MX2010012041A - Modified copper-tin electrolyte and process for the deposition of bronze layers. - Google Patents
Modified copper-tin electrolyte and process for the deposition of bronze layers.Info
- Publication number
- MX2010012041A MX2010012041A MX2010012041A MX2010012041A MX2010012041A MX 2010012041 A MX2010012041 A MX 2010012041A MX 2010012041 A MX2010012041 A MX 2010012041A MX 2010012041 A MX2010012041 A MX 2010012041A MX 2010012041 A MX2010012041 A MX 2010012041A
- Authority
- MX
- Mexico
- Prior art keywords
- deposition
- electrolyte
- modified copper
- bronze layers
- tin electrolyte
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Abstract
The invention relates to a modified copper-tin electrolyte which is free of toxic constituents such as cyanides or thio compounds. The invention further relates to a process for the deposition of decorative bronze layers on consumer goods and industrial articles using the electrolyte of the invention. The electrolyte comprises an additive formed from epichlorohydrin and hexamethylenetetramine and contains carbonate or hydrogencarbonate ions.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08008637A EP2116634B1 (en) | 2008-05-08 | 2008-05-08 | Modified copper-tin electrolyte and method of depositing bronze layers |
PCT/EP2009/002323 WO2009135572A2 (en) | 2008-05-08 | 2009-03-31 | Modified copper-tin electrolyte and process for the deposition of bronze layers |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2010012041A true MX2010012041A (en) | 2011-03-04 |
Family
ID=39639007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2010012041A MX2010012041A (en) | 2008-05-08 | 2009-03-31 | Modified copper-tin electrolyte and process for the deposition of bronze layers. |
Country Status (12)
Country | Link |
---|---|
US (1) | US20110089043A1 (en) |
EP (1) | EP2116634B1 (en) |
JP (1) | JP2011520037A (en) |
KR (1) | KR20110011613A (en) |
CN (1) | CN102016130B (en) |
AT (1) | ATE486157T1 (en) |
DE (1) | DE502008001647D1 (en) |
HK (1) | HK1152352A1 (en) |
MX (1) | MX2010012041A (en) |
PL (1) | PL2116634T3 (en) |
TW (1) | TW201005129A (en) |
WO (1) | WO2009135572A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5569718B2 (en) * | 2009-08-21 | 2014-08-13 | キザイ株式会社 | Cyan-free bright copper-tin alloy plating bath |
KR101236165B1 (en) * | 2011-02-15 | 2013-02-22 | (주)지오데코 | Environmental friendly three element alloys plating solution and method for treating metal surface using the same |
DE102011121798B4 (en) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell |
DE102011121799B4 (en) * | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell |
JP5952093B2 (en) * | 2012-05-31 | 2016-07-13 | ローム・アンド・ハース電子材料株式会社 | Electrolytic copper plating solution and electrolytic copper plating method |
JP6093143B2 (en) * | 2012-10-19 | 2017-03-08 | 株式会社シミズ | Non-cyanide copper-tin alloy plating bath |
US20160024683A1 (en) * | 2013-03-21 | 2016-01-28 | Atotech Deutschland Gmbh | Apparatus and method for electrolytic deposition of metal layers on workpieces |
AR100422A1 (en) * | 2014-05-15 | 2016-10-05 | Nippon Steel & Sumitomo Metal Corp | SOLUTION FOR DEPOSITION FOR THREADED CONNECTION FOR A PIPE OR PIPE AND PRODUCTION METHOD OF THE THREADED CONNECTION FOR A PIPE OR PIPE |
CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
CN111276725B (en) * | 2017-11-19 | 2021-10-08 | 湖南辰砾新材料有限公司 | Anion exchange membrane fuel cell |
BE1027099B1 (en) * | 2019-03-08 | 2020-10-05 | Umicore Nv | PROCEDURE FOR ELECTROLYTIC BUYER EXECUTION |
DE102021117095A1 (en) | 2021-07-02 | 2023-01-05 | Umicore Galvanotechnik Gmbh | Bronze layers as a substitute for precious metals |
DE202021004169U1 (en) | 2021-07-02 | 2022-12-07 | Umicore Galvanotechnik Gmbh | Bronze layer as a substitute for precious metals in smart cards |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2198365A (en) * | 1938-06-29 | 1940-04-23 | Special Chemicals Corp | Electroplating |
US3227638A (en) * | 1961-06-16 | 1966-01-04 | Robert H Burnson | Alkali cyanide bath and process for electroplating therewith |
DE3346721A1 (en) * | 1983-12-23 | 1985-06-27 | Fa. Karl-Wilh. Hen, 5820 Gevelsberg | Alkaline bath for depositing a high-lustre electroplated coating on a substrate |
JPH02175894A (en) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | Method and device for tin or tin alloy electroplating |
US5194140A (en) * | 1991-11-27 | 1993-03-16 | Macdermid, Incorporated | Electroplating composition and process |
DE4324995C2 (en) | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
JP3674887B2 (en) * | 1996-09-30 | 2005-07-27 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
SG68083A1 (en) * | 1997-10-30 | 1999-10-19 | Sung Soo Moon | Tin alloy plating compositions |
TW577938B (en) | 1998-11-05 | 2004-03-01 | Uyemura C & Co Ltd | Tin-copper alloy electroplating bath and plating process therewith |
JP2001181889A (en) * | 1999-12-22 | 2001-07-03 | Nippon Macdermid Kk | Bright tin-copper alloy electroplating bath |
JP3455712B2 (en) | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
DE10046600C2 (en) | 2000-09-20 | 2003-02-20 | Schloetter Fa Dr Ing Max | Electrolyte and process for the deposition of tin-copper alloy layers and use of the electrolyte |
JP4249438B2 (en) * | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
ES2531163T3 (en) * | 2002-10-11 | 2015-03-11 | Enthone | Procedure and electrolyte for galvanic deposition of bronzes |
-
2008
- 2008-05-08 DE DE502008001647T patent/DE502008001647D1/en active Active
- 2008-05-08 EP EP08008637A patent/EP2116634B1/en not_active Not-in-force
- 2008-05-08 PL PL08008637T patent/PL2116634T3/en unknown
- 2008-05-08 AT AT08008637T patent/ATE486157T1/en active
-
2009
- 2009-03-31 MX MX2010012041A patent/MX2010012041A/en active IP Right Grant
- 2009-03-31 JP JP2011507800A patent/JP2011520037A/en active Pending
- 2009-03-31 CN CN2009801164345A patent/CN102016130B/en not_active Expired - Fee Related
- 2009-03-31 KR KR1020107024999A patent/KR20110011613A/en not_active Application Discontinuation
- 2009-03-31 WO PCT/EP2009/002323 patent/WO2009135572A2/en active Application Filing
- 2009-03-31 US US12/991,575 patent/US20110089043A1/en not_active Abandoned
- 2009-04-13 TW TW098112181A patent/TW201005129A/en unknown
-
2011
- 2011-06-21 HK HK11106316.1A patent/HK1152352A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
PL2116634T3 (en) | 2011-04-29 |
TW201005129A (en) | 2010-02-01 |
WO2009135572A2 (en) | 2009-11-12 |
CN102016130A (en) | 2011-04-13 |
ATE486157T1 (en) | 2010-11-15 |
HK1152352A1 (en) | 2012-02-24 |
KR20110011613A (en) | 2011-02-08 |
CN102016130B (en) | 2013-03-13 |
JP2011520037A (en) | 2011-07-14 |
EP2116634A1 (en) | 2009-11-11 |
WO2009135572A3 (en) | 2009-12-30 |
DE502008001647D1 (en) | 2010-12-09 |
EP2116634B1 (en) | 2010-10-27 |
US20110089043A1 (en) | 2011-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |