EP1475463A3 - Reverse pulse plating composition and method - Google Patents

Reverse pulse plating composition and method Download PDF

Info

Publication number
EP1475463A3
EP1475463A3 EP03258024A EP03258024A EP1475463A3 EP 1475463 A3 EP1475463 A3 EP 1475463A3 EP 03258024 A EP03258024 A EP 03258024A EP 03258024 A EP03258024 A EP 03258024A EP 1475463 A3 EP1475463 A3 EP 1475463A3
Authority
EP
European Patent Office
Prior art keywords
reverse pulse
plating composition
pulse plating
composition
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03258024A
Other languages
German (de)
French (fr)
Other versions
EP1475463B1 (en
EP1475463A2 (en
EP1475463B2 (en
Inventor
Leon R. Barstad
Thomas Buckley
Raymond Cruz
Trevor Goodrick
Gary Hamm
Mark J. Kapeckas
Katie Price
Erik Reddington
Wade Sonnenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32990583&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1475463(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Publication of EP1475463A2 publication Critical patent/EP1475463A2/en
Publication of EP1475463A3 publication Critical patent/EP1475463A3/en
Publication of EP1475463B1 publication Critical patent/EP1475463B1/en
Application granted granted Critical
Publication of EP1475463B2 publication Critical patent/EP1475463B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
EP03258024.3A 2002-12-20 2003-12-18 Reverse pulse plating method Expired - Lifetime EP1475463B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43597602P 2002-12-20 2002-12-20
US435976P 2002-12-20

Publications (4)

Publication Number Publication Date
EP1475463A2 EP1475463A2 (en) 2004-11-10
EP1475463A3 true EP1475463A3 (en) 2006-04-12
EP1475463B1 EP1475463B1 (en) 2011-03-30
EP1475463B2 EP1475463B2 (en) 2017-03-01

Family

ID=32990583

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03258024.3A Expired - Lifetime EP1475463B2 (en) 2002-12-20 2003-12-18 Reverse pulse plating method

Country Status (7)

Country Link
US (2) US20050016858A1 (en)
EP (1) EP1475463B2 (en)
JP (1) JP4342294B2 (en)
KR (1) KR101085005B1 (en)
CN (1) CN1540040B (en)
DE (1) DE60336539D1 (en)
TW (1) TWI296014B (en)

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US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US9034165B2 (en) * 2008-06-23 2015-05-19 Brookhaven Science Associates, Llc Underpotential deposition-mediated layer-by-layer growth of thin films
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CN102481647B (en) 2009-08-14 2015-07-15 圣戈班磨料磨具有限公司 Abrasive Articles Including Abrasive Particles Bonded To An Elongated Body
CA2770508C (en) 2009-08-14 2014-10-28 Saint-Gobain Abrasives, Inc. Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof
JP5574912B2 (en) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 Tin plating solution
TW201507812A (en) 2010-12-30 2015-03-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
US9375826B2 (en) 2011-09-16 2016-06-28 Saint-Gobain Abrasives, Inc. Abrasive article and method of forming
CN103842132A (en) 2011-09-29 2014-06-04 圣戈班磨料磨具有限公司 Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof
TW201404527A (en) 2012-06-29 2014-02-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
TWI477343B (en) 2012-06-29 2015-03-21 Saint Gobain Abrasives Inc Abrasive article and method of forming
TW201402274A (en) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc Abrasive article and method of forming
TW201441355A (en) 2013-04-19 2014-11-01 Saint Gobain Abrasives Inc Abrasive article and method of forming
CN103668370A (en) * 2013-12-19 2014-03-26 潮州市连思科技发展有限公司 Method for pulse plating of disk
US9681828B2 (en) 2014-05-01 2017-06-20 Medtronic Minimed, Inc. Physiological characteristic sensors and methods for forming such sensors
US9725816B2 (en) * 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
TWI664057B (en) 2015-06-29 2019-07-01 美商聖高拜磨料有限公司 Abrasive article and method of forming
CN108138348B (en) * 2015-10-06 2020-04-24 埃托特克德国有限公司 Methods and articles for indium or indium alloy deposition
KR101646160B1 (en) * 2015-11-13 2016-08-08 (주)에스에이치팩 Chrome plating solution having excellent corrosion resistance
US20180030608A1 (en) * 2016-07-27 2018-02-01 Apple Inc. Plating having increased thickness and reduced grain size
CN106637308B (en) * 2016-11-16 2019-07-09 山东金宝电子股份有限公司 Electrolysis is without profile copper foil additive package and the method for preparing electrolytic copper foil with it
CN106782980B (en) * 2017-02-08 2018-11-13 包头天和磁材技术有限责任公司 The manufacturing method of permanent-magnet material
JP7087760B2 (en) * 2018-07-18 2022-06-21 住友金属鉱山株式会社 Copper-clad laminate
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods

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EP0440027A2 (en) * 1990-01-29 1991-08-07 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
WO2000044042A1 (en) * 1999-01-21 2000-07-27 Atotech Deutschland Gmbh Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
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WO2003080896A1 (en) * 2002-03-18 2003-10-02 Taskem, Inc. High speed acid copper plating

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EP0440027A2 (en) * 1990-01-29 1991-08-07 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
WO2000044042A1 (en) * 1999-01-21 2000-07-27 Atotech Deutschland Gmbh Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
WO2001021294A2 (en) * 1999-09-24 2001-03-29 Semitool, Inc. Pattern dependent surface profile evolution of electrochemically deposited metal
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WO2003080896A1 (en) * 2002-03-18 2003-10-02 Taskem, Inc. High speed acid copper plating

Also Published As

Publication number Publication date
JP2004204351A (en) 2004-07-22
TW200424330A (en) 2004-11-16
EP1475463B1 (en) 2011-03-30
US20050016858A1 (en) 2005-01-27
TWI296014B (en) 2008-04-21
KR101085005B1 (en) 2011-11-21
JP4342294B2 (en) 2009-10-14
EP1475463A2 (en) 2004-11-10
DE60336539D1 (en) 2011-05-12
US20060081475A1 (en) 2006-04-20
CN1540040B (en) 2012-04-04
EP1475463B2 (en) 2017-03-01
CN1540040A (en) 2004-10-27
KR20040055684A (en) 2004-06-26

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