CN106757193B - A kind of method without cyanogen acid bright copper plating of leaf - Google Patents
A kind of method without cyanogen acid bright copper plating of leaf Download PDFInfo
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- CN106757193B CN106757193B CN201611067921.5A CN201611067921A CN106757193B CN 106757193 B CN106757193 B CN 106757193B CN 201611067921 A CN201611067921 A CN 201611067921A CN 106757193 B CN106757193 B CN 106757193B
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- leaf
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- copper plating
- acid bright
- cyanogen acid
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A kind of method without cyanogen acid bright copper plating of leaf, includes the following steps：(1) it pre-processes, chooses leaf, remove mesophyll, it is spare；(2) oil on leaf surface is removed by ultrasonic washing instrument；(3) by silver mirror reaction in leaf surface coating；(4) by Common platings method on the leaf of plated film electro-coppering base；(5) by dual-pulse power supply on the leaf for be electroplate with base copper electro-coppering bright layer；Layer-stabilizing will be plated, and applies protective film, you can the leaf without cyanogen acid bright copper plating is made.The present invention can be widely applied to that high-end craftwork is made, and customization of individual character is applied to interior decoration, gift souvenir, Jewelry Accessories etc..
Description
Technical field
Bright copper coating that the present invention relates to one kind on non-conductive substrate, and in particular to a kind of leaf without cyanic acid
The method of property bright copper plating.
Background technology
Currently, most plants plating is electroplated using direct current, activation polarization is big, and thickness of coating is uneven,
It is easy to generate hydrogen embrittlement and dendrite phenomenon, the long-time for being unfavorable for material retains, in addition, in plant electro-coppering, generally use cyanogen
Compound copper facing, cyanide toxicity is very big, is easy to pollute environment, and the leveling ability of cyanide is weak, therefore, although light on the market
There are many kinds of bright dose, but it is directed to metal matrix mostly, moreover, the effect of some brighteners is not highly desirable, electroplating cost is high.
Invention content
In view of this, the present invention provides a kind of thickness of coating uniformly, it is bright, it is pollution-free, leaf at low cost without cyanogen
The method of acid bright copper plating.
The present invention provides a kind of methods without cyanogen acid bright copper plating of leaf, include the following steps：
(1) it pre-processes：Leaf is chosen, is first dried the leaf of selection 3-5 days, then leaf is put into deionized water and is impregnated
One day, leaf is taken out, the mesophyll of leaf is removed, vein is left, is cleaned, it is spare；
(2) oil removing：The leaf pre-processed is put into ultrasonic washing instrument, cleaning is added into ultrasonic washing instrument and is situated between
Matter to leaf is completely submerged in cleansing medium, opens ultrasonic washing instrument, cleans 3-5 minutes, leaf is taken out, and is rinsed dry
Only；
(3) plated film：The SnCl of the mass fraction 1% newly configured will be put at room temperature by the leaf of step (2) processing2
5-10min is impregnated in solution, takes out leaf, is cleaned, and clean leaf is placed in the silver of 200mL mass fractions 2% at 30 DEG C
In ammonia solution, 5-10min is stood, the sodium potassium tartrate tetrahydrate of formalin and 0.1mL 40g/L that 1mL mass fractions 36% are added is molten
Liquid, heating water bath is until uniformly silver-colored simple substance, taking-up leaf are rinsed with distilled water, obtain silver leaf surface plating last layer repeatedly
The leaf of color；
(4) base copper is electroplated：Copper sulfate electrolyte is prepared, a copper mesh and two clean copper wires are taken, by two copper wires point
It is not wrapped at the top of petiole root and the copper mesh of the leaf handled by step (3), leaf and copper mesh is inserted into copper sulphate electricity
It solves in liquid, leaf is all connected to the circuit of adjustable DC power supply as electroplating cathode, copper mesh as galvanic anode, two copper wires
In, voltage is adjusted to 6V, electric current is controlled in 0.5-1.0A, magnetic stirrer copper sulfate electrolyte is used in combination, 15- is electroplated
20min takes out leaf, rinses in deionized water, dries up；
(5) electro-coppering bright layer：Prepare without cyanogen acid bright copper plating electrolyte, by by step (4) processing leaf and
Copper mesh is put into no cyanogen acid bright copper plating electrolyte, and leaf and copper mesh is connected into dipulse circuit, and leaf connects reverse impulse
Electrode, copper mesh connect direct impulse electrode, open dipulse circuit, and dipulse circuit parameter, the average electricity of adjustment direct impulse is arranged
Stream is 0.2-0.6A, and reverse impulse average current is 0.02-0.06A, meanwhile, it is plated without cyanogen Technology Bright Acidic with magnetic stirrer
Copper electrolyte, be electroplated 8-12h, add a sulphoxylic acid and Technology Bright Acidic agent every a hour, after the completion of plating, leaf spend from
Sub- water is cleaned, and leaf is sealed, and prevents from aoxidizing；
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, at 30 DEG C of bath temperature, the tree of step (5) processing will be passed through
Leaf is put into coating stabilization agent, stabilizes 30-40min, leaf is taken out, is rinsed well with deionized water；
(7) protective film is applied：Protective film is prepared, the leaf that will pass through step (6) processing applies one layer of uniform protective film at once,
After 12h, repetition brushing protective film is primary, and natural air drying is to get to plating, whether there is or not the leaves of cyanic acid bright copper.
