US20060180839A1 - Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same - Google Patents
Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same Download PDFInfo
- Publication number
- US20060180839A1 US20060180839A1 US11/354,144 US35414406A US2006180839A1 US 20060180839 A1 US20060180839 A1 US 20060180839A1 US 35414406 A US35414406 A US 35414406A US 2006180839 A1 US2006180839 A1 US 2006180839A1
- Authority
- US
- United States
- Prior art keywords
- ferromagnetic
- film
- layer
- magnetic layer
- layered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
- H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3281—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn only by use of asymmetry of the magnetic film pair itself, i.e. so-called pseudospin valve [PSV] structure, e.g. NiFe/Cu/Co
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/303—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices with exchange coupling adjustment of magnetic film pairs, e.g. interface modifications by reduction, oxidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/11—Magnetic recording head
- Y10T428/1107—Magnetoresistive
- Y10T428/1114—Magnetoresistive having tunnel junction effect
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Hall/Mr Elements (AREA)
- Thin Magnetic Films (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Semiconductor Memories (AREA)
- Magnetic Heads (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/834,646 US8865326B2 (en) | 2005-02-16 | 2010-07-12 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
US14/454,102 US20140346625A1 (en) | 2005-02-16 | 2014-08-07 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005039852 | 2005-02-16 | ||
JP2005-039852 | 2005-02-16 | ||
JP2005-361431 | 2005-12-15 | ||
JP2005361431A JP5077802B2 (ja) | 2005-02-16 | 2005-12-15 | 積層強磁性構造体、及び、mtj素子 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/834,646 Continuation US8865326B2 (en) | 2005-02-16 | 2010-07-12 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060180839A1 true US20060180839A1 (en) | 2006-08-17 |
Family
ID=36570618
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/354,144 Abandoned US20060180839A1 (en) | 2005-02-16 | 2006-02-15 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
US12/834,646 Active 2026-05-29 US8865326B2 (en) | 2005-02-16 | 2010-07-12 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
US14/454,102 Abandoned US20140346625A1 (en) | 2005-02-16 | 2014-08-07 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/834,646 Active 2026-05-29 US8865326B2 (en) | 2005-02-16 | 2010-07-12 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
US14/454,102 Abandoned US20140346625A1 (en) | 2005-02-16 | 2014-08-07 | Magnetoresistance device including layered ferromagnetic structure, and method of manufacturing the same |
Country Status (5)
Country | Link |
---|---|
US (3) | US20060180839A1 (de) |
EP (1) | EP1693854B1 (de) |
JP (1) | JP5077802B2 (de) |
CN (1) | CN1822219B (de) |
DE (1) | DE602006018377D1 (de) |
Cited By (34)
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US20070278602A1 (en) * | 2006-06-06 | 2007-12-06 | Wolfgang Raberg | MRAM structure using sacrificial layer for anti-ferromagnet and method of manufacture |
US20080186638A1 (en) * | 2007-02-05 | 2008-08-07 | Kazumasa Nishimura | Tunneling magnetic sensing element having free magnetic layer inserted with nonmagnetic metal layers |
US20090219754A1 (en) * | 2005-05-19 | 2009-09-03 | Nec Corporation | Magnetoresistive device and magnetic memory using the same |
US7695761B1 (en) | 2006-12-21 | 2010-04-13 | Western Digital (Fremont), Llc | Method and system for providing a spin tunneling magnetic element having a crystalline barrier layer |
US20100258889A1 (en) * | 2007-07-23 | 2010-10-14 | Magic Technologies, Inc. | High performance MTJ elements for STT-RAM and method for making the same |
WO2010126723A1 (en) * | 2009-04-30 | 2010-11-04 | Everspin Technologies, Inc. | A method for reducing current density in a magnetoelectronic device |
US20110109397A1 (en) * | 2009-11-06 | 2011-05-12 | Commissariat A I'energie Atomique Et Aux Energies Alternatives | Radiofrequency oscillator |
US20110222335A1 (en) * | 2007-09-25 | 2011-09-15 | Kabushiki Kaisha Toshiba | Magnetoresistive element and magnetoresistive random access memory including the same |
US20120069471A1 (en) * | 2010-09-16 | 2012-03-22 | Hitachi Global Storage Technologies Netherlands B.V. | Current-perpendicular-to-plane (cpp) read sensor with ferromagnetic buffer, shielding and seed layers |
US8194365B1 (en) | 2009-09-03 | 2012-06-05 | Western Digital (Fremont), Llc | Method and system for providing a read sensor having a low magnetostriction free layer |
US8243401B2 (en) | 2009-10-02 | 2012-08-14 | Hitachi Global Storage Technologies Netherlands B.V. | Tunneling magnetoresistance read sensor with dual sense layers |
US8383427B2 (en) | 2008-06-04 | 2013-02-26 | Renesas Electronics Corporation | Semiconductor device including a magnetic tunnel junction device including a laminated structure and manufacturing method therefor |
US20130077390A1 (en) * | 2011-09-28 | 2013-03-28 | Crocus Technology Sa | Magnetic random access memory (mram) cell, method for writing and reading the mram cell using a self-referenced read operation |
