CN106757193A - A kind of method without cyanogen acid bright copper plating of leaf - Google Patents
A kind of method without cyanogen acid bright copper plating of leaf Download PDFInfo
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- CN106757193A CN106757193A CN201611067921.5A CN201611067921A CN106757193A CN 106757193 A CN106757193 A CN 106757193A CN 201611067921 A CN201611067921 A CN 201611067921A CN 106757193 A CN106757193 A CN 106757193A
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- Prior art keywords
- leaf
- copper
- copper plating
- acid bright
- cyanogen acid
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A kind of method without cyanogen acid bright copper plating of leaf, comprises the following steps：(1) pre-process, choose leaf, remove mesophyll, it is standby；(2) oil on leaf surface is removed by ultrasonic washing instrument；(3) by silver mirror reaction in leaf surface coating；(4) base copper is electroplated on the leaf of plated film by Common platings method；(5) by dual-pulse power supply on the leaf for be electroplate with base copper electro-coppering bright layer；Layer-stabilizing will be plated, and will apply diaphragm, you can so that the leaf without cyanogen acid bright copper plating is obtained.The present invention can be widely applied to be made high-end handicraft, and customization of individual character is applied to the aspects such as interior decoration, gift souvenir, Jewelry Accessories.
Description
Technical field
The bright copper coating on non-conductive substrate the present invention relates to one kind, and in particular to a kind of leaf without cyanic acid
The method of property bright copper plating.
Background technology
At present, most plants plating is electroplated using direct current, and its activation polarization is big, and thickness of coating is uneven,
It is easy to produce hydrogen embrittlement and dendrite phenomenon, is unfavorable for that the long-time of material retains, in addition, in plant electro-coppering, generally using cyanogen
Compound copper facing, cyanide toxicity is very big, it is easy to pollute environment, and the leveling ability of cyanide is weak, therefore, although light on the market
Bright dose has many kinds, but is directed to metal matrix mostly, and, the effect of some brighteners is not highly desirable, and electroplating cost is high.
The content of the invention
In view of this, it is pollution-free the invention provides a kind of thickness of coating is uniform, light, the leaf of low cost without cyanogen
The method of acid bright copper plating.
The invention provides a kind of method without cyanogen acid bright copper plating of leaf, comprise the following steps：
(1) pre-process：Leaf is chosen, first the leaf of selection is dried 3-5 days, then leaf is put into immersion in deionized water
One day, leaf is taken out, the mesophyll of leaf is removed, leave vein, cleaned, it is standby；
(2) oil removing：The leaf that will have been pre-processed is put into ultrasonic washing instrument, is situated between to cleaning is added in ultrasonic washing instrument
Matter to leaf is completely submerged in cleansing medium, opens ultrasonic washing instrument, is cleaned 3-5 minutes, and leaf is taken out, and rinses dry
Only；
(3) plated film：The leaf processed by step (2) is put into the SnCl of the mass fraction 1% of new configuration at room temperature2
5-10min is soaked in solution, leaf is taken out, cleaned, clean leaf is placed in the silver of 200mL mass fractions 2% at 30 DEG C
In ammonia solution, 5-10min is stood, the formalin of addition 1mL mass fractions 36% and the sodium potassium tartrate tetrahydrate of 0.1mL 40g/L are molten
Liquid, heating water bath takes out leaf until the uniform silver simple substance of leaf plated surface last layer, is rinsed repeatedly with distilled water, obtains silver
The leaf of color；
(4) base copper is electroplated：Copper sulfate electrolyte is prepared, the copper wire of a copper mesh and two cleanings is taken, by two copper wires point
The petiole root and copper mesh top of the leaf processed by step (3) are not wrapped in, and leaf and copper mesh are inserted into copper sulphate electricity
In solution liquid, leaf is all connected to the circuit of adjustable dc source as electroplating cathode, copper mesh as galvanic anode, two copper wires
In, by voltage Tiao Jiedao 6V, control electric current uses magnetic stirrer copper sulfate electrolyte in 0.5-1.0A, electroplates 15-
20min, takes out leaf, rinses in deionized water, dries up；
(5) electro-coppering bright layer：Prepare without cyanogen acid bright copper plating electrolyte, the leaf that will be processed by step (4) and
During copper mesh is put into without cyanogen acid bright copper plating electrolyte, and leaf and copper mesh are connected into dipulse circuit, leaf connects reverse impulse
Electrode, copper mesh connects direct impulse electrode, opens dipulse circuit, sets dipulse circuit parameter, and adjustment direct impulse is averagely electric
It is 0.2-0.6A to flow, and reverse impulse average current is 0.02-0.06A, meanwhile, plated without cyanogen Technology Bright Acidic with magnetic stirrer
Copper electrolyte, electroplate 8-12h, add a sulphoxylic acid and Technology Bright Acidic agent every a hour, after the completion of plating, leaf spend from
Sub- water is cleaned, and leaf is sealed, anti-oxidation；
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, at 30 DEG C of bath temperature, the tree that will be processed by step (5)
Leaf is put into coating stabilization agent, stabilizes 30-40min, and leaf is taken out, and is rinsed well with deionized water；
(7) diaphragm is applied：Diaphragm is prepared, the leaf that will be processed by step (6) applies one layer of uniform diaphragm at once,
After 12h, brushing diaphragm is repeated once, natural air drying obtains being coated with the leaf without cyanic acid bright copper.