Further, in the step (1), selection vein is sparse and solid, is in the keratin leaf in maturity period, will first choose
Leaf discoloration silica dehydrator 3-5 days, then leaf is put into deionized water and is impregnated one day, taking-up leaf, by the leaf of leaf
Meat is removed by soft hairbrush, leaves vein, then cleaned leaf with deionized water.
Further, in the step (2), cleansing medium is the Na of mass fraction 4%2CO3Solution.
Further, in the step (4), copper sulfate electrolyte is the CuSO of 400mL mass fractions 30%4Solution, and drip
Add the H of 0.2-0.3mL 1.5mol/L2SO4。
Further, in the step (5), the formula of no cyanogen acid bright copper plating electrolyte is：CuSO4·5H2O200g/L,
H2SO4The molecular weight of 50-60g/L, polyethylene glycol 30mg/L, polyethylene glycol are 6000, acetyl thiourea 12mg/L, Cl-3mg/L,
Sulphur pyrolle thioketones 1mg/L between 2- tetrahydrochysenes.
Further, in the step (5), dipulse circuit parameter is that direct impulse turn-on time is 0.2-0.4ms, shutdown
Time is 0.8-1ms, and working time 100-150ms, reverse impulse turn-on time is 0.1-0.2ms, turn-off time 0.9-
1.2ms, working time 10ms.
Further, in the step (5), leaf is sealed by preservative film.
Further, in the step (6), the pH of coating stabilization agent is adjusted by sulfuric acid and buffer solution in 4.5-5, coating
The formula of stabilization agent is：The molecular weight of polyethylene glycol 50-100mg/L, polyethylene glycol are 6000, thiocarbamide 0.05-10mg/L.
Further, in the step (7), the formula of protective film is：Novolaks and turpentine oil, novolaks and turpentine oil
Ratio be 1：2.
Compared with prior art, the invention has the advantages that：Method is simple, easily operated, can be widely used in
The surface treatment of the non-conductive substrates such as plastics, peanut shell, beetle shell, for high-end craftwork, customization of individual character, indoor dress to be made
Decorations, gift souvenir or Jewelry Accessories etc.；It is uniformly and smooth that coating is effectively ensured, coating brightness is high, not oxidizable, tool
There is good electric conductivity, ornamental value is high, can retain the leaf for being easy to corruption for a long time, moreover, reagent is environmentally friendly, and it is nontoxic, it is suitable for
Large-scale production.
Description of the drawings
Fig. 1 is the flow chart of one embodiment of the invention.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with embodiment and attached drawing to this hair
It is bright to be further described.