US20130099339A1 (en) * | 2011-10-20 | 2013-04-25 | The United States Of America As Represented By The Secretary Of The Army | Spintronic Electronic Device and Circuits |
US8451566B2 (en) | 2010-09-16 | 2013-05-28 | HGST Netherlands B.V. | Current-perpendicular-to-plane (CPP) read sensor with ferromagnetic buffer and seed layers |
US8498084B1 (en) | 2009-07-21 | 2013-07-30 | Western Digital (Fremont), Llc | Magnetoresistive sensors having an improved free layer |
US8545999B1 (en) | 2008-02-21 | 2013-10-01 | Western Digital (Fremont), Llc | Method and system for providing a magnetoresistive structure |
US8559141B1 (en) | 2007-05-07 | 2013-10-15 | Western Digital (Fremont), Llc | Spin tunneling magnetic element promoting free layer crystal growth from a barrier layer interface |
US20130313665A1 (en) * | 2010-05-26 | 2013-11-28 | Samsung Electronics Co., Ltd. | Magnetic Tunnel Junction Device Having Amorphous Buffer Layers That Are Magnetically Connected Together And That Have Perpendicular Magnetic Anisotropy |
US20140139214A1 (en) * | 2012-11-16 | 2014-05-22 | Korea Basic Science Institute | Magnetic sensor using spin transfer torque devices |
US20140159179A1 (en) * | 2010-08-30 | 2014-06-12 | Everspin Technologies, Inc. | Two-axis magnetic field sensor having reduced compensation angle for zero offset |
US20150084624A1 (en) * | 2013-09-25 | 2015-03-26 | Seagate Technology Llc | Magnetoresistive sensor |
US9070381B1 (en) | 2013-04-12 | 2015-06-30 | Western Digital (Fremont), Llc | Magnetic recording read transducer having a laminated free layer |
US20160035971A1 (en) * | 2006-12-12 | 2016-02-04 | Sony Corporation | Storage element and memory |
US20160181508A1 (en) * | 2014-12-23 | 2016-06-23 | Qualcomm Incorporated | Ultrathin perpendicular pinned layer structure for magnetic tunneling junction devices |
US9455400B2 (en) * | 2011-01-19 | 2016-09-27 | Headway Technologies, Inc. | Magnetic tunnel junction for MRAM applications |
US9484526B2 (en) * | 2014-07-18 | 2016-11-01 | Samsung Electronics Co., Ltd. | Magnetic memory device and method for forming the same |
US20170110509A1 (en) * | 2015-10-15 | 2017-04-20 | Jung-Hoon Bak | Mtj structures and magnetoresistive random access memory devices including the same |
US20170301383A1 (en) * | 2014-11-17 | 2017-10-19 | Imec Vzw | Magnetic memory having multiple gates and method of operating same |
WO2018063355A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Perpendicular sttm multi-layer insert free layer |
US9947865B2 (en) | 2011-06-10 | 2018-04-17 | Everspin Technologies, Inc. | Magnetoresistive stack and method of fabricating same |
US10141498B2 (en) | 2015-12-10 | 2018-11-27 | Everspin Technologies, Inc. | Magnetoresistive stack, seed region thereof and method of manufacturing same |
US10361361B2 (en) * | 2016-04-08 | 2019-07-23 | International Business Machines Corporation | Thin reference layer for STT MRAM |
US10483320B2 (en) | 2015-12-10 | 2019-11-19 | Everspin Technologies, Inc. | Magnetoresistive stack with seed region and method of manufacturing the same |
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US20080261082A1 (en) | 2006-12-28 | 2008-10-23 | Kazumasa Nishimura | Tunneling magnetoresistive element including multilayer free magnetic layer having inserted nonmagnetic metal sublayer |
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US8058697B2 (en) * | 2007-03-26 | 2011-11-15 | Magic Technologies, Inc. | Spin transfer MRAM device with novel magnetic synthetic free layer |
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US8536669B2 (en) | 2009-01-13 | 2013-09-17 | Qualcomm Incorporated | Magnetic element with storage layer materials |
US8957486B2 (en) * | 2009-03-04 | 2015-02-17 | Hitachi, Ltd. | Magnetic memory |
US8324697B2 (en) * | 2010-06-15 | 2012-12-04 | International Business Machines Corporation | Seed layer and free magnetic layer for perpendicular anisotropy in a spin-torque magnetic random access memory |
JP5786341B2 (ja) * | 2010-09-06 | 2015-09-30 | ソニー株式会社 | 記憶素子、メモリ装置 |
US9019758B2 (en) * | 2010-09-14 | 2015-04-28 | Avalanche Technology, Inc. | Spin-transfer torque magnetic random access memory with perpendicular magnetic anisotropy multilayers |
US8796796B2 (en) * | 2012-12-20 | 2014-08-05 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions having improved polarization enhancement and reference layers |
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US9230575B2 (en) | 2013-12-13 | 2016-01-05 | Seagate Technology Llc | Magnetoresistive sensor with SAF structure having crystalline layer and amorphous layer |
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Also Published As
Publication number | Publication date |
---|---|
US20100276771A1 (en) | 2010-11-04 |
CN1822219B (zh) | 2011-06-15 |
US8865326B2 (en) | 2014-10-21 |
CN1822219A (zh) | 2006-08-23 |
US20140346625A1 (en) | 2014-11-27 |
JP5077802B2 (ja) | 2012-11-21 |
EP1693854B1 (de) | 2010-11-24 |
EP1693854A3 (de) | 2007-01-10 |
DE602006018377D1 (de) | 2011-01-05 |
JP2006261637A (ja) | 2006-09-28 |
EP1693854A2 (de) | 2006-08-23 |
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