AU2003265370A1 - Pulse reverse electrolysis of acidic copper electroplating solutions - Google Patents

Pulse reverse electrolysis of acidic copper electroplating solutions

Info

Publication number
AU2003265370A1
AU2003265370A1 AU2003265370A AU2003265370A AU2003265370A1 AU 2003265370 A1 AU2003265370 A1 AU 2003265370A1 AU 2003265370 A AU2003265370 A AU 2003265370A AU 2003265370 A AU2003265370 A AU 2003265370A AU 2003265370 A1 AU2003265370 A1 AU 2003265370A1
Authority
AU
Australia
Prior art keywords
copper electroplating
acidic copper
reverse electrolysis
electroplating solutions
pulse reverse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003265370A
Other versions
AU2003265370A8 (en
Inventor
Michael R. Crary
Roderick D. Herdman
Ernest Long
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Acumen Inc
Original Assignee
MacDermid Acumen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Acumen Inc filed Critical MacDermid Acumen Inc
Publication of AU2003265370A8 publication Critical patent/AU2003265370A8/en
Publication of AU2003265370A1 publication Critical patent/AU2003265370A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
AU2003265370A 2002-10-21 2003-08-06 Pulse reverse electrolysis of acidic copper electroplating solutions Abandoned AU2003265370A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/274,634 US20040074775A1 (en) 2002-10-21 2002-10-21 Pulse reverse electrolysis of acidic copper electroplating solutions
US10/274,634 2002-10-21
PCT/US2003/024498 WO2004038070A2 (en) 2002-10-21 2003-08-06 Pulse reverse electrolysis of acidic copper electroplating solutions

Publications (2)

Publication Number Publication Date
AU2003265370A8 AU2003265370A8 (en) 2004-05-13
AU2003265370A1 true AU2003265370A1 (en) 2004-05-13

Family

ID=32093089

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003265370A Abandoned AU2003265370A1 (en) 2002-10-21 2003-08-06 Pulse reverse electrolysis of acidic copper electroplating solutions

Country Status (4)

Country Link
US (1) US20040074775A1 (en)
AU (1) AU2003265370A1 (en)
TW (1) TWI261075B (en)
WO (1) WO2004038070A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105082B2 (en) * 2003-02-27 2006-09-12 Novellus Systems, Inc. Composition and method for electrodeposition of metal on a work piece
US20050284766A1 (en) * 2004-06-25 2005-12-29 Herdman Roderick D Pulse reverse electrolysis of acidic copper electroplating solutions
EP1712660A1 (en) 2005-04-12 2006-10-18 Enthone Inc. Insoluble anode
TWI374502B (en) * 2007-05-14 2012-10-11 Renesas Electronics Corp Method of manufacturing semiconductor device to decrease defect number of plating film
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
DE102012206800B3 (en) * 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Method and apparatus for the electrolytic deposition of a deposition metal on a workpiece
CN103334135A (en) * 2013-06-19 2013-10-02 西北工业大学 Preparation method of ultra-fine grain copper wire
CN103668370A (en) * 2013-12-19 2014-03-26 潮州市连思科技发展有限公司 Method for pulse plating of disk
CN103911635B (en) * 2014-03-21 2016-02-24 复旦大学 A kind of copper electroplating solution
CN106757193B (en) * 2016-11-24 2018-07-13 中国地质大学（武汉） A kind of method without cyanogen acid bright copper plating of leaf

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2558090A (en) * 1947-12-11 1951-06-26 Westinghouse Electric Corp Periodic reverse current electroplating apparatus
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US4673469A (en) * 1984-06-08 1987-06-16 Mcgean-Rohco, Inc. Method of plating plastics
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
KR100366631B1 (en) * 2000-09-27 2003-01-09 삼성전자 주식회사 Electrolyte for copper plating comprising polyvinylpyrrolidone and electroplating method for copper wiring of semiconductor devices using the same
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
JP2003105584A (en) * 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co Copper plating solution for embedding fine wiring and copper plating method using the same
JP4148895B2 (en) * 2001-10-16 2008-09-10 新光電気工業株式会社 Hole copper plating method

Also Published As

Publication number Publication date
AU2003265370A8 (en) 2004-05-13
WO2004038070A2 (en) 2004-05-06
US20040074775A1 (en) 2004-04-22
WO2004038070A3 (en) 2004-07-01
TWI261075B (en) 2006-09-01
TW200407467A (en) 2004-05-16

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase