US20050199367A1 - Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device - Google Patents

Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device Download PDF

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Publication number
US20050199367A1
US20050199367A1 US10/522,349 US52234905A US2005199367A1 US 20050199367 A1 US20050199367 A1 US 20050199367A1 US 52234905 A US52234905 A US 52234905A US 2005199367 A1 US2005199367 A1 US 2005199367A1
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US
United States
Prior art keywords
heat
mobile radio
metal foil
present
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/522,349
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English (en)
Inventor
Jorg Romahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ROMAHN, JORG
Publication of US20050199367A1 publication Critical patent/US20050199367A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Definitions

  • the present invention relates to a method for heat dissipation in mobile radio devices, and to a corresponding mobile radio device.
  • An operating range with an environmental temperature generally of +55° C. is specified in mobile telecommunications terminals and in mobile radio devices, such as mobile telephones, PDAs and laptops.
  • mobile radio devices are constructed like a shell for the electronic components, wherein the temperature rises from shell to shell towards the components.
  • the maximum temperature is functionally limited.
  • the temperature close to the individual components in this case may be an environmental temperature of 82° C., while the temperature of the component itself may be up to 100° C.
  • the electronic components convert the majority of the energy/power supplied to them to heat, which heats not only the component itself but also its immediate surrounding area. The power that is converted to heat is, accordingly, a power loss.
  • heat sinks or fans have been mounted on the temperature-critical components.
  • care must be taken to ensure that good thermal coupling is provided between the heat sink and the electrical component which is heated by the power loss.
  • spaces between the corresponding component and the heat sink are filled with thermally conductive sheets or thermally conductive pastes.
  • the distribution of the heat in electrical components can be influenced by a matched structure.
  • Thermally conductive sheets and thermally conductive pastes are admittedly better thermal conductors than air, but they are also not adequate to ensure satisfactory heat dissipation for electrical components.
  • the present invention seeks to provide a method which makes it possible to ensure good and satisfactory heat dissipation from electronic components in mobile radio devices, as well as a corresponding mobile radio device.
  • a method for heat dissipation in mobile radio devices having heat-emitting, electrical components, in which the heat-emitting components are brought into heat-dissipating contact with a metal foil.
  • the metal foil is corrugated and/or is structured in the form of a honeycomb.
  • the use of a metal foil which is corrugated and/or is structured in the form of a honeycomb minimizes the resistance for heat dissipation.
  • the capability of the metal foil that is corrugated and/or is structured in the form of a honeycomb to deform results in any intermediate spaces which occur being completely filled, thus ensuring optimum heat dissipation.
  • the metal foil which is corrugated and/or in the form of a honeycomb can be arranged in an interlocking manner on the surfaces which can be brought into contact for heat dissipation.
  • the metal foil is brought into contact with a heat sink.
  • the heat sink may, for example, be a metallic body which either has a large area for radiated emission and/or a large volume as a heat sink.
  • the metal foil is itself used as a heat sink.
  • the magnitude of the heat loss to be dissipated determines whether the metal foil is itself adequate as a heat sink.
  • the honeycomb and/or corrugated structure provided according to the present invention offers a very large heat-emitting surface area.
  • the present invention covers a mobile radio device having heat-emitting electrical components, in which the components are each in heat-dissipating contact with a metal foil.
  • the metal foil is preferably corrugated and/or has a honeycomb structure.
  • the use of a metal foil which is corrugated or is structured in the form of a honeycomb enlarges the radiation-emitting surface area.
  • the heat dissipation resistance is minimized, on the one hand, by the use of a metallic foil as well as by its structure, which is corrugated or is in the form of a honeycomb.
  • the metal foil is in heat-dissipating contact with a heat sink.
  • the metal foil itself acts as a heat sink. Its honeycomb and/or corrugated structure results in it having a very large heat-emitting surface area.
  • the present invention covers the use of a metal foil which is corrugated and/or is structured in the form of a honeycomb for heat dissipation from heat-emitting electrical components in mobile radio devices.
  • FIG. 1 shows a schematic illustration of one implemented embodiment of the method according to the present invention.
  • FIG. 2 shows a schematic illustration of another implemented embodiment of the method according to the present invention.
  • FIG. 3 shows a schematic illustration of a further implemented embodiment of the method according to the present invention.
  • FIG. 1 shows a printed circuit board 1 which is fitted on one side with components 2 which develop a large amount of heat.
  • a heat sink 4 in the form of a cold plate is arranged on the other side of the printed circuit board 1 via suitable connecting elements 3 which, for example, may be screws or rivets.
  • suitable connecting elements 3 which, for example, may be screws or rivets.
  • a metal foil 5 or a metal paste is, according to the present invention, inserted in the space which occurs between the printed circuit board 1 and the heat sink 4 .
  • FIG. 2 shows another possible implementation of the method according to the present invention.
  • FIG. 2 once again shows a printed circuit board 1 which is fitted with a component 2 , that produces heat losses, on one side.
  • a shielding cover 6 is also provided above the component 2 for shielding.
  • a heat sink 4 is arranged on the other side of the printed circuit board 1 .
  • This may be a heat sink, a battery or a chassis.
  • a metal foil 5 which is corrugated and/or structured in the form of a honeycomb, is arranged in the resultant spaces between the component 2 or the printed circuit board 1 and the shielding cover 6 or the heat sink 4 .
  • the metal foil 5 which is corrugated and/or structured in the form of a honeycomb, to deform allows very good contact for heat transfer.
  • the metal foil 5 may provide only the junction to a heat sink 4 , in this case, in the space between the heat sink 4 and the printed circuit board 1 .
  • the metal foil 5 could itself act as a heat sink. This is because the use of a metal foil 5 with a corrugated or honeycomb structure considerably enlarges the radiation-emitting surface area.
  • FIG. 3 shows a further possible implementation of the method according to the present invention.
  • FIG. 3 shows a printed circuit board 1 with a lossy component 2 arranged on one side of the printed circuit board 1 .
  • a plastic part 7 is arranged on the other side of the printed circuit board 1 .
  • a metal foil 5 which is in the form of a honeycomb and/or is corrugated is provided between the plastic part 7 and the printed circuit board 1 and can be matched to the respective surfaces by virtue of its capability to be deformed well.
  • the metal foil 5 itself has a very large heat-emitting surface area, which represents an additional beneficial factor.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)
US10/522,349 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device Abandoned US20050199367A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10234500A DE10234500A1 (de) 2002-07-23 2002-07-23 Verfahren zur Wärmeableitung in Mobilfunkgeräten und ein entsprechendes Mobilfunkgerät
DE10234500.7 2002-07-23
PCT/DE2003/002441 WO2004017697A1 (de) 2002-07-23 2003-07-16 Verfahren zur wärmeableitung in mobilfunkgeräten und ein entsprechendes mobilfunkgerät

Publications (1)

Publication Number Publication Date
US20050199367A1 true US20050199367A1 (en) 2005-09-15

Family

ID=30469148

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/522,349 Abandoned US20050199367A1 (en) 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device

Country Status (7)

Country Link
US (1) US20050199367A1 (zh)
EP (1) EP1523870A1 (zh)
JP (1) JP2005534197A (zh)
CN (1) CN1669376A (zh)
AU (1) AU2003250308A1 (zh)
DE (1) DE10234500A1 (zh)
WO (1) WO2004017697A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105584A1 (en) * 2002-03-20 2005-05-19 Ngk Insulators Ltd Method of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en) * 2007-01-09 2007-07-12 Lockheed Martin Corporation High Performance Large Tolerance Heat Sink
CN105141727A (zh) * 2015-10-13 2015-12-09 太仓市和准电子科技有限公司 一种手机外壳
US20160320815A1 (en) * 2008-06-27 2016-11-03 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
CN107305292A (zh) * 2016-04-20 2017-10-31 佳能株式会社 头戴式显示器以及把持装置
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007300222A (ja) * 2006-04-27 2007-11-15 Kyocera Corp 電子機器
US8325483B2 (en) 2006-04-27 2012-12-04 Kyocera Corporation Electronic device including a heat conduction member
KR101390082B1 (ko) 2007-08-01 2014-05-28 삼성전자주식회사 프로젝터를 구비하는 이동통신 단말기
DE102015207893B3 (de) * 2015-04-29 2016-10-13 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul
DE102020005527A1 (de) * 2020-09-10 2022-03-10 Daimler Ag Kühlanordnung sowie Batterieanordnung mit einem von Wärmeleitpaste umgebenen Flachgebilde zur thermischen Kopplung

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5020138A (en) * 1989-04-03 1991-05-28 Sony Corporation Radio communication apparatus having cooling means
US5030793A (en) * 1990-05-07 1991-07-09 Motorola Inc. Integrated EMI filter and thermal heat sink
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
US5369879A (en) * 1992-06-05 1994-12-06 Eaton Corporation Method of mounting a semiconductor device to a heat sink
US5548090A (en) * 1995-08-21 1996-08-20 Northern Telecom Limited Heat sink and printed circuit board combination
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
US5783862A (en) * 1992-03-20 1998-07-21 Hewlett-Packard Co. Electrically conductive thermal interface
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6131646A (en) * 1998-01-19 2000-10-17 Trw Inc. Heat conductive interface material
US6257328B1 (en) * 1997-10-14 2001-07-10 Matsushita Electric Industrial Co., Ltd. Thermal conductive unit and thermal connection structure using the same
US6545352B1 (en) * 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694699A (en) * 1970-03-30 1972-09-26 Nat Beryllia Corp Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
JP2794154B2 (ja) * 1993-06-04 1998-09-03 ダイヤモンド電機 株式会社 ヒートシンク
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
DE19734110C1 (de) * 1997-08-07 1998-11-19 Bosch Gmbh Robert Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts
KR200239827Y1 (ko) * 1998-03-06 2001-09-25 구자홍 티브이용방열판
US6031727A (en) * 1998-10-26 2000-02-29 Micron Technology, Inc. Printed circuit board with integrated heat sink
DE60035798T2 (de) * 1999-12-01 2008-04-30 Cool Options, Inc. Tragrahmen eines wärmeleitenden materials

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5020138A (en) * 1989-04-03 1991-05-28 Sony Corporation Radio communication apparatus having cooling means
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5030793A (en) * 1990-05-07 1991-07-09 Motorola Inc. Integrated EMI filter and thermal heat sink
US5783862A (en) * 1992-03-20 1998-07-21 Hewlett-Packard Co. Electrically conductive thermal interface
US5369879A (en) * 1992-06-05 1994-12-06 Eaton Corporation Method of mounting a semiconductor device to a heat sink
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
US5548090A (en) * 1995-08-21 1996-08-20 Northern Telecom Limited Heat sink and printed circuit board combination
US6257328B1 (en) * 1997-10-14 2001-07-10 Matsushita Electric Industrial Co., Ltd. Thermal conductive unit and thermal connection structure using the same
US6131646A (en) * 1998-01-19 2000-10-17 Trw Inc. Heat conductive interface material
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6545352B1 (en) * 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105584A1 (en) * 2002-03-20 2005-05-19 Ngk Insulators Ltd Method of measuring thermal conductivity of honeycomb structure
US7682072B2 (en) * 2002-03-20 2010-03-23 Ngk Insulators, Ltd. Method of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en) * 2007-01-09 2007-07-12 Lockheed Martin Corporation High Performance Large Tolerance Heat Sink
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
US20160320815A1 (en) * 2008-06-27 2016-11-03 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
US10234916B2 (en) * 2008-06-27 2019-03-19 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
CN105141727A (zh) * 2015-10-13 2015-12-09 太仓市和准电子科技有限公司 一种手机外壳
CN107305292A (zh) * 2016-04-20 2017-10-31 佳能株式会社 头戴式显示器以及把持装置
EP3239762A1 (en) * 2016-04-20 2017-11-01 Canon Kabushiki Kaisha Head-mounted display and gripping apparatus
US10477730B2 (en) 2016-04-20 2019-11-12 Canon Kabushiki Kaisha Head-mounted display and gripping apparatus
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units

Also Published As

Publication number Publication date
WO2004017697A1 (de) 2004-02-26
JP2005534197A (ja) 2005-11-10
EP1523870A1 (de) 2005-04-20
AU2003250308A1 (en) 2004-03-03
DE10234500A1 (de) 2004-02-19
CN1669376A (zh) 2005-09-14

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AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ROMAHN, JORG;REEL/FRAME:016718/0683

Effective date: 20041126

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION