyl(meth)acrylate, monomethylaminopropyl(meth)acrylate, monoethylaminopropyl(meth)acrylate n
• the monomer containing a cross-linking functional group in a molecule as above may be used alone or in a combination thereof.
• the group containing one or more carbon-carbon unsaturated bonds is for example a (meth)acryloyl group.
• the cross-linking functional group-containing monomer does not contain an acid component, from a standpoint of a suppression of corrosion of the metal foil mesh, and thus, hydroxyalkyl (meth)acrylate is particularly preferable.
• the cross-linking functional group-containing monomer can be used at an amount of, preferably 0-10% by mass, more preferably 0.2-5% by mass, in the monomer mixture.
• nitrogen-containing vinyl monomer there may be mentioned, for example, (meth)acrylamide, N-tert-butylacrylamide, N-vinylpyrrolidone, N,N-dimethylacrylamide, N,N-diethylacrylamide, N,N-dimethylaminopropylacrylamide, N-isopropylacrylamide, N-phenylacrylamide, dimethylaminopropylacrylamide, N-vinylcaprolactam, acryloyl morpholine, dimethylaminoethyl acrylate, or acryloylpiperidine.
• Tg glass-transition temperature
• acrylamide (119° C.), methacrylamide (171° C.), N-tert-butylacrylamide (135° C.), N,N-dimethylacrylamide (119° C.), N,N-dimethylaminopropylacrylamide (119° C.), N-isopropylacrylamide (134° C.), N-phenylacrylamide (160° C.), acryloyl morpholine (145° C.), or acryloylpiperidine (116° C.), and acryloyl morpholine, or N,N-dimethylacrylamide is particularly preferable.
• the temperature shown in brackets is a glass-transition temperature of the corresponding homopolymer.
• the nitrogen-containing vinyl monomer also may be the cross-linking functional group-containing monomer.
• the acrylic copolymer may optionally contain other monomers such as vinyl acetate or styrene, as a comonomer.
• the acrylic copolymer can be prepared, for example, by any known polymerization methods, such as a solution polymerization or a mass polymerization from the monomer mixture containing the (meth)acrylic alkyl ester monomers and the nitrogen-containing vinyl monomers.
• the weight-average molecular weight thereof is preferably about 200 to 1800 thousands, more preferably 500 to 1500 thousands.
• the acrylic copolymer is cross-linked with a cross-linking agent.
• a cross-linking agent there may be mentioned, for example, a polyisocyanate compound, a metal chelate compound, or an epoxy compound, and the polyisocyanate compound is preferable.
• the polyisocyanate compound there may be mentioned, for example, a compound containing two or more isocyanate groups, such as, tolylene diisocyanate or a hydride thereof, an adduct of tolylene diisocyanate with trimethylolpropane, triphenylmethane triisocyanate, methylene-bis-di-phenylisocyanate or a hydride thereof, hexamethylene diisocyanate, an adduct of hexamethylene diisocyanate with trimethylolpropane, xylylenediisocyanate, an adduct of xylenediisocyanate with trimethylolpropane, 4 , 4 ′-dicyclohexylmethane diisocyanate, or polymerization product thereof.
• An amount of the cross-linking agent used is not particularly limited, but generally, is 0.01 to 10 parts by mass with respect to 100 parts by mass of the acrylic copolymer.
• the pressure sensitive adhesive of the present invention may contain, in addition to the acrylic copolymer as above, for example, a tackifier resin such as petroleum resin, terpene resin, rosin resin, coumarone-indene resin or phenol resin, antioxidant, ultraviolet absorber, light stabilizer, softening agent, anticorrosive agent, or silane coupling agent or filler, or other appropriate additives, so long as the object of the present invention is not inhibited.
• a tackifier resin such as petroleum resin, terpene resin, rosin resin, coumarone-indene resin or phenol resin, antioxidant, ultraviolet absorber, light stabilizer, softening agent, anticorrosive agent, or silane coupling agent or filler, or other appropriate additives, so long as the object of the present invention is not inhibited.
• the pressure sensitive adhesive of the present invention can contain a near infrared ray adsorbing agent, a neon light shielding agent, dyestuff, pigment or the like to prevent or alleviate an emission of various optical radiations, such as near infrared ray or neon light, from the plasma display.
• the near infrared ray adsorbing agent there may be mentioned, for example, a colorant, such as a colorant of cyanines, thiols, metal complexs, an azo compound, polymethines, diphenyl methanes, triphenyl methanes quinines or diimmonium salt.
• a colorant such as a colorant of cyanines, thiols, metal complexs, an azo compound, polymethines, diphenyl methanes, triphenyl methanes quinines or diimmonium salt.
