DE502008001647D1 - Modified copper-tin electrolyte and process for the deposition of bronze layers - Google Patents
Modified copper-tin electrolyte and process for the deposition of bronze layersInfo
- Publication number
- DE502008001647D1 DE502008001647D1 DE502008001647T DE502008001647T DE502008001647D1 DE 502008001647 D1 DE502008001647 D1 DE 502008001647D1 DE 502008001647 T DE502008001647 T DE 502008001647T DE 502008001647 T DE502008001647 T DE 502008001647T DE 502008001647 D1 DE502008001647 D1 DE 502008001647D1
- Authority
- DE
- Germany
- Prior art keywords
- electrolyte
- deposition
- bronze layers
- modified copper
- carbonate ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Abstract
Non-toxic pyrophosphate-containing electrolyte comprises metals (which are to be deposited) in the form of water-soluble salts, a brightener system obtained from the reaction product of epichlorohydrin with hexamethylene tetramine and additionally carbonate ions and/or hydrogen carbonate ions. An independent claim is included for an electrolytically deposition method for galvanic application of decorative bronze layers on consumer goods and technical articles comprising immersing the substrates (that are to be coated) in a electrolyte, which is the electrolyte as above per se.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08008637A EP2116634B1 (en) | 2008-05-08 | 2008-05-08 | Modified copper-tin electrolyte and method of depositing bronze layers |
Publications (1)
Publication Number | Publication Date |
---|---|
DE502008001647D1 true DE502008001647D1 (en) | 2010-12-09 |
Family
ID=39639007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE502008001647T Active DE502008001647D1 (en) | 2008-05-08 | 2008-05-08 | Modified copper-tin electrolyte and process for the deposition of bronze layers |
Country Status (12)
Country | Link |
---|---|
US (1) | US20110089043A1 (en) |
EP (1) | EP2116634B1 (en) |
JP (1) | JP2011520037A (en) |
KR (1) | KR20110011613A (en) |
CN (1) | CN102016130B (en) |
AT (1) | ATE486157T1 (en) |
DE (1) | DE502008001647D1 (en) |
HK (1) | HK1152352A1 (en) |
MX (1) | MX2010012041A (en) |
PL (1) | PL2116634T3 (en) |
TW (1) | TW201005129A (en) |
WO (1) | WO2009135572A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5569718B2 (en) * | 2009-08-21 | 2014-08-13 | キザイ株式会社 | Cyan-free bright copper-tin alloy plating bath |
KR101236165B1 (en) * | 2011-02-15 | 2013-02-22 | (주)지오데코 | Environmental friendly three element alloys plating solution and method for treating metal surface using the same |
DE102011121798B4 (en) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell |
DE102011121799B4 (en) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell |
JP5952093B2 (en) * | 2012-05-31 | 2016-07-13 | ローム・アンド・ハース電子材料株式会社 | Electrolytic copper plating solution and electrolytic copper plating method |
JP6093143B2 (en) * | 2012-10-19 | 2017-03-08 | 株式会社シミズ | Non-cyanide copper-tin alloy plating bath |
KR20150132574A (en) * | 2013-03-21 | 2015-11-25 | 아토테크더치랜드게엠베하 | Apparatus and method for electrolytic deposition of metal layers on workpieces |
AR100422A1 (en) * | 2014-05-15 | 2016-10-05 | Nippon Steel & Sumitomo Metal Corp | SOLUTION FOR DEPOSITION FOR THREADED CONNECTION FOR A PIPE OR PIPE AND PRODUCTION METHOD OF THE THREADED CONNECTION FOR A PIPE OR PIPE |
CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
CN111276725B (en) * | 2017-11-19 | 2021-10-08 | 湖南辰砾新材料有限公司 | Anion exchange membrane fuel cell |
BE1027099B1 (en) * | 2019-03-08 | 2020-10-05 | Umicore Nv | PROCEDURE FOR ELECTROLYTIC BUYER EXECUTION |
DE102021117095A1 (en) | 2021-07-02 | 2023-01-05 | Umicore Galvanotechnik Gmbh | Bronze layers as a substitute for precious metals |
DE202021004169U1 (en) | 2021-07-02 | 2022-12-07 | Umicore Galvanotechnik Gmbh | Bronze layer as a substitute for precious metals in smart cards |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2198365A (en) * | 1938-06-29 | 1940-04-23 | Special Chemicals Corp | Electroplating |
US3227638A (en) * | 1961-06-16 | 1966-01-04 | Robert H Burnson | Alkali cyanide bath and process for electroplating therewith |
DE3346721A1 (en) * | 1983-12-23 | 1985-06-27 | Fa. Karl-Wilh. Hen, 5820 Gevelsberg | Alkaline bath for depositing a high-lustre electroplated coating on a substrate |
JPH02175894A (en) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | Method and device for tin or tin alloy electroplating |
US5194140A (en) * | 1991-11-27 | 1993-03-16 | Macdermid, Incorporated | Electroplating composition and process |
DE4324995C2 (en) | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
JP3674887B2 (en) * | 1996-09-30 | 2005-07-27 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
SG68083A1 (en) * | 1997-10-30 | 1999-10-19 | Sung Soo Moon | Tin alloy plating compositions |
TW577938B (en) * | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
JP2001181889A (en) | 1999-12-22 | 2001-07-03 | Nippon Macdermid Kk | Bright tin-copper alloy electroplating bath |
JP3455712B2 (en) | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
DE10046600C2 (en) | 2000-09-20 | 2003-02-20 | Schloetter Fa Dr Ing Max | Electrolyte and process for the deposition of tin-copper alloy layers and use of the electrolyte |
JP4249438B2 (en) * | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
ES2531163T3 (en) | 2002-10-11 | 2015-03-11 | Enthone | Procedure and electrolyte for galvanic deposition of bronzes |
-
2008
- 2008-05-08 AT AT08008637T patent/ATE486157T1/en active
- 2008-05-08 PL PL08008637T patent/PL2116634T3/en unknown
- 2008-05-08 EP EP08008637A patent/EP2116634B1/en not_active Not-in-force
- 2008-05-08 DE DE502008001647T patent/DE502008001647D1/en active Active
-
2009
- 2009-03-31 MX MX2010012041A patent/MX2010012041A/en active IP Right Grant
- 2009-03-31 WO PCT/EP2009/002323 patent/WO2009135572A2/en active Application Filing
- 2009-03-31 US US12/991,575 patent/US20110089043A1/en not_active Abandoned
- 2009-03-31 KR KR1020107024999A patent/KR20110011613A/en not_active Application Discontinuation
- 2009-03-31 JP JP2011507800A patent/JP2011520037A/en active Pending
- 2009-03-31 CN CN2009801164345A patent/CN102016130B/en not_active Expired - Fee Related
- 2009-04-13 TW TW098112181A patent/TW201005129A/en unknown
-
2011
- 2011-06-21 HK HK11106316.1A patent/HK1152352A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN102016130A (en) | 2011-04-13 |
HK1152352A1 (en) | 2012-02-24 |
US20110089043A1 (en) | 2011-04-21 |
JP2011520037A (en) | 2011-07-14 |
WO2009135572A2 (en) | 2009-11-12 |
MX2010012041A (en) | 2011-03-04 |
CN102016130B (en) | 2013-03-13 |
EP2116634A1 (en) | 2009-11-11 |
TW201005129A (en) | 2010-02-01 |
WO2009135572A3 (en) | 2009-12-30 |
KR20110011613A (en) | 2011-02-08 |
ATE486157T1 (en) | 2010-11-15 |
EP2116634B1 (en) | 2010-10-27 |
PL2116634T3 (en) | 2011-04-29 |
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