HK1152352A1 - Modified copper-tin electrolyte and process for the deposition of bronze layers - Google Patents

Modified copper-tin electrolyte and process for the deposition of bronze layers

Info

Publication number
HK1152352A1
HK1152352A1 HK11106316.1A HK11106316A HK1152352A1 HK 1152352 A1 HK1152352 A1 HK 1152352A1 HK 11106316 A HK11106316 A HK 11106316A HK 1152352 A1 HK1152352 A1 HK 1152352A1
Authority
HK
Hong Kong
Prior art keywords
electrolyte
deposition
bronze layers
modified copper
carbonate ions
Prior art date
Application number
HK11106316.1A
Inventor
Weyhmueller Bernd
Bronder Klaus
Oberst Frank
Berger Sascha
Manz Uwe
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of HK1152352A1 publication Critical patent/HK1152352A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Abstract

Non-toxic pyrophosphate-containing electrolyte comprises metals (which are to be deposited) in the form of water-soluble salts, a brightener system obtained from the reaction product of epichlorohydrin with hexamethylene tetramine and additionally carbonate ions and/or hydrogen carbonate ions. An independent claim is included for an electrolytically deposition method for galvanic application of decorative bronze layers on consumer goods and technical articles comprising immersing the substrates (that are to be coated) in a electrolyte, which is the electrolyte as above per se.
HK11106316.1A 2008-05-08 2011-06-21 Modified copper-tin electrolyte and process for the deposition of bronze layers HK1152352A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08008637A EP2116634B1 (en) 2008-05-08 2008-05-08 Modified copper-tin electrolyte and method of depositing bronze layers
PCT/EP2009/002323 WO2009135572A2 (en) 2008-05-08 2009-03-31 Modified copper-tin electrolyte and process for the deposition of bronze layers

Publications (1)

Publication Number Publication Date
HK1152352A1 true HK1152352A1 (en) 2012-02-24

Family

ID=39639007

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11106316.1A HK1152352A1 (en) 2008-05-08 2011-06-21 Modified copper-tin electrolyte and process for the deposition of bronze layers

Country Status (12)

Country Link
US (1) US20110089043A1 (en)
EP (1) EP2116634B1 (en)
JP (1) JP2011520037A (en)
KR (1) KR20110011613A (en)
CN (1) CN102016130B (en)
AT (1) ATE486157T1 (en)
DE (1) DE502008001647D1 (en)
HK (1) HK1152352A1 (en)
MX (1) MX2010012041A (en)
PL (1) PL2116634T3 (en)
TW (1) TW201005129A (en)
WO (1) WO2009135572A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5569718B2 (en) * 2009-08-21 2014-08-13 キザイ株式会社 Cyan-free bright copper-tin alloy plating bath
KR101236165B1 (en) * 2011-02-15 2013-02-22 (주)지오데코 Environmental friendly three element alloys plating solution and method for treating metal surface using the same
DE102011121798B4 (en) 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell
DE102011121799B4 (en) * 2011-12-21 2013-08-29 Umicore Galvanotechnik Gmbh An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell
JP5952093B2 (en) * 2012-05-31 2016-07-13 ローム・アンド・ハース電子材料株式会社 Electrolytic copper plating solution and electrolytic copper plating method
JP6093143B2 (en) * 2012-10-19 2017-03-08 株式会社シミズ Non-cyanide copper-tin alloy plating bath
US20160024683A1 (en) * 2013-03-21 2016-01-28 Atotech Deutschland Gmbh Apparatus and method for electrolytic deposition of metal layers on workpieces
AR100422A1 (en) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp SOLUTION FOR DEPOSITION FOR THREADED CONNECTION FOR A PIPE OR PIPE AND PRODUCTION METHOD OF THE THREADED CONNECTION FOR A PIPE OR PIPE
CN104152955A (en) * 2014-07-17 2014-11-19 广东致卓精密金属科技有限公司 Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution
CN111276725B (en) * 2017-11-19 2021-10-08 湖南辰砾新材料有限公司 Anion exchange membrane fuel cell
BE1027099B1 (en) * 2019-03-08 2020-10-05 Umicore Nv PROCEDURE FOR ELECTROLYTIC BUYER EXECUTION
DE102021117095A1 (en) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronze layers as a substitute for precious metals
DE202021004169U1 (en) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronze layer as a substitute for precious metals in smart cards

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US2198365A (en) * 1938-06-29 1940-04-23 Special Chemicals Corp Electroplating
US3227638A (en) * 1961-06-16 1966-01-04 Robert H Burnson Alkali cyanide bath and process for electroplating therewith
DE3346721A1 (en) * 1983-12-23 1985-06-27 Fa. Karl-Wilh. Hen, 5820 Gevelsberg Alkaline bath for depositing a high-lustre electroplated coating on a substrate
JPH02175894A (en) * 1988-12-28 1990-07-09 Kosaku:Kk Method and device for tin or tin alloy electroplating
US5194140A (en) * 1991-11-27 1993-03-16 Macdermid, Incorporated Electroplating composition and process
DE4324995C2 (en) 1993-07-26 1995-12-21 Demetron Gmbh Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings
JP3674887B2 (en) * 1996-09-30 2005-07-27 日本ニュークローム株式会社 Pyrophosphate bath for copper-tin alloy plating
SG68083A1 (en) * 1997-10-30 1999-10-19 Sung Soo Moon Tin alloy plating compositions
TW577938B (en) 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP2001181889A (en) * 1999-12-22 2001-07-03 Nippon Macdermid Kk Bright tin-copper alloy electroplating bath
JP3455712B2 (en) 2000-04-14 2003-10-14 日本ニュークローム株式会社 Pyrophosphate bath for copper-tin alloy plating
DE10046600C2 (en) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Electrolyte and process for the deposition of tin-copper alloy layers and use of the electrolyte
JP4249438B2 (en) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 Pyrophosphate bath for copper-tin alloy plating
ES2531163T3 (en) * 2002-10-11 2015-03-11 Enthone Procedure and electrolyte for galvanic deposition of bronzes

Also Published As

Publication number Publication date
PL2116634T3 (en) 2011-04-29
TW201005129A (en) 2010-02-01
WO2009135572A2 (en) 2009-11-12
CN102016130A (en) 2011-04-13
ATE486157T1 (en) 2010-11-15
MX2010012041A (en) 2011-03-04
KR20110011613A (en) 2011-02-08
CN102016130B (en) 2013-03-13
JP2011520037A (en) 2011-07-14
EP2116634A1 (en) 2009-11-11
WO2009135572A3 (en) 2009-12-30
DE502008001647D1 (en) 2010-12-09
EP2116634B1 (en) 2010-10-27
US20110089043A1 (en) 2011-04-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170331