Further, in the step (1), selection vein is sparse and solid, the keratin leaf in the maturity period, will first choose
Leaf discoloration silica dehydrator 3-5 days, then leaf be put into deionized water soak one day, taking-up leaf, by the leaf of leaf
Meat is removed by soft hairbrush, leaves vein, then cleaned leaf with deionized water.
Further, in the step (2), cleansing medium is the Na of mass fraction 4%2CO3Solution.
Further, in the step (4), copper sulfate electrolyte is the CuSO of 400mL mass fractions 30%4Solution, and drip
Plus the H of 0.2-0.3mL 1.5mol/L2SO4。
Further, in the step (5), the formula without cyanogen acid bright copper plating electrolyte is：CuSO4·5H2O200g/L,
H2SO450-60g/L, polyethylene glycol 30mg/L, the molecular weight of polyethylene glycol is 6000, acetyl thiourea 12mg/L, Cl-3mg/L,
Sulphur pyrolle sulphur cave 1mg/L between 2- tetrahydrochysenes.
Further, in the step (5), dipulse circuit parameter is that direct impulse ON time is 0.2-0.4ms, shut-off
Time is 0.8-1ms, and the working time is 100-150ms, and reverse impulse ON time is 0.1-0.2ms, and the turn-off time is 0.9-
1.2ms, the working time is 10ms.
Further, in the step (5), leaf is sealed by preservative film.
Further, in the step (6), the pH of coating stabilization agent is adjusted in 4.5-5, coating by sulfuric acid and buffer solution
The formula of stabilization agent is：Polyethylene glycol 50-100mg/L, the molecular weight of polyethylene glycol is 6000, thiocarbamide 0.05-10mg/L.
Further, in the step (7), the formula of diaphragm is：Novolaks and turpentine oil, novolaks and turpentine oil
Ratio be 1：2.
Compared with prior art, the invention has the advantages that：Method is simple, it is easy to operate, and can be widely used in
The surface treatment of the non-conductive substrates such as plastics, peanut shell, beetle shell, for being made high-end handicraft, customization of individual character, indoor dress
The aspects such as decorations, gift souvenir, or Jewelry Accessories；Coating is effectively ensured uniform and smooth, coating brightness is high, not oxidizable, tool
There is good electric conductivity, ornamental value is high, can for a long time retain the leaf for being easy to corrupt, and, reagent environmental protection is nontoxic, is suitable to
Large-scale production.
Brief description of the drawings
Fig. 1 is the flow chart of one embodiment of the invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with embodiment and accompanying drawing to this hair
It is bright to be further described.
Embodiment 1
Fig. 1 is referred to, the present embodiment is comprised the following steps：
(1) pre-process：The leaf of the cassia tree in growth medium is chosen, cassia tree leaf is keratin leaf, with discoloration silica gel
Leaf is dried 3 days as drier, then leaf is put into deionized water is soaked one day, take out leaf, will with soft hairbrush
The mesophyll removal of leaf, leaves vein, is rinsed well with deionized water, standby；
(2) oil removing：The leaf that will have been pre-processed is put into ultrasonic washing instrument, and the cleansing medium in ultrasonic washing instrument is
The Na of mass fraction 4%2CO3Solution, allows leaf to be totally submerged in cleansing medium, opens ultrasonic washing instrument, cleans 3 minutes,
The leaf after cleaning is taken out with tweezers, and is flushed three times with deionized water；
(3) plated film：The leaf that step (2) is handled well is put into the SnCl of the mass fraction 1% of new configuration at room temperature2It is molten
In liquid, 5min is soaked, taken out leaf with tweezers, rinsed more than three times with deionized water, cleaned, by clean leaf at 30 DEG C
Under be placed in the silver ammino solution of 200mL mass fractions 2%, after standing 5min, add 1mL mass fractions 36% formalin and
The potassium sodium tartrate solution of 0.1mL 40g/L, heating water bath takes out until the uniform silver simple substance of leaf surface chemical plating last layer
Leaf, is rinsed repeatedly with distilled water, obtains the leaf of chemical silvering；
(4) base copper is electroplated：Prepare the CuSO of 400mL mass fractions 30%4Solution, and it is added dropwise 0.2mL1.5mol/L's
H2SO4Copper sulfate electrolyte is obtained, the copper wire of a copper mesh and two cleanings is taken, two copper wires are twined as wire with a copper wire
The petiole root of leaf is wound on, and is fixed on a glass bar or small wood, the top of copper mesh is wrapped in another copper wire,
And be fixed on another glass bar or small wood, by leaf and copper mesh insertion copper sulfate electrolyte, leaf is cloudy as plating
Pole, copper mesh adjusts copper mesh and interlobate distance as galvanic anode, and two copper wires are connected into adjustable dc source
In circuit, by voltage Tiao Jiedao 6V, control electric current is 0.75A, uses magnetic stirrer copper sulfate electrolyte, electroplates 20min,
Take out leaf to rinse in deionized water, dry up；
(5) electro-coppering bright layer：Prepare without cyanogen acid bright copper plating electrolyte, without matching somebody with somebody for cyanogen acid bright copper plating electrolyte
Fang Wei：
| Title | Technological requirement |
| CuSO4·5H2O | 200g/L |
| H2SO4 | 60g/L |
| Polyethylene glycol (M=6000) | 30mg/L |
| Acetyl thiourea | 12mg/L |
| Cl- | 3mg/L |
| Sulphur pyrolle sulphur cave (H between 2- tetrahydrochysenes1) | 1mg/L |
During the leaf and copper mesh that are processed by step (4) are put into without cyanogen acid bright copper plating electrolyte, and by leaf and
Copper mesh is connected into dipulse circuit, and leaf is reversed to pulsed electrode, and copper mesh connects direct impulse electrode, opens dipulse circuit, sets
Dipulse circuit parameter, adjustment direct impulse average current is 0.2A, and reverse impulse average current is 0.02A, electroplates 8h, herein
During add the sulfuric acid and Technology Bright Acidic agent that have once prepared every a hour, after the completion of plating, leaf is spent
Ionized water is flushed three times, and leaf is sealed with preservative film, anti-oxidation；
Dipulse circuit parameter is：
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, coating stabilization agent formula is：
| Title | Technological requirement |
| Polyethylene glycol (M=6000) | 100mg/L |
| Thiocarbamide | 5mg/L |
| PH (is adjusted) with sulfuric acid and buffer solution | 4.5 |
At 30 DEG C of bath temperature, the leaf processed by step (5) is put into coating stabilization agent solution, stabilized
30min, takes out leaf, is rinsed well with deionized water；
(7) diaphragm is applied：Diaphragm is prepared, the formula of diaphragm is：
| Title | Technological requirement |
| Novolaks | 100ml |
| Turpentine oil | 200ml |
The leaf that will be processed by step (6) applies one layer of uniform chemoproection film at once, prevents brightness from declining, 12h
Afterwards, brushing diaphragm is repeated once, natural air drying obtains being coated with the leaf without cyanic acid bright copper.
The inventive method is simple, it is easy to operate, and can be widely used in the non-conductive substrates such as plastics, peanut shell, beetle shell
Surface treatment, for being made the aspects such as high-end handicraft, customization of individual character, interior decoration, gift souvenir, or Jewelry Accessories；Have
Effect ensures that coating is uniform and smooth, and coating brightness is high, and with good electric conductivity, ornamental value is high, can retain for a long time easily
In corrupt leaf, and, reagent environmental protection is nontoxic, is suitable to large-scale production.
Embodiment 2
Fig. 1 is referred to, the present embodiment is comprised the following steps：
(1) pre-process：The leaf of the rubber tree in growth medium is chosen, rubber tree leaf is keratin leaf, with discoloration
Silica gel dries leaf 4 days as drier, then leaf is put into deionized water soaks one day, takes out leaf, uses soft hair
Brush and remove the mesophyll of leaf, leave vein, rinsed well with deionized water, it is standby；
(2) oil removing：The leaf that will have been pre-processed is put into ultrasonic washing instrument, and the cleansing medium in ultrasonic washing instrument is
The Na of mass fraction 4%2CO3Solution, allows leaf to be totally submerged in cleansing medium, opens ultrasonic washing instrument, cleans 3 minutes,
The leaf after cleaning is taken out with tweezers, and is flushed three times with deionized water；
(3) plated film：The leaf that step (2) is handled well is put into the SnCl of the mass fraction 1% of new configuration at room temperature2It is molten
In liquid, 10min is soaked, taken out leaf with tweezers, rinsed more than three times with deionized water, cleaned, by clean leaf 30
It is placed at DEG C in the silver ammino solution of 200mL mass fractions 2%, after standing 10min, adds the formaldehyde of 1mL mass fractions 36% molten
The potassium sodium tartrate solution of liquid and 0.1mL 40g/L, heating water bath until the uniform silver simple substance of leaf surface chemical plating last layer,
Leaf is taken out, is rinsed repeatedly with distilled water, obtain the leaf of chemical silvering；
(4) base copper is electroplated：Prepare the CuSO of 400mL mass fractions 30%4Solution, and it is added dropwise 0.2mL1.5mol/L's
H2SO4As copper sulfate electrolyte, the copper wire of a copper mesh and two cleanings is taken, two copper wires are wound as wire with a copper wire
In the petiole root of leaf, and it is fixed on a glass bar or small wood, the top of copper mesh is wrapped in another copper wire,
And be fixed on another glass bar or small wood, by leaf and copper mesh insertion copper sulfate electrolyte, leaf is used as plating
Negative electrode, copper mesh adjusts copper mesh and interlobate distance as galvanic anode, and two copper wires are connected into adjustable dc source
Circuit in, by voltage Tiao Jiedao 6V, control electric current is 0.75A, uses magnetic stirrer copper sulfate electrolyte, plating
15min, takes out leaf and rinses in deionized water, dries up；
(5) electro-coppering bright layer：Prepare without cyanogen acid bright copper plating electrolyte, without matching somebody with somebody for cyanogen acid bright copper plating electrolyte
Fang Wei：
| Title | Technological requirement |
| CuSO4·5H2O | 200g/L |
| H2SO4 | 60g/L |
| Polyethylene glycol (M=6000) | 30mg/L |
| Acetyl thiourea | 12mg/L |
| Cl- | 3mg/L |
| Sulphur pyrolle sulphur cave (H between 2- tetrahydrochysenes1) | 1mg/L |
During the leaf and copper mesh that are processed by step (4) are put into without cyanogen acid bright copper plating electrolyte, and by leaf and
Copper mesh is connected into dipulse circuit, and leaf is reversed to pulsed electrode, and copper mesh connects direct impulse electrode, opens dipulse circuit, sets
Dipulse circuit parameter, adjustment direct impulse average current is 0.6A, and reverse impulse average current is 0.06A, electroplates 8h, herein
During add the sulfuric acid and Technology Bright Acidic agent that have once prepared every a hour, after the completion of plating, leaf is spent
Ionized water is flushed three times, and leaf is sealed with preservative film, anti-oxidation；
Dipulse circuit parameter is：
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, coating stabilization agent formula is：
| Title | Technological requirement |
| Polyethylene glycol (M=6000) | 100mg/L |
| Thiocarbamide | 10mg/L |
| PH (is adjusted) with sulfuric acid and buffer solution | 5 |
At 30 DEG C of bath temperature, the leaf processed by step (5) is put into coating stabilization agent solution, stabilized
30min, takes out leaf, is rinsed well with deionized water；
(7) diaphragm is applied：Diaphragm is prepared, the formula of diaphragm is：
| Title | Technological requirement |
| Novolaks | 100ml |
| Turpentine oil | 200ml |
The leaf that will be processed by step (6) applies one layer of uniform chemoproection film at once, prevents brightness from declining, 12h
Afterwards, brushing diaphragm is repeated once, natural air drying obtains being coated with the leaf without cyanic acid bright copper.
The inventive method is simple, it is easy to operate, and can be widely used in the non-conductive substrates such as plastics, peanut shell, beetle shell
Surface treatment, for being made the aspects such as high-end handicraft, customization of individual character, interior decoration, gift souvenir, or Jewelry Accessories；Have
Effect ensures that coating is uniform and smooth, and coating brightness is high, and with good electric conductivity, ornamental value is high, can retain for a long time easily
In corrupt leaf, and, reagent environmental protection is nontoxic, is suitable to large-scale production.
In the case where not conflicting, the feature in embodiment herein-above set forth and embodiment can be combined with each other.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all it is of the invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (9)
1. a kind of method without cyanogen acid bright copper plating of leaf, it is characterised in that comprise the following steps：
(1) pre-process：Leaf is chosen, first the leaf of selection is dried 3-5 days, then leaf is put into deionized water is soaked one
My god, leaf is taken out, the mesophyll of leaf is removed, vein is left, clean, it is standby；
(2) oil removing：The leaf that will have been pre-processed is put into ultrasonic washing instrument, and cleansing medium is added extremely in ultrasonic washing instrument
Leaf is completely submerged in cleansing medium, opens ultrasonic washing instrument, is cleaned 3-5 minutes, and leaf is taken out, and is rinsed well；
(3) plated film：The leaf processed by step (2) is put into the SnCl of the mass fraction 1% of new configuration at room temperature2Solution
Middle immersion 5-10min, takes out leaf, cleans, and the silver-colored ammonia that clean leaf is placed in into 200mL mass fractions 2% at 30 DEG C is molten
In liquid, 5-10min is stood, adds the formalin of 1mL mass fractions 36% and the potassium sodium tartrate solution of 0.1mL 40g/L,
Heating water bath takes out leaf until the uniform silver simple substance of leaf plated surface last layer, is rinsed repeatedly with distilled water, obtains silver color
Leaf；
(4) base copper is electroplated：Copper sulfate electrolyte is prepared, the copper wire of a copper mesh and two cleanings is taken, two copper wires are twined respectively
The petiole root and copper mesh top of the leaf processed by step (3) are wound on, leaf and copper mesh are inserted into copper sulfate electrolyte
In, leaf is all connected in the circuit of adjustable dc source as electroplating cathode, copper mesh as galvanic anode, two copper wires,
By voltage Tiao Jiedao 6V, control electric current uses magnetic stirrer copper sulfate electrolyte in 0.5-1.0A, electroplates 15-
20min, takes out leaf, rinses in deionized water, dries up；
(5) electro-coppering bright layer：Prepare without cyanogen acid bright copper plating electrolyte, the leaf and copper mesh that will be processed by step (4)
In being put into without cyanogen acid bright copper plating electrolyte, and leaf and copper mesh are connected into dipulse circuit, leaf is reversed to pulsed electrode,
Copper mesh connects direct impulse electrode, opens dipulse circuit, sets dipulse circuit parameter, and adjustment direct impulse average current is
0.2-0.6A, reverse impulse average current is 0.02-0.06A, meanwhile, with magnetic stirrer without cyanogen acid bright copper plating electricity
Solution liquid, electroplates 8-12h, and a sulphoxylic acid and Technology Bright Acidic agent, after the completion of plating, leaf deionized water are added every a hour
Clean, and leaf is sealed, anti-oxidation；
(6) layer-stabilizing is plated：Coating stabilization agent is prepared, at 30 DEG C of bath temperature, the leaf processed by step (5) is put
Enter in coating stabilization agent, stabilize 30-40min, leaf is taken out, rinsed well with deionized water；
(7) diaphragm is applied：Diaphragm is prepared, the leaf that will be processed by step (6) applies one layer of uniform diaphragm, 12h at once
Afterwards, brushing diaphragm is repeated once, natural air drying obtains being coated with the leaf without cyanic acid bright copper.
2. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (1)
In, selection vein is sparse and solid, the keratin leaf in the maturity period, and the leaf that will first choose uses discoloration silica dehydrator 3-5 days,
Leaf is put into deionized water is again soaked one day, take out leaf, the mesophyll of leaf is removed by soft hairbrush, leave leaf
Arteries and veins, then cleaned leaf with deionized water.
3. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (2)
In, cleansing medium is the Na of mass fraction 4%2CO3Solution.
4. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (4)
In, copper sulfate electrolyte is the CuSO of 400mL mass fractions 30%4Solution, and the H of 0.2-0.3mL 1.5mol/L is added dropwise2SO4。
5. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (5)
In, the formula without cyanogen acid bright copper plating electrolyte is：CuSO4·5H2O 200g/L, H2SO450-60g/L, polyethylene glycol
30mg/L, the molecular weight of polyethylene glycol is 6000, acetyl thiourea 12mg/L, Cl-Sulphur pyrolle sulphur cave 1mg/ between 3mg/L, 2- tetrahydrochysene
L。
6. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (5)
In, dipulse circuit parameter is that direct impulse ON time is 0.2-0.4ms, and the turn-off time is 0.8-1ms, and the working time is
100-150ms, reverse impulse ON time is 0.1-0.2ms, and the turn-off time is 0.9-1.2ms, and the working time is 10ms.
7. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (5)
In, leaf is sealed by preservative film.
8. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (6)
In, the pH of coating stabilization agent is adjusted in 4.5-5 by sulfuric acid and buffer solution, and the formula of coating stabilization agent is：Polyethylene glycol
50-100mg/L, the molecular weight of polyethylene glycol is 6000, thiocarbamide 0.05-10mg/L.
9. the method without cyanogen acid bright copper plating of leaf according to claim 1, it is characterised in that the step (7)
In, the formula of diaphragm is：Novolaks and turpentine oil, novolaks and terebinthine ratio are 1：2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611067921.5A CN106757193B (en) | 2016-11-24 | 2016-11-24 | A kind of method without cyanogen acid bright copper plating of leaf |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611067921.5A CN106757193B (en) | 2016-11-24 | 2016-11-24 | A kind of method without cyanogen acid bright copper plating of leaf |
Publications (2)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111593376A (en) * | 2020-06-15 | 2020-08-28 | 深圳市缤纷珠宝开发有限公司 | Method for electrodepositing bright copper |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339620A (en) * | 2000-08-24 | 2002-03-13 | 韩巍 | Gold electroplatic method for flowers |
| US20040074775A1 (en) * | 2002-10-21 | 2004-04-22 | Herdman Roderick Dennis | Pulse reverse electrolysis of acidic copper electroplating solutions |
| CN101481812A (en) * | 2008-12-31 | 2009-07-15 | 清华大学 | Electrolytic solution for integrated circuit copper wire laying electrodeposition |
| CN101487130A (en) * | 2009-01-06 | 2009-07-22 | 北京航空航天大学 | Duplicating method for making scaliness biological epidermis morphology duplicating template by pulse electroforming method |
| CN101736342A (en) * | 2010-01-19 | 2010-06-16 | 陕西科技大学 | Method for plating metal on surface of flower |
| CN103774191A (en) * | 2014-02-24 | 2014-05-07 | 襄垣县韩山度假有限责任公司 | Copper plating method of leaf carving artware |
| CN103882488A (en) * | 2014-03-15 | 2014-06-25 | 沈阳师范大学 | Natural plant electroplating and finishing technique |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339620A (en) * | 2000-08-24 | 2002-03-13 | 韩巍 | Gold electroplatic method for flowers |
| US20040074775A1 (en) * | 2002-10-21 | 2004-04-22 | Herdman Roderick Dennis | Pulse reverse electrolysis of acidic copper electroplating solutions |
| CN101481812A (en) * | 2008-12-31 | 2009-07-15 | 清华大学 | Electrolytic solution for integrated circuit copper wire laying electrodeposition |
| CN101487130A (en) * | 2009-01-06 | 2009-07-22 | 北京航空航天大学 | Duplicating method for making scaliness biological epidermis morphology duplicating template by pulse electroforming method |
| CN101736342A (en) * | 2010-01-19 | 2010-06-16 | 陕西科技大学 | Method for plating metal on surface of flower |
| CN103774191A (en) * | 2014-02-24 | 2014-05-07 | 襄垣县韩山度假有限责任公司 | Copper plating method of leaf carving artware |
| CN103882488A (en) * | 2014-03-15 | 2014-06-25 | 沈阳师范大学 | Natural plant electroplating and finishing technique |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111593376A (en) * | 2020-06-15 | 2020-08-28 | 深圳市缤纷珠宝开发有限公司 | Method for electrodepositing bright copper |
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