EP1496142A3 - Electroplating method and electroplating apparatus - Google Patents
Electroplating method and electroplating apparatus Download PDFInfo
- Publication number
- EP1496142A3 EP1496142A3 EP03257520A EP03257520A EP1496142A3 EP 1496142 A3 EP1496142 A3 EP 1496142A3 EP 03257520 A EP03257520 A EP 03257520A EP 03257520 A EP03257520 A EP 03257520A EP 1496142 A3 EP1496142 A3 EP 1496142A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- electroplating
- plating
- plated
- carrier tape
- object product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000009713 electroplating Methods 0.000 title 2
- 238000007747 plating Methods 0.000 abstract 5
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003192500 | 2003-07-04 | ||
JP2003192500A JP2005023398A (en) | 2003-07-04 | 2003-07-04 | Method and apparatus for plating |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1496142A2 EP1496142A2 (en) | 2005-01-12 |
EP1496142A3 true EP1496142A3 (en) | 2006-04-05 |
Family
ID=33447965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03257520A Withdrawn EP1496142A3 (en) | 2003-07-04 | 2003-11-28 | Electroplating method and electroplating apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050006243A1 (en) |
EP (1) | EP1496142A3 (en) |
JP (1) | JP2005023398A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005039100A1 (en) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Device for holding or holding a plurality of substrates and electroplating device |
JP5056888B2 (en) * | 2010-03-29 | 2012-10-24 | Tdk株式会社 | Plating apparatus, plating method and chip type electronic component manufacturing method |
JP6019297B2 (en) * | 2012-02-01 | 2016-11-02 | 株式会社ニックス | Plating material protector |
CN113818057B (en) * | 2021-09-25 | 2023-03-10 | 山东睿思精密工业有限公司 | Continuous electroplating method for discrete CPU (central processing unit) radiating fins |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3898145A (en) * | 1971-02-17 | 1975-08-05 | Scm Corp | Process for applying contrasting coatings to a workpiece |
US4321124A (en) * | 1981-02-02 | 1982-03-23 | Select Technology Corporation | Loose parts plating apparatus |
EP0501392A2 (en) * | 1991-02-28 | 1992-09-02 | The Whitaker Corporation | Carrier, method of manufacturing and use therefor |
EP1205411A1 (en) * | 2000-11-13 | 2002-05-15 | Wilhelm Steckelbach | Modular device for surface treatement of individual articles |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4904363A (en) * | 1989-04-25 | 1990-02-27 | Burndy Corporation | Selective plating systems |
-
2003
- 2003-07-04 JP JP2003192500A patent/JP2005023398A/en active Pending
- 2003-11-21 US US10/717,584 patent/US20050006243A1/en not_active Abandoned
- 2003-11-28 EP EP03257520A patent/EP1496142A3/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3898145A (en) * | 1971-02-17 | 1975-08-05 | Scm Corp | Process for applying contrasting coatings to a workpiece |
US4321124A (en) * | 1981-02-02 | 1982-03-23 | Select Technology Corporation | Loose parts plating apparatus |
EP0501392A2 (en) * | 1991-02-28 | 1992-09-02 | The Whitaker Corporation | Carrier, method of manufacturing and use therefor |
EP1205411A1 (en) * | 2000-11-13 | 2002-05-15 | Wilhelm Steckelbach | Modular device for surface treatement of individual articles |
Also Published As
Publication number | Publication date |
---|---|
US20050006243A1 (en) | 2005-01-13 |
EP1496142A2 (en) | 2005-01-12 |
JP2005023398A (en) | 2005-01-27 |
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Legal Events
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PUAL | Search report despatched |
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AX | Request for extension of the european patent |
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AKX | Designation fees paid | ||
REG | Reference to a national code |
Ref country code: DE Ref legal event code: 8566 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20061006 |