EP1496142A3 - Electroplating method and electroplating apparatus - Google Patents

Electroplating method and electroplating apparatus Download PDF

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Publication number
EP1496142A3
EP1496142A3 EP03257520A EP03257520A EP1496142A3 EP 1496142 A3 EP1496142 A3 EP 1496142A3 EP 03257520 A EP03257520 A EP 03257520A EP 03257520 A EP03257520 A EP 03257520A EP 1496142 A3 EP1496142 A3 EP 1496142A3
Authority
EP
European Patent Office
Prior art keywords
electroplating
plating
plated
carrier tape
object product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03257520A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1496142A2 (en
Inventor
Satochi Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneko Denki KK
Original Assignee
Kaneko Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneko Denki KK filed Critical Kaneko Denki KK
Publication of EP1496142A2 publication Critical patent/EP1496142A2/en
Publication of EP1496142A3 publication Critical patent/EP1496142A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
EP03257520A 2003-07-04 2003-11-28 Electroplating method and electroplating apparatus Withdrawn EP1496142A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003192500 2003-07-04
JP2003192500A JP2005023398A (ja) 2003-07-04 2003-07-04 メッキ方法およびメッキ装置

Publications (2)

Publication Number Publication Date
EP1496142A2 EP1496142A2 (en) 2005-01-12
EP1496142A3 true EP1496142A3 (en) 2006-04-05

Family

ID=33447965

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03257520A Withdrawn EP1496142A3 (en) 2003-07-04 2003-11-28 Electroplating method and electroplating apparatus

Country Status (3)

Country Link
US (1) US20050006243A1 (ja)
EP (1) EP1496142A3 (ja)
JP (1) JP2005023398A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
JP5056888B2 (ja) * 2010-03-29 2012-10-24 Ｔｄｋ株式会社 めっき装置、めっき方法およびチップ型電子部品の製造方法
JP6019297B2 (ja) * 2012-02-01 2016-11-02 株式会社ニックス 被めっき材の保護具
CN113818057B (zh) * 2021-09-25 2023-03-10 山东睿思精密工业有限公司 一种散件cpu散热片连续电镀方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898145A (en) * 1971-02-17 1975-08-05 Scm Corp Process for applying contrasting coatings to a workpiece
US4321124A (en) * 1981-02-02 1982-03-23 Select Technology Corporation Loose parts plating apparatus
EP0501392A2 (en) * 1991-02-28 1992-09-02 The Whitaker Corporation Carrier, method of manufacturing and use therefor
EP1205411A1 (de) * 2000-11-13 2002-05-15 Wilhelm Steckelbach Modulare Vorrichtung zum Oberflächenbehandeln von Behandlungsgut in Form von Einzelheiten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4904363A (en) * 1989-04-25 1990-02-27 Burndy Corporation Selective plating systems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3898145A (en) * 1971-02-17 1975-08-05 Scm Corp Process for applying contrasting coatings to a workpiece
US4321124A (en) * 1981-02-02 1982-03-23 Select Technology Corporation Loose parts plating apparatus
EP0501392A2 (en) * 1991-02-28 1992-09-02 The Whitaker Corporation Carrier, method of manufacturing and use therefor
EP1205411A1 (de) * 2000-11-13 2002-05-15 Wilhelm Steckelbach Modulare Vorrichtung zum Oberflächenbehandeln von Behandlungsgut in Form von Einzelheiten

Also Published As

Publication number Publication date
EP1496142A2 (en) 2005-01-12
US20050006243A1 (en) 2005-01-13
JP2005023398A (ja) 2005-01-27

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