• Two or more agents as mentioned above can be generally used in combination in accordance with the wavelengths of two or more near infrared rays emitted from the plasma display.
• the neon light shielding agent there may be mentioned, for example, a cyanine compound, a squalium compound, an azomethine compound, a xanthene compound, or an oxonol compound.
• the pressure sensitive adhesive of the present invention is used for sticking together the electromagnetic wave-shielding film and the optically functional film, as mentioned above.
• the electromagnetic wave-shielding film may be a laminate of
• the electromagnetic wave-shielding film can be prepared, for example, by a method comprising placing a metal foil on one surface of a transparent substrate film carrying thereon an adhesive for a metal foil, and etching the metal foil to form a metal foil mesh.
• a metal foil there may be mentioned a foil of a metal such as copper, iron, nickel, or chromium, or an alloy thereof, or an alloy containing one or more above-mentioned metals as main components.
• the metal foil is not particularly limited, but a copper foil is preferable because an electromagnetic wave can be effectively shielded, an etching procedure can be easily conducted, and the workability is good.
• the thickness of the metal foil is preferably 1 ⁇ m to 100 ⁇ m, more preferably 5 ⁇ m to 20 ⁇ m. If the thickness is less than 1 ⁇ m, an electromagnetic wave cannot be sufficiently shielded. If the thickness is more than 100 ⁇ m, side-etching proceeds and cannot be ignored, and thus, it is difficult to form pores in an accurate manner.
• the metal foil may have a blackened layer formed by a blackening treatment on the side of the transparent substrate film, to impart not only an anticorrosive property but also an anti-reflective property. A chromate treatment can be carried out on the blackened layer as an anticorrosive treatment. When a metal foil without a pre-blackening treatment is used, a blackening treatment can be carried out at any one of the subsequent steps.
• the blackened layer also can be formed by forming a photosensitive resin layer, which may be a resist layer, from a black-colored composition, carrying out an etching, and allowing the resist layer to remain.
• a metal plating can be used to form a black coating.
• the transparent substrate film and the metal foil can be laminated without an adhesive layer therebetween.
• the lamination is carried out by a dry laminate method or the like, using an adhesive.
• an adhesive such as an acrylic resin, a polyester resin, a polyurethane resin, a polyvinyl alcohol resin, a vinyl chloride/vinyl acetate copolymer resin, or a ethylene/vinyl acetate copolymer resin.
• a thermosetting resin or a radiation-curable resin such as a ultraviolet ray-curable resin, an electron radiation-curable resin can be used.
• the metal foil on the resulting laminate is etched to form thick pores, whereby a mesh is formed.
• an electromagnetic wave-shielding film which is a laminate of the transparent substrate film, the adhesive layer, and the metal foil mesh can be obtained.
• the metal foil mesh which is one of the subjects to be stuck with the pressure sensitive adhesive of the present invention, is required to have a transmittability, and an aperture ratio of the metal foil mesh used is generally 65 to 95%.
• the aperture ratio means a ratio of a transmittable portion without the metal foil to an area of the metal foil mesh.
• the thickness of the metal foil mesh is preferably 1 ⁇ m to 100 ⁇ m, more preferably 5 ⁇ m to 20 ⁇ m.
• the pressure sensitive adhesive of the present invention can be applied on the side of the metal foil mesh of the electromagnetic wave-shielding film or the surface of the optically functional film by any known methods, to thereby form a film carrying the pressure sensitive adhesive.
• the pressure sensitive adhesive can be applied, for example, by a method comprising forming a layer of the pressure sensitive adhesive of the present invention on a releasable surface of the release sheet by a known applying method, and laying the layer of the pressure sensitive adhesive on the side of the metal foil mesh or the surface of the optically functional film to transfer the layer thereto, or a method comprising applying the pressure sensitive adhesive on the side of the metal foil mesh or the surface of the optically functional film by a known applying method.
• the applying method may be, for example, a roll coater, a knife coater, a die coater, a blade coater, a gravure coater, a screen printing, or the like.
• the pressure sensitive adhesive of the present invention is applied on the side of the metal foil mesh of the electromagnetic wave-shielding film or the surface of the optically functional film, it is subjected to an autoclaving treatment in the state that it is stuck to the metal foil mesh side and the optically functional film surface.
• the autoclaving treatment can be carried out by a known method, for example, at 40 to 80° C., under the pressure of 0.3 to 1.5 MPa.
• the pressure sensitive adhesive is applied at a thickness such that it can entirely cover the metal foil mesh.
• the thickness of the resulting pressure sensitive adhesive after the autoclaving treatment is preferably 20 ⁇ m to 100 ⁇ m, more preferably 20 ⁇ m to 40 ⁇ m.
• optically functional film there may be mentioned, for example, a film absorbing a near infrared or infrared light, a film absorbing a neon light, a film absorbing an ultraviolet light, a film preventing or alleviating a leakage of an electromagnetic wave in addition to the metal foil mesh, a film inhibiting a reflection of an outside light, or a film adjusting a color tone. Further, a film protecting a glass surface of a display panel, or a film preventing a glass from shattering also can be stuck.
• a substrate of the optically functional film may be a film of polyethylene terephthalate, polymethyl methacrylate, polycarbonate or the like. The thickness of the substrate is about 20 ⁇ m to 300 ⁇ m.
• the display panel filter element according to the present invention comprises
• the display panel filter element can be used as a component of a plasma display panel or the like.
• a trifunctional adduct based on xylenediisocyanate [TD-75: manufactured by Soken Chemical & Engineering Co., Ltd.] was added as a cross-linking agent at an amount of 0.5 part by mass with respect to 100 parts by mass of solid content of the copolymer solution.
• the whole was diluted with 2-butanone to a solution having a concentration of 25% by mass, to thereby obtain a solution of a pressure sensitive adhesive.
• a glass-transition temperature of acryloyl morpholine homopolymer was 145° C.
• the resulting solution of the pressure sensitive adhesive was coated on a releasable surface of a release film [SP-PET3811: manufactured by LINTEC Corporation] by a knife coater, and dried at 90° C. for one minute to obtain a layer of the pressure sensitive adhesive with a thickness of 25 ⁇ m.
• a polyethylene terephthalate film [CosmoshineA4300: manufactured by Toyobo Co., Ltd.] with a thickness of 100 ⁇ m was laminated as a substrate of an optically functional film to obtain a film carrying the pressure sensitive adhesive.
• Example 2 The procedure of Example 1 was repeated, except that 59.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 0.5 part by mass of 2-hydroxyethyl acrylate, and 10 parts by mass of acryloyl morpholine were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 850 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 54.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 0.5 part by mass of 2-hydroxyethyl acrylate, and 15 parts by mass of acryloyl morpholine were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 850 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 49.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 0.5 part by mass of 2-hydroxyethyl acrylate, and 20 parts by mass of acryloyl morpholine were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 850 thousand.
• Example 1 The procedure of Example 1 was repeated, except that 64.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 0.5 part by mass of 2-hydroxyethyl acrylate, and 5 parts by mass of N,N-dimethyl acrylamide were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• a glass-transition temperature of the homopolymer of N,N-dimethyl acrylamide was 119° C.
• Example 2 The procedure of Example 1 was repeated, except that 59.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 0.5 part by mass of 2-hydroxyethyl acrylate, and 10 parts by mass of N,N-dimethyl acrylamide were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 1 The procedure of Example 1 was repeated, except that 54.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 0.5 part by mass of 2-hydroxyethyl acrylate, and 15 parts by mass of N,N-dimethyl acrylamide were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 49.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 0.5 part by mass of 2-hydroxyethyl acrylate, and 20 parts by mass of N,N-dimethyl acrylamide were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 59 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 1 part by mass of 2-hydroxyethyl acrylate, and 10 parts by mass of acryloyl morpholine were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 58 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 2 parts by mass of 2-hydroxyethyl acrylate, and 10 parts by mass of acryloyl morpholine were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 57 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 3 parts by mass of 2-hydroxyethyl acrylate, and 10 parts by mass of acryloyl morpholine were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 54 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 1 part by mass of 2-hydroxyethyl acrylate, and 10 parts by mass of acryloyl morpholine were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 49.5 parts by mass of n-butyl acrylate, 30 parts by mass of methyl acrylate, 20 parts by mass of methyl methacrylate, and 0.5 part by mass of 2-hydroxyethyl acrylate were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 800 thousand.
• Example 2 The procedure of Example 1 was repeated, except that 79 parts by mass of n-butyl acrylate, 20 parts by mass of methyl acrylate, and 1 part by mass of 2-hydroxyethyl acrylate were used as monomer components, to obtain a film carrying a pressure sensitive adhesive.
• a weight-average molecular weight of the resulting acrylate ester copolymer was 900 thousand.
• a copper mesh-laminated film was prepared as an electromagnetic wave-shielding film to be used in the following evaluation of properties, as follows:
• a resist solution containing casein as a main ingredient was coated on the copper foil side of the resulting laminate and dried to form a photosensitive resin layer.
• a mask with a pattern was used to conduct a contact exposure with an ultraviolet ray.
• the laminate was developed with water, cured, and baked at 100° C. to form a resist pattern.
• the mask used had a pattern with pitches of 300 ⁇ m and line widths of 10 ⁇ m.
• the laminate was washed and dried to obtain a copper mesh laminate, i.e., an electromagnetic wave-shielding film, composed of the polyethylene terephthalate film/the layer of the adhesive for a metal foil/the copper mesh.
• the aperture ratio of the copper foil was 80%, and the thickness of the copper foil was 10 ⁇ m.
• a sample having a width of 25 mm and a length of 240 mm was cut from each of the films carrying the pressure sensitive adhesive. After a release film was peeled therefrom, the film carrying the pressure sensitive adhesive was stuck to the copper mesh laminate on the copper mesh side. The whole was pressed in an autoclave (manufactured by Kurihara Manufactory Inc.) under 0.5 MPa at 70° C. for 30 minutes, and then allowed to stand at 23° C. under a relative humidity of 50% for 24 hours. Thereafter, an adhesive strength was measure by a tensile strength tester (Tensilon: manufactured by Orientec Co., Ltd.) at a peeling rate of 300 mm/min and a peeling angle of 180°. In all films prepared in Examples 1 to 12 and Comparative Examples 1 and 2, the peeling occurred at an interface between the pressure sensitive adhesive and the copper mesh.
• a tensile strength tester Teensilon: manufactured by Orientec Co., Ltd.
• a loss tangent (tan ⁇ ) can be calculated from a storage elastic modulus (G′) and a loss elastic modulus (G′′) by the following equation:
• a sample having a width of 50 mm and a length of 120 mm was cut from each of the films carrying the pressure sensitive adhesive. After a release film was peeled therefrom, the film carrying the pressure sensitive adhesive was stuck to the copper mesh laminate on the copper mesh side. The whole was pressed in an autoclave (manufactured by Kurihara Manufactory Inc.) under 0.5 MPa at 70° C. for 30 minutes, and then the existence or nonexistence of bubbles was visually observed. The results were evaluated as follows:
• a sample having a width of 50 mm and a length of 120 mm was cut from each of the films carrying the pressure sensitive adhesive. After a release film was peeled therefrom, the film carrying the pressure sensitive adhesive was stuck to the copper mesh laminate on the copper mesh side. The whole was pressed in an autoclave (manufactured by Kurihara Manufactory Inc.) under 0.9 MPa at 70° C. for 60 minutes, and then allowed to stand at 23° C. under a relative humidity of 90% for 24 hours, and further, at 80° C. under a relative humidity of 50% for 24 hours. Thereafter, the appearance was visually evaluated as follows:
• a sample having a width of 50 mm and a length of 120 mm was cut from each of the films carrying the pressure sensitive adhesive. After a release film was peeled therefrom, the film carrying the pressure sensitive adhesive was stuck to the copper mesh laminate on the copper mesh side. The whole was pressed in an autoclave (manufactured by Kurihara Manufactory Inc.) under 0.5 MPa at 70° C. for 30 minutes (pressure conditions 1), or under 0.9 MPa at 70° C. for 60 minutes (pressure conditions 2) to obtain specimens for evaluation. Before and after the specimen was allowed to stand at 60° C.
• Example 1 22.8 23.0 2.82 ⁇ 10 5 1.02 ⁇ 10 5 ⁇ 10.0 ⁇ ⁇ 0.28 0.28
• Example 2 25.0 25.0 3.15 ⁇ 10 5 1.26 ⁇ 10 5 ⁇ 1.5 ⁇ ⁇ 0.40 0.41
• Example 3 29.0 34.0 4.56 ⁇ 10 5 1.56 ⁇ 10 5 5.0 ⁇ ⁇ 0.31 0.33
• Example 4 36.3 36.0 7.47 ⁇ 10 5 1.33 ⁇ 10 5 15.0 ⁇ ⁇ 0.66 0.66
• Example 5 22.0 23.0 2.11 ⁇ 10 5 7.67 ⁇ 10 4 ⁇ 11.0 ⁇ ⁇ 0.34 0.34
• Example 6 28.0 25.0 2.19 ⁇ 10 5 8.34 ⁇ 10 4 ⁇ 3.0 ⁇ ⁇ 0.52 0.55
• Example 7 37.5 34.0 3.27 ⁇ 10 5 9.66 ⁇ 10 4 2.7 ⁇ ⁇ 0.48 0.51
• Example 8 41.7 36.0 6.79 ⁇ 10 5 1.42 ⁇ 10 5 10.1 ⁇ ⁇ 0.51 0.51
• Example 9 27.5
• the pressure sensitive adhesive of the present invention can be used, for example, in the manufacture of a display panel filter element constituting a plasma display panel or the like, and in the manufacture of a display using the same.

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