NL170870B
(en)
*
|
1952-07-05 |
|
Koninklijke Hoogovens En Staal |
PROCESS FOR FIRE-PROOF CLADING OF OVEN WALLS AND AN THIS MANUFACTURED METALLURGIC SHAFT OVEN.
|
US2882209A
(en)
*
|
1957-05-20 |
1959-04-14 |
Udylite Res Corp |
Electrodeposition of copper from an acid bath
|
US3649509A
(en)
*
|
1969-07-08 |
1972-03-14 |
Buckbee Mears Co |
Electrodeposition systems
|
US3727620A
(en)
*
|
1970-03-18 |
1973-04-17 |
Fluoroware Of California Inc |
Rinsing and drying device
|
US4027686A
(en)
*
|
1973-01-02 |
1977-06-07 |
Texas Instruments Incorporated |
Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
|
JPS5271871A
(en)
*
|
1975-12-11 |
1977-06-15 |
Nec Corp |
Washing apparatus
|
CH629542A5
(en)
*
|
1976-09-01 |
1982-04-30 |
Inoue Japax Res |
METHOD AND DEVICE FOR GALVANIC MATERIAL DEPOSITION.
|
US4326940A
(en)
*
|
1979-05-21 |
1982-04-27 |
Rohco Incorporated |
Automatic analyzer and control system for electroplating baths
|
US4315059A
(en)
*
|
1980-07-18 |
1982-02-09 |
The United States Of America As Represented By The United States Department Of Energy |
Molten salt lithium cells
|
US4336114A
(en)
*
|
1981-03-26 |
1982-06-22 |
Hooker Chemicals & Plastics Corp. |
Electrodeposition of bright copper
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
EP0076569B1
(en)
*
|
1981-10-01 |
1986-08-27 |
EMI Limited |
Electroplating arrangements
|
US4428815A
(en)
*
|
1983-04-28 |
1984-01-31 |
Western Electric Co., Inc. |
Vacuum-type article holder and methods of supportively retaining articles
|
JPS6063987A
(en)
*
|
1983-09-17 |
1985-04-12 |
沖電気工業株式会社 |
Method of producing printed circuit board
|
US4510176A
(en)
*
|
1983-09-26 |
1985-04-09 |
At&T Bell Laboratories |
Removal of coating from periphery of a semiconductor wafer
|
US4518678A
(en)
*
|
1983-12-16 |
1985-05-21 |
Advanced Micro Devices, Inc. |
Selective removal of coating material on a coated substrate
|
US4519846A
(en)
*
|
1984-03-08 |
1985-05-28 |
Seiichiro Aigo |
Process for washing and drying a semiconductor element
|
DE3688840T2
(en)
*
|
1985-12-24 |
1993-11-25 |
Gould Inc |
METHOD AND DEVICE FOR ELECTROPLATING A COPPER BLADE.
|
US4732785A
(en)
*
|
1986-09-26 |
1988-03-22 |
Motorola, Inc. |
Edge bead removal process for spin on films
|
US4891106A
(en)
*
|
1987-08-18 |
1990-01-02 |
Hughes Aircraft Company |
Method of forming nonmagnetic silver electrodes on quartz glass
|
US5224504A
(en)
*
|
1988-05-25 |
1993-07-06 |
Semitool, Inc. |
Single wafer processor
|
US5230743A
(en)
*
|
1988-05-25 |
1993-07-27 |
Semitool, Inc. |
Method for single wafer processing in which a semiconductor wafer is contacted with a fluid
|
US5235995A
(en)
*
|
1989-03-27 |
1993-08-17 |
Semitool, Inc. |
Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
|
US5092975A
(en)
*
|
1988-06-14 |
1992-03-03 |
Yamaha Corporation |
Metal plating apparatus
|
US5316974A
(en)
*
|
1988-12-19 |
1994-05-31 |
Texas Instruments Incorporated |
Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer
|
EP0422760A1
(en)
*
|
1989-10-12 |
1991-04-17 |
Mitsubishi Rayon Co., Ltd |
Amorphous alloy and process for preparation thereof
|
US5287237A
(en)
*
|
1990-03-16 |
1994-02-15 |
Hitachi, Ltd. |
Antiferromagnetic film superior in corrosion resistance, magnetoresistance-effect element and magnetoresistance-effect head including such thin film
|
CA2038615C
(en)
*
|
1990-03-23 |
1995-12-12 |
Masamichi Akatsu |
Poly (phenylene sulfide) fibers and production process thereof
|
US5222310A
(en)
*
|
1990-05-18 |
1993-06-29 |
Semitool, Inc. |
Single wafer processor with a frame
|
US5368711A
(en)
*
|
1990-08-01 |
1994-11-29 |
Poris; Jaime |
Selective metal electrodeposition process and apparatus
|
JP2524436B2
(en)
*
|
1990-09-18 |
1996-08-14 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
Surface treatment method
|
EP0496605B1
(en)
*
|
1991-01-24 |
2001-08-01 |
Wako Pure Chemical Industries Ltd |
Surface treating solutions for semiconductors
|
JP2525521B2
(en)
*
|
1991-06-25 |
1996-08-21 |
日本リーロナール株式会社 |
Electroless tin-lead alloy plating bath
|
JPH05211384A
(en)
*
|
1991-11-20 |
1993-08-20 |
Nec Corp |
Plating method of printed wiring board
|
US5486264A
(en)
*
|
1992-03-25 |
1996-01-23 |
The Trustees Of Columbia University |
Laser etching of semiconductors
|
JP3200468B2
(en)
*
|
1992-05-21 |
2001-08-20 |
日本エレクトロプレイテイング・エンジニヤース株式会社 |
Wafer plating equipment
|
EP0667923B1
(en)
*
|
1992-09-15 |
1997-05-02 |
ATR WIRE & CABLE CO., INC. |
Method and apparatus for electrolytically plating copper
|
US5643803A
(en)
*
|
1992-09-18 |
1997-07-01 |
Nippondenso Co., Ltd. |
Production method of a semiconductor dynamic sensor
|
US5482680A
(en)
*
|
1992-10-09 |
1996-01-09 |
Ballard Power Systems, Inc. |
Electrochemical fuel cell assembly with integral selective oxidizer
|
US5328589A
(en)
*
|
1992-12-23 |
1994-07-12 |
Enthone-Omi, Inc. |
Functional fluid additives for acid copper electroplating baths
|
US5384640A
(en)
*
|
1993-01-19 |
1995-01-24 |
Gaztech International Corporation |
Gas sample chamber for use with a source of coherent radiation
|
US5608943A
(en)
*
|
1993-08-23 |
1997-03-11 |
Tokyo Electron Limited |
Apparatus for removing process liquid
|
US5705050A
(en)
*
|
1996-04-29 |
1998-01-06 |
Sampson; Richard L. |
Electrolytic process and apparatus for the controlled oxidation and reduction of inorganic and organic species in aqueous solutions
|
US5415890A
(en)
*
|
1994-01-03 |
1995-05-16 |
Eaton Corporation |
Modular apparatus and method for surface treatment of parts with liquid baths
|
US5625170A
(en)
*
|
1994-01-18 |
1997-04-29 |
Nanometrics Incorporated |
Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
|
US5885469B1
(en)
*
|
1996-11-05 |
2000-08-08 |
Applied Materials Inc |
Topographical structure of an electrostatic chuck and method of fabricating same
|
US5528118A
(en)
*
|
1994-04-01 |
1996-06-18 |
Nikon Precision, Inc. |
Guideless stage with isolated reaction stage
|
IL109240A
(en)
*
|
1994-04-07 |
1998-02-22 |
Yeda Res & Dev |
Ion exchange membranes
|
US5651865A
(en)
*
|
1994-06-17 |
1997-07-29 |
Eni |
Preferential sputtering of insulators from conductive targets
|
US5705223A
(en)
*
|
1994-07-26 |
1998-01-06 |
International Business Machine Corp. |
Method and apparatus for coating a semiconductor wafer
|
US5516412A
(en)
*
|
1995-05-16 |
1996-05-14 |
International Business Machines Corporation |
Vertical paddle plating cell
|
US5643456A
(en)
*
|
1995-05-30 |
1997-07-01 |
The Regents Of The University Of California |
Process for the displacement of cyanide ions from metal-cyanide complexes
|
US5516418A
(en)
*
|
1995-06-26 |
1996-05-14 |
International Business Machines Corporation |
Patterned electroplating
|
US5597460A
(en)
*
|
1995-11-13 |
1997-01-28 |
Reynolds Tech Fabricators, Inc. |
Plating cell having laminar flow sparger
|
US5785833A
(en)
*
|
1996-04-29 |
1998-07-28 |
Vaughan; Daniel J. |
Process for removing iron from tin-plating electrolytes
|
US6203582B1
(en)
*
|
1996-07-15 |
2001-03-20 |
Semitool, Inc. |
Modular semiconductor workpiece processing tool
|
US5883762A
(en)
*
|
1997-03-13 |
1999-03-16 |
Calhoun; Robert B. |
Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
|
US6174425B1
(en)
*
|
1997-05-14 |
2001-01-16 |
Motorola, Inc. |
Process for depositing a layer of material over a substrate
|
JPH1180989A
(en)
*
|
1997-09-02 |
1999-03-26 |
Oki Electric Ind Co Ltd |
Plating apparatus
|
US6024856A
(en)
*
|
1997-10-10 |
2000-02-15 |
Enthone-Omi, Inc. |
Copper metallization of silicon wafers using insoluble anodes
|
US5882498A
(en)
*
|
1997-10-16 |
1999-03-16 |
Advanced Micro Devices, Inc. |
Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate
|
CA2320278C
(en)
*
|
1998-02-12 |
2006-01-03 |
Acm Research, Inc. |
Plating apparatus and method
|
US6423642B1
(en)
*
|
1998-03-13 |
2002-07-23 |
Semitool, Inc. |
Reactor for processing a semiconductor wafer
|
US6565729B2
(en)
*
|
1998-03-20 |
2003-05-20 |
Semitool, Inc. |
Method for electrochemically depositing metal on a semiconductor workpiece
|
US6197181B1
(en)
*
|
1998-03-20 |
2001-03-06 |
Semitool, Inc. |
Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
|
US6113771A
(en)
*
|
1998-04-21 |
2000-09-05 |
Applied Materials, Inc. |
Electro deposition chemistry
|
WO1999054527A2
(en)
*
|
1998-04-21 |
1999-10-28 |
Applied Materials, Inc. |
Electro-chemical deposition system and method of electroplating on substrates
|
US6071388A
(en)
*
|
1998-05-29 |
2000-06-06 |
International Business Machines Corporation |
Electroplating workpiece fixture having liquid gap spacer
|
US6080291A
(en)
*
|
1998-07-10 |
2000-06-27 |
Semitool, Inc. |
Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
|
US6074544A
(en)
*
|
1998-07-22 |
2000-06-13 |
Novellus Systems, Inc. |
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
|
US6210555B1
(en)
*
|
1999-01-29 |
2001-04-03 |
Faraday Technology Marketing Group, Llc |
Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
|
US6203684B1
(en)
*
|
1998-10-14 |
2001-03-20 |
Faraday Technology Marketing Group, Llc |
Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates
|
US6251236B1
(en)
*
|
1998-11-30 |
2001-06-26 |
Applied Materials, Inc. |
Cathode contact ring for electrochemical deposition
|
US6267853B1
(en)
*
|
1999-07-09 |
2001-07-31 |
Applied Materials, Inc. |
Electro-chemical deposition system
|
US6613214B2
(en)
*
|
1998-11-30 |
2003-09-02 |
Applied Materials, Inc. |
Electric contact element for electrochemical deposition system and method
|
US6258220B1
(en)
*
|
1998-11-30 |
2001-07-10 |
Applied Materials, Inc. |
Electro-chemical deposition system
|
US6254760B1
(en)
*
|
1999-03-05 |
2001-07-03 |
Applied Materials, Inc. |
Electro-chemical deposition system and method
|
US6340633B1
(en)
*
|
1999-03-26 |
2002-01-22 |
Advanced Micro Devices, Inc. |
Method for ramped current density plating of semiconductor vias and trenches
|
US6551484B2
(en)
*
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Reverse voltage bias for electro-chemical plating system and method
|
US6585876B2
(en)
*
|
1999-04-08 |
2003-07-01 |
Applied Materials Inc. |
Flow diffuser to be used in electro-chemical plating system and method
|
US6557237B1
(en)
*
|
1999-04-08 |
2003-05-06 |
Applied Materials, Inc. |
Removable modular cell for electro-chemical plating and method
|
US6582578B1
(en)
*
|
1999-04-08 |
2003-06-24 |
Applied Materials, Inc. |
Method and associated apparatus for tilting a substrate upon entry for metal deposition
|
US6551488B1
(en)
*
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Segmenting of processing system into wet and dry areas
|
US6571657B1
(en)
*
|
1999-04-08 |
2003-06-03 |
Applied Materials Inc. |
Multiple blade robot adjustment apparatus and associated method
|
US6261733B1
(en)
*
|
1999-05-10 |
2001-07-17 |
Agfa-Gevaert |
Silver salt diffusion transfer material sensitized for blue light
|
JP3835058B2
(en)
*
|
1999-05-12 |
2006-10-18 |
スズキ株式会社 |
Outboard motor electrical component mounting structure
|
SG80035A1
(en)
*
|
1999-05-27 |
2001-04-17 |
Inst Of Microelectronics |
Viterbi decoding of punctured convolutional codes without real-time branch metric computation
|
US6224737B1
(en)
*
|
1999-08-19 |
2001-05-01 |
Taiwan Semiconductor Manufacturing Company |
Method for improvement of gap filling capability of electrochemical deposition of copper
|
US6399479B1
(en)
*
|
1999-08-30 |
2002-06-04 |
Applied Materials, Inc. |
Processes to improve electroplating fill
|
US6395101B1
(en)
*
|
1999-10-08 |
2002-05-28 |
Semitool, Inc. |
Single semiconductor wafer processor
|
US6423636B1
(en)
*
|
1999-11-19 |
2002-07-23 |
Applied Materials, Inc. |
Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer
|
US6409903B1
(en)
*
|
1999-12-21 |
2002-06-25 |
International Business Machines Corporation |
Multi-step potentiostatic/galvanostatic plating control
|
US6562204B1
(en)
*
|
2000-02-29 |
2003-05-13 |
Novellus Systems, Inc. |
Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers
|
JP2004513221A
(en)
*
|
2000-05-23 |
2004-04-30 |
アプライド マテリアルズ インコーポレイテッド |
Method and apparatus for overcoming copper seed layer anomalies and adjusting surface feature size and aspect ratio
|
SE516623C2
(en)
*
|
2000-06-15 |
2002-02-05 |
Electrolux Ab |
Safety device in the case of a washing machine door
|
DE60113842T2
(en)
*
|
2000-06-20 |
2006-07-13 |
Koninklijke Philips Electronics N.V. |
CIRCUIT
|
US6551487B1
(en)
*
|
2001-05-31 |
2003-04-22 |
Novellus Systems, Inc. |
Methods and apparatus for controlled-angle wafer immersion
|