Embodiment 1
Referring to Fig. 1, the present embodiment includes the following steps：
(1) it pre-processes：The leaf of the cassia tree in growth medium is chosen, cassia tree leaf is keratin leaf, with discoloration silica gel
Leaf is dried 3 days as drier, then leaf is put into deionized water and is impregnated one day, takes out leaf, it will with soft hairbrush
The mesophyll of leaf removes, and leaves vein, is rinsed well with deionized water, spare；
(2) oil removing：The leaf pre-processed is put into ultrasonic washing instrument, the cleansing medium in ultrasonic washing instrument is
The Na of mass fraction 4%2CO3Solution allows leaf to be totally submerged in cleansing medium, opens ultrasonic washing instrument, cleans 3 minutes,
The leaf after cleaning is taken out with tweezers, deionized water is used in combination to flush three times；
(3) plated film：The leaf that step (2) is handled well is put into the SnCl of the mass fraction 1% newly configured at room temperature2It is molten
In liquid, 5min is impregnated, is taken out leaf with tweezers, more than deionized water rinsing three times, cleaned, by clean leaf at 30 DEG C
Under be placed in the silver ammino solution of 200mL mass fractions 2%, after standing 5min, be added 1mL mass fractions 36% formalin and
The potassium sodium tartrate solution of 0.1mL 40g/L, heating water bath take out until the uniform silver-colored simple substance of leaf surface chemical plating last layer
Leaf is rinsed with distilled water, obtains the leaf of chemical silvering repeatedly；
(4) base copper is electroplated：Prepare the CuSO of 400mL mass fractions 30%4Solution, and it is added dropwise 0.2mL1.5mol/L's
H2SO4Copper sulfate electrolyte is obtained, a copper mesh and two clean copper wires, two copper wires is taken to be twined with a copper wire as conducting wire
It is wound on the petiole root of leaf, and is fixed on a glass bar or small wood, the top of copper mesh is wrapped in another copper wire,
And be fixed on another glass bar or small wood, leaf and copper mesh are inserted into copper sulfate electrolyte, leaf is cloudy as plating
Pole, copper mesh adjust copper mesh and interlobate distance as galvanic anode, and two copper wires are connected to adjustable DC power supply
In circuit, voltage is adjusted to 6V, control electric current is 0.75A, and with magnetic stirrer copper sulfate electrolyte, 20min is electroplated,
It takes out leaf to rinse in deionized water, dry up；
(5) electro-coppering bright layer：It prepares without cyanogen acid bright copper plating electrolyte, no cyanogen acid bright copper plating electrolyte is matched
Fang Wei：
| Title | Technological requirement |
| CuSO4·5H2O | 200g/L |
| H2SO4 | 60g/L |
| Polyethylene glycol (M=6000) | 30mg/L |
| Acetyl thiourea | 12mg/L |
| Cl- | 3mg/L |
| Sulphur pyrolle thioketones (H between 2- tetrahydrochysenes1) | 1mg/L |
By by step (4) processing leaf and copper mesh be put into no cyanogen acid bright copper plating electrolyte, and by leaf and
Copper mesh is connected into dipulse circuit, and leaf is reversed to pulsed electrode, and copper mesh connects direct impulse electrode, opens dipulse circuit, setting
Dipulse circuit parameter, adjustment direct impulse average current are 0.2A, and reverse impulse average current is 0.02A, 8h is electroplated, herein
Primary prepared sulfuric acid and Technology Bright Acidic agent are added every a hour in the process, after the completion of plating, leaf is spent
Ionized water flushes three times, and leaf is sealed with preservative film, prevents from aoxidizing；
Dipulse circuit parameter is：
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, coating stabilization agent formula is：
| Title | Technological requirement |
| Polyethylene glycol (M=6000) | 100mg/L |
| Thiocarbamide | 5mg/L |
| PH (is adjusted) with sulfuric acid and buffer solution | 4.5 |
At 30 DEG C of bath temperature, it will be put into coating stabilization agent solution, stabilize by the leaf of step (5) processing
30min takes out leaf, is rinsed well with deionized water；
(7) protective film is applied：Protective film is prepared, the formula of protective film is：
| Title | Technological requirement |
| Novolaks | 100ml |
| Turpentine oil | 200ml |
The leaf that step (6) processing will be passed through applies one layer of uniform chemoproection film at once, prevents brightness from declining, 12h
Afterwards, it is primary to repeat brushing protective film, natural air drying is to get whether there is or not the leaves of cyanic acid bright copper to plating.
The method of the present invention is simple, easily operated, can be widely used in the non-conductive substrates such as plastics, peanut shell, beetle shell
Surface treatment, for high-end craftwork, customization of individual character, interior decoration, gift souvenir or Jewelry Accessories etc. to be made；Have
Effect ensures that coating is uniformly and smooth, and coating brightness is high, has good electric conductivity, and ornamental value is high, can retain for a long time easily
In the leaf of corruption, moreover, reagent is environmentally friendly, it is nontoxic, it is suitable for large-scale production.
Embodiment 2
Referring to Fig. 1, the present embodiment includes the following steps：
(1) it pre-processes：The leaf of the rubber tree in growth medium is chosen, rubber tree leaf is keratin leaf, with discoloration
Silica gel dries leaf 4 days as drier, then leaf is put into deionized water and is impregnated one day, leaf is taken out, with soft hair
Brush removes the mesophyll of leaf, leaves vein, is rinsed well with deionized water, spare；
(2) oil removing：The leaf pre-processed is put into ultrasonic washing instrument, the cleansing medium in ultrasonic washing instrument is
The Na of mass fraction 4%2CO3Solution allows leaf to be totally submerged in cleansing medium, opens ultrasonic washing instrument, cleans 3 minutes,
The leaf after cleaning is taken out with tweezers, deionized water is used in combination to flush three times；
(3) plated film：The leaf that step (2) is handled well is put into the SnCl of the mass fraction 1% newly configured at room temperature2It is molten
In liquid, 10min is impregnated, is taken out leaf with tweezers, more than deionized water rinsing three times, cleaned, by clean leaf 30
It is placed at DEG C in the silver ammino solution of 200mL mass fractions 2%, after standing 10min, the formaldehyde that 1mL mass fractions 36% are added is molten
The potassium sodium tartrate solution of liquid and 0.1mL 40g/L, heating water bath until the uniform silver-colored simple substance of leaf surface chemical plating last layer,
Leaf is taken out, is rinsed repeatedly with distilled water, obtains the leaf of chemical silvering；
(4) base copper is electroplated：Prepare the CuSO of 400mL mass fractions 30%4Solution, and it is added dropwise 0.2mL1.5mol/L's
H2SO4As copper sulfate electrolyte, a copper mesh and two clean copper wires, two copper wires is taken to be wound with a copper wire as conducting wire
It in the petiole root of leaf, and is fixed on a glass bar or small wood, the top of copper mesh is wrapped in another copper wire,
And be fixed on another glass bar or small wood, leaf and copper mesh are inserted into copper sulfate electrolyte, leaf is as plating
Cathode, copper mesh adjust copper mesh and interlobate distance as galvanic anode, and two copper wires are connected to adjustable DC power supply
Circuit in, voltage is adjusted to 6V, control electric current is 0.75A, with magnetic stirrer copper sulfate electrolyte, is electroplated
15min takes out leaf and rinses in deionized water, dries up；
(5) electro-coppering bright layer：It prepares without cyanogen acid bright copper plating electrolyte, no cyanogen acid bright copper plating electrolyte is matched
Fang Wei：
| Title | Technological requirement |
| CuSO4·5H2O | 200g/L |
| H2SO4 | 60g/L |
| Polyethylene glycol (M=6000) | 30mg/L |
| Acetyl thiourea | 12mg/L |
| Cl- | 3mg/L |
| Sulphur pyrolle thioketones (H between 2- tetrahydrochysenes1) | 1mg/L |
By by step (4) processing leaf and copper mesh be put into no cyanogen acid bright copper plating electrolyte, and by leaf and
Copper mesh is connected into dipulse circuit, and leaf is reversed to pulsed electrode, and copper mesh connects direct impulse electrode, opens dipulse circuit, setting
Dipulse circuit parameter, adjustment direct impulse average current are 0.6A, and reverse impulse average current is 0.06A, 8h is electroplated, herein
Primary prepared sulfuric acid and Technology Bright Acidic agent are added every a hour in the process, after the completion of plating, leaf is spent
Ionized water flushes three times, and leaf is sealed with preservative film, prevents from aoxidizing；
Dipulse circuit parameter is：
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, coating stabilization agent formula is：
| Title | Technological requirement |
| Polyethylene glycol (M=6000) | 100mg/L |
| Thiocarbamide | 10mg/L |
| PH (is adjusted) with sulfuric acid and buffer solution | 5 |
At 30 DEG C of bath temperature, it will be put into coating stabilization agent solution, stabilize by the leaf of step (5) processing
30min takes out leaf, is rinsed well with deionized water；
(7) protective film is applied：Protective film is prepared, the formula of protective film is：
| Title | Technological requirement |
| Novolaks | 100ml |
| Turpentine oil | 200ml |
The leaf that step (6) processing will be passed through applies one layer of uniform chemoproection film at once, prevents brightness from declining, 12h
Afterwards, it is primary to repeat brushing protective film, natural air drying is to get whether there is or not the leaves of cyanic acid bright copper to plating.
The method of the present invention is simple, easily operated, can be widely used in the non-conductive substrates such as plastics, peanut shell, beetle shell
Surface treatment, for high-end craftwork, customization of individual character, interior decoration, gift souvenir or Jewelry Accessories etc. to be made；Have
Effect ensures that coating is uniformly and smooth, and coating brightness is high, has good electric conductivity, and ornamental value is high, can retain for a long time easily
In the leaf of corruption, moreover, reagent is environmentally friendly, it is nontoxic, it is suitable for large-scale production.
In the absence of conflict, the feature in embodiment and embodiment herein-above set forth can be combined with each other.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of method without cyanogen acid bright copper plating of leaf, which is characterized in that include the following steps：
(1) it pre-processes：Leaf is chosen, is first dried the leaf of selection 3-5 days, then leaf is put into deionized water and impregnates one
It, takes out leaf, and the mesophyll of leaf is removed, vein is left, and cleans, spare；
(2) oil removing：The leaf pre-processed is put into ultrasonic washing instrument, cleansing medium is added extremely into ultrasonic washing instrument
Leaf is completely submerged in cleansing medium, opens ultrasonic washing instrument, cleans 3-5 minutes, leaf is taken out, is rinsed well；
(3) plated film：The SnCl of the mass fraction 1% newly configured will be put at room temperature by the leaf of step (2) processing2Solution
Middle immersion 5-10min takes out leaf, cleans, and the silver-colored ammonia that clean leaf is placed in 200mL mass fractions 2% at 30 DEG C is molten
In liquid, 5-10min is stood, the potassium sodium tartrate solution of the formalin and 0.1mL 40g/L of 1mL mass fractions 36% is added,
Heating water bath is until uniformly silver-colored simple substance, taking-up leaf are rinsed with distilled water, obtain silver color leaf surface plating last layer repeatedly
Leaf；
(4) base copper is electroplated：Copper sulfate electrolyte is prepared, a copper mesh and two clean copper wires is taken, two copper wires is twined respectively
It is wound at the top of petiole root and the copper mesh of the leaf handled by step (3), leaf and copper mesh is inserted into copper sulfate electrolyte
In, leaf is all connected to as galvanic anode, two copper wires in the circuit of adjustable DC power supply as electroplating cathode, copper mesh,
Voltage is adjusted to 6V, electric current is controlled in 0.5-1.0A, magnetic stirrer copper sulfate electrolyte is used in combination, 15- is electroplated
20min takes out leaf, rinses in deionized water, dries up；
(5) electro-coppering bright layer：It prepares without cyanogen acid bright copper plating electrolyte, the leaf and copper mesh of step (4) processing will be passed through
It being put into no cyanogen acid bright copper plating electrolyte, and leaf and copper mesh is connected into dipulse circuit, leaf is reversed to pulsed electrode,
Copper mesh connects direct impulse electrode, opens dipulse circuit, and dipulse circuit parameter is arranged, and adjustment direct impulse average current is
0.2-0.6A, reverse impulse average current are 0.02-0.06A, meanwhile, with magnetic stirrer without cyanogen acid bright copper plating electricity
Liquid is solved, 8-12h is electroplated, a sulphoxylic acid and Technology Bright Acidic agent are added every a hour, after the completion of plating, leaf deionized water
It cleans, and leaf is sealed, prevent from aoxidizing；
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, at 30 DEG C of bath temperature, will be put by the leaf of step (5) processing
Enter in coating stabilization agent, stabilizes 30-40min, leaf is taken out, is rinsed well with deionized water；
(7) protective film is applied：Protective film is prepared, the leaf that will pass through step (6) processing applies one layer of uniform protective film, 12h at once
Afterwards, it is primary to repeat brushing protective film, natural air drying is to get whether there is or not the leaves of cyanic acid bright copper to plating.
2. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (1)
In, selection vein is sparse and solid, is in the keratin leaf in maturity period, and the leaf of selection is first used discoloration silica dehydrator 3-5 days,
Leaf is put into deionized water again and is impregnated one day, leaf is taken out, the mesophyll of leaf is removed by soft hairbrush, leaves leaf
Arteries and veins, then cleaned leaf with deionized water.
3. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (2)
In, cleansing medium is the Na of mass fraction 4%2CO3Solution.
4. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (4)
In, copper sulfate electrolyte is the CuSO of 400mL mass fractions 30%4Solution, and the H of 0.2-0.3mL 1.5mol/L is added dropwise2SO4。
5. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (5)
In, the formula of no cyanogen acid bright copper plating electrolyte is：CuSO4·5H2O 200g/L, H2SO450-60g/L, polyethylene glycol
The molecular weight of 30mg/L, polyethylene glycol are 6000, acetyl thiourea 12mg/L, Cl-Sulphur pyrolle thioketones 1mg/ between 3mg/L, 2- tetrahydrochysene
L。
6. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (5)
In, it is 0.2-0.4ms that dipulse circuit parameter, which is direct impulse turn-on time, turn-off time 0.8-1ms, and the working time is
100-150ms, reverse impulse turn-on time are 0.1-0.2ms, turn-off time 0.9-1.2ms, working time 10ms.
7. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (5)
In, leaf is sealed by preservative film.
8. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (6)
In, the pH of coating stabilization agent is adjusted by sulfuric acid and buffer solution in 4.5-5, and the formula of coating stabilization agent is：Polyethylene glycol
The molecular weight of 50-100mg/L, polyethylene glycol are 6000, thiocarbamide 0.05-10mg/L.
9. the method without cyanogen acid bright copper plating of leaf according to claim 1, which is characterized in that the step (7)
In, the formula of protective film is：Novolaks and turpentine oil, novolaks and terebinthine volume ratio are 1：2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611067921.5A CN106757193B (en) | 2016-11-24 | 2016-11-24 | A kind of method without cyanogen acid bright copper plating of leaf |
Applications Claiming Priority (1)
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339620A (en) * | 2000-08-24 | 2002-03-13 | 韩巍 | Gold electroplatic method for flowers |
| CN101481812A (en) * | 2008-12-31 | 2009-07-15 | 清华大学 | Electrolytic solution for integrated circuit copper wire laying electrodeposition |
| CN101487130A (en) * | 2009-01-06 | 2009-07-22 | 北京航空航天大学 | Duplicating method for making scaliness biological epidermis morphology duplicating template by pulse electroforming method |
| CN101736342A (en) * | 2010-01-19 | 2010-06-16 | 陕西科技大学 | Method for plating metal on surface of flower |
| CN103774191A (en) * | 2014-02-24 | 2014-05-07 | 襄垣县韩山度假有限责任公司 | Copper plating method of leaf carving artware |
| CN103882488A (en) * | 2014-03-15 | 2014-06-25 | 沈阳师范大学 | Natural plant electroplating and finishing technique |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040074775A1 (en) * | 2002-10-21 | 2004-04-22 | Herdman Roderick Dennis | Pulse reverse electrolysis of acidic copper electroplating solutions |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339620A (en) * | 2000-08-24 | 2002-03-13 | 韩巍 | Gold electroplatic method for flowers |
| CN101481812A (en) * | 2008-12-31 | 2009-07-15 | 清华大学 | Electrolytic solution for integrated circuit copper wire laying electrodeposition |
| CN101487130A (en) * | 2009-01-06 | 2009-07-22 | 北京航空航天大学 | Duplicating method for making scaliness biological epidermis morphology duplicating template by pulse electroforming method |
| CN101736342A (en) * | 2010-01-19 | 2010-06-16 | 陕西科技大学 | Method for plating metal on surface of flower |
| CN103774191A (en) * | 2014-02-24 | 2014-05-07 | 襄垣县韩山度假有限责任公司 | Copper plating method of leaf carving artware |
| CN103882488A (en) * | 2014-03-15 | 2014-06-25 | 沈阳师范大学 | Natural plant electroplating and finishing technique |
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