US20050006243A1 - Plating method and plating apparatus - Google Patents
Plating method and plating apparatus Download PDFInfo
- Publication number
- US20050006243A1 US20050006243A1 US10/717,584 US71758403A US2005006243A1 US 20050006243 A1 US20050006243 A1 US 20050006243A1 US 71758403 A US71758403 A US 71758403A US 2005006243 A1 US2005006243 A1 US 2005006243A1
- Authority
- US
- United States
- Prior art keywords
- plated
- plating
- carrier tape
- object product
- accommodating concave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007747 plating Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000005406 washing Methods 0.000 claims description 16
- 238000011144 upstream manufacturing Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 6
- 239000000243 solution Substances 0.000 description 28
- 238000010586 diagram Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Definitions
- the present invention relates to a plating method and a plating apparatus.
- Japanese Patent Application Laid-Open No.2002-220690 has disclosed such a conventional technology.
- a first aspect of the present invention concerns a plating method comprising putting an object product to be plated in each accommodating concave portion in a carrier tape which has a number of spaced accommodating concave portions and passing that object product to be plated through a plating apparatus by feeding the carrier tape so as to form metallic plating layer on the surface of the object product to be plated.
- washing units are disposed in the upstream and downstream of the plating apparatus and the object product to be plated is passed through each washing unit and washed.
- a plating apparatus comprising a feeding mechanism for the carrier tape containing a number of accommodating concave portions each capable of keeping an object product to be plated and a cell so constructed that the carrier tape can pass through plating solution and the cell is provided with a cathode member for supplying the object product to be plated with electricity.
- each accommodating concave portion in said carrier tape includes an opening which allows plating solution to flow in and out and said cathode member to invade.
- FIG. 1 is a schematic arrangement diagram provided by the plating method which plates continuously by feeding a carrier tape;
- FIG. 2 is a perspective structure diagram of the carrier tape when viewed from its front side
- FIG. 3 is a perspective structure diagram of major portions in the carrier tape as viewed from its rear side;
- FIG. 4 is a perspective structure diagram showing a condition in which the carrier tape is fed while it is supported by a cathode member provided in a cell;
- FIG. 5 is a schematic enlarged structure diagram showing the condition of FIG. 4 ;
- FIG. 6 is a partially broken perspective structure diagram showing the interior of the cell so constructed that the cathode member is provided above the same cell so as to feed the carrier tape in a upside down condition.
- FIG. 1 shows schematic arrangement diagram of a plating apparatus, in which a washing unit 1 filled with alkaline solution such as sodium hydrate solution, a plating unit 2 filled with plating solution, a washing unit 3 filled with water or the like, and a drying unit 4 are disposed in succession from an upstream to a downstream.
- Sprockets 6 , 6 , 6 are disposed to construct a feeding mechanism for the carrier tape 5 so that the carrier tape 5 can be passed through insides of the respective units 1 , 2 , 3 , 4 .
- these feeing sprockets 6 , 6 , 6 are rotated, the carrier tape 5 is fed successively from the upstream to the downstream. After plating and drying, the carrier tape 5 is wound around a reel 7 .
- a number of accommodating concave portions 51 , 51 , 51 are formed and then, an object product to be plated W such as a small electric part or automobile part is placed into each accommodating concave portion 51 on the upstream of the washing unit 1 .
- the object products to be plated W, W, W are placed in respective accommodating concave portions 51 , 51 , 51 and the carrier tape 5 is fed out by rotations of the sprockets 6 .
- the carrier tape 5 is passed through the washing unit 1 , the object product to be plated W accommodated in the accommodating concave portion 51 is degreased and washed with sodium hydrate solution or the like.
- the same product is advanced into the plating unit 2 , in which metallic plating layer is formed on the surface of the object product to be plated W. After that, it is passed through the washing unit 3 so as to wash off the plating solution and then, when it is passed through the drying unit 4 , the object product to be plated W is dried excellently.
- the plating on the object product to be plated can be carried out continuously and finally, the carrier tape 5 can be wound around the reel 7 with the plated products W accommodated in the respective accommodating concave portions 51 . Then, the carrier tape 5 wound around the reel 7 is transported to plant as it is and loaded on a charging unit disposed on electronic products or automobile part production line. By feeding the carrier tape 5 successively from the reel 7 , the plated products W are taken out successively and installed on an electric product or the like.
- the object products to be plated W can be plated in a condition that they are accommodated in the carrier tape 5 and thus, no deformation or damage occurs in those object products to be plated W during the plating treatment and such small parts can be plated very effectively.
- the plated products W can be fed to the charging unit continuously in a condition that they are accommodated in the carrier tape 5 .
- FIG. 2 shows a perspective view of major portions indicating an example of the carrier tape 5
- FIG. 3 shows a perspective view of the rear side of the carrier tape 5 .
- the carrier tape 5 is constructed of resin excellent in heat resistance and chemical resistance having two layers or multiple layers formed by coextrusion.
- Each accommodating concave portion 51 is formed into a concave shape corresponding to the shape of the object product to be plated W.
- a pair of slip-out preventing pieces 52 , 52 are provided on a top face of the accommodating concave portion 51 such that the center portions of those pieces 52 , 52 are tilted downward and oppose each other in order to prevent the object product to be plated W from dropping out when the same object products to be plated W are put into the accommodating concave portions 51 .
- the bottom portion and side portions of the accommodating concave portion 51 are cut out at positions of the slip-out preventing pieces 52 , 52 so that a through opening 53 is formed.
- the through opening 53 in the respective accommodating concave portion 51 is formed continuously in the longitudinal direction of the carrier tape.
- Narrow slits 54 , 54 are formed through at least in the bottom and side faces of each accommodating concave portion 51 so that washing solution or plating solution escapes easily.
- the washing solution or plating solution can flow into the accommodating concave portion 51 excellently through the opening 53 and the slits 54 , so that the washing solution or plating solution can flow into or out the accommodating concave portion 51 easily.
- Feeding holes 55 , 55 are formed through on both sides in the width direction of the carrier tape 5 at a specific interval in the length direction. Said feeding sprocket 6 engages these feeding holes 55 , 55 and when the feeding sprocket 6 is rotated, the carrier tape 5 is fed successively from the upstream to the downstream.
- FIG. 4 shows a schematic structure diagram of the plating unit 2 and the plating unit 2 contains a cell 8 filled with plating solution and a cathode member 9 is provided within this cell 8 .
- This cathode member 9 is provided from the upstream to the downstream in the cell 8 along the flow direction of the carrier tape 5 and connected to a cathode of an outside power supply.
- a copper plate 10 connected to an anode of a power supply, is disposed on a side of the cell 8 .
- the object product to be plated W is plated with copper and the cell 8 is filled with plating solution 11 composed of copper sulfate solution.
- the cathode member 9 is fit to the opening 53 in the carrier tape 5 and then, the carrier tape 5 is fed from the upstream to the downstream along the cathode member 9 in a condition that the carrier tape 5 rides on the cathode member 9 .
- FIG. 5 is a schematic structure diagram showing the condition in the plating solution in enlargement.
- the top face of the object product to be plated W accommodated in each accommodating concave portion 51 in the carrier tape 5 is pressed to the slip-out preventing pieces 52 , 52 . Consequently, the cathode member 9 invades into the opening 53 so that this cathode member 9 comes into a contact with the bottom face of the object product to be plated W accommodated in each accommodating concave portion 51 .
- minus current is supplied to the object product to be plated W through the cathode member 9 , so that the object product to be plated W is charged with negative electricity.
- the copper plate 10 on the anode side is dissolved and copper plating layer is formed on the surface of each object product to be plated W successively.
- the carrier tape 5 is fed slowly in the cell 8 such that it is dipped in the plating solution 11 for about 10 minutes, copper plating is achieved on each object product to be plated W excellently within the cell 8 .
- the plating solution 11 is nickel sulfate solution and instead of the copper plate, a nickel plate is employed. Additionally, silver plating, gold plating, galvanization, chrome plating and the like can be carried out in similar ways.
- FIG. 6 shows a modification, in which the carrier tape 5 is fed in an upside down condition (state shown in FIG. 3 ) through the plating solution in the cell 8 .
- FIG. 7 shows a schematic diagram indicating enlarged major parts.
- each object product to be plated W is supported by a pair of the slip-out preventing pieces 52 , 52 so that the object product to be plated W is prevented from dropping out.
- the opening 53 is disposed on the side of the top face of the object product to be plated W, if the cathode member 9 from which a number of brushes 9 a, 9 a, 9 a capable of invading into the opening 53 is provided above the cell 8 , minus current is supplied to each object product to be plated W through each brush 9 a from this cathode member 9 . Consequently, each object product to be plated W turns to a cathode so that the surface is plated excellently.
- the cathode member 9 can be disposed outside the plating solution 11 .
- plating layer is formed on the surface of each object product to be plated accommodated in each accommodating concave portion 51 .
- the object product to be plated is put into each accommodating concave portion in the carrier tape including a number of the accommodating concave portions spaced at a specific interval and the carrier tape is fed through the plating unit so as to form metallic plating layer on the surface of the object product to be plated
- the object product to be plated can be plated effectively in a condition that it is accommodated in the carrier tape without damaging or deforming small electric parts or automobile parts. Consequently, the plating treatment can be carried out continuously and effectively while the carrier tape is fed.
- the carrier tape can be used by a charging unit in plant or the like just as it is and the effectively plated products can be transferred to a next production stage without any delay.
- washing units are disposed in the upstream and downstream of the plating unit and each object product to be plated is washed when it passes through each washing unit, washing in a process before plating and washing in a process after plating can be carried out continuously in a condition that the object product to be plated is kept in the carrier tape.
- the plating unit of the present invention includes a feeding mechanism for the carrier tape containing a number of the accommodating concave portions each capable of keeping the object product to be plated and the cell so constructed that the carrier tape can pass through the plating solution and that cell is provided with the cathode member which supplies the object product to be plated with electricity, when the carrier tape is passed through the plating solution in the cell in a condition that the object product to be plated is kept in each accommodating concave portion, the object product to be plated is charged with negative electricity through the cathode member. Consequently, metallic plating layer can be formed excellently on the surface of the object product to be plated in the cell.
- the cathode member comes into a contact with the object product to be plated accommodated in the accommodating concave portion, so that the object product to be plated is charged with negative electricity excellently. Further, because the plating solution can flow in and out through the opening excellently, the object product to be plated in each accommodating concave portion can undergo excellent plating treatment.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-192500 | 2003-07-04 | ||
JP2003192500A JP2005023398A (ja) | 2003-07-04 | 2003-07-04 | メッキ方法およびメッキ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050006243A1 true US20050006243A1 (en) | 2005-01-13 |
Family
ID=33447965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/717,584 Abandoned US20050006243A1 (en) | 2003-07-04 | 2003-11-21 | Plating method and plating apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050006243A1 (ja) |
EP (1) | EP1496142A3 (ja) |
JP (1) | JP2005023398A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113818057A (zh) * | 2021-09-25 | 2021-12-21 | 潍坊裕元电子有限公司 | 一种散件cpu散热片连续电镀方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005039100A1 (de) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung |
JP5056888B2 (ja) * | 2010-03-29 | 2012-10-24 | Tdk株式会社 | めっき装置、めっき方法およびチップ型電子部品の製造方法 |
JP6019297B2 (ja) * | 2012-02-01 | 2016-11-02 | 株式会社ニックス | 被めっき材の保護具 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3898145A (en) * | 1971-02-17 | 1975-08-05 | Scm Corp | Process for applying contrasting coatings to a workpiece |
US4321124A (en) * | 1981-02-02 | 1982-03-23 | Select Technology Corporation | Loose parts plating apparatus |
US4904363A (en) * | 1989-04-25 | 1990-02-27 | Burndy Corporation | Selective plating systems |
US5133847A (en) * | 1991-02-28 | 1992-07-28 | Amp Incorporated | Component carrier, method of manufacture and use therefor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1205411B1 (de) * | 2000-11-13 | 2003-03-05 | Wilhelm Steckelbach | Modulare Vorrichtung zum Oberflächenbehandeln von Behandlungsgut in Form von Einzelheiten |
-
2003
- 2003-07-04 JP JP2003192500A patent/JP2005023398A/ja active Pending
- 2003-11-21 US US10/717,584 patent/US20050006243A1/en not_active Abandoned
- 2003-11-28 EP EP03257520A patent/EP1496142A3/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3898145A (en) * | 1971-02-17 | 1975-08-05 | Scm Corp | Process for applying contrasting coatings to a workpiece |
US4321124A (en) * | 1981-02-02 | 1982-03-23 | Select Technology Corporation | Loose parts plating apparatus |
US4904363A (en) * | 1989-04-25 | 1990-02-27 | Burndy Corporation | Selective plating systems |
US5133847A (en) * | 1991-02-28 | 1992-07-28 | Amp Incorporated | Component carrier, method of manufacture and use therefor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113818057A (zh) * | 2021-09-25 | 2021-12-21 | 潍坊裕元电子有限公司 | 一种散件cpu散热片连续电镀方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1496142A3 (en) | 2006-04-05 |
EP1496142A2 (en) | 2005-01-12 |
JP2005023398A (ja) | 2005-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: KANEKO DENKI KABUSHIKI KAISHA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KANEKO, SATOSHI;REEL/FRAME:014740/0987 Effective date: 20031015 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |