ATE549434T1 - IMPROVED COPPER-TIN ELECTROLYTE AND METHOD FOR APPLYING TIN-BRONZE LAYERS - Google Patents
IMPROVED COPPER-TIN ELECTROLYTE AND METHOD FOR APPLYING TIN-BRONZE LAYERSInfo
- Publication number
- ATE549434T1 ATE549434T1 AT09776985T AT09776985T ATE549434T1 AT E549434 T1 ATE549434 T1 AT E549434T1 AT 09776985 T AT09776985 T AT 09776985T AT 09776985 T AT09776985 T AT 09776985T AT E549434 T1 ATE549434 T1 AT E549434T1
- Authority
- AT
- Austria
- Prior art keywords
- bronze layers
- tin
- layers
- bronze
- decorative
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Consumer goods and industrial articles are electroplated with bronze layers for decorative purposes and for protection against corrosion. The electrolytes used hitherto for producing decorative bronze layers are cyanide-containing or, as in the case of baths based on organosulfonic acids, highly corrosive, or, as in the case of cyanide-free baths based on diphosphoric acid, give unsatisfactory brightness and shine. The present invention provides a nontoxic electrolyte for the electrochemical deposition of uniformly bright and shiny bronze layers and a corresponding process for the application of such decorative bronze layers to consumer goods and industrial articles, by means of which relatively thick bronze layers can also be deposited electrochemically in a satisfactory way.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008032398A DE102008032398A1 (en) | 2008-07-10 | 2008-07-10 | Improved copper-tin electrolyte and process for depositing bronze layers |
PCT/EP2009/004879 WO2010003621A1 (en) | 2008-07-10 | 2009-07-06 | Improved copper-tin electrolyte and process for the deposition of bronze layers |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE549434T1 true ATE549434T1 (en) | 2012-03-15 |
Family
ID=41258161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT09776985T ATE549434T1 (en) | 2008-07-10 | 2009-07-06 | IMPROVED COPPER-TIN ELECTROLYTE AND METHOD FOR APPLYING TIN-BRONZE LAYERS |
Country Status (10)
Country | Link |
---|---|
US (1) | US20110174631A1 (en) |
EP (1) | EP2310558B1 (en) |
JP (1) | JP2011527381A (en) |
KR (1) | KR20110031183A (en) |
CN (1) | CN102089466B (en) |
AT (1) | ATE549434T1 (en) |
DE (1) | DE102008032398A1 (en) |
PL (1) | PL2310558T3 (en) |
TW (1) | TW201014935A (en) |
WO (1) | WO2010003621A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010044551A1 (en) * | 2010-09-07 | 2012-03-08 | Coventya Gmbh | Anode and their use in an alkaline electroplating bath |
DE102011121799B4 (en) * | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | An electrolyte and a method for the electrodeposition of Cu-Zn-Sn alloy layers and a method for producing a thin-film solar cell |
DE102012008544A1 (en) | 2012-05-02 | 2013-11-07 | Umicore Galvanotechnik Gmbh | Chromed composites without nickel coating |
AT514818B1 (en) * | 2013-09-18 | 2015-10-15 | W Garhöfer Ges M B H Ing | Deposition of Cu, Sn, Zn coatings on metallic substrates |
DE102013226297B3 (en) * | 2013-12-17 | 2015-03-26 | Umicore Galvanotechnik Gmbh | Aqueous, cyanide-free electrolyte for the deposition of copper-tin and copper-tin-zinc alloys from an electrolyte and process for the electrolytic deposition of these alloys |
CN103789803B (en) * | 2014-01-13 | 2016-04-27 | 孙松华 | A kind of without cyanogen gunmetal electroplate liquid and preparation method thereof |
JP5938426B2 (en) * | 2014-02-04 | 2016-06-22 | 株式会社豊田中央研究所 | Electroplating cell and metal film manufacturing method |
AR100422A1 (en) * | 2014-05-15 | 2016-10-05 | Nippon Steel & Sumitomo Metal Corp | SOLUTION FOR DEPOSITION FOR THREADED CONNECTION FOR A PIPE OR PIPE AND PRODUCTION METHOD OF THE THREADED CONNECTION FOR A PIPE OR PIPE |
CN106521574B (en) * | 2016-12-05 | 2018-10-26 | 浙江工业大学 | A kind of non-cyanide plating solution for copper-plating used and preparation method thereof suitable for width pH and wide current density range |
EP3562974B1 (en) * | 2016-12-28 | 2020-10-07 | ATOTECH Deutschland GmbH | Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
CN110344079B (en) * | 2019-08-16 | 2021-06-08 | 广东超华科技股份有限公司 | Device and method for reducing concentration of iron ions in electrolytic copper foil electrolyte |
RU2762501C1 (en) * | 2021-05-17 | 2021-12-21 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) | Alkaline electrolyte for electrolytic deposition of yellow tin bronze |
DE102021117095A1 (en) | 2021-07-02 | 2023-01-05 | Umicore Galvanotechnik Gmbh | Bronze layers as a substitute for precious metals |
DE202021004169U1 (en) | 2021-07-02 | 2022-12-07 | Umicore Galvanotechnik Gmbh | Bronze layer as a substitute for precious metals in smart cards |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3833486A (en) * | 1973-03-26 | 1974-09-03 | Lea Ronal Inc | Cyanide-free electroplating |
US4289286A (en) * | 1978-10-16 | 1981-09-15 | East/West Industries, Inc. | Replaceable harness bracket assembly |
US4356067A (en) * | 1979-06-13 | 1982-10-26 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
US4389286A (en) * | 1980-07-17 | 1983-06-21 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
US4417956A (en) * | 1980-07-17 | 1983-11-29 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
US4347108A (en) * | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
CN1004010B (en) * | 1986-07-11 | 1989-04-26 | 南京大学 | Cyanida free imitative electrogilding solution |
DE4324995C2 (en) | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
SG68083A1 (en) * | 1997-10-30 | 1999-10-19 | Sung Soo Moon | Tin alloy plating compositions |
US6508927B2 (en) * | 1998-11-05 | 2003-01-21 | C. Uyemura & Co., Ltd. | Tin-copper alloy electroplating bath |
JP2001181889A (en) | 1999-12-22 | 2001-07-03 | Nippon Macdermid Kk | Bright tin-copper alloy electroplating bath |
JP3455712B2 (en) | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
DE10046600C2 (en) | 2000-09-20 | 2003-02-20 | Schloetter Fa Dr Ing Max | Electrolyte and process for the deposition of tin-copper alloy layers and use of the electrolyte |
EP1325175B1 (en) * | 2000-09-20 | 2005-05-04 | Dr.Ing. Max Schlötter GmbH & Co. KG | Electrolyte and method for depositing tin-copper alloy layers |
US6645364B2 (en) * | 2000-10-20 | 2003-11-11 | Shipley Company, L.L.C. | Electroplating bath control |
JP4249438B2 (en) | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | Pyrophosphate bath for copper-tin alloy plating |
DE10243139A1 (en) * | 2002-09-17 | 2004-03-25 | Omg Galvanotechnik Gmbh | Alloy for decorative or functional purposes e.g. as a coating material for buttons and sliding clasp fasteners and absorbing layers in solar cells contains tin, copper, bismuth and oxidic oxygen |
EP1408141B1 (en) | 2002-10-11 | 2014-12-17 | Enthone Inc. | Process and electrolyte for the galvanic deposition of bronze |
JP4441726B2 (en) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | Method for producing tin or tin alloy aliphatic sulfonic acid plating bath |
US7128822B2 (en) * | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
US20050067297A1 (en) * | 2003-09-26 | 2005-03-31 | Innovative Technology Licensing, Llc | Copper bath for electroplating fine circuitry on semiconductor chips |
US20060231409A1 (en) * | 2005-03-31 | 2006-10-19 | Tdk Corporation | Plating solution, conductive material, and surface treatment method of conductive material |
EP1870495A1 (en) * | 2006-06-21 | 2007-12-26 | Atotech Deutschland Gmbh | Aqueous alkaline, cyanide-free, bath for the galvanic deposition of Zinc and Zinc alloy layers |
PL1961840T3 (en) * | 2007-02-14 | 2010-06-30 | Umicore Galvanotechnik Gmbh | Copper-tin electrolyte and method for depositing bronze layers |
-
2008
- 2008-07-10 DE DE102008032398A patent/DE102008032398A1/en not_active Ceased
-
2009
- 2009-07-03 TW TW098122653A patent/TW201014935A/en unknown
- 2009-07-06 WO PCT/EP2009/004879 patent/WO2010003621A1/en active Application Filing
- 2009-07-06 JP JP2011517017A patent/JP2011527381A/en not_active Withdrawn
- 2009-07-06 PL PL09776985T patent/PL2310558T3/en unknown
- 2009-07-06 EP EP09776985A patent/EP2310558B1/en not_active Not-in-force
- 2009-07-06 AT AT09776985T patent/ATE549434T1/en active
- 2009-07-06 KR KR1020117000324A patent/KR20110031183A/en not_active Application Discontinuation
- 2009-07-06 CN CN2009801264856A patent/CN102089466B/en not_active Expired - Fee Related
- 2009-07-06 US US13/003,209 patent/US20110174631A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
PL2310558T3 (en) | 2012-09-28 |
EP2310558A1 (en) | 2011-04-20 |
WO2010003621A1 (en) | 2010-01-14 |
JP2011527381A (en) | 2011-10-27 |
TW201014935A (en) | 2010-04-16 |
CN102089466A (en) | 2011-06-08 |
US20110174631A1 (en) | 2011-07-21 |
KR20110031183A (en) | 2011-03-24 |
CN102089466B (en) | 2012-11-07 |
DE102008032398A1 (en) | 2010-01-14 |
EP2310558B1 (en) | 2012-03-14 